3859127

Information

• Patent Grant
• 3859127

• References
• Source

• Patent Number

  3,859,127

• Date Filed

  Not available

• Date Issued

  Tuesday, January 7, 1975
  50 years ago

• CPC

  • H01L23/3157 - Partial encapsulation or coating
  • H01L29/00 - Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier
  • H01L2924/0002 - Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
  • Y10S148/028 - Dicing
  • Y10S148/051 - Etching
  • Y10S148/085 - Isolated-integrated
  • Y10S148/122 - Polycrystalline
  • Y10S148/125 - Polycrystalline passivation
  • Y10S438/958 - Passivation layer

• US Classifications

  • 438 - Semiconductor device manufacturing: process
  • 148 - Metal treatment