3864147

Information

• Patent Grant
• 3864147

• References
• Source

• Patent Number

  3,864,147

• Date Filed

  Not available

• Date Issued

  Tuesday, February 4, 1975
  50 years ago

• CPC

  • H05K3/381 - by special treatment of the substrate
  • B05D3/10 - by other chemical means
  • B05D2201/00 - Polymeric substrate or laminate
  • B05D2350/35 - by chemical means
  • H05K3/181 - by electroless plating
  • H05K2203/1152 - Replicating the surface structure of a sacrificial layer

• US Classifications

  • 427 - Coating processes
  • 216 - Etching a substrate: processes