3885071

Information

• Patent Grant
• 3885071

• References
• Source

• Patent Number

  3,885,071

• Date Filed

  Not available

• Date Issued

  Tuesday, May 20, 1975
  49 years ago

• CPC

  • B29C65/5057 - positioned between the surfaces to be joined
  • B29C37/0082 - Mechanical anchoring
  • B29C66/0222 - without removal of material
  • B29C66/0224 - with removal of material
  • B29C66/026 - Chemical pre-treatments
  • B29C66/1162 - Single bevel to bevel joints
  • B29C66/14 - the joint having the same thickness as the thickness of the parts to be joined
  • B29C66/30321 - making use of protusions belonging to at least one of the parts to be joined
  • B29C66/43 - Joining a relatively small portion of the surface of said articles
  • B29C66/71 - characterised by the composition of the plastics material of the parts to be joined
  • B29C66/72141 - Fibres of continuous length
  • B29C66/73941 - characterised by the materials of both parts being thermosets
  • B29C65/4835 - Heat curing adhesives
  • B29C65/8215 - Tensile tests
  • B29C66/00145 - Vacuum
  • B29C66/02245 - Abrading
  • B29C66/1142 - Single butt to butt joints
  • B29C66/7212 - characterised by the composition of the fibres
  • B29C66/9141 - by controlling or regulating the temperature
  • B29C66/919 - characterised by specific temperature, heat or thermal flux values or ranges
  • B29C66/929 - characterized by specific pressure, force, mechanical power or displacement values or ranges
  • B29C66/949 - characterised by specific time values or ranges
  • B29K2063/00 - Use of EP
  • B29K2105/101 - oriented
  • B29K2277/00 - Use of PA, i.e. polyamides
  • B29K2307/00 - Use of elements other than metals as reinforcement
  • B29K2307/02 - Boron
  • B29K2309/08 - Glass
  • H05K1/0366 - reinforced
  • H05K1/142 - Arrangements of planar printed circuit boards in the same plane
  • H05K3/0017 - Etching of the substrate by chemical or physical means
  • H05K3/36 - Assembling printed circuits with other printed circuits
  • Y10S273/03 - Epoxy
  • Y10S273/23 - High modulus filaments
  • Y10T428/195 - Beveled, stepped, or skived in thickness
  • Y10T428/249945 - Carbon or carbonaceous fiber
  • Y10T428/249946 - Glass fiber

• US Classifications

  • 428 - Stock material or miscellaneous articles
  • 156 - Adhesive bonding and miscellaneous chemical manufacture
  • 216 - Etching a substrate: processes
  • 273 - Amusement devices: games