The disclosed technologies are related to at least the technical fields of energy harvesting, ultrasonic transducers, piezoelectric transducers, and capacitive transducers.
An ultrasonic transducer can convert between acoustic energy and electrical energy. Typically, the acoustic energy can include sound waves at frequencies higher than an audible limit of human hearing: ultrasound. Generally, an ultrasonic transducer can be one of two types: a piezoelectric transducer and a capacitive transducer. A piezoelectric transducer can include a piezoelectric material between a pair of electrodes. The piezoelectric material can move (e.g., change a size, a shape, or both) in response to a voltage being applied between the pair of electrodes. Conversely, the piezoelectric material can produce a voltage between the pair of electrodes in response to a force that causes the piezoelectric material to move (e.g., change a size, a shape, or both). A capacitive transducer can include a cavity between a pair of electrodes. The pair of electrodes can include a conductive diaphragm and a backing plate. A bias voltage can be applied between the pair of electrodes. With the bias voltage applied between the pair of electrodes, the conductive diaphragm can move in response to an alternating voltage being applied between the pair of electrodes. Conversely, with the bias voltage applied between the pair of electrodes, an alternating voltage can be produced in response to a force that causes the conductive diaphragm to move.
According to an implementation of the disclosed technologies, a system for producing a bias voltage can include a piezoelectric transducer and a circuit. The piezoelectric transducer can be configured to receive an acoustic energy. The piezoelectric transducer can have a pair of electrodes. The pair of electrodes can be configured to convey an electrical energy. The circuit can have an input and an output. The input can be configured to receive the electrical energy. The output can be configured to convey the bias voltage.
According to an implementation of the disclosed technologies, in a method for producing a bias voltage, an acoustic energy can be received at a piezoelectric transducer. An electrical energy, produced from the acoustic energy, can be conveyed from the piezoelectric transducer. The electrical energy can be received at a circuit. The bias voltage, produced from the electrical energy, can be conveyed from the circuit.
According to an implementation of the disclosed technologies, in a method for making a system for producing a bias voltage, a piezoelectric transducer can be mounted on a printed circuit board. The piezoelectric transducer can be configured to receive an acoustic energy. The piezoelectric transducer can have a pair of electrodes. The pair of electrodes can be configured to convey an electrical energy. An integrated circuit chip can be mounted on the printed circuit board. The integrated circuit chip can have an input and an output. The input can be configured to receive the electrical energy. The output can be configured to convey the bias voltage.
Additional features, advantages, and aspects of the disclosed technologies are set forth or apparent from consideration of the following detailed description, drawings, and claims. Moreover, it is to be understood that both the foregoing summary and the following detailed description are illustrative and are intended to provide further explanation without limiting the scope of the claims.
The accompanying drawings, which are included to provide a further understanding of the disclosed technologies, are incorporated in and constitute a part of this specification. The drawings also illustrate aspects of the disclosed technologies and together with the detailed description serve to explain the principles of aspects of the disclosed technologies. No attempt is made to show structural details in more detail than may be necessary for a fundamental understanding of the disclosed technologies and various ways in which they may be practiced.
As used herein, a statement that a component can be “configured to” perform an operation can be understood to mean that the component requires no structural alterations, but merely needs to be placed into an operational state (e.g., be provided with electrical power, have an underlying operating system running, etc.) in order to perform the operation.
An ultrasonic transducer can convert between acoustic energy and electrical energy. Typically, the acoustic energy can include sound waves at frequencies higher than an audible limit of human hearing: ultrasound. Generally, an ultrasonic transducer can be one of two types: a piezoelectric transducer and a capacitive transducer. A piezoelectric transducer can include a piezoelectric material between a pair of electrodes. The piezoelectric material can move (e.g., change a size, a shape, or both) in response to a voltage being applied between the pair of electrodes. Conversely, the piezoelectric material can produce a voltage between the pair of electrodes in response to a force that causes the piezoelectric material to move (e.g., change a size, a shape, or both). A capacitive transducer can include a cavity between a pair of electrodes. The pair of electrodes can include a conductive diaphragm and a backing plate. A bias voltage can be applied between the pair of electrodes. With the bias voltage applied between the pair of electrodes, the conductive diaphragm can move in response to an alternating voltage being applied between the pair of electrodes. Conversely, with the bias voltage applied between the pair of electrodes, an alternating voltage can be produced in response to a force that causes the conductive diaphragm to move.
Electrical power for an electrical device can be acoustically produced by an ultrasonic transducer. Theoretically, a capacitive transducer can be more efficient than a piezoelectric transducer at converting from acoustic energy to electrical energy. However, as described above, operation of a capacitive transducer requires that a bias voltage be applied between the pair of electrodes of the capacitive transducer. The disclosed technologies provide, for example, a system for producing a bias voltage that can include a piezoelectric transducer and a circuit. The piezoelectric transducer can be configured to receive a first portion of an acoustic energy. The piezoelectric transducer can have a first pair of electrodes configured to convey a first electrical energy. The circuit can have an input and an output. The input can be configured to receive the first electrical energy. The output can be configured to convey the bias voltage. Optionally, the system can further include a capacitive transducer. The capacitive transducer can be configured to receive a second portion of the acoustic energy. The capacitive transducer can have a second pair of electrodes configured to receive the bias voltage and to convey a second electrical energy. Optionally, the system can be a component of the electrical device. The electrical device can be configured to use the second electrical energy as the electrical power for the electrical device. A ratio of the second electrical energy to the second portion of the acoustic energy can be greater than a ratio of the first electrical energy to the first portion of the acoustic energy. In this manner, the electrical power for the electrical device can be acoustically produced efficiently by the capacitive transducer by having the required bias voltage produced by the piezoelectric transducer.
The piezoelectric transducer 106 can be configured to receive a first portion 110 of an acoustic energy 112. For example, the acoustic energy 112 can include a sound wave at an ultrasound frequency. For example, the acoustic energy 112 can be transmitted by an ultrasonic transmitter 114. The piezoelectric transducer 106 can have a first pair of electrodes 116. The first pair of electrodes 116 can be configured to convey a first electrical energy 118. For example, the piezoelectric transducer 106 can be a microelectromechanical device. For example, the piezoelectric transducer 106 can be a surface mount device. Optionally, the piezoelectric transducer 106 can be mounted on a printed circuit board 120.
The circuit 108 can have an input 122 and an output 124. The input 122 can be configured to receive the first electrical energy 118. The output 124 can be configured to convey the bias voltage 104. For example, the circuit 108 can be a voltage doubler circuit. For example, the circuit 108 can be an integrated circuit chip. For example, the circuit 108 can be a surface mount device. Optionally, the circuit 108 can be mounted on the printed circuit board 120.
Optionally, the system 102 can include a first Zener diode 126 and a second Zener diode 128. An anode of the first Zener diode 126 can be coupled to a first electrode 130 of the first pair of electrodes 116. An anode of the second Zener diode 128 can be coupled to a second electrode 132 of the first pair of electrodes 116. A cathode of the second Zener diode 128 can be coupled to a cathode of the first Zener diode 126. In this configuration, the first Zener diode 126 and the second Zener diode 128 can act to maintain a voltage of the first electrical energy 118 at a constant level. For example, the first Zener diode 126, the second Zener diode 128, or both can be Part Number MM3Z3V0ST1G manufactured by ON Semiconductor of Phoenix, Ariz. Optionally, the first Zener diode 126, the second Zener diode 128, or both can be mounted on the printed circuit board 120.
Optionally, the system 102 can include a capacitive transducer 134. The capacitive transducer 134 can be configured to receive a second portion 136 of the acoustic energy 112. The capacitive transducer 134 can have a second pair of electrodes 138. The second pair of electrodes 138 can include a first electrode 140 of the second pair of electrodes 138 and a second electrode 142 of the second pair of electrodes 138. The second pair of electrodes 138 can be configured to receive the bias voltage 104. The second pair of electrodes 138 can be configured to convey a second electrical energy 144. For example, the capacitive transducer 134 can be a microelectromechanical device. For example, the capacitive transducer 134 can be a surface mount device. Optionally, the capacitive transducer 134 can be mounted on the printed circuit board 120.
Optionally, the system 102 can be a component of an electrical device 146. The electrical device 146 can be configured to use the second electrical energy 144 as an electrical power for the electrical device 146. Optionally, at least one other component 148 of the electrical device 146 can be mounted on the printed circuit board 120. A ratio of the second electrical energy 144 to the second portion 136 of the acoustic energy 112 can be greater than a ratio of the first electrical energy 118 to the first portion 110 of the acoustic energy 112. In this manner, the electrical power for the electrical device 146 can be acoustically produced efficiently by the capacitive transducer 134 by having the required bias voltage 104 produced by the piezoelectric transducer 106.
With reference to
One of skill in the art in light of the description herein understands that the circuit 108 can be realized by another example of the circuit 108 and that such another circuit can be different from a voltage doubler circuit.
Optionally, the output 122 of the circuit 108 can include the output 406 of the first stage 402 and an output 410 of the second stage 404. For example, if both the first stage 402 and the second stage 404 are voltage doubler circuits, then the bias voltage 104, conveyed from the output 124 of the circuit 108, can be selectable from among: (1) the output 406 of the first stage 402 (a constant voltage equal to twice the peak voltage associated with the alternating voltage of the first electrical energy 118 received at the input 122 of the circuit 108) and (2) the output 410 of the second stage 404 (a constant voltage equal to four times the peak voltage associated with the alternating voltage of the first electrical energy 118 received at the input 122 of the circuit 108).
One of skill in the art in light of the description herein understands that the circuit 108 can be realized by another example of the circuit 108 and that such another circuit can have more than two stages and that selectable outputs can be associated with various stages. For example,
At an operation 604, a first electrical energy, produced from the first portion of the acoustic energy, can be conveyed from the piezoelectric transducer. For example, the piezoelectric transducer can have a first pair of electrodes and the first electrical energy can be conveyed by the first pair of electrodes. For example, the first pair of electrodes can be the first pair of electrodes 116 of the piezoelectric transducer 106 of the system 100 for producing the bias voltage.
At an operation 606, the first electrical energy can be received at a circuit. For example, the circuit can have an input and the input can receive the first electrical energy. For example, the input can be the input 122 of the circuit 108 of the system 100 for producing the bias voltage.
At an operation 608, the bias voltage 104, produced from the first electrical energy, can be conveyed from the circuit. For example, the circuit can have an output and the output can convey the bias voltage. For example, the output can be the output 124 of the circuit 108 of the system 100 for producing the bias voltage.
Optionally, at an operation 610, the bias voltage can be received at a capacitive transducer. For example, the capacitive transducer can have a second pair of electrodes and the bias voltage can be received by the second pair of electrodes. For example, the capacitive transducer can be the capacitive transducer 134 of the system 100 for producing the bias voltage. For example, the second pair of electrodes can be the second pair of electrodes 138 of the capacitive transducer 134.
Optionally, at an operation 612, a second portion of the acoustic energy can be received at the capacitive transducer. For example, the capacitive transducer can be the capacitive transducer 134 of the system 100 for producing the bias voltage.
Optionally, at an operation 614, a second electrical energy, produced from the second portion of the acoustic energy, can be conveyed from the capacitive transducer. For example, the capacitive transducer can have a second pair of electrodes and the second electrical energy can be conveyed by the second pair of electrodes. For example, the capacitive transducer can be the capacitive transducer 134 of the system 100 for producing the bias voltage. For example, the second pair of electrodes can be the second pair of electrodes 138 of the capacitive transducer 134.
Optionally, at an operation 616, the second electrical energy can be used as an electrical power for an electrical device. A ratio of the second electrical energy to the second portion of the acoustic energy can be greater than a ratio of the first electrical energy to the first portion of the acoustic energy. In this manner, the electrical power for the electrical device can be acoustically produced efficiently by the capacitive transducer by having the required bias voltage produced by the piezoelectric transducer.
At an operation 704, an integrated circuit chip can be mounted on the printed circuit board. The integrated circuit chip can have an input and an output. The input can be configured to receive the first electrical energy. The output can be configured to convey the bias voltage. For example, the integrated circuit chip can be a surface mount device.
Optionally, at an operation 706, a capacitive transducer can be mounted on the printed circuit board. The capacitive transducer can be configured to receive a second portion of the acoustic energy. The capacitive transducer can have a second pair of electrodes configured to receive the bias voltage. The capacitive transducer can be configured to convey a second electrical energy. For example, the capacitive transducer can be a microelectromechanical device. For example, capacitive transducer can be a surface mount device.
Optionally, at an operation 708, a first Zener diode can be mounted on the printed circuit board. An anode of the first Zener diode can be coupled to a first electrode of the first pair of electrodes. Optionally, at an operation 710, a second Zener diode can be mounted on the printed circuit board. An anode of the second Zener diode can be coupled to a second electrode of the first pair of electrodes. A cathode of the second Zener diode can be coupled to a cathode of the first Zener diode. For example, the first Zener diode, the second Zener diode, or both can be Part Number MM3Z3V0ST1G manufactured by ON Semiconductor of Phoenix, Ariz.
The foregoing description, for purpose of explanation, has been described with reference to specific aspects. However, the illustrative discussions above are not intended to be exhaustive or to limit aspects of the disclosed technologies to the precise forms disclosed. Many modifications and variations are possible in view of the above teachings. The aspects were chosen and described in order to explain the principles of aspects of the disclosed technologies and their practical applications, to thereby enable others skilled in the art to utilize those aspects as well as various aspects with various modifications as may be suited to the particular use contemplated.