Patent Grant
9454195
In a typical computing device, a processor and other components can generate significant amount of heat. It is important to remove the heat from the processor in order to protect the processor and other components in the device. In order to expel the heat, it is typically transported through heat pipes into a fin pack. The heat is then conducted through the fins of the fin pack. A blower, or fan, blows air through the fin pack, and the air collects heat from the fins. The heated air leaves the fin pack and is expelled from the computing device through an exhaust vent.
As computing devices have become thinner and more compact, the fin packs have had to become smaller as well. Typical fin packs may have very narrow fins (for example only a few tenths of a mm wide). The greater the surface area of the fins, the greater the amount of heat that can be expelled by blowing air through the fins. In order to maximize the amount of surface area, typical fins span the height of the opening between a bottom end of the fin pack to the top end of the fin pack adjacent to the heat pipe. The fins may also be tightly spaced (for example only 1 mm apart).
This tight packing of the fins can cause debris to collect along the fins, such as fibers dust or other particles. The debris may increase the noise of the fan blowing through the fin pack, decrease the amount of air flowing through the fins, and decrease the amount of expelled heat. By reducing the efficiency of the fin pack, the operating temperature of the processor may also increase. In order to protect the processor, the computing device and users, the computing device may increase the fan speed to expel the heat, creating more noise, and/or slow down the speed of the processor. These may be an annoyance to users of these devices, and may also degrade the device's performance.
One aspect of the disclosure provides a fin pack for expelling heat from a computing device. The fin pack includes a housing having a first sidewall, a second sidewall opposite of the first sidewall, a third sidewall between the first and the second sidewalls, a fourth sidewall opposite of the third sidewall and adjacent the first and second sidewalls, and an open first end adjacent the first, second, third, and fourth sidewalls and an open second end opposite of the open first end and adjacent the first second third and fourth sidewalls. The fin pack also includes a set of fins disposed in the housing. The set of fins is arranged to conduct heat from the first sidewall towards the second sidewall. Each fin of the set of fins is fixed to the first sidewall and extending towards the second sidewall. At least one of the fins of the set of fins does not contact the second sidewall such that there is an opening between an edge of the at least one fin and the second sidewall. The edge of the at least one fin is oriented towards the second sidewall. The opening between the edge extends along a complete length of the edge between the first open end and the second open end.
In one example, the edge of the at least one fin is curved at a portion of the edge adjacent to the open first end. In another example, the at least one fin has a first curve shape and the set of fins includes a second fin having a second curve shape. In this example, the second fin has a second height that is less than the distance between the first sidewall and the second sidewall to define a second opening between an edge of the at least one fin and the second sidewall, and the second curve shape is different from the first curve shape. In yet another example, the set of fins includes a second fin having a second height that spans the distance between the first sidewall and the second sidewall such that there is no opening between the second fin and the second sidewall. In a further example, the opening is no less than 0.1 millimeters. In another example, the fin pack also includes a plurality of openings between edges of each fin of the set of fins and the second sidewall such that there is an open space in the housing that extends from the third sidewall to the fourth sidewall.
Another aspect of the disclosure provides a fin pack for expelling heat from a computing device. The fin pack includes a housing having a first sidewall, a second sidewall opposite of the first sidewall, a third sidewall between the first and the second sidewalls, a fourth sidewall opposite of the third sidewall and adjacent the first and second sidewalls, and an open first end adjacent the first, second, third, and fourth sidewalls. The housing also includes an open second end opposite of the open first end and adjacent the first second third and fourth sidewalls. The fin pack also includes a first set of fins disposed in the housing. The first set of fins is arranged to conduct heat from the first sidewall towards the second sidewall. Each fin of the first set of fins is fixed to the first sidewall and extending towards the second sidewall. The fin pack also includes a second set of fins disposed in the housing. The second set of fins is arranged to conduct heat from the second sidewall towards the first sidewall. Each fin of the second set of fins is fixed to the second sidewall and extending towards the first sidewall. A first fin of the first set of fins extends towards a second fin of the second set of fins, such that the first fin and the second fin are a corresponding pair of opposing fins such that a closest fin of the second set of fins to the first fin of the first set of fins is the second fin of the second set of fins. An edge of the first fin and an edge of the second fin is oriented towards one another and are a distance apart.
In one example, a portion of the edge of the first fin curved. In another example, the first fin has a first curve shape and the second fin has a second curve shape, wherein the first curve shape is different from the second curve shape. In yet another example, the fin pack also includes a full fin between the first sidewall and the second sidewall, and the full fin has a second height that spans the distance between the first sidewall and the second sidewall. In another example, the fin pack also includes plurality of openings between edges of each fin of the set of fins and the second sidewall such that there is an open space in the housing that extends from the third sidewall to the fourth sidewall. In yet another example, the first fin of the first set of fins and the second fin of the second set of fins are arranged along an imaginary axis which is perpendicular to both the first and second sidewalls.
Yet another aspect of the disclosure provides a computing device. The computing device includes a processor configured to execute instructions, and heat is generated during execution of the instructions. The computing device also includes a heat pipe which transfers heat from the processor, and a fin pack adjacent to and contacting the heat pipe. The fin pack includes a housing having a first sidewall, a second sidewall opposite of the first sidewall, a third sidewall between the first and the second sidewalls, a fourth sidewall opposite of the third sidewall and adjacent the first and second sidewalls, and an open first end adjacent the first, second, third, and fourth sidewalls. The housing also includes an open second end opposite of the open first end and adjacent the first second third and fourth sidewalls. The fin pack also includes a set of fins disposed in the housing. The set of fins are arranged to conduct heat from the first sidewall towards the second sidewall. Each fin of the set of fins is fixed to the first sidewall and extending towards the second sidewall. At least one of the fins of the set of fins not contacting the second sidewall such that there is an opening between an edge of the at least one fin and the second sidewall. The edge of the at least one fin is oriented towards the second sidewall, and the opening between the edge extends along a complete length of the edge between the first open end and the second open end. The computing device also includes a blower for blowing air through the fin pack from the first open end towards the second open end to move the heat from the set of fins out of the fin pack. The opening is configured to allow debris to move freely through the fin pack from the first open end to the second open end.
In one example, the edge of the at least one fin is curved at a portion of the edge adjacent to the open first end and the curved portion allows the debris to move through the opening. In another example, the at least one fin has a first curve shape and the set of fins includes a second fin having a second curve shape, the second fin having a second height that is less than the distance between the first sidewall and the second sidewall such that there is an opening between an edge of the at least one fin and the second sidewall, the second curve shape is different from the first curve shape. In another example, the set of fins includes a second fin having a second height that spans the distance between the first sidewall and the second sidewall such that the second fin contacts the second sidewall. In yet another example, the fin pack further includes a plurality of openings between edges of each fin of the set of fins and the second sidewall such that there is an open space in the housing that extends from the third sidewall to the fourth sidewall.
A further aspect of the disclosure provides a computing device. The computing device includes a fin pack adjacent to a heat pipe which transfers heat from the processor. The fin pack includes a housing having a first sidewall, a second sidewall opposite of the first sidewall, a third sidewall between the first and the second sidewalls, a fourth sidewall opposite of the third sidewall and adjacent the first and second sidewalls. The housing also includes an open first end adjacent the first, second, third, and fourth sidewalls and an open second end opposite of the open first end and adjacent the first second third and fourth sidewalls. The fin pack also includes a first set of fins disposed in the housing. The first set of fins is arranged to conduct heat from the first sidewall towards the second sidewall. Each fin of the first set of fins is fixed to the first sidewall and extending towards the second sidewall. The fin pack also includes a second set of fins disposed in the housing. The second set of fins is arranged to conduct heat from the second sidewall towards the first sidewall. Each fin of the set of fins is fixed to the second sidewall and extending towards the first sidewall. A first fin of the first set of fins extends towards a second fin of the second set of fins. The first fin and the second fin are a corresponding pair of opposing fins such that a closest fin of the second set of fins to the first fin of the first set of fins is the second fin of the second set of fins. An edge of the first fin and an edge of the second fin are oriented towards one another and being a distance apart. The computing device also includes a blower for blowing air through the fin pack from the first open end towards the second open end to move the heat from the first and second sets of fins out of the computing device, wherein the opening is configured to allow debris to move freely through the fin pack from the first open end to the second open end.
In one example, the first fin has a first curve shape and the second fin has a second curve shape, wherein the first curve shape is different from the second curve shape. In another example, the computing device also includes a plurality of openings between edges of each fin of the set of fins and the second sidewall such that there is an open space in the housing that extends from the third sidewall to the fourth sidewall. In yet another example, the computing device is a laptop computer.
Aspects of the disclosure relate generally to active cooling or removing heat generated by a processor in a computing device. In a typical mobile computing device (such as a laptop computer), heat is transported through a heat pipe and into a fin pack. Fin pack 100 of
A blower, or fan, blows air through the fin pack in order to force the heat from the fin pack and the computing device. For example, as shown in
As the fan blows air through the fin pack, dust, fibers, and other particles may collect along the fins. For example, as fibers 150 may be caught along the fins at the first end 102 of the fin pack 100. Eventually, for example, after only a few months of use, the spaces 120 of fins 110 may become clogged by the fibers 150 as shown in
As noted above, clogging may cause a number of ill effects including, increasing the noise of the fan blowing through the fin pack and decreasing the amount of expelled heat. This, in turn, may increase the operating temperature of the processor as well as the temperature of a housing of the computing device. For example, if the skin or surface of the housing is close to the processor, fin pack, and/or heat pipe, the heat from these features may cause the skin temperature to increase. In order to protect the processor, the computing device, and users, the computing device may increase the fan speed to expel the heat (creating more noise) or slow down the speed processor (to reduce the amount of heat produced).
In this example, the edge of the fin 210 includes a first portion 332, a second portion 334, and a third portion 336. The second portion 334 of the fin includes a curved, rounded, or chamfered edge. This portion of the fins may promote the movement of debris through the fin pack while still allowing the heat to be expelled through the fins. The second portion, though depicted as curved in
The computing device housing the fin pack may include a processor, memory, instructions, and other components typically present in general purpose computers. For example, as shown in
As noted above, the computing device may include a processor which generates heat. As shown in
As noted above, the opening may allow debris to move through the fin pack rather than being caught up against the fins. The opening 320 allows debris, identified as dots 450A-D, to move through and eventually out of the fin pack, rather than becoming stuck against the fin 210. For example, debris 450A-D may be a hair or other item which has been blown against fin 210. The first portion 332 (shown in
The expulsion of debris from the fin pack, and in some examples, the computing device, may reduce the likelihood that debris will clog the fins. This in turn may reduce the likelihood that the device will need to increase the fan speed or reduce the processing speed of the processor to maintain a safe or required temperature. In addition, because of the relatively small height of the fin pack, the fin pack may still effectively transfer and expel heat even with the loss of surface area due to the shortened fins.
Other configurations of the fins may also be used. For example, as shown in
Fin pack 500 may also include two sets of fins, rather than a single set as with fin pack 200. In this example, a fin 510A of a first set of fins may extend into the fin pack from the top wall 506 of the housing, and a fin 510B of a second set of fins may extend into the fin pack from the bottom wall 514 of the housing. Each of the fins 510A of the first set of fins is arranged perpendicularly to the top wall 506 while each of the fins 510B of the second set of fins is arranged perpendicularly to the bottom wall 514. However, the fins need not be perpendicular to the top and/or bottom walls, but may be fixed at other angles. Each of the fins of fin pack 500 includes two side surfaces which are opposite to one another and an edge (see, e.g. edges 530A and 530B of
In the examples of a fin pack having two sets of fins (as in the example of fin pack 500), each fin of the first set of fins may be associated with an opposing fin of the second set of fins. For example, fins 510A and 510B of each of the examples of
In this configuration, the fin pack may be adjacent to two different heat pipes, one heat pipe being adjacent one end of the fin pack and another heat pack being adjacent the other end of the fin pack. For example, computing device 600 may include processors 610A and 610B. Although depicted as two distinct processors, these processors may actually be the same (i.e. a single) processor. The computing device 600 may be similar to computing device 400, for example include a processor, memory, instructions, and other components typically present in general purpose computers. It will be understood that the arrangement depicted is merely an illustrative example and not a required arrangement, orientation, sizing, etc. of the features of computing device 600.
Returning to
Processors 610A and 610B of
As with opening 320, opening 520 may allow debris to move freely through the fin pack rather than being caught up against the fins (see
In another example, debris 655A-D may be a hair or other item which has been blown against fin 510B. The first portion 532B (shown in
The fin packs may have various configurations depending on the space available for the fin pack. For example, although fin packs 100, 200, and 500 have an s-shaped profile, other fins, such as fin packs 700, 720, 740, 760, and 780 may have a rectangular profile (as shown in
In addition to the shapes and configurations of the examples depicted by fins 210 and 510, the fins may have any number of configurations and shapes as noted above. For example,
In another example, although fins 510A and 510B are shown as symmetrical in fin pack 500, as shown in
In still other examples, the fin packs may include a single or double set of fins where each set has plurality of fins of different heights. For example, only some of the fins may span the distance between the top wall and the bottom wall, such as every other fin or every two or more fins. The number of fins in a row that need not span this distance will define the width of the duct and also the size of debris that may be forced through the duct. Returning to the examples of fin pack 200 of
A fin pack may also have several full fins (such as fin 810B) with various numbers of shortened fins (fin 810A) between them. For example,
In yet another example, a fin pack may include shortened fins of different heights. For example, as shown in
The fin packs described herein may be made of various metals or other heat conducting materials. For example, the housing and fins may be formed of a metal (including alloys) with a low thermal resistance in order to conduct the heat down or along the fins as described above.
As these and other variations and combinations of the features discussed above can be utilized without departing from the subject matter defined by the claims, the foregoing description of the embodiments should be taken by way of illustration rather than by way of limitation of the subject matter defined by the claims. It will also be understood that the provision of the examples disclosed herein (as well as clauses phrased as “such as,” “including” and the like) should not be interpreted as limiting the claimed subject matter to the specific examples; rather, the examples are intended to illustrate only one of many possible embodiments. Further, the same reference numbers in different drawings may identify the same or similar elements.
The present application is a divisional of U.S. patent application Ser. No. 13/765,817, filed on Feb. 13, 2013, which is a continuation of U.S. patent application Ser. No. 13/438,312, filed on Apr. 3, 2012, the disclosures of which are incorporated herein by reference.
| Number | Name | Date | Kind |
|---|---|---|---|
| 3004196 | Drexel | Oct 1961 | A |
| 3180404 | Nelson et al. | Apr 1965 | A |
| 4707726 | Tinder | Nov 1987 | A |
| 5002123 | Nelson et al. | Mar 1991 | A |
| 5297005 | Gourdine | Mar 1994 | A |
| 5339214 | Nelson | Aug 1994 | A |
| 5422787 | Gourdine | Jun 1995 | A |
| 5504650 | Katsui et al. | Apr 1996 | A |
| 5597035 | Smith et al. | Jan 1997 | A |
| 5630469 | Butterbaugh et al. | May 1997 | A |
| 5712762 | Webb | Jan 1998 | A |
| 5828549 | Gandre | Oct 1998 | A |
| 5912802 | Nelson | Jun 1999 | A |
| 5963424 | Hileman et al. | Oct 1999 | A |
| 6113485 | Marquis et al. | Sep 2000 | A |
| 6137680 | Kodaira et al. | Oct 2000 | A |
| 6154368 | Scofield | Nov 2000 | A |
| 6198630 | Cromwell | Mar 2001 | B1 |
| 6288895 | Bhatia | Sep 2001 | B1 |
| 6304445 | Bollesen | Oct 2001 | B1 |
| 6377459 | Gonsalves et al. | Apr 2002 | B1 |
| 6452797 | Konstad | Sep 2002 | B1 |
| 6504712 | Hashimoto et al. | Jan 2003 | B2 |
| 6504718 | Wu | Jan 2003 | B2 |
| 6707675 | Barsun et al. | Mar 2004 | B1 |
| 6798663 | Rubenstein | Sep 2004 | B1 |
| 7002797 | Wittig | Feb 2006 | B1 |
| 7180740 | Li et al. | Feb 2007 | B2 |
| 7256993 | Cravens et al. | Aug 2007 | B2 |
| 7310228 | Chen | Dec 2007 | B2 |
| 7372147 | Dai et al. | May 2008 | B2 |
| 7447021 | Chen | Nov 2008 | B2 |
| 7742295 | Hata et al. | Jun 2010 | B2 |
| 7952872 | Hata et al. | May 2011 | B1 |
| 20010023759 | Katsui | Sep 2001 | A1 |
| 20020044424 | Hashimoto et al. | Apr 2002 | A1 |
| 20020172008 | Michael | Nov 2002 | A1 |
| 20020179285 | Sas et al. | Dec 2002 | A1 |
| 20030116302 | Sauciuc et al. | Jun 2003 | A1 |
| 20030210525 | Chung et al. | Nov 2003 | A1 |
| 20040080912 | Goth et al. | Apr 2004 | A1 |
| 20040150959 | Sullivan | Aug 2004 | A1 |
| 20050041392 | Chen | Feb 2005 | A1 |
| 20060061966 | Korinsky et al. | Mar 2006 | A1 |
| 20060181851 | Frank et al. | Aug 2006 | A1 |
| 20060221570 | Yang et al. | Oct 2006 | A1 |
| 20070117502 | Kim | May 2007 | A1 |
| 20070165374 | Chen et al. | Jul 2007 | A1 |
| 20080074845 | Sun et al. | Mar 2008 | A1 |
| 20080101017 | Hata et al. | May 2008 | A1 |
| 20080165498 | Gallina et al. | Jul 2008 | A1 |
| 20100073877 | Yu et al. | Mar 2010 | A1 |
| 20100079947 | Aoki | Apr 2010 | A1 |
| 20110026223 | Kaneko | Feb 2011 | A1 |
| 20110286178 | Bridges et al. | Nov 2011 | A1 |
| Number | Date | Country |
|---|---|---|
| 201025749 | Feb 2008 | CN |
| 2000165074 | Jun 2000 | JP |
| 2005-321287 | Nov 2005 | JP |
| 2019990004886 | Feb 1999 | KR |
| Entry |
|---|
| Extended European Search Report for Application No. 13771895.3 dated Oct. 6, 2015. |
| M. Baris Dogruoz et al., “Experiments and modeling of the hydraulic resistance of in-line square pin fin heat sinks with top by-pass flow,” 2002 The Eighth Inter Society Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 251-260, 2002. |
| Thang Nguyen et al., “Advanced Cooling System Using Miniature Heat Pipes in Mobile PC,” IEEE Transactions on Components and Packaging Technology, vol. 23, No. 1, pp. 86-90, Mar. 2000. |
| International Search Report and Written Opinion for Application No. PCT/US2013/034956 dated Jul. 23, 2013. |
| Number | Date | Country | |
|---|---|---|---|
| 20140198448 A1 | Jul 2014 | US |
| Number | Date | Country | |
|---|---|---|---|
| Parent | 13765817 | Feb 2013 | US |
| Child | 14191665 | US |
| Number | Date | Country | |
|---|---|---|---|
| Parent | 13438312 | Apr 2012 | US |
| Child | 13765817 | US |
