Alignment plate

Abstract

A mounting material alignment plate of the present invention is operative to place an electronic component to be mounted on a printed circuit board and has a plurality of bores that admit terminals of the electronic component to be placed. The mounting material alignment plate has first dents formed on one surface, on which the electronic component is located, around the individual bores, and second dents formed on another surface opposite to the one surface on which the electronic component is located.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A to 1C are conceptual diagrams showing one mounting technology of the related art.

FIG. 2 is a conceptual diagram of another mounting technology of the related art.

FIGS. 3A and 3B are conceptual diagrams showing another mounting technology of the related art.

FIGS. 4A and 4B are conceptual diagrams showing another mounting technology of the related art.

FIGS. 5A to 5C are conceptual diagrams showing another mounting technology of the related art.

FIG. 6 is a cross-sectional view of a bracket of an embodiment according to an embodiment of the present invention.

FIGS. 7A to 7C are external views of the bracket of the embodiment shown in FIG. 6 according to an embodiment of the present invention.

FIG. 8 is a view showing the bracket to which lead terminals are inserted according to an embodiment of the present invention.

FIGS. 9A and 9B are views showing a dent and a counterbore of the bracket shown in FIG. 6 according to an embodiment of the present invention.

FIGS. 10A to 10D are views showing a sequence of mounting an electronic component on a printed circuit board according to an embodiment of the present invention.

FIG. 11 is an enlarged view showing a status in which a through-hole is filled with solder according to an embodiment of the present invention.

FIGS. 12A to 12C are views showing a sequence of removing electronic component from the printed circuit board according to an embodiment of the present invention.

FIG. 13 is a block diagram of hardware of a mounting device of the embodiment according to an embodiment of the present invention.

FIG. 14 is a view showing lead terminals inserted to the bracket according to an embodiment of the present invention.

FIGS. 15A and 15B are views showing a dent and a counterbore of a bracket of another embodiment according to the present invention according to an embodiment of the present invention.

Claims

1. A alignment plate for aligning solder chips having a plurality of bores for inserting terminals of electronic components, the alignment plate comprising: a plurality of first dent portions formed around the bores on one surface of the alignment plate for receiving solder chips, respectively; anda plurality of second dent portions formed around the bores respectively on the other surface opposite to said one surface.

2. The alignment plate according to claim 1, wherein: said second dent portions are formed in tapered shapes, respectively.

3. The alignment plate according to claim 2, wherein: said second dent portions are formed to be centered around the bores in shapes broadened toward a surface of the alignment plate.

4. The alignment plate according to claim 1, wherein: each of the bores has a shape so as to enable to insert therethrough a plurality of the terminals of the electric component.

5. The alignment plate according to claim 1, wherein: the first dent portions are circular in shape.

6. The alignment plate according to claim 1, wherein: said solder chips disposed in the first dent portions have cylindrical shapes.

7. A circuit unit comprising: a plurality of electronic components;a printed circuit board on which the plurality of electronic components are mounted by using solder chips, formed a plurality of hole portions for inserting terminals of the electronic components; anda alignment plate formed a plurality of bores, a plurality of first dents, and a plurality of second dents, said first dents being formed around the bores on one surface of the alignment plate for receiving said solder chips respectively, said second dents being formed around the bores respectively on the other surface opposite to said one surface, said alignment plate being placed on the printed circuit board so as to enable to insert the terminals of the electronic components in said bores. for aligning solder chips having a plurality of bores for inserting terminals of electronic components

8. A mounting device for mounting an electronic component which has terminals on a printed circuit board, the mounting device comprising: mounting material locating means including a alignment plate having a plurality of bores, first dents and second dents, said first dents being formed around the bores on one surface of the alignment plate for receiving solder chips respectively, said second dents being formed around said bores respectively on the other surface opposite to said one surface;terminal inserting means for inserting the terminals of the electronic component into the solder chips, the bores and terminal connector portions of the printed circuit board; andreflowing means for heating the mounting materials and subsequently cooling the solder chips to fill the solder chips in the terminal connector portions.

9. A mounting method for mounting an electronic component having terminals on a printed circuit board, the mounting method comprising: locating solder chips on an alignment plate having a plurality of bores, first dents and second dents, said first dents being formed around the bores respectively on one surface for receiving said solder chips, said second dents being formed around said bores on the other surface opposite to the one surface;inserting the terminals of the electronic component into the said solder chips, the bores and terminal connector portions of the printed circuit board; andperforming reflowing by heating and subsequently cooling said solder chips to fill said solder chips in the terminal connector portions.

10. A computer-readable recording medium that stores a computer program for mounting an electronic component which has terminals on a printed circuit board, by controlling an information processing apparatus according to a process comprising: locating solder chips on an alignment plate having a plurality of bores, first dents and second dents, said first dents being formed around the bores respectively on one surface for receiving said solder chips, said second dents being formed around said bores on the other surface opposite to the one surface;inserting the terminals of the electronic component into the said solder chips, the bores and terminal connector portions of the printed circuit board; andperforming reflowing by heating and subsequently cooling said solder chips to fill said solder chips in the terminal connector portions.

11. A method of manufacturing a printed circuit board mounted an electronic component, the method comprising: locating solder chips on an alignment plate having a plurality of bores, first dents and second dents, said first dents being formed around the bores respectively on one surface of said alignment plate, said second dents being formed around the bores respectively on the other surface opposite to the one surface;inserting terminals of the electronic component into the solder chips, the bores and terminal connector portions of the circuit substrate; andperforming reflowing by heating and subsequently cooling the solder chips to fill the solder chips in the terminal connector portions.