Amine flux composition and method of soldering

Abstract

An amine flux composition is provided, comprising, as an initial component: an amine fluxing agent represented by formula I:

Description

The present invention relates to an amine flux composition comprising, as an initial component an amine fluxing agent represented by formula I, wherein R¹, R², R³ and R⁴ are independently selected from a hydrogen, a substituted C_1-80 alkyl group, an unsubstituted C_1-80 alkyl group, a substituted C_7-80 arylalkyl group and an unsubstituted C_7-80 arylalkyl group; wherein R⁷ and R⁸ are independently selected from a C_1-20 alkyl group, a substituted C_1-20 alkyl group, a C_6-20 aryl group and a substituted C_6-20 aryl group or wherein R⁷ and R⁸, together with the carbon to which they are attached, form a C_3-20 cycloalkyl ring optionally substituted with a C_1-6 alkyl group; wherein R¹⁰ and R¹¹ are independently selected from a C_1-20 alkyl group, a substituted C_1-20 alkyl group, a C_6-20 aryl group and a substituted C_6-20 aryl group or wherein R¹⁰ and R¹¹, together with the carbon to which they are attached, form a C_3-20 cycloalkyl ring optionally substituted with a C_1-6 alkyl group; and, wherein R⁹ is selected from a hydrogen, a C_1-30 alkyl group, a substituted C_1-30 alkyl group, a C_6-30 aryl group and a substituted C_6-30 aryl group. The present invention further relates to a method of soldering an electrical contact.

Soldering processes ranging from manual, hand soldering methods to automated soldering methods. The use of flux materials in soldering processes, both manual and automated, is also well know. In fact, the use of solder alone generally will not result in an acceptable electrical interconnection. Flux materials serve multiple functions in the soldering process. For example, flux materials operate to remove any oxides that may have formed on the metallic contacts (e.g., solder regions, contact pads, contact pins, copper plated through holes); to enhance wetting of solder onto the metallic contacts.

Various methods have been employed to apply flux materials to the surface of a metallic contact during the soldering process. In some methods, flux materials containing solder are used. For example, such combined materials have been provided in the form of an annular shaped wire incorporating a core of flux material. As the solder melts upon heating, the flux material in the core is activated, fluxing the surfaces to be interconnected by the molten solder. Solder pastes are also known in which a flux material and a solder powder are compounded to form a generally homogenous stable suspension of solder particles in the paste.

One commercially significant, application of an automated soldering method is the manufacture of semiconductor devices. That is, reflow soldering processes are commonly used in the automated production of semiconductor devices, wherein a semiconductor chip is mounted on to a printed circuit board (PCB). In some such automated production methods, a solder paste is applied to a printed circuit board using, for example, screen printing or stencil printing. The semiconductor chip is then brought into contact with the PCB and the solder paste is heated to reflow the solder in the paste, forming electrical interconnects between the semiconductor chip and the PCB. The heating may be facilitated by, for example, exposure of the solder paste to infrared light or by heating in an oven. In some applications, the semiconductor chip/PCB assembly is further treated with an under fill material that substantially fills the interstitial area between the semiconductor chip and the PCB, encapsulating the interconnects.

Given the demands for the mass production of electronic devices containing circuits of increasing complexity and miniaturization, rapid, automated soldering processes have emerged, such as, for example, those incorporating pick and dip processes. In such processes, a flux can be applied to a plurality of electrical contacts on a semiconductor chip by dipping the electrical contact portion of the semiconductor chip into a bath of flux. The flux coated electrical contacts on the semiconductor chip can then be brought into contact with a PCB comprising corresponding electrical contacts and solder balls. The solder balls may then be heated to reflux interconnecting the semiconductor chip and the PCB. Alternatively, the pick and dip process can be employed with device components that have electrical contacts with preapplied solder. In these processes, the preapplied solder is dip coated with the flux material and then brought into contact with the corresponding electrical contact(s) and heated to reflow, forming the electrical interconnects. Many electronic components fit into this latter process category in that they are manufactured with a sufficient amount of solder on board the component to facilitate interconnection of the component with another electrical component (e.g., a PCB).

In most instances, use of commercially available fluxes leave ionic residues on the soldered regions, which may undesirably lead to corrosion of circuitry and to short circuits. Accordingly, additional process steps are required to remove such residues after formation of the soldered interconnections. For semiconductor device manufacturing processes, the solder connections formed between the semiconductor chip and the PCB result in a relatively small gap between the semiconductor chip and the PCB (e.g., <4 mils). Hence, it is very difficult to remove (i.e., clean) ionic residues remaining on the soldered regions following the soldering process. Even in processes where the soldered regions are accessible (hence, facilitating cleaning operations), cleaning operations create environmental concerns involving the disposal of the waste generated during the cleaning operations.

Some low residue, no clean fluxes having a low solid content are commercially available. One flux composition asserted to substantially minimize or substantially eliminate flux residues when soldering electronic components is disclosed in United States Patent Application Publication No. 20100175790 to Duchesne et al. Duchesne et al. disclose a composition of matter comprising a flux, wherein said flux consists essentially of a combination of: (a) a fluxing agent; and (b) a solvent; wherein said fluxing agent: (1) comprises a keto acid; or (2) comprises an ester acid; or (3) comprises a mixture of said keto acid with said ester acid; and wherein said solvent comprises a mixture of a tacky solvent selected from polyhydric alcohols or mixtures thereof, and a non-tacky solvent selected from monohydric alcohols or mixtures thereof.

Notwithstanding, there remains a need for flux compositions that are non-curing, facilitate reliable soldering connections and are customizable to facilitate compatibility with conventional epoxy based under fill materials.

The present invention provides an amine flux composition comprising, as an initial component: an amine fluxing agent represented by formula I:

wherein R¹, R², R³ and R⁴ are independently selected from a hydrogen, a substituted C_1-80 alkyl group, an unsubstituted C_1-80 alkyl group, a substituted C_7-80 arylalkyl group and an unsubstituted C_7-80 arylalkyl group; wherein R⁷ and R⁸ are independently selected from a C_1-20 alkyl group, a substituted C_1-20 alkyl group, a C_6-20 aryl group and a substituted C_6-20 aryl group or wherein R⁷ and R⁸, together with the carbon to which they are attached, form a C_3-20 cycloalkyl ring optionally substituted with a C_1-6 alkyl group; wherein R¹⁰ and R¹¹ are independently selected from a C_1-20 alkyl group, a substituted C_1-20 alkyl group, a C_6-20 aryl group and a substituted C_6-20 aryl group or wherein R¹⁰ and R¹¹, together with the carbon to which they are attached, form a C_3-20 cycloalkyl ring optionally substituted with a C_1-6 alkyl group; and, wherein R⁹ is selected from a hydrogen, a C_1-30 alkyl group, a substituted C_1-30 alkyl group, a C_6-30 aryl group and a substituted C_6-30 aryl group.

The present invention provides a method of applying solder to an electrical contact, comprising: providing an electrical contact; providing an amine flux composition of the present invention; applying the amine flux composition to the electrical contact; providing a solder; melting the solder; and, displacing the amine flux composition applied to the electrical contact with the molten solder; wherein the molten solder makes physical contact with the electrical contact and bonds to the electrical contact.

DETAILED DESCRIPTION

The amine flux composition of the present invention is designed to facilitate compatibilization with various under fill compositions, such that, the soldered surfaces preferably do not require cleaning before application of an under fill composition to form a finished electrical joint.

The term “no clean flux composition” as used herein and in the appended claims refers to amine flux compositions that exhibit a low, or no, amine flux residue activity with <0.5 wt % halide content (i.e., amine fluxes that are categorized as an ORL1 or ORL0 under IPC J-STD-004B).

The amine flux composition of the present invention comprises (consists essentially of), as an initial component: an amine fluxing agent represented by formula I. Preferably, the amine flux composition is a non-curing composition (i.e., wherein the amine flux composition is free of compounds having two or more reactive functional groups per molecule capable of reacting under soldering conditions to form inter molecular covalent bonds and wherein the amine fluxing agent does not contain two or more reactive functional groups per molecule capable of reacting under soldering conditions to form inter molecular covalent bonds).

The amine fluxing agent used in the amine flux composition of the present invention is according to formula I, wherein R¹, R², R³ and R⁴ are independently selected from hydrogen, a substituted C_1-80 alkyl group, an unsubstituted C_1-80 alkyl group, a substituted C_7-80 arylalkyl group and an unsubstituted C_7-80 arylalkyl group (preferably wherein R¹, R², R³ and R⁴ are independently selected from a hydrogen, a substituted C_1-20 alkyl group, an unsubstituted C_1-20 alkyl group, a substituted C_7-30 arylalkyl group and an unsubstituted C_7-30 arylalkyl group); wherein R⁷ and R⁸ are independently selected from a C_1-20 alkyl group, a substituted C_1-20 alkyl group, a C_6-20 aryl group and a substituted C_6-20 aryl group (alternatively, wherein R⁷ and R⁸, together with the carbon to which they are attached, form a C_3-20 cycloalkyl ring optionally substituted with a C_1-6 alkyl group); wherein R¹⁰ and R¹¹ are independently selected from a C_1-20 alkyl group, a substituted C_1-20 alkyl group, a C_6-20 aryl group and a substituted C_6-20 aryl group (alternatively, wherein R¹⁰ and R¹¹, together with the carbon to which they are attached, form a C_3-20 cycloalkyl ring optionally substituted with a C_1-6 alkyl group); and, wherein R⁹ is selected from a hydrogen, a C_1-30 alkyl group, a substituted C_1-30 alkyl group, a C_6-30 aryl group and a substituted C_6-30 aryl group. Preferably, zero to three of R¹, R², R³ and R⁴ is(are) hydrogen. The R¹, R², R³, R⁴, R⁷, R⁸, R⁹, R¹⁰ and R¹¹ groups of the amine fluxing agent according to formula I are preferably selected: to provide the amine fluxing agent with desirable rheological properties for a given application; optionally, to compatibilize the amine fluxing agent with a given solvent package for delivery to the surface(s) to be soldered; and, optionally, to compatibilize the amine fluxing agent with a given encapsulating composition (e.g., an epoxy resin) to be used post soldering to form an encapsulated solder joint (e.g., for use in conventional flip chip under fill applications). Preferably, the R¹, R², R³, R⁴, R⁷, R⁸, R⁹, R¹⁰ and R¹¹ groups of the amine fluxing agent according to formula I are selected to compatibilize the amine fluxing agent with a given encapsulating composition such that the amine flux composition is a no clean flux composition. Preferably, zero to three of R¹, R², R³ and R⁴ is(are) hydrogen. More preferably, one to three of R¹, R², R³ and R⁴ is(are) hydrogen. Still more preferably, two to three of R¹,R², R³ and R⁴ are hydrogen. Yet still more preferably, two of R¹, R², R³ and R⁴ are hydrogen. Most preferably, one of R¹ and R² is hydrogen and one of R³ and R⁴ is hydrogen. Also, the R¹, R², R³, R⁴, R⁷, R⁸, R⁹, R¹⁰ and R¹¹ groups of the amine fluxing agent according to formula I are preferably selected to provide the amine fluxing agent with a boiling point temperature, determined by differential scanning calorimetry of ≧125° C. (more preferably ≧250° C.) and a percent weight loss of ≦10 wt % upon heating to 250° C. determined by thermogravimetric analysis (TGA) using a temperature ramp of 10° C./min starting at 25° C.

Preferably, the amine fluxing agent used in the amine fluxing composition of the present invention is according to formula I; wherein R¹, R², R³ and R⁴ are independently selected from a hydrogen, a substituted C_1-80 alkyl group, an unsubstituted C_1-80 alkyl group, a substituted C_7-80 arylalkyl group and an unsubstituted C_7-80 arylalkyl group; and, wherein the substitutions in the substituted C_1-80 alkyl group and the substituted C_7-80 arylalkyl group are selected from at least one of an —OH group, an —OR⁵ group, a —COR⁵— group, a —COR⁵ group, a —C(O)R⁵ group, a —CHO group, a —COOR⁵ group, an —OC(O)OR⁵ group, a —S(O)(O)R⁵ group, a —S(O)R⁵ group, a —S(O)(O)NR⁵₂ group, an —OC(O)NR⁶₂ group, a —C(O)NR⁶₂ group, a —CN group, a —N(R⁶)— group and a —NO₂ group (preferably at least one of an —OH group, an —OR⁵ group, a —COR⁵— group, a —COR⁵ group, a —C(O)R⁵ group, a —CHO group, a —COOR⁵ group, an —OC(O)OR⁵ group, a —S(O)(O)R⁵ group, a —S(O)R⁵ group, a —S(O)(O)NR⁵₂ group, an —OC(O)NR⁶₂ group, a —C(O)NR⁶₂ group, a —CN group and a —NO₂ group); wherein R⁵ is selected from a C_1-28 alkyl group, a C_3-28 cycloalkyl group, a C_6-15 aryl group, a C_7-28 arylalkyl group and a C_7-28 alkylaryl group; wherein R⁶ is selected from a hydrogen, a C_1-28 alkyl group, a C_3-28 cycloalkyl group, a C_6-15 aryl group, a C_7-28 arylalkyl group and a C_7-28 alkylaryl group. The substituted C_1-80 alkyl group and the substituted C_7-80 arylalkyl group can contain combinations of substitutions. For example, the substituted C_1-80 alkyl group and the substituted C_7-80 arylalkyl group can: contain more than one of the same type of substitution (e.g., two —OH groups); contain more than one type of substitution (e.g., an —OH group and a —COR⁵— group); contain more than one type of substitution with more than one of the same type of substitution (e.g., two —OH groups and an —OR⁵ group).

Preferably, the amine fluxing agent used in the amine fluxing composition of the present invention is according to formula I; wherein R⁷ and R⁸ are independently selected from a C_1-20 alkyl group, a substituted C_1-20 alkyl group, a C_6-20 aryl group and a substituted C_6-20 aryl group (alternatively, wherein R⁷ and R⁸, together with the carbon to which they are attached, form a C_3-20 cycloalkyl ring optionally substituted with a C_1-6 alkyl group); and wherein the substitutions in the substituted C_1-20 alkyl group and the substituted C_6-20 aryl group are selected from at least one of an —OH group, a phenyl group, a C_1-14 alkyl group, an —OR¹² group, a —COR¹²— group, a —COR¹² group, a —C(O)R¹² group, a —CHO group, a —COOR¹² group, an —OC(O)OR¹² group, a —S(O)(O)R¹² group, a —S(O)R¹² group, a —S(O)(O)NR¹³₂ group, an —OC(O)NR¹³₂ group, a —C(O)NR¹³₂ group, a —CN group, a —N(R¹³)— group and a —NO₂ group (preferably at least one of an —OH group, an —OR¹² group, a —COR¹²— group, a —COR¹² group, a —C(O)R¹² group, a —CHO group, a —COOR¹² group, an —OC(O)OR¹² group, a —S(O)(O)R¹² group, a —S(O)R¹² group, a —S(O)(O)NR¹²₂ group, an —OC(O)NR¹³₂ group, a —C(O)NR¹³₂ group, a —CN group and a —NO₂ group); wherein R¹² is selected from a C_1-19 alkyl group, a C_3-19 cycloalkyl group, a C_6-19 aryl group, a C_7-19 arylalkyl group and a C_7-19 alkylaryl group; and wherein R¹³ is selected from a hydrogen, a C_1-19 alkyl group, a C_3-19 cycloalkyl group, a C_6-19 aryl group, a C_7-19 arylalkyl group and a C_7-19 alkylaryl group. The substituted C_1-20 alkyl group and the substituted C_6-20 aryl group can contain combinations of substitutions. For example, the substituted C_1-20 alkyl group and the substituted C_6-20 aryl group can: contain more than one of the same type of substitution (e.g., two —OH groups); contain more than one type of substitution (e.g., an —OH group and a —COR¹² — group); contain more than one type of substitution with more than one of the same type of substitution (e.g., two —OH groups and an —OR¹² group).

Preferably, the amine fluxing agent used in the amine fluxing composition of the present invention is according to formula I; wherein R¹⁰ and R¹¹ are independently selected from a C_1-20 alkyl group, a substituted C_1-20 alkyl group, a C_6-20 aryl group and a substituted C_6-20 aryl group (alternatively, wherein R¹⁰ and R¹¹, together with the carbon to which they are attached, form a C_3-20 cycloalkyl ring optionally substituted with a C_1-6 alkyl group); and, wherein the substitutions in the substituted C_1-20 alkyl group and the substituted C_6-20 aryl group are selected from at least one of an —OH group, an —OR¹² group, a —COR¹²— group, a —COR¹² group, a —C(O)R¹² group, a —CHO group, a —COOR¹² group, an —OC(O)OR¹² group, a —S(O)(O)R¹² group, a —S(O)R¹² group, a —S(O)(O)NR¹²₂ group, an —OC(O)NR¹³₂ group, a —C(O)NR¹³₂ group, a —CN group, a —N(R¹³)— group and a —NO₂ group (preferably at least one of an —OH group, an —OR¹² group, a —COR¹²— group, a —COR¹² group, a —C(O)R¹² group, a —CHO group, a —COOR¹² group, an —OC(O)OR¹² group, a —S(O)(O)R¹² group, a —S(O)R¹² group, a —S(O)(O)NR¹²₂ group, an —OC(O)NR¹³₂ group, a —C(O)NR¹³₂ group, a —CN group and a —NO₂ group); wherein R¹² is selected from a C_1-19 alkyl group, a C_3-19 cycloalkyl group, a C_6-19 aryl group, a C_7-19 arylalkyl group and a C_7-19 alkylaryl group; and wherein R¹³ is selected from a hydrogen, a C_1-19 alkyl group, a C_3-19 cycloalkyl group, a C_6-19 aryl group, a C_7-19 arylalkyl group and a C_7-19 alkylaryl group. The substituted C_1-20 alkyl group and the substituted C_6-20 aryl group can contain combinations of substitutions. For example, the substituted C_1-20 alkyl group and the substituted C_6-20 aryl group can: contain more than one of the same type of substitution (e.g., two —OH groups); contain more than one type of substitution (e.g., an —OH group and a —COR¹²— group); contain more than one type of substitution with more than one of the same type of substitution (e.g., two —OH groups and an —OR¹² group).

Preferably, the amine fluxing agent used in the amine fluxing composition of the present invention is according to formula I; wherein R⁹ is selected from a hydrogen, a C_1-30 alkyl group, a substituted C_1-30 alkyl group, a C_6-30 aryl group and a substituted C_6-30 aryl group; and, wherein the substitutions in the substituted C_1-30 alkyl group and the substituted C_6-30 aryl group are selected from at least one of an —OH group, an —OR¹⁴ group, a —COR¹⁴— group, a —COR¹⁴ group, a —C(O)R¹⁴ group, a —CHO group, a —COOR¹⁴ group, an —OC(O)OR¹⁴ group, a —S(O)(O)R¹⁴ group, a —S(O)R¹⁴ group, a —S(O)(O)NR¹⁴₂ group, an —OC(O)NR¹⁵₂ group, a —C(O)NR¹⁵₂ group, a —CN group, a —N(R¹⁵)— group and a —NO₂ group (preferably at least one of an —OH group, an —OR¹⁴ group, a —COR¹⁴— group, a —COR¹⁴ group, a —C(O)R¹⁴ group, a —CHO group, a —COOR¹⁴ group, an —OC(O)OR¹⁴ group, a —S(O)(O)R¹⁴ group, a —S(O)R¹⁴ group, a —S(O)(O)NR¹⁴₂ group, an —OC(O)NR¹⁵₂ group, a —C(O)NR¹⁵₂ group, a —CN group and a —NO₂ group); wherein R¹⁴ is selected from a C_1-29 alkyl group, a C_3-29 cycloalkyl group, a C_6-29 aryl group, a C_7-29 arylalkyl group and a C_7-29 alkylaryl group; and wherein R¹⁵ is selected from a hydrogen, a C_1-29 alkyl group, a C_3-29 cycloalkyl group, a C_6-29 aryl group, a C_7-29 arylalkyl group and a C_7-29 alkylaryl group. The substituted C_1-30 alkyl group and the substituted C_6-30 aryl group can contain combinations of substitutions. For example, the substituted C_1-30 alkyl group and the substituted C_6-30 aryl group can: contain more than one of the same type of substitution (e.g., two —OH groups); contain more than one type of substitution (e.g., an —OH group and a —COR¹⁴— group); contain more than one type of substitution with more than one of the same type of substitution (e.g., two —OH groups and an —OR¹⁴ group).

More preferably, the amine fluxing agent used in the amine fluxing composition of the present invention is according to formula I; wherein R¹, R², R³ and R⁴ are independently selected from a hydrogen, a substituted C_1-20 alkyl group, an unsubstituted C_1-20 alkyl group, a substituted C_7-30 arylalkyl group and an unsubstituted C_7-30 arylalkyl group; and, wherein the substitutions in the substituted C_1-20 alkyl group and the substituted C_7-30 arylalkyl group are selected from at least one of an —OH group, an —OR¹⁶ group, a —COR¹⁶— group, a —COR¹⁶ group, a —C(O)R¹⁶ group, a —CHO group, a —COOR¹⁶ group, an —OC(O)OR¹⁶ group, a —S(O)(O)R¹⁶ group, a —S(O)R¹⁶ group, a —S(O)(O)NR¹⁶₂ group, an —OC(O)NR¹⁷₂ group, a —C(O)NR¹⁷₂ group, a —CN group, a —N(R¹⁷)— group and a —NO₂ group (preferably at least one of an —OH group, an —OR¹⁶ group, a —COR¹⁶— group, a —COR¹⁶ group, a —C(O)R¹⁶ group, a —CHO group, a —COOR¹⁶ group, an —OC(O)OR¹⁶ group, a —S(O)(O)R¹⁶ group, a —S(O)R¹⁶ group, a —S(O)(O)NR¹⁶₂ group, an —OC(O)NR¹⁷₂ group, a —C(O)NR¹⁷₂ group, a —CN group and a —NO₂ group); wherein R¹⁶ is selected from a C_1-19 alkyl group, a C_3-19 cycloalkyl group, a C_6-15 aryl group, a C_7-19 arylalkyl group and a C_7-19 alkylaryl group; wherein R¹⁷ is selected from a hydrogen, a C_1-19 alkyl group, a C_3-19 cycloalkyl group, a C_6-15 aryl group, a C_7-19 arylalkyl group and a C_7-19 alkylaryl group; wherein R⁷ and R⁸ are independently selected from a C_1-4 alkyl group and a C_1-4 hydroxy alkyl group (more preferably wherein R⁷ and R⁸ are independently selected from a methyl group and a hydroxy methyl group; most preferably wherein R⁷ and R⁸ are both a methyl group); wherein R¹⁰ and R¹¹ are independently selected from a C_1-4 alkyl group and a C_1-4 hydroxy alkyl group (more preferably wherein R¹⁰ and R¹¹ are independently selected from a methyl group and a hydroxy methyl group; most preferably wherein R¹⁰ and R¹¹ are both a methyl group); and, wherein R⁹ is selected from a hydrogen, a C_1-10 alkyl group, a C_1-10 hydroxyalkyl group, a phenyl group, a hydroxyphenyl group, a C_7-10 alkylaryl group, a C_7-10 arylalkyl group and a naphthyl group (more preferably wherein R⁹ is selected from a hydrogen, a C_1-4 alkyl group, a C_1-4 hydroxyl alkyl group, a phenyl group, a hydroxyl phenyl group, a C₇ alkylaryl group and a C₇ arylalkyl group; most preferably wherein R⁹ is selected from a methyl group and a phenyl group). The substituted C_1-20 alkyl group and the substituted C_7-30 arylalkyl group, from which R¹, R², R³ and R⁴ are selected, can contain combinations of substitutions. For example, the substituted C_1-20 alkyl group and the substituted C_7-30 arylalkyl group can: contain more than one of the same type of substitution (e.g., two —OH groups); contain more than one type of substitution (e.g., an —OH group and a —COR¹⁶- group); contain more than one type of substitution with more than one of the same type of substitution (e.g., two —OH groups and an —OR¹⁶ group). Preferably, zero to three of R¹, R², R³ and R⁴ is(are) hydrogen. More preferably, one to three of R¹, R², R³ and R⁴ is(are) hydrogen. Still more preferably, two to three of R¹, R², R³ and R⁴ are hydrogen. Yet still more preferably, two of R¹, R², R³ and R⁴ are hydrogen. Most preferably, one of R¹ and R² is hydrogen and one of R³ and R⁴ is hydrogen.

Still more preferably, the amine fluxing agent used in the amine fluxing composition of the present invention is according to formula I; wherein R¹, R², R³ and R⁴ are independently selected from a hydrogen, a —CH₂CH(OH)R¹⁸ and a —CH₂CH(OH)CH₂—O—R¹⁸ group; wherein R¹⁸ is selected from a hydrogen, a C_1-28 alkyl group, a C_3-28 cycloalkyl group, a C_6-15 aryl group, a C_7-28 arylalkyl group and a C_7-28 alkylaryl group (preferably, wherein R¹⁸ is selected from a C_5-10 alkyl group, a C_6-15 aryl group and a C_7-15 alkylaryl group; most preferably wherein R¹⁸ is selected from a C₈ alkyl group, a C₇ alkylaryl group and a C₁₀ naphthyl group); wherein R⁷ and R⁸ are independently selected from a C_1-4 alkyl group and a C_1-4 hydroxy alkyl group (more preferably wherein R⁷ and R⁸ are independently selected from a methyl group and a hydroxy methyl group; most preferably wherein R⁷ and R⁸ are both a methyl group); wherein R¹⁰ and R¹¹ are independently selected from a C_1-4 alkyl group and a C_1-4 hydroxy alkyl group (more preferably wherein R¹⁰ and R¹¹ are independently selected from a methyl group and a hydroxy methyl group; most preferably wherein R¹⁰ and R¹¹ are both a methyl group); and, wherein R⁹ is selected from a hydrogen, a C_1-10 alkyl group, a C_1-10 hydroxyalkyl group, a phenyl group, a hydroxyphenyl group, a C_7-10 alkylaryl group, a C_7-10 arylalkyl group and a naphthyl group (more preferably wherein R⁹ is selected from a hydrogen, a C_1-4 alkyl group, a C_1-4 hydroxyl alkyl group, a phenyl group, a hydroxyl phenyl group, a C₇ alkylaryl group and a C₇ arylalkyl group; most preferably wherein R⁹ is selected from a methyl group and a phenyl group). Preferably, zero to three of R¹, R², R³ and R⁴ is(are) hydrogen. More preferably, one to three of R¹, R², R³ and R⁴ is(are) hydrogen. Still more preferably, two to three of R¹, R², R³ and R⁴ are hydrogen. Yet still more preferably, two of R¹, R², R³ and R⁴ are hydrogen. Most preferably, one of R¹ and R² is hydrogen and one of R³ and R⁴ is hydrogen.

Most preferably, the amine fluxing agent used in the amine flux composition of the present invention is according to formula I; wherein R¹, R², R³ and R⁴ are independently selected from a hydrogen, a —CH₂CH(OH)R¹⁸ and a —CH₂CH(OH)CH₂—O—R¹⁸ group; wherein R¹⁸ is selected from a hydrogen, a —CH₂CH(OH)R¹⁸ and a —CH₂CH(OH)CH₂—O—R¹⁸ group; wherein R¹⁸ is selected from a hydrogen, a C_1-28 alkyl group, a C_3-28 cycloalkyl group, a C_6-16 aryl group, a C_7-28 arylalkyl group and a C_7-28 alkylaryl group (preferably, wherein R¹⁸ is selected from a C_5-10 alkyl group, a C_6-16 aryl group and a C_7-15 alkylaryl group; more preferably wherein R¹⁸ is selected from a C₈ alkyl group, a C₇ alkylaryl group, a naphthyl group, a biphenyl group and a substituted C_12-16 biphenyl group; most preferably, wherein R¹⁸ is selected from a C₈ alkyl group, a C₇ alkylaryl group and a naphthyl group); wherein R⁷ and R⁸ are both a methyl group; wherein R¹⁰ and R¹¹ are both a methyl group; and, wherein R⁹ is selected a methyl group and a phenyl group. Preferably, zero to three of R¹, R², R³ and R⁴ is(are) a hydrogen. More preferably, one to three of R¹, R², R³ and R⁴ is(are) hydrogen. Still more preferably, two to three of R¹, R², R³ and R⁴ are hydrogen. Yet still more preferably, two of R¹, R², R³ and R⁴ are hydrogen. Most preferably, R¹ and R³ are hydrogen; and, R² and R⁴ are selected from a —CH₂CH(OH)R¹⁸ and a —CH₂CH(OH)CH₂—O—R¹⁸ group.

The amine flux composition of the present invention optionally further comprises a solvent. Solvent is optionally included in the amine flux composition of the present invention to facilitate delivery of the amine fluxing agent to the surface, or surfaces, to be soldered. Preferably, the amine flux composition contains 8 to 95 wt % solvent. Solvent used in the amine flux composition of the present invention is preferably an organic solvent selected from hydrocarbons (e.g., dodecane, tetradecane); aromatic hydrocarbons (e.g., benzene, toluene, xylene, trimethylbenzene, butyl benzoate, dodecylbenzene); ketones (e.g., methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone); ethers (e.g., tetrahydrofuran, 1,4-dioxaneandtetrahydrofuran, 1,3-dioxalane, diprolylene glycol dimethyl ether); alcohols (e.g., 2-methoxy-ethanol, 2-butoxyethanol, methanol, ethanol, isopropanol, α-terpineol, benzyl alcohol, 2-hexyldecanol,); esters (e.g., ethyl acetate, ethyl lactate, butyl acetate, diethyl adipate, diethyl phthalate, diethylene glycol monobutyl acetate, ethyl lactate, methyl 2-hydroxyisobutyrate, propylene glycol monomethyl ether acetate); and, amides (e.g., N-methylpyrrolidone, N,N-dimethylformamide and N,N-dimethylacetamide); glycol derivatives (e.g., cellosolve, butyl cellosolve); glycols (e.g., ethylene glycol; diethylene glycol; dipropylene glycol; triethylene glycol; hexylene glycol; 1,5-pentanediol); glycol ethers (e.g., propylene glycol monomethyl ether, methyl carbitol, butyl carbitol, triethylene glycol monomethyl ether, triethylene glycol dimethyl ether, tetraethylene glycol dimethyl ether, diethylene glycol monomethyl ether, diethylene glycol monobutyl ether, diethylene glycol monohexyl ether, ethylene glycol monophenyl ether, diethylene glycol monophenyl ether, diethylene glycol-2-ethylhexyl ether,); and petroleum solvents (e.g., petroleum ether, naptha). More preferably, the solvent used in the amine flux composition of the present invention is an organic solvent selected from methyl ethyl ketone; 2-propanol; propylene glycol monomethyl ether; propylene glycol monomethyl ether acetate; ethyl lactate and methyl 2-hydroxy isobutyrate. Most preferably, the solvent used in the amine flux composition of the present invention is propylene glycol monomethyl ether.

The amine flux composition of the present invention optionally further comprises a thickening agent. Preferably, the amine flux composition contains 0 to 30 wt % thickening agent. Thickening agent used in the amine flux composition of the present invention can be selected from non-curing resin materials (i.e., <2 reactive functional groups per molecule), such as, for example, a non-curing novolac resin.

The amine flux composition of the present invention optionally further comprises a thixotropic agent. Preferably, the amine flux composition contains 1 to 30 wt % thixotropic agent. Thixotropic agent used in the amine flux composition of the present invention can be selected from fatty acid amides (e.g., stearamide, hydroxystearic acid bisamide); fatty acid esters (e.g., castor wax, beeswax, carnauba wax); organic thixotropic agents (e.g., polyethylene glycol, polyethylene oxide, methyl cellulose, ethyl cellulose, hydroxyethyl cellulose, hydroxypropyl cellulose, diglycerine monooleate, deglycerine laurate, decaglycerine oleate, diglycerine monolaurate, sorbitan laurate); inorganic thixotropic agents (e.g., silica powders, kaolin powders). Preferably, the thixotropic agent used is selected from a polyethylene glycol and a fatty acid amide.

The amine flux composition of the present invention optionally further comprise an inorganic filler. Inorganic fillers can be selected from alumina, aluminum hydroxide, aluminosilicate, cordierite, lithium aluminum silicate, magnesium aluminate, magnesium hydroxide, clay, talc, antimony trioxide, antimony pentoxide, zinc oxide, colloidal silica, fused silica, glass powder, quartz powder and glass microspheres.

The amine flux composition of the present invention optionally further comprises an antioxidant. Preferably, the amine flux composition of the present invention contains 0.01 to 30 wt % antioxidant.

The amine flux composition of the present invention optionally further comprises an additive selected from matting agents, coloring agents, defoaming agents, dispersion stabilizers, chelating agents, thermoplastic particles, UV impermeable agents, flame retardants, leveling agents, adhesion promoters and reducing agents.

The amine flux composition of the present invention preferably comprises (consists essentially of), as an initial component: 3.99 to 100 wt % of an amine fluxing agent represented by formula I. Preferably, the amine flux composition of the present invention comprises (consists essentially of), as initial components: 3.99 to 100 wt % of an amine fluxing agent represented by formula I, 0 to 95 wt % (more preferably 8 to 95 wt %) of a solvent, 0 to 30 wt % thickening agent, 0 to 30 wt % (more preferably 1 to 30 wt %) of a thixotropic agent, and 0 to 30 wt % (more preferably 0.01 to 30 wt %) of an antioxidant.

The amine flux composition of the present invention can be used in, for example, the production of electronic components, electronic modules and printed circuit boards. The amine flux composition can be applied to the surface(s) to be soldered by any conventional technique including, for example, liquid spray techniques, liquid foaming techniques, pick and dip techniques and wave techniques or any other conventional technique capable of dispensing a liquid or semisolid onto a silicon die or substrate.

The amine flux composition of the present invention optionally further comprises a solder powder; wherein the amine flux composition is a solder paste. Preferably, the solder powder is an alloy selected from Sn/Pb, Sn/Ag, Sn/Ag/Cu, Sn/Cu, Sn/Zn, Sn/Zn/Bi, Sn/Zn/Bi/In, Sn/Bi and Sn/In (preferably wherein the solder powder is an alloy selected from 63 wt % Sn/37 wt % Pb; 96.5 wt % Sn/3.5 wt % Ag; 96 wt % Sn/3.5 wt % Ag/0.5 wt % Cu; 96.4 wt % Sn/2.9 wt % Ag/0.5 wt % Cu; 96.5 wt % Sn/3 wt % Ag/0.5 wt % Cu; 42 wt % Sn/58 wt % Bi; 99.3 wt % Sn/0.7 wt % Cu; 91 wt % Sn/9 wt % Zn and 89 wt % Sn/8 wt % Zn/3 wt % Bi).

The solder paste preferably comprises: 1 to 50 wt % (more preferably 5 to 30 wt %, most preferably 5 to 15 wt %) of an amine fluxing agent and 50 to 99 wt % of a solder powder. The solder paste can be compounded by conventional techniques, for example, by kneading and mixing the solder powder with the amine fluxing agent using conventional equipment for such operations.

The solder paste can be used in, for example, the production of electronic components, electronic modules and printed circuit boards. The solder paste can be applied to the surface(s) to be soldered by any conventional technique including, for example, printing the solder paste through a conventional solder mask using a solder printer or screen printer.

The amine fluxing agent used in the amine flux composition of the present invention can be prepared using conventional synthesis techniques well known to those of ordinary skill in the art.

The method of applying solder to an electrical contact of the present invention comprises: providing an electrical contact; providing an amine flux composition of the present invention; applying the amine flux composition to the electrical contact; providing a solder; melting the solder; and, displacing the amine flux composition applied to the electrical contact with the molten solder; wherein the molten solder makes physical contact with the electrical contact and bonds to the electrical contact. In the method, the molten solder desirably comes into intimate contact with the electrical contact to facilitate formation of a metallic bond between the solder material and the electrical contact, providing a good mechanical and electrical bond between the solder and the electrical contact. Any conventional soldering technique can be used in the method of the present invention. For example, a soldering bit or iron can be used to heat the electrical contact and the solder to a temperature above the melting point temperature for the solder. A soldering bath can be used, wherein solder in a liquid state is transferred to the electrical contact through immersion of the electrical contact into the molten solder. Conventional wave soldering techniques can be implemented. Also, reflow soldering techniques can also be used, wherein solder previously deposited onto a second electrical contact is brought into proximity with the first electrical contact and heated to a temperature above the melting point temperature of the solder, wherein the solder melts and reflows, coming into contact with both the first electrical contact and the second electrical contact, forming an electrical contact between the first electrical contact and the second electrical contact.

The method of applying solder to an electrical contact of the present invention can optionally be part of a flip chip soldering process, wherein a semiconductor chip is mounted onto a printed circuit board, wherein the semiconductor chip comprises a plurality of first electrical contacts and wherein the printed circuit board comprises a plurality of second electrical contacts. In such flip chip method, the amine flux composition of present invention is applied to either one, or both, of the plurality of first electrical contacts and the plurality of second electrical contacts to facilitate solder bonding of the plurality of first electrical contacts to the plurality of second electrical contacts to form electrical inter connects. Preferably, the flip chip solder process further comprises an under fill step wherein a thermosetting resin is provided to encapsulate the electrical inter connects. Most preferably, the thermosetting resin is an epoxy resin.

Some embodiments of the present invention will now be described in detail in the following Examples.

EXAMPLE 1

Synthesis of Amine Fluxing Agent

A 2,6-diamino-2,5,6-trimethylheptan-3-ol amine fluxing agent was prepared using the following procedure. First, a 2,5,6-trimethyl-2,6-dinitroheptan-3-ol intermediate was prepared using the following synthesis method

Specifically, a three neck round bottom flask was equipped with a stir bar, a thermocouple, a dropping funnel capped with a nitrogen inlet and a condenser. The flask was then charged with 2-nitropropane (50 g, 0.56 mols, 5.0 equivalents) and a catalytic amount of 1,8-diazabicyclo[5.4.0]undec-7-ene. The contents of the flask were then stirred under nitrogen for thirty minutes. Then crotonaldehyde (7.9 g, 9.2 mL, 0.112 moles, 1.0 equivalent) was added to the flask drop-wise over a period of twenty minutes. The contents of the flask were then stirred under nitrogen for 5-6 hours, during which a white solid was observed to precipitate from the solution. At this point, GC analysis showed the absence of any crotonaldehyde in the reaction mixture. The contents of the flask were allowed to stir overnight under nitrogen. The precipitate was then vacuum filtered from the solution and was washed thoroughly with water yielding a white solid. The intermediate solid was air dried, followed by vacuum drying at 45° C. The total yield of the desired intermediate dinitro alcohol was 72% (27.8 g). Nuclear magnetic resonance testing (“NMR”) and liquid chromatography (“LC”) showed that the intermediate was >99% pure.

Second, the product 2,6-diamino-2,5,6-trimethylheptan-3-ol amine fluxing agent was then prepared from the intermediate dinitro alcohol using the following synthesis method

Specifically, 25 g of the intermediate dinitro alcohol was dissolved in 200 mL methanol with 14.2 g of RaNi 3111 as a catalyst. The mixture was then hydrogenated in an autoclave at 60° C. under 4,137 kPa (600 psi) of hydrogen pressure. After workup which included filtration of the catalyst and removal of methanol, 11 g (59% yield) of a low viscosity liquid product was obtained. NMR and gas chromatograph-mass spectroscopy (“GC-MS”) analysis confirmed the presence of the desired product 2,6-diamino-2,5,6-trimethylheptan-3-ol amine fluxing agent. Chemical ionization mass spectroscopy (CI-MS) showed [M+H]=189 and GC analysis showed that the purity of the product to be 94%. The boiling point of the material was 125° C. to 135° C. at 0.68 kPa (5.1 torr). ¹³C NMR (CDCl₃): δ 16.8, 25.2, 27.9, 30.8, 34.7, 42.2, 51.8, 52.8 and 77.3 ppm.

EXAMPLE 2

Synthesis of Amine Fluxing Agent

A 2,6-diamino-2,6-dimethyl-5-phenylheptan-3-ol amine fluxing agent was prepared using the following procedure. First, a 2,6-dimethyl-2,6-dinitro-5-phenylheptan-3-ol intermediate was prepared using the following synthesis method

Specifically, a three neck round bottom flask was equipped with a stir bar, a thermocouple, a dropping funnel capped with a nitrogen inlet and a condenser. The flask was then charged with 2-nitropropane (101.1 g, 1.14 mols, 6.0 equivalents) and a catalytic amount of 1,8-diazabicyclo[5.4.0]undec-7-ene (“DBU”). The contents of the flask were then stirred under nitrogen for twenty minutes. Then trans-cinnamaldehyde (25.0 g, 0.19 moles, 1.0 equivalent) was added to the flask drop-wise over a period of twenty minutes. During the addition of the trans-cinnamldehyde, an exotherm of approximately 22° C. was observed. Following the complete addition of the trans-cinnamaldehyde, the flask contents were heated to 50° C. and maintained at that temperature for 4 hours. The mixture was then allowed to cool to room temperature. When the flask contents reached 36.8° C., a pale yellow solid formed out of the solution. The flask contents were then filtered through a Buchner funnel and the recovered intermediate diamino alcohol powder was washed thoroughly with pentane and ether. The intermediate diamino alcohol powder was then left to dry under vacuum for 1 hour. The total yield of the desired diamino alcohol intermediate was 62% (36 g). NMR analysis showed that the diamino alcohol intermediate was >99% pure. ¹H NMR (CDCl₃): δ 1.45-2.27 (m, 15H), 3.52-3.54 (m, 1H), 3.67-3.74 (m, 1H), 7.17-7.34 (m, 5H). ¹³C NMR (CDCl₃): δ 20.8, 22.4, 23.2, 25.8, 31.3, 50.3, 72.9, 91.5, 91.6, 128.1, 128.7, 129.4, 136.6 ppm.

Second, the product 2,6-diamino-2,6-dimethyl-5-phenylheptane-3-ol amine fluxing agent was then prepared from the dinitro alcohol intermediate using the following synthesis method

Specifically, 50 g of the dinitro alcohol intermediate was dissolved in 300 mL methanol with 24.3 g of RaNi 3111 as a catalyst. The mixture was then hydrogenated in an autoclave at 60° C. under 4137 kPa (600 psi) of hydrogen pressure. After workup which included filtration of the catalyst and removal of methanol, 40 g (68% yield) of a high viscosity liquid product was obtained. NMR and gas chromatograph-mass spectroscopy (“GC-MS”) analysis confirmed the presence of the desired product 2,6-diamino-2,6-dimethyl-5-phenylheptane-3-ol amine fluxing agent. Chemical ionization mass spectroscopy (CI-MS) showed [M+H]=251 and GC analysis showed that the purity of the product to be 78% straight from the autoclave. The rest of the material present appeared to be the mono adduct obtained from the reversal of the Henry reaction. The product was then purified to 96.2% purity by vacuum distillation. The boiling point of the purified product was determined to be 150° C. to 160° C. at 0.67 kPa (5.0 torr). ¹H NMR (CDCl₃): δ 0.91-0.99 (m, 12H), 1.67-1.81 (m, 3H), 2.71-2.76 (m, 2H), 7.08-7.23 (m, 5H). ¹³C NMR (CDCl₃): δ 24.6, 27.9, 28.3, 29.8, 31.6, 51.8, 52.6, 54.2, 75.9, 126.3, 127.8, 129.4, 142.0 ppm.

EXAMPLE 3

Synthesis of Amine Fluxing Agent

An amine fluxing agent having the formula

was prepared using the following procedure. Specifically, into a reaction vessel with a stir bar, (0.05 mol) of the product of Example 1 was added. The reaction vessel was then placed on a hotplate with magnetic stirring capability. The reaction vessel was then inerted with nitrogen and (0.1 mol) of 2-ethylhexyl glycidyl ether (available from Momentive Performance Materials) was then added to the reaction vessel at ambient temperature, with stirring. The set point temperature on the hot plate was then raised to 75° C. and the contents of the reaction vessel were allowed to continue stirring for two (2) hours. The set point temperature of the hot plate was then raised to 140° C. and the contents of the reaction vessel were allowed to continue stirring for two (2) more hours. The set point temperature of the hot plate was then reduced to 80° C. and a vacuum was pulled on the reaction vessel, reducing the pressure in the vessel to 30 mm Hg. The contents of the reaction vessel were allowed to continue stirring under these conditions for another two (2) hours to provide the product fluxing agent. The percent weight loss from the product fluxing agent upon heating to 250° C. was measured by thermogravimetric analysis (TGA) using a temperature ramp of 10° C./min starting at 25° C. The measured weight loss (WL) for the product fluxing agent was 9 wt %.

EXAMPLE 4

Synthesis of Amine Fluxing Agent

An amine fluxing agent having the formula

was prepared using the following procedure. Specifically, into a reaction vessel with a stir bar, (0.05 mol) of the product of Example 2 was added. The reaction vessel was then placed on a hotplate with magnetic stirring capability. The reaction vessel was then inerted with nitrogen and (0.1 mol) of 2-ethylhexyl glycidyl ether (available from Momentive Performance Materials) was then added to the reaction vessel at ambient temperature, with stirring. The set point temperature on the hot plate was then raised to 75° C. and the contents of the reaction vessel were allowed to continue stirring for two (2) hours. The set point temperature of the hot plate was then raised to 140° C. and the contents of the reaction vessel were allowed to continue stirring for two (2) more hours. The set point temperature of the hot plate was then reduced to 80° C. and a vacuum was pulled on the reaction vessel, reducing the pressure in the vessel to 30 mm Hg. The contents of the reaction vessel were allowed to continue stirring under these conditions for another two (2) hours to provide the product fluxing agent. The percent weight loss from the product fluxing agent upon heating to 250° C. was measured by thermogravimetric analysis (TGA) using a temperature ramp of 10° C./min starting at 25° C. The measured weight loss (WL) for the product fluxing agent was 5 wt %.

EXAMPLE 5

Evaluation of Fluxing Capability

The fluxing capability of amine flux compositions prepared according to Examples 3-4 was evaluated and compared with a hydroxystearic acid reference material using the following procedure. In each evaluation, a copper coupon was used as an electrical contact to be soldered. The surface to be soldered on each of the copper coupons was pretreated by: (1) first polishing with fine sand paper (600 grit), (2) then cleaning with a 5% ammonium persulfate solution, (3) then rinsing with deionized water, (4) then dipping in a 1% benzotriazole solution for 30 seconds, and (5) then blow drying with nitrogen. Following pretreatment of the copper coupons, a small drop of each one the amine flux compositions was individually dispensed onto the surface to be soldered of one of the copper coupons. Four 0.381 mm diameter balls of a lead-free solder (95.5 wt % Sn/4.0 wt % Ag/0.5 wt % Cu) were placed into the drop of amine flux composition on each of the copper coupons. The melting range of the lead-free solder used is 217 to 221° C. The copper coupons were then placed on a hotplate that was preheated to 145° C. and held there for two (2) minutes. The copper coupons were then placed on another hotplate preheated to 260° C. and held there until the solder reached reflow conditions (45 sec. to 3 min. depending on the amine flux composition present). The copper coupons were then removed from the heat and evaluated by (a) the extent of fusion and coalescence of the originally placed four solder balls, (b) the size of the resulting coalesced solder to assess the flow and spread and (c) the bonding of the solder to the surface of the copper coupon. A scale of 0 to 4 was used to describe the amine fluxing capability of the amine flux compositions and the hydroxystearic acid reference material, as follows:

• • 0=no fusion between solder drops and no solder bonding to copper coupon;
  • 1,2=partial to complete fusion between solder drops, but no solder bonding to copper coupon;
  • 3=complete fusion between solder drops, but minimal solder spread and flow;
  • 4=complete fusion between solder drops, good solder spread and flow over surface of copper coupon and solder bonding to the copper coupon.The result of the evaluation of the amine flux compositions is provided in TABLE 1

TABLE 1
Amine flux Composition Evaluation Result
Example 3              4
Example 4              4
Reference material     4
(hydroxystearic acid)

Claims

1. An amine flux composition comprising, as an initial component: an amine fluxing agent represented by formula I:

2. The amine flux composition of claim 1, wherein the substitutions in the substituted C1-80 alkyl group and the substituted C7-80 arylalkyl group, from which R1, R2, R3 and R4 are selected, are selected from at least one of an —OH group, an —OR5 group, a —COR5— group, a —COR5 group, a —C(O)R5 group, a —CHO group, a —COOR5 group, an —OC(O)OR5 group, a —S(O)(O)R5 group, a —S(O)R5 group, a —S(O)(O)NR52 group, an —OC(O)NR62 group, a —C(O)NR62 group, a —CN group, a —N(R6)— group and a —NO2 group; wherein R5 is selected from a C1-28 alkyl group, a C3-28 cycloalkyl group, a C6-15 aryl group, a C7-28 arylalkyl group and a C7-28 alkylaryl group; wherein R6 is selected from a hydrogen, a C1-28 alkyl group, a C3-28 cycloalkyl group, a C6-15 aryl group, a C7-28 arylalkyl group and a C7-28 alkylaryl group.

3. The amine flux composition of claim 1, wherein R1, R2, R3 and R4 are independently selected from a hydrogen, a —CH2CH(OH)R18 and a —CH2CH(OH)CH2—O—R18 group; wherein R18 is selected from a hydrogen, a C1-28 alkyl group, a C3-28 cycloalkyl group, a C6-28 aryl group, a C7-28 arylalkyl group and a C7-28 alkylaryl group; wherein R7 and R8 are both a methyl group; wherein R10 and R11 are both a methyl group; and, wherein R9 is selected a methyl group and a phenyl group; and wherein zero to three of R1, R2, R3 and R4 is(are) hydrogen.

4. The amine flux composition of claim 3, wherein zero to three of R1, R2, R3 and R4 is(are) hydrogen.

5. The amine flux composition of claim 1, further comprising a solvent, wherein the solvent is an organic solvent selected from hydrocarbons, aromatic hydrocarbons, ketones, ethers, alcohols, esters, amides, glycols, glycol ethers, glycol derivatives and petroleum solvents.

6. The amine flux composition of claim 1, further comprising at least one of: an inorganic filler; a thixotropic agent; and an antioxidant.

7. The amine flux composition of claim 1, further comprising: an additive selected from matting agents, coloring agents, defoaming agents, dispersion stabilizers, chelating agents, thermoplastic particles, UV impermeable agents, flame retardant and reducing agents.

8. The amine flux composition of claim 1, further comprising, as initial components: 0 to 95 wt % of a solvent,0 to 30 wt % of a thickening agent,0 to 30 wt % of a thixotropic agent, and0 to 30 wt % of an antioxidant.

9. The amine flux composition of claim 1, further comprising: a solder powder.

10. A method of applying solder to an electrical contact, comprising: providing an electrical contact;providing an amine flux composition according to claim 1;applying the amine flux composition to the electrical contact;providing a solder;melting the solder; and,displacing the amine flux composition applied to the electrical contact with the molten solder;wherein the molten solder makes physical contact with the electrical contact and bonds to the electrical contact.