Number | Name | Date | Kind |
---|---|---|---|
4360142 | Carpenter et al. | Nov 1982 | |
4526859 | Christensen et al. | Jul 1985 | |
4740099 | Philipoussi | Apr 1988 | |
4792532 | Ohtani et al. | Dec 1988 | |
4870224 | Smith et al. | Sep 1989 | |
5007163 | Pope et al. | Apr 1991 | |
5052481 | Horvath et al. | Oct 1991 | |
5170930 | Dolbear et al. | Dec 1992 | |
5173451 | Kinsman et al. | Dec 1992 | |
5237269 | Aimi et al. | Aug 1993 | |
5268072 | Agarawala et al. | Dec 1993 | |
5289631 | Koopman et al. | Mar 1994 | |
5298459 | Arikawa et al. | Mar 1994 | |
5334804 | Love et al. | Aug 1994 | |
5376584 | Agarwala | Dec 1994 | |
5447264 | Koopman et al. | Sep 1995 |
Entry |
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P. J. Lueck, IBM Technical Disclosure Bulletin, vol. 36, No. 03, Mar. 1993, "Burn-in/In Situ Testing of Computer Chips". |
E. Anemojanis, et al., IBM Technical Disclosure Bulletin, vol. 34, No. 8, Jan. 1992, "Wafer Level Test and Burn-In". |