Claims
- 1. A fine pattern forming apparatus comprising:
- a vacuum chamber defined by and inside a wall; p1 reactive gas supplying means for generating a plasma in a reactive gas within said vacuum chamber;
- a sample stage electrode disposed within said vacuum chamber for supporting a sample and connected to said plasma generating means;
- a second electrode disposed within said vacuum chamber opposed to said sample stage electrode and connected to said plasma generating means;
- elastic wave generating means for generating ultrasonic waves, said elastic wave generating means being disposed on the wall of and outside said vacuum chamber transverse to said sample stage electrode, said second electrode, and a sample disposed on said sample stage electrode whereby uniformity of the plasma in said vacuum chamber across a sample disposed on said sample stage electrode is improved by the ultrasonic wages generated by said elastic wave generating means; and
- evacuation means for evacuating said vacuum chamber.
- 2. A fine pattern forming apparatus according to claim 1 wherein an elastic wave generating means generates ultrasonic waves having a frequency of 10 KHz or above.
- 3. A fine pattern forming apparatus according to claim 1 wherein said sample is a semiconductor substrate.
- 4. A fine pattern forming apparatus according to claim 1 wherein said sample is a magnetic tape.
- 5. A fine pattern forming apparatus according to claim 1 wherein said sample is a magnetic disk.
- 6. A fine pattern forming apparatus according to claim 1 wherein said sample is an optical disk.
- 7. A fine pattern forming apparatus according to claim 1 wherein said sample is a shaped metal substance.
- 8. A fine pattern forming apparatus according to claim 1 wherein said sample is a machine component.
- 9. A fine pattern forming apparatus according to claim 1 wherein said sample is a substrate on which a film in which a fine pattern is to be formed in disposed.
- 10. A fine pattern forming apparatus according to claim 9 wherein said film in which a fine pattern is to be formed is selected from the group consisting of silicon oxide, silicon nitride, and silicon oxynitride.
- 11. A fine pattern forming apparatus according to claim 9 wherein said film in which a fine pattern is to be formed is selected from the group consisting of polycrystalline and single crystal silicon films.
- 12. A fine pattern forming apparatus according to claim 9 wherein said film in which a fine pattern is to be formed is selected from the group consisting of tungsten, tantalum, molybdenum, zirconium, titanium, hafnium, chromium, platinum, iron, zinc, tin, silicides of any of the foregoing elements, nitrides of any of the foregoing elements, and carbides of any of the foregoing elements.
- 13. A fine pattern forming apparatus according to claim 9 wherein said film in which a fine pattern is to be formed is selected from the group consisting of aluminum, copper, gold, silver, and alloys composed mainly of any of these metals.
- 14. A fine pattern forming apparatus according to claim 9 wherein said film in which a fine pattern is to be formed is an organic polymer such as a novolak resin and a polyimide.
- 15. A fine pattern forming apparatus according to claim 9 wherein said film in which a fine pattern is to be formed is a ferroelectric substance such as PZT (lead, zinc, tin).
- 16. A fine pattern forming apparatus according to claim 9 wherein said film in which a fine pattern is to be formed is a superconductor including an oxide superconductor.
- 17. A fine pattern forming apparatus according to claim 9 wherein said film in which a fine pattern is to be formed is a ferromagnetic substance.
Priority Claims (1)
Number |
Date |
Country |
Kind |
2-228018 |
Aug 1990 |
JPX |
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Parent Case Info
This application is a continuation of application Ser. No. 07/630,054, filed Dec. 19, 1990, now abandoned.
Foreign Referenced Citations (10)
Number |
Date |
Country |
3900768 |
Feb 1990 |
DEX |
59-004025 |
Jan 1984 |
JPX |
63-072110 |
Apr 1988 |
JPX |
63-099531 |
Apr 1988 |
JPX |
63-149368 |
Jun 1988 |
JPX |
63-153265 |
Jun 1988 |
JPX |
63-290270 |
Nov 1988 |
JPX |
1-62461 |
Mar 1989 |
JPX |
1-111333 |
Apr 1989 |
JPX |
1-298169 |
Dec 1989 |
JPX |
Non-Patent Literature Citations (1)
Entry |
Shwartzman et al. "Megasonic Particle Removal From Solid-State Wafers", RCA Review, vol. 46, Mar. 1985, pp. 81-105. |
Continuations (1)
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Number |
Date |
Country |
Parent |
630054 |
Dec 1990 |
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