Claims
- 1. A printed circuit board providing crosstalk compensation, the printed circuit board comprising:
first plated through holes for receiving a first connecting component; second plated through holes for receiving a second connecting component; a signal carrying trace for transmitting a signal from one of said first plated through holes to one of said second plated through holes; a phase delay control trace in electrical connection with said one of said first plated through holes, said phase delay control trace affecting phase delay of said signal from said one of said first plated through holes to said one of said second plated through holes.
- 2. The printed circuit board of claim 1 wherein:
said phase delay control trace is the same as said signal carrying trace.
- 3. The printed circuit board of claim 2 wherein:
said phase delay control trace has an increased conductivity in order to affect the phase delay of said signal from said one of said first plated through holes to said one of said second plated through holes.
- 4. The printed circuit board of claim 2 wherein:
said phase delay control trace includes multiple redundant phase delay control traces in order to provide said increased conductivity.
- 5. The printed circuit board of claim 2 wherein:
said phase delay control trace includes an increased dimension in order to provide said increased conductivity.
- 6. The printed circuit board of claim 1 wherein:
said phase delay control trace is an isolated dead end trace separate from signal carrying trace, said dead end trace isolated to avoid reactive coupling with other traces.
- 7. The printed circuit board of claim 1 wherein:
said phase delay control trace includes a first phase delay control trace and a second phase delay control trace.
- 8. The printed circuit board of claim 7 wherein:
said first phase delay control trace is the same as said signal carrying trace; and said second phase delay control trace is an isolated dead end trace separate from signal carrying trace, said dead end trace isolated to avoid reactive coupling with other traces.
- 9. The printed circuit board of claim 8 wherein:
said first phase delay control trace has an increased thickness in order to affect the phase delay of said signal from said one of said first plated through holes to said one of said second plated through holes.
- 10. The printed circuit board of claim 8 wherein:
said first phase delay control trace includes multiple redundant phase delay control traces in order to affect the phase delay of said signal from said one of said first plated through holes to said one of said second plated through holes.
- 11. The printed circuit board of claim 1 wherein:
said first connecting component is an outlet.
- 12. The printed circuit board of claim 1 wherein:
second connecting component is a wire termination block.
- 13. The printed circuit board of claim 1 further comprising:
a crosstalk magnitude control trace in electrical connection with said one of said first plated through holes, said crosstalk magnitude control trace being reactively coupled with another trace to control crosstalk magnitude.
- 14. A telecommunications connector comprising:
a first connecting component for connection with a first cable; a second connection component for connection with a second cable; a printed circuit board providing crosstalk compensation, the printed circuit board including:
first plated through holes for receiving a first connecting component; second plated through holes for receiving a second connecting component; a signal carrying trace for transmitting a signal from one of said first plated through holes to one of said second plated through holes; a phase delay control trace in electrical connection with said one of said first plated through holes, said phase delay control trace affecting phase delay of said signal from said one of said first plated through holes to said one of said second plated through holes.
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application claims the benefit of U.S. provisional patent application serial No. 60/427,985 filed Nov. 20, 2002, the entire contents of which are incorporated herein by reference.
Provisional Applications (1)
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Number |
Date |
Country |
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60427985 |
Nov 2002 |
US |