Patent Application
20070272153
The apparatus for low-temperature plasma treatment according to the present invention will be described below in further detail using the drawings.
The apparatus for surface treatment of a film according to the present invention comprises a first vacuum chamber 3 equipped with an unrolling unit 2 for continuously unrolling a rolled film 1, a second vacuum chamber 4 in which low-temperature plasma treatment is performed; and a third vacuum chamber 6 equipped with a winding unit 5 for continuously winding the plasma treated film 1, with the vacuum chambers 3, 4, 6 being mutually connected through the joining parts 7, 8.
The unrolling unit 2 and the winding unit 5 are placed in the first vacuum chamber 3 and the third vacuum chamber 6, respectively, but there are no particular limitations thereto so that any apparatuses capable of unrolling a film or capable of winding up a film can serve here for the purpose.
The unrolling unit 2 and the winding unit 5 may be any apparatus usually under use for paper tube making or plastic tube making or the like, and the unrolling and winding diameter may be a standard 3-inches or 6-inches or thereabout.
Note that various devices which are usually used for film 1, for instance as a tension controller for controlling the tension on the film 1 or a film edge limiter for restricting the rolling of the film 1, may also be provided when necessary.
Anodes 9 connected to a high-frequency power source and a cathode 10 which acts as the ground are placed in the second vacuum chamber 4 as the apparatus for plasma treatment. The anode 9 and the cathode 10 are not particularly limitative, so long as they are capable of generating plasma. However, the shape of the anode 9 may be a standard flat plate, but a rod forms are preferable because better plasma treatment effect can be achieved. Similarly, the shape of the cathode 10 may be a standard flat plate, but a rotating drum shape is preferable from the viewpoint of continuously treating the film 1. The reason for this is that the film 1 can be continuously treated while rotating the drum without the film 1 rubbing on the surface of the drum. Note, the film 1 is heated by the plasma treatment, but the cathode 10 has a drum form, so a water-cooled form with water cooling from the inside is simple.
The first, second, and third vacuum chambers of the present invention must be connected together, and the joining parts preferably have a construction such that the plasma generated in the second vacuum chamber does not diffuse out into the first and third vacuum chambers. The reason is that if plasma flows into the first and third vacuum chambers, regions which are not to be treated will be treated, and the plasma treatment effect will not be uniform. Therefore, the clearance in both of the joining parts that the running film passes through is preferably as small as possible, and as shown by the enlargement of the joining parts in
The first, second, and third vacuum chambers of the present invention as well as the construction thereof are not particularly li,itative, but should be able to maintain a vacuum pressure that can provide an environment where low-temperature plasma can easily be generated, and that unrolling and winding can be performed.
The material of the vacuum chambers is preferably constructed such that iron is not exposed on the inside surface of the vacuum chamber because the surface of iron is subject to corrosioned by plasma emission if so-called common steel is exposed on the inside surface of the vacuum chamber. Therefore the vacuum chamber housing is preferably made of stainless steel or aluminum. However, if the vacuum chamber housing is made from solid stainless steel or aluminum, the cost will be so high that it is also acceptable to make the vacuum chamber housing from common steel and to coat the inner surface with a plastic resin or the like. Note, the resin coating may be degraded if continuedly exposed to plasma atmosphere. Therefore, from the balance between cost and corrosion resistance, the vacuum chamber housing may be built from iron with flame spray coating by using a stainless steel on the inside surface.
Low temperature plasma treatment is a widely known process simply referred to as a plasma treatment, and is the same treatment disclosed in the aforementioned Japanese Laid-open Patent Applications S57-18737 and H09-209158, as well as in standard technical books (for instance “Surface Treatment of Polymer Materials Using Plasma, Industrial Materials, Vol. 32, No. 3, pages 24-30, 1984” or “Surface Treatment of Polymer Materials Using Low Temperature Plasma, Polymer Digest, Vol. 35, No. 5, pages 2-16, 1983” and elsewhere.
Note, the plasma treatment of the present invention differs from so-called normal pressure plasma treatment and is performed in vacuum. For example, a pressure of vacuum of 100 Pa or lower is preferable for stable plasma treatment. A pressure of vacuum of 30 Pa or lower is even more preferable.
Furthermore, the frequency of the high-frequency power source is not particularly limitative, and usually a range between 10 kHz and 14 MHz may be used.
The surrounding gas for low temperature plasma generation may be selected from gases exhibiting high etching effect such as nitrogen, oxygen, and argon and the gases having polymerizability as employed in the so-called CVD process.
The films suitable to the treatment in the present invention can be a standard commercial film. Examples include polyethylene films, polypropylene films, polyvinylchloride films, polyimide films, liquid crystal polymer films, polyester films, fluorocarbon polymer films, polyamide films, cellulose films, and aramid films and the like. Of these, polyester films commercially sold as Lumirror, Tetoron, and Diafoil, polyimide film commercially sold as Kapton, Apical, and Upilex, and aramid films commercially sold as Mictron and Aramica are particularly suitable.
With the present invention, the thickness of the film for treatment is not particularly limitative, but, since the film is unrolled from a rolled form and wound up into a rolled form on a continuous type apparatus, the thickness is preferably between 2 microns and 500 microns. A thickness between 2 microns and 300 microns is more preferable.
By using the apparatus of the present invention, a continuous-length film can be treated with low temperature plasma without the unrolling unit and winding unit being damaged by the plasma.
Next, the present invention is described in more details by way of examples and comparative examples, but the present invention is never limited by and to these examples.
A device having the structure shown in
After setting of the PET film, the vacuum chambers were closed and evacuation of the chambers was started. When the pressure of vacuum had reached 2 Pa, nitrogen gas was introduced into the second vacuum chamber at a rate of 1 liter/minute, and the pressure in the chambers was stationarilyly maintained at 10 Pa.
Furthermore, the unrolling speed of the PET film was 10 m/minute, and the low-temperature plasma treatment was undertaken using a high frequency power source (produced by Kokusai Electric Co.) with a load of 350 watts at 300 KHz.
By using an apparatus illustrated in
By using the apparatus illustrated in
By using the apparatus illustrated in
By using the apparatus illustrated in
An apparatus having the structure illustrated in
After setting of the PET film, the vacuum chambers were closed and evacuation was started, and when the pressure of vacuum had reached 2 Pa, nitrogen gas was introduced into the second vacuum chamber at a rate of 1 liter/minute, and the pressure in the chamber was stationarily maintained at 10 Pa.
Furthermore, the unrolling speed of the PET film was set at 10 meters/minute, and the low-temperature plasma treatment was performed using a high-frequency power source (produced by Kokusai Electric) with a load of 350 watts at 300 kHz.
A plasma treatment apparatus (manufactured by Hitachi Ltd.) having the structure illustrated in
A plasma processing apparatus (manufactured by Shin-Etsu Engineering Co. having the structure illustrated in
The following measurements and observations were undertaken for Examples 1 through 6 and Comparative Examples 1 and 2, and the results are summarized and shown in Table 1. Note, the evaluation criterion for each of the evaluation items was as shown below.
(1) Contact angle (degrees): The angle of contact between the surface of a plasma treated film and a liquid droplet was measured using a contact angle measuring apparatus produced by Kyowa Science.
(2) Film wrinkles: The plasma treated film was visually inspected for wrinkles.
Wrinkles not found: grade A
Wrinkles found: grade B
(3) Vacuum chamber cost: Comparison was made between the cost paid for the base materials required for construction of the vacuum chamber.
Relatively low cost: grade A
Slightly lower cost: grade B
Relatively high cost: grade C
(4) Thermal degradation of films: A 100 mm by 100 mm piece of the film taken by cutting the film before or immediately after the treatment was laid flat on a horizontal board to conduct measurement of the highest lift of the film piece. An average of five measurements was taken as the lift value which was assumed to correspond to the extent of thermal degradation of the film. The lift value of the films before the plasma treatment was 1.0 mm for the PET film and 1.3 mm for the PI film.
Lift value of 2 mm or smaller, grade A
Lift value of 2 mm to 4 mm grade B
Lift value of 4 mm or larger grade C: O
(5) Corrosion of vacuum chamber walls: the surface condition of the inside surface of the vacuum chambers was visually inspected after 300 hours of continued low-temperature plasma discharge without loading of the plastic film roll.
Just as before: grade A
Resin-coated surface roughened with partial falling of the coating: grade B
Rusting found on a part of the inner surface: grade C
(6) Stability of low-temperature plasma discharge. When the low-temperature discharge is unstable or irregular, plasma emission is noted in the first and third vacuum chambers under the operating conditions of Examples and Comparative Examples resulting in a decreased plasma treatment efficiency.
No plasma discharge in the first and third vacuum chambers: grade A:
Plasma discharge in the first and third vacuum chambers: grade B
The present invention will contribute to reduced manufacturing costs for a low temperature plasma treatment apparatus and to reduced surface treatment costs for the film.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2006-143391 | May 2006 | JP | national |
