The present technology relates to an apparatus and system for manufacturing thin film devices. More specifically it relates to an apparatus and system for manufacturing photovoltaic devices.
Thin-film solar (photovoltaic) cells, and particularly perovskite devices, are a promising technology for sustainable and renewable energy generation since they can be flexibly installed in a variety of settings and can be much less expensive to manufacture than other types of solar cells.
Metal halide perovskite photovoltaics have undergone rapid development in the past few years, with lab efficiency of small area devices reaching 25%, which is competitive with silicon solar cells. At the same time, the pursuit of large area perovskite solar cells has attracted increasing attention in recent years. For the fabrication of large area perovskite films, industrial processes such as slot-die coating, blade coating, and roll-to-roll fabrication, may be adopted. In such processes, precise adjustments and modulation of several parameters are usually required to obtain a film with sufficiently high quality for photovoltaic applications. The dynamic coating process in these methods may require tight tolerances on the machinery involved in manufacturing. Such methods commonly fabricate a single film during each round of coating.
Thin-film devices are formed using several materials layered upon one another, by printing, coating using polymer inks, or via vacuum deposition on a substrate. A substrate in a thin-film device may include polyethylene terephthalate (PET) and indium tin oxide (ITO) as initial layers.
The relatively poor manufacturability of perovskite solar cells, when utilizing using current processes, is a significant obstacle preventing broader adoption of these cells. For example, making such processes more scalable and reproducible may improve commercial viability of perovskite solar cells.
An existing process that has been proposed is called “solution shearing” as described in Min Kyu Kim, et al. J. Mater. Chem. A, 2018, 6, 24911; Jihye Choe, et al. Solar Energy, 2019, 191, 629; Gizachew Belay Adugna, et al. ACS Appl. Mater. Interfaces, 2021, 13, 25926. In this process, a tilted blade is used to scrape liquid on a substrate.
In a related technique, blade coating relies on a sharp edge that remains in contact with the liquid solution being used to form a coating. The sharp edge may be substantially one-dimensional or at least not extending completely along the plane that is either forming the coating or is having the coating formed thereon.
The blade coating process requires precise adjustment of the distance between the blade and the surface on which the coating is being formed.
Methods like blade coating, screen printing and roll-to-roll coating are limited to producing one perovskite film in a round of coating.
What is needed is an apparatus and system for producing thin film devices. It would be preferable if two or more coated surfaces could be produced at one time. It would be preferable if the depth of the coatings could be controlled. It would be further preferable if a second and subsequent coating could be applied using the apparatus.
The present technology provides an efficient method of producing thin film devices through the use of the apparatus and system of the present technology. Two or more coated surfaces can be produced at one time. The depth of the coatings can be controlled. A second and subsequent coating can be applied.
In one embodiment, a system for manufacturing thin-film devices is provided, the system comprising: a computing device; a robotic arm or a conveyor system; a holder which is configured to retain a first substrate; a dispenser which configured to dispense a solution onto an upper surface of the first substrate; an X-Y press, which includes a base, a vertically disposed member which is attached to the base, a horizontal arm which is moveably attached to the vertically disposed member, a vertical actuator which is configured to urge the horizontal arm up and down and is attached to the vertically disposed member, a horizontal actuator which is attached to the horizontal arm, a block which is attached to the horizontal actuator, wherein the horizontal actuator is configured to urge the block horizontally; and a dryer, wherein the robotic arm or the conveyor system, the dispenser, the X-Y press and the dryer are under control of the computing device.
The system may further comprise a heater which is located downstream from the dryer and is under control of the computing device.
The system may comprise the robotic arm.
In the system, the dryer may be a gas line with a nozzle, the gas line for communication with a compressed gas source.
In the system, the compressed gas source may be a compressed nitrogen gas source.
The system may include the compressed gas source.
In the system, the heater may be one of an oven, an infrared light source or a high intensity light source.
In the system, the holder may be integral with the X-Y press.
In the system, the X-Y press may include a microprocessor which is in electronic communication with the computing device.
In another embodiment, a system is provided for manufacturing thin-film devices, the system comprising: a computing device; a robotic arm or a conveyor system; a holder which is configured to retain a first substrate; a dispenser which configured to dispense a solution onto an upper surface of the first substrate; an X-Y press, which includes a base, a vertically disposed member which is attached to the base, a horizontal arm which is moveably attached to the vertically disposed member, a vertical actuator which is configured to urge the horizontal arm up and down and is attached to the vertically disposed member, a horizontal actuator which is attached to the base, wherein the horizontal actuator is configured to urge the holder horizontally, a block which is attached to the horizontal arm and is positioned to block movement of a second substrate; and a dryer, wherein the robotic arm or the conveyor system, the dispenser, the X-Y press and the dryer are under control of the computing device.
The system may further comprise a heater which is located downstream from the dryer and is under control of the computing device.
The system may comprise the robotic arm.
In the system, the X-Y press may include a microprocessor which is in electronic communication with the computing device.
In another embodiment, an n X-Y press is provided for manufacturing thin-film devices, the X-Y press comprising a base, a holder which is attached to the base, a vertically disposed member which is attached to the base, a horizontal arm which is moveably attached to the vertically disposed member, a vertical actuator which is configured to urge the horizontal arm up and down and is attached to the vertically disposed member, a horizontal actuator which is attached to the horizontal arm, and a block which is attached to the horizontal actuator, wherein the horizontal actuator is configured to urge the block horizontally.
In the X-Y press, the vertical actuator may be a power screw system.
In the X-Y press, the horizontal actuator may be a power screw system.
The X-Y press may further comprise a microprocessor.
Except as otherwise expressly provided, the following rules of interpretation apply to this specification (written description and claims): (a) all words used herein shall be construed to be of such gender or number (singular or plural) as the circumstances require; (b) the singular terms “a”, “an”, and “the”, as used in the specification and the appended claims include plural references unless the context clearly dictates otherwise; (c) the antecedent term “about” applied to a recited range or value denotes an approximation within the deviation in the range or value known or expected in the art from the measurements method; (d) the words “herein”, “hereby”, “hereof”, “hereto”, “hereinbefore”, and “hereinafter”, and words of similar import, refer to this specification in its entirety and not to any particular paragraph, claim or other subdivision, unless otherwise specified; (e) descriptive headings are for convenience only and shall not control or affect the meaning or construction of any part of the specification; and (f) “or” and “any” are not exclusive and “include” and “including” are not limiting. Further, the terms “comprising,” “having,” “including,” and “containing” are to be construed as open-ended terms (i.e., meaning “including, but not limited to,”) unless otherwise noted.
Recitation of ranges of values herein are merely intended to serve as a shorthand method of referring individually to each separate value falling within the range, unless otherwise indicated herein, and each separate value is incorporated into the specification as if it were individually recited herein. Where a specific range of values is provided, it is understood that each intervening value, to the tenth of the unit of the lower limit unless the context clearly dictates otherwise, between the upper and lower limit of that range and any other stated or intervening value in that stated range, is included therein. All smaller sub ranges are also included. The upper and lower limits of these smaller ranges are also included therein, subject to any specifically excluded limit in the stated range.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the relevant art. Although any methods and materials similar or equivalent to those described herein can also be used, the acceptable methods and materials are now described.
The following disclosure relates to an apparatus and system for forming coatings, and in particularly, forming such coatings in the manufacture of photovoltaic devices. In some embodiments, the apparatus, system and processes disclosed herein may improve scalability and/or reproducibility.
The system and apparatus disclosed herein improve manufacturability, by improving ease of tuning the manufacturing process and reducing costs thereof. A uniform thickness of wet film may be formed by ensuring the two substrates contact each other uniformly.
Moves over—in the context of the present technology, “moves over” or “slides over” does not mean moves above or is slid above but means movement along or across.
This-film device—in the context of the present technology, a thin-film device is a substrate that has at least one thin film thereon.
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In one embodiment, the vertical actuator 120 comprises sprockets and a chain. In another embodiment, the vertical actuator 120 is a pneumatic actuator. In this embodiment, the vertical actuator motor 122 drives a pneumatic pump which is in fluid communication with the pneumatic actuator. In another embodiment, the vertical actuator 120 comprises pulleys and a belt. In another embodiment, the vertical actuator 120 comprises a rack and pinion system. In another embodiment the vertical actuator 120 is a power screw system. In one embodiment, the horizontal actuator 124 comprises sprockets and a chain. In another embodiment, the horizontal actuator 124 is a pneumatic actuator. In this embodiment, the horizontal actuator motor 126 drives a pneumatic pump, which is in fluid communication with the pneumatic actuator. In another embodiment, the horizontal actuator 124 comprises pulleys and a belt. In another embodiment, the horizontal actuator 124 comprises a rack and pinion system. In another embodiment the horizontal actuator 124 is a power screw system.
In alternative embodiment, there is a first holder on an upper conveyor belt and a second holder on a lower conveyor belt, each conveyor belt driven by a motor. The first substrate 10A and the second substrate 10B are loaded onto one or the other of the holders before the conveyor belts are started. One conveyor belt travels at a slower speed than the other conveyor belt, thus one of the substrates moves over the other substrate, then is separated from the substrate. The coated substrates continue to travel on the conveyor belts, passing the coated substrates through a stream of gas from the gas line 76 and through the heater 78, to form the thin-film device.
In all embodiments, the volume of the solution 14, the thickness of the gap between the substrates 10A, 10B and therefore the thickness of the resultant film, the speed that the substrates are slid, the drying temperature, the drying time, the heating temperature and the heating time are all controlled by the computing device 84.
The gas may be at a temperature between 18° C. and 35° C. The gas pressure is between 0.1 MPa˜0.5 MPa. Heating may be at a temperature between 20° C. and 500° C. for between ten hours and less than 1 minute. A particularly advantageous temperature and time to achieve better quality perovskite films may be about 100° C., or between 100° C. and 150° C. for between 10 and 30 minutes.
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While example embodiments have been described in connection with what is presently considered to be an example of a possible most practical and/or suitable embodiment, it is to be understood that the descriptions are not to be limited to the disclosed embodiments, but on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the example embodiment. Those skilled in the art will recognize or be able to ascertain using no more than routine experimentation, many equivalents to the specific example embodiments specifically described herein. Such equivalents are intended to be encompassed in the scope of the claims, if appended hereto or subsequently filed.