Claims
- 1. An apparatus for processing a substrate, in which the substrate is successively processed with a plurality of different kinds of process solutions, comprising: a spin chuck supporting the substrate; a driving source for rotating the spin chuck; a nozzle member for supplying a first process solution prepared by mixing sulfuric acid and a hydrogen peroxide solution at a predetermined mixing ratio to the substrate supported by the spin chuck and second process solution for rinsing the substrate to the substrate; a switching mechanism for selecting sulfuric acid, the hydrogen peroxide solution and the second process solution supplied to the nozzle member; a concentration adjusting mechanism for adjusting the mixing ratio of sulfuric acid to the hydrogen peroxide solution, which collectively form the first process solution, supplied to the nozzle member; and a control device for controlling the supply of sulfuric acid, the hydrogen peroxide solution and the second process solution, which is switched by the switching mechanism, and the adjustment of the mixing ratio of sulfuric acid to the hydrogen peroxide solution, which is performed by the concentration adjusting mechanism.
- 2. The apparatus for processing a substrate according to claim 1, wherein each of a first supply pipe for supplying the sulfuric acid, a second supply pipe for supplying the hydrogen peroxide solution, and a third supply pipe for supplying the second process solution is connected to the nozzle member.
- 3. The apparatus for processing a substrate according to claim 1, wherein the switching mechanism consists of opening-closing valves mounted to the first to third supply pipes.
- 4. The apparatus for processing a substrate according to claim 1, wherein the concentration adjusting mechanism consists of the flow rate control valves mounted to the first supply pipe and the second supply pipe.
- 5. The apparatus for processing a substrate according to claim 1, wherein a temperature sensor for detecting the temperature of the first process solution is mounted to the nozzle member, and the control device serves to control the concentration adjusting mechanism in accordance with the temperature of the first process solution detected by the temperature sensor so as to adjust the concentrations of the sulfuric acid and the hydrogen peroxide solution, which collectively form the first process solution.
- 6. The apparatus for processing a substrate according to claim 1, wherein an angular velocity detecting sensor for detecting the angular velocity of the spin chuck is connected to the control device to enable the control device to control the concentration adjusting mechanism depending on the angular velocity of the spin chuck detected by the angular velocity detecting sensor so as to adjust the mixing ratio of sulfuric acid to the hydrogen peroxide solution, which collectively form the first process solution.
- 7. The apparatus for processing a substrate according to claim 1, wherein a mixing mechanism for mixing sulfuric acid and a hydrogen peroxide solution, which collectively form the first process solution, supplied to the nozzle member is arranged within the nozzle member.
- 8. The apparatus for processing a substrate according to claim 7, wherein the nozzle member comprises a mixing chamber into which said sulfuric acid and the hydrogen peroxide solution flow and a spurting hole for spurting the mixture of the sulfuric acid and the hydrogen peroxide solution flowing into the mixing chamber, and the mixing mechanism consists of baffle members arranged within the spurting hole for converting the streams of said sulfuric acid and said hydrogen peroxide solution into an eddy current.
- 9. The apparatus for processing a substrate according to claim 1, wherein an arm body having a distal end portion and a proximal end portion is arranged above the spin chuck, said nozzle member being mounted to the distal end portion, and a driving mechanism for driving said arm body within a predetermined range of angle being connected to the proximal end portion, and the nozzle member is driven in the radial direction of the substrate held by the spin chuck in accordance with rotation of the arm body.
Priority Claims (2)
Number |
Date |
Country |
Kind |
11-238493 |
Aug 1999 |
JP |
|
11-273031 |
Sep 1999 |
JP |
|
Parent Case Info
[0001] CROSS-REFERENCE TO RELATED APPLICATIONS
[0002] This application is a divisional of U.S. patent application Ser. No. 09/644,170 which claims the benefit of and priority from Japanese Patent Applications No. 11-238493, filed Aug. 25, 1999; and No. 11-273031, filed Sep. 27, 1999. The entire contents of each of the above mentioned related applications is hereby incorporated by reference herein as if fully set forth.
Divisions (1)
|
Number |
Date |
Country |
Parent |
09644170 |
Aug 2000 |
US |
Child |
09935034 |
Aug 2001 |
US |