The present disclosure relates to apparatus, a system and methods for separating gases and mitigating debris in a controlled pressure environment. In particular, the present disclosure relates to apparatus, system and method for generating a controlled gas stream with nozzles and passing the gas stream through a collector to entrain debris associated with generation of extreme ultra-violet light.
Plasma sources are used to generate light, such as extreme ultra-violet (EUV) for use in semi-conductor applications, such as semi-conductor inspection systems in low pressure environments. Typically, the light is transmitted in an axial direction to, for example, a chamber including optical components for the inspection station. A by-product of the light generation is debris that can migrate into sensitive portions of the inspection system, for example, degrading light quality or contaminating optical components, adversely impacting the function and service life of the optical components and/or requiring more frequent purging of the inspection system, all of which are undesirable.
S R Mohanty, T Sakamoto, Y Kobayashi, et al., disclose a gas curtain to address debris from a EUV source. The design uses an annular nozzle to create an annular curtain coaxial with the source (S R Mohanty, T Sakamoto, Y Kobayashi, et. al., “Influence of electrode separation and gas curtain on extreme ultraviolet emission of a gas jet z-pinch source”, Applied Physics Letters, 89, 041502, 2006). The method used by Mohanty et al. does not stop debris travelling in the axial direction from the source. Thus, the method of Mohanty et al. is unsuitable for controlling debris associated with the axial transmission of the EUV emission. For example, for a semi-conductor inspection system, the method of Mohanty et al. cannot prevent debris from the EUV light source from entering the chamber in an axial direction and contaminating the optical components in the chamber.
According to aspects illustrated herein, there is provided a nozzle for producing a controlled gas stream in a low pressure environment, including: a first chamber with a first orifice arranged for connection to a source of gas and to receive a stream of gas from the source; a second chamber with a second orifice arranged to emit the stream; a throat connecting the first and second chambers; and a longitudinal axis extending from the first orifice to the second orifice in a first direction. The first chamber tapers from the first orifice to the throat. The second chamber expands in size from the throat to the second orifice.
According to aspects illustrated herein, there is provided a collector for entraining and ejecting debris in a gas flow for a low pressure system, including: a top wall, a bottom wall, and first and second side walls connecting the top and bottom walls; first and second openings in the top and bottom walls, respectively; and a first chamber: formed by the top wall, the bottom wall, and the first and second side walls; including a third opening arranged to receive a stream of gas and a fourth opening; and expanding in size from the first opening to the second opening. The collector includes a longitudinal axis extending in a first direction from the third opening to the fourth opening. The collector is arranged to: entrain, in the stream, debris entering the first chamber through the first or second opening; and emit the stream, with the entrained debris, from the fourth opening.
According to aspects illustrated herein, there is provided an assembly for removing debris from a controlled pressure environment, including: a nozzle including a first chamber with a first orifice arranged for connection to a source of gas and to receive a stream of gas from the source a second chamber with a second orifice arranged to emit the stream; a throat connecting the first and second chambers; and a collector including top and bottom walls with first and second openings, respectively, a third chamber bounded in part by the top and bottom walls and including a third opening connected to the second orifice and arranged to receive the stream, and a fourth opening; and, a longitudinal axis passing through the first and second orifices and the third and fourth openings in a first direction. The first chamber tapers from the first orifice to the throat. The second chamber expands in size from the throat to the second orifice. The third chamber expands in size from the third opening to the fourth opening. The collector is arranged to: entrain, in the stream, debris entering the third chamber through first or second opening; and emit the stream, with the entrained debris, from the fourth opening.
According to aspects illustrated herein, there is provided a method for removing debris from a controlled pressure environment, including: flowing gas, in a first direction, through a first chamber for a nozzle while simultaneously reducing, along the first direction, a first area, in second and third directions orthogonal to the first direction, of a stream of the gas in the first chamber; flowing the gas through a throat connecting the first chamber to a second chamber for the nozzle; flowing the gas, in the first direction, through the second chamber while simultaneously increasing, along the first direction, a second area, in the second and third directions, of the steam of the gas in the second chamber; flowing the gas from the second chamber into a third chamber for a collector; flowing the gas through the third chamber in the first direction, while simultaneously increasing, along the first direction, a third area, in the second and third directions, of the stream of the gas in the third chamber; entraining, in the stream of the gas, debris located in the third chamber; and emitting, in the first direction, the stream of the gas with the entrained debris from the third chamber through a first opening of the collector.
Various embodiments are disclosed, by way of example only, with reference to the accompanying schematic drawings in which corresponding reference symbols indicate corresponding parts, in which:
At the outset, it should be appreciated that like drawing numbers on different drawing views identify identical, or functionally similar, structural elements of the disclosure. It is to be understood that the disclosure as claimed is not limited to the disclosed aspects.
Furthermore, it is understood that this disclosure is not limited to the particular methodology, materials and modifications described and as such may, of course, vary. It is also understood that the terminology used herein is for the purpose of describing particular aspects only, and is not intended to limit the scope of the present disclosure.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood to one of ordinary skill in the art to which this disclosure belongs. It should be understood that any methods, devices or materials similar or equivalent to those described herein can be used in the practice or testing of the disclosure.
Nozzle 100 includes longitudinal axis LA extending in direction D1 from orifice 108 to orifice 110 through chambers 102 and 104 and throat 106. In an example embodiment as shown in
In an example embodiment as shown in
In an example embodiment, height 136 of orifice 110 in direction D2 is less than width 138 of orifice 110 in direction D3. That is, orifice 110 has a rectangular shape in a plane defined by directions D2 and D3. It should be understood that a configuration and shape of orifice 110 is not limited to the configuration and shape shown in
In an example embodiment, maximum dimension, or length, 140 for chamber 104 in direction D1 is greater than maximum dimension, or length, 142 for chamber 102 in direction D1. In an example embodiment, maximum height 124 for chamber 104 is greater than maximum height, 112 for chamber 102.
In an example embodiment, gas stream GS reaches supersonic speed in chamber 104.
Nozzle 200 includes longitudinal axis LA extending in direction D1 from orifice 208 to orifice 210 through chambers 202 and 204 and throat 206. In an example embodiment as shown in
In an example embodiment as shown in
In an example embodiment, height 236 of orifice 210 in direction D2 is less than width 238 of orifice 210 in direction D3. That is, orifice 210 has a rectangular shape in a plane defined by directions D2 and D3. It should be understood that a configuration and shape of orifice 210 is not limited to the configuration and shape shown in
In an example embodiment, maximum dimension, or length, 240 for chamber 204 in direction D1 is greater than maximum dimension, or length, 242 for chamber 202 in direction D1. In an example embodiment, maximum dimension, or height, 244 for chamber 104 in direction D2 is greater than maximum dimension, or height, 246 for chamber 202 in direction D2.
In an example embodiment, gas stream GS reaches supersonic speed in chamber 204.
Collector 300 includes longitudinal axis LA extending in direction D1 from opening 314 to opening 316 through chamber 312. In an example embodiment as shown in
In an example embodiment as shown in
In an example embodiment, bottom wall 304 includes opening 328. At least respective portions of openings 310 and 328 are aligned in direction D2. In an example embodiment, an entirety of opening 310 is aligned with opening 328 in direction D2. In an example embodiment, diameter DM1 of opening 328 is larger than diameter DM2 of opening 310 to accommodate cone-shaped a light beam passing through the collector. In an example embodiment, openings 310 and 328 have common center line CL.
In an example embodiment, collector 300 includes collar 330 extending from edge 332 opening 310 in direction D2. Collar 330 is arranged to create a seal with an opening for a partition plate separating collector 300 from another chamber as discussed below.
In an example embodiment, openings 310 and 328 are only partially enclosed by walls 302 and 304, respectively. For example, gap 334 is present to accommodate a nozzle, such as nozzle 100.
In an example embodiment, assembly 400 includes partition plates 402 and 404 (not shown in
In an example embodiment, plates 402 and 404 are substantially parallel in a plane formed by directions D1 and D3. In an example embodiment, plates 402 and 404 are in contact with walls 302 and 304, respectively, and co-planar with walls 302 and 304, respectively.
In an example embodiment, plasma source PL is located in chamber 410 partially formed by plate 402 and optical components (not shown) are located in chamber 412 partially formed by plate 404. For example, the optical components are for a semi-conductor inspection system. In an example embodiment, pressure in chamber 410 is controlled independent of system 400. For example, chamber 410 contains a buffer gas, such as argon, and pressure in chamber 410 is controlled by a vacuum pump (not shown).
The dimensions and proportions of nozzles 100 and 200, as well as the pressure of gas G entering nozzles 100 and 200 are selectable to obtain a desired flow rate and flow pattern of gas G from nozzles 100 and 200, for example, into collector 200 in assembly 300. The discussion below is directed to assembly 300; however, it should be understood that portions of the discussion directed to nozzles 100 and 200 and collector 200 also are applicable to nozzles 100 and 200 and collector 200 outside of assembly 300.
In an example embodiment as shown in
As noted above, plasma sources are used to generate light, such as EUV for use in semi-conductor applications, such as semi-conductor inspection systems in low pressure environments. However, a by-product of the light generation is debris that can migrate into sensitive portions of an inspection system, for example, degrading light quality or contaminating optical components. Thus, the debris adversely impacts the function and service life of the optical components and/or requires more frequent purging of the inspection system, all of which are undesirable. Advantageously, assembly 300 provides a means for entraining and removing such debris as described above and further below.
In some instances, it is desirable to generate a gas flow pattern, in direction D1, into collector 200 expanding in direction D2 and remaining substantially uniform in direction D3. Nozzle 100 provides such a flow pattern as shown in
In some instances, it is desirable to generate a gas flow pattern, in direction D1, into collector 200 expanding in direction D3 and remaining substantially uniform in direction D2. Nozzle 200 provides such a flow pattern as shown in
It should be understood that any gas or combination of gases known in the art can be used with system 400.
The following are example advantages of system 400:
1. Nozzles 100 and 200 shape supersonic gas flows at low Reynolds number regimes (R˜1,000) in vacuum by shaping the dimensions of chambers 102, 104, 202, and 204 and throats 106 and 206.
2. Nozzles 100 and 200 reduce condensation in some gases and assist in the acceleration of heavy gases. For example, nozzle 100 can be heated before or after throat 106 and nozzle 200 can be heated before or after throat 206 to reduce or eliminate condensation.
3. A shape of collector 400 collects a high fraction of curtain gas, for example from nozzles 100 and 200 such that the collector itself becomes a pump.
4. Stops debris and undesirable gas species from passing through an opening, such as opening 310 for passing a light beam, while minimizing absorption of light by the entraining gas and minimizing the development of larger gas pressures in regions near the gas curtain.
5. The shape of the gas stream produced, for example, by nozzle 200 (narrowly focused in direction D2 and spreading in direction D3) enables the size of openings 310 and 328 (for passing a light beam) to be minimized, further reducing the transmission path for debris to enter the chamber.
6. System 400 shapes a gas stream with minimal undesirable impact on gas pressures outside of the curtain. For example, stream GS can be such that there is little or no flow into chamber 410, which is a relatively closed area, improving EUV transmission.
7. System 400 shapes a gas stream with minimal undesirable impact on gas pressures outside of the curtain. For example, stream GS can be such that there is little or no flow into chamber 414, which is a relatively open area, improving EUV transmission.
8. Collector 300 enables collection of the gas stream and entrained debris (at opening 316) while gas G has a relatively large density, enabling easier removal of the gas and entrained debris.
9. The design gas collector 300 prevents a gas species located on one side of system 400, for example, in chamber 410, from diffusing around system 400 to the other side of system 400, for example, to chamber 414.
10. The complimentary designs of nozzles 100/200 and collector 300 eliminate dead space in the collector, for example as described above for nozzle 200 and collector 300.
11. The complimentary designs of nozzles 100/200 and collector 300 closely matches a shape of the high-speed region of stream GS such that the entire volume of the collector is continually swept by the gas flowing through the collector, for example as described above for nozzle 200 and collector 300.
12. To affect and/or control the flow rate of buffer gas, for example in chamber 410, and the distribution of the buffer gas in the chamber, the gas pressure in system 400 can be controlled. For example, increasing gas pressure in system 400 reduces the flow rate of buffer gas from chamber 410 into collector 300.
13. To affect and/or control the flow rate of buffer gas, for example in chamber 410, and the distribution of the buffer gas in the chamber, the respective temperatures of the buffer gas in chamber 410 and gas G in system 400 can be controlled.
It will be appreciated that various of the above-disclosed and other features and functions, or alternatives thereof, may be desirably combined into many other different systems or applications. Various presently unforeseen or unanticipated alternatives, modifications, variations, or improvements therein may be subsequently made by those skilled in the art which are also intended to be encompassed by the following claims.
This application claims the benefit under 35 U.S.C. §119(e) of U.S. Provisional Patent Application No. 61/738,342, filed Dec. 17, 2012, which application is incorporated herein by reference in its entirety.
Number | Date | Country | |
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61738342 | Dec 2012 | US |