Claims
- 1. A 1-Gigabyte capacity memory module comprising 36 integrated circuits of type 256-Megabit SDRAM organized as 64 Meg by 4 bits in a TSOP package having an approximate dimension of 5.25 inches wide by 2.05 inches high, the integrated circuits arranged in two rows on each of two surfaces of a printed circuit board.
- 2. The memory module of claim 1, wherein the integrated circuits are Double Data Rate SDRAM.
- 3. A 2-Gigabyte capacity memory module comprising 36 integrated circuits of type 512-Megabit SDRAM organized as 128 Meg by 4 bits in a TSOP package having an approximate dimension of 5.25 inches wide by 2.05 inches high, the integrated circuits arranged in two rows on each of two surfaces of a printed circuit board.
- 4. The memory module of claim 3, wherein the integrated circuits are Double Data Rate SDRAM.
RELATED APPLICATIONS
[0001] This application is a divisional of U.S. patent application Ser. No. 10/094,512, filed Mar. 7, 2002, the disclosures of which are hereby incorporated in their entirety by reference herein. This application is related to U.S. patent application Ser. No. ______ (Attorney Docket NETL.001DV2) filed on even date herewith, which is a divisional of U.S. patent application Ser. No. 10/094,512, filed Mar. 7, 2002.
Divisions (1)
|
Number |
Date |
Country |
Parent |
10094512 |
Mar 2002 |
US |
Child |
10674240 |
Sep 2003 |
US |