"Low-K Fluorinated Amorphous Carbon Interlayer Technology for Quarter Micron Devices", by Matsubara, Y. et al., IEEE, IEDM 96, pp. 369-372 (1996). |
"Novel Low-K Dielectrics Based on DLC Materials", by Grill, A. et al., Materials Science, RC 20878 (92467), pp. 1-9 (Jun. 4, 1997). |
"Diamondlike Carbon Materials as Low-K Dielectrics for Multilevel Interconnects in ULSI", by Grill, A. et al., Mat. Res. Soc. Symp. Proc,, vol. 443, pp. 155-164 (1997). |
"Fluorinated Amorphous Carbon Thin Films Grown by Plasma Enhanced Chemical Vapor Deposition for Low Dielectric Constant Interlayer Dielectrics", by Endo, K. et al., App. Phys. of Japan, 78(2),1 pp. 1370-1372 (Ju.. 15, 1995). |
"Preparation of Fluorinated Amorphous Carbon (a-C:F) by Magnetron Sputtering", by Amano T. et al., Appl. Phys. of Japan, 58th conf. on Applied Physics of Japan (Oct. 2-5, 1997). |