1. Field of the Invention
The present invention relates to system and method for processing substrates, such as silicon wafers for semiconductor, solar cells, and other applications, in a clean environment. More specifically, the invention relates to system and method for handling broken substrates, especially broken silicon wafers.
2. Description of the Related Art
State of the art systems for fabrication of semiconductor wafers generally utilize a mainframe, about which several processing chambers are mounted. Other systems, especially those used for solar cell fabrication, are structured as in-line systems, wherein transport of substrates from one chamber to the next is performed in a linear fashion. Regardless of the architecture used, at some point the wafers have to be transferred from atmospheric environment to vacuum environment. This is done in order to introduce the wafers into a vacuum processing chamber, such as chemical vapor deposition (CVD), plasma enhanced chemical vapor deposition (PECVD), physical vapor deposition system (PVD), etc.
In many systems used for fabricating integrated circuits, the wafers move from chamber to chamber individually. On the other hand, for solar cells fabrication, many linear systems utilize trays, upon which multiple silicon wafers are placed. The tray can move from chamber to chamber in a linear fashion, or the wafers can be moved separately and placed on stationary trays, such that in each chamber many silicon wafers are processes concurrently on a single tray e.g., 64 substrates of 125 mm by 125 mm each.
As can be appreciated, such systems operate in clean rooms under strict handling protocols. However, at times it happens that a wafer breaks in the system, whether during processing or during transport. Such breakage generates broken pieces, particles, and dust, that can cause contamination and lead to disruptions of production. Generally, when such breakage occurs, the system has to be stopped and disassembled in order to perform manual cleaning. Such disruption is costly from the manufacturing throughput perspective, and also requires manual labor for the cleaning. The effect on system throughput is especially acute in solar cell fabrication, where generally each system's throughout is on the order of one to three thousand wafers per hour.
The following summary of the invention is included in order to provide a basic understanding of some aspects and features of the invention. This summary is not an extensive overview of the invention and as such it is not intended to particularly identify key or critical elements of the invention or to delineate the scope of the invention. Its sole purpose is to present some concepts of the invention in a simplified form as a prelude to the more detailed description that is presented below.
Various embodiments of the present invention provide system and method for detection, recovery and cleaning of broken substrates. Embodiments of the invention are especially beneficial for fabrication systems using silicon wafer carried on trays. Embodiments of the invention enable removal of broken wafers and particles from within the fabrication system without requiring disassembly of the system and without requiring manual labor.
According to various embodiments of the subject invention, a broken substrate removable system for use in a substrate processing system is provided, comprising: a suction head having an inlet; a placing mechanism for moving the suction head to location of the broken substrate; a suction pump; and a flexible hose coupling the suction head to the suction pump. A hood is positioned at the inlet of the suction head, and setback extensions are provided at the bottom of the hood to allow air flow into the inlet and prevent thermal conductance from the tray to the hood. A plurality of movable pins are extendable about the inlet of the suction head to enable breakage of the wafer to smaller pieces for easy removal. The head placing mechanism can be constructed as a first gantry providing linear motion in one direction and a second gantry providing linear motion is a perpendicular direction. Alternatively, The head placing mechanism can be constructed as a rotatable pivot providing rotational motion and an arm providing linear motion. A parking and disposal station enables parking of the suction head when not in use and disposal of broken pieces removed by the suction head. Optical sensors, such as digital cameras, are coupled to a controller to detect a broken wafer, and monitor and/or control the placing mechanism to place the suction head above the location of the broken wafer, and to confirm the broken wafer has been successfully removed post operation.
According to embodiments of the invention, a method for removing pieces of broken wafer from a plate supporting a plurality of wafers in a fabrication system is disclosed, comprising: analyzing an optical signal to determine whether one of the plurality of wafers is broken; when it is determined that a broken wafer occupies a position on the plate, transporting the plate to an exchange station, placing a suction head over the position of the broken wafer, and activating a suction pump to remove the pieces of the broken wafer. Optionally, when it is determined that a broken wafer occupies a position on the plate, the plate is moved to a position of a secondary optical sensor to verify that a broken wafer is on the plate. In another embodiment, incoming wafers are analyzed to determine if there are breakages or damage to the wafers prior to processing. Suspected wafers are removed from the incoming tray to minimize the potential of wafers breaking inside the processing apparatus.
Other aspects and features of the invention will become apparent from the description of various embodiments described herein, and which come within the scope and spirit of the invention as claimed in the appended claims.
The invention is described herein with reference to particular embodiments thereof, which are exemplified in the drawings. It should be understood, however, that the various embodiments depicted in the drawings are only exemplary and may not limit the invention as defined in the appended claims.
Various embodiments of the present invention provide apparatus and method for recovering pieces of wafers that were broken during the fabrication of, e.g., semiconductor integrated circuits, solar cells, flat panel displays, LED's etc. Embodiments of the invention are particularly useful for systems that utilize trays to transport and/or process wafers.
The flow of wafers illustrated in
Meanwhile, concurrent with the above processing, the other wafer hanger 119 is positioned in the loading chamber 120 and is loaded with new substrates. The loaded hanger 119 is then moved into the loadlock 110, valve 112 is closed, and vacuum is drawn. When processing in chamber 100 is completed, valve 102 is opened and wafer hanger 118 is moved from loadlock 110 into chamber 100 so as to collect the processed substrates, and hanger 119 is moved from loadlock chamber 110 into chamber 100, so as to deposit its new substrates for processing in chamber 100. When both hangers have been removed back into loadlock 110, the valve 102 is closed, and chamber 100 is energized for processing of the new wafers. The loadlock 110 is then vented to atmospheric pressure, upon which valve 112 is then opened and hanger 118 is moved into loading chamber 120, to unload its processed wafers and load new substrates for processing.
The broken wafer recovery system shown in
The broken wafer recovery system shown in
Additionally, in the embodiment of
According to an embodiment of the invention, when image processor utilizes an image of sensor 246 to indicate that a wafer has been broken on the susceptor 208, the hanger 219 is used to engage the susceptor and bring it to sensor 244 for a second inspection. If sensor 244 also indicates that the wafer is indeed broken, then the hanger can be used to move the susceptor to station 220 for removing the broken pieces.
According to another embodiment, the system of
In this example, the broken wafer recovery system is provided on the flipping station 221. The broken wafer recovery system can be in the form of those described with respect to
Another feature illustrated in
When the broken wafer removal system is fitted into a system utilizing the susceptor of
While the invention has been described with reference to particular embodiments thereof, it is not limited to those embodiments. Specifically, various variations and modifications may be implemented by those of ordinary skill in the art without departing from the invention's spirit and scope, as defined by the appended claims. Additionally, all of the above-cited prior art references are incorporated herein by reference.
This Application is a divisional application of, and claims priority from, U.S. application Ser. No. 13/115,064 filed on May 24, 2011.
Number | Name | Date | Kind |
---|---|---|---|
3158086 | Weimer | Nov 1964 | A |
4490042 | Wyatt | Dec 1984 | A |
4544642 | Maeda et al. | Oct 1985 | A |
4590042 | Drage | May 1986 | A |
4612077 | Tracy et al. | Sep 1986 | A |
4643629 | Takahashi et al. | Feb 1987 | A |
4694779 | Hammond et al. | Sep 1987 | A |
H000422 | Daniels et al. | Feb 1988 | H |
4752180 | Yoshikawa | Jun 1988 | A |
4854263 | Chang et al. | Aug 1989 | A |
5084125 | Aoi | Jan 1992 | A |
5136975 | Bartholomew et al. | Aug 1992 | A |
5167922 | Long | Dec 1992 | A |
5178638 | Kaneko et al. | Jan 1993 | A |
5288379 | Namiki et al. | Feb 1994 | A |
5353495 | Terabayashi et al. | Oct 1994 | A |
5404894 | Shiraiwa | Apr 1995 | A |
5439524 | Cain et al. | Aug 1995 | A |
5486080 | Sieradzki | Jan 1996 | A |
5551327 | Hamby et al. | Sep 1996 | A |
5558717 | Zhao et al. | Sep 1996 | A |
5589002 | Su | Dec 1996 | A |
5591269 | Arami et al. | Jan 1997 | A |
5595606 | Fujikawa et al. | Jan 1997 | A |
5624498 | Lee et al. | Apr 1997 | A |
5631573 | Ohno | May 1997 | A |
5679055 | Greene et al. | Oct 1997 | A |
5690742 | Ogata et al. | Nov 1997 | A |
5695564 | Imahashi | Dec 1997 | A |
5746875 | Maydan et al. | May 1998 | A |
5756155 | Tzeng et al. | May 1998 | A |
5759334 | Kojima et al. | Jun 1998 | A |
5795399 | Hasegawa et al. | Aug 1998 | A |
5846332 | Zhao et al. | Dec 1998 | A |
5853607 | Zhao et al. | Dec 1998 | A |
5855468 | Cagle et al. | Jan 1999 | A |
5885356 | Zhao et al. | Mar 1999 | A |
5944940 | Toshima | Aug 1999 | A |
5968275 | Lee et al. | Oct 1999 | A |
5989346 | Hiroki | Nov 1999 | A |
5996528 | Berrian et al. | Dec 1999 | A |
6007675 | Toshima | Dec 1999 | A |
6050506 | Guo et al. | Apr 2000 | A |
6064629 | Stringer et al. | May 2000 | A |
6110287 | Arai et al. | Aug 2000 | A |
6113984 | MacLeish et al. | Sep 2000 | A |
6135102 | Sorimachi et al. | Oct 2000 | A |
6148761 | Majewski et al. | Nov 2000 | A |
6159301 | Sato et al. | Dec 2000 | A |
6176668 | Kurita et al. | Jan 2001 | B1 |
6202589 | Grahn et al. | Mar 2001 | B1 |
6206972 | Dunham | Mar 2001 | B1 |
6245192 | Dhindsa et al. | Jun 2001 | B1 |
6267839 | Shamouilian et al. | Jul 2001 | B1 |
6286230 | White et al. | Sep 2001 | B1 |
6302965 | Umotoy et al. | Oct 2001 | B1 |
6323616 | Sagues et al. | Nov 2001 | B1 |
6361648 | Tobin | Mar 2002 | B1 |
6435798 | Satoh | Aug 2002 | B1 |
6436193 | Kasai et al. | Aug 2002 | B1 |
6471779 | Nishio et al. | Oct 2002 | B1 |
6486444 | Fairbairn et al. | Nov 2002 | B1 |
6517691 | Bluck et al. | Feb 2003 | B1 |
6556715 | Kozlowski | Apr 2003 | B1 |
6586886 | Katz et al. | Jul 2003 | B1 |
6677712 | Katz et al. | Jan 2004 | B2 |
6719517 | Beaulieu et al. | Apr 2004 | B2 |
6722834 | Tepman | Apr 2004 | B1 |
6746198 | White et al. | Jun 2004 | B2 |
6793733 | Janakiraman et al. | Sep 2004 | B2 |
6821563 | Yudovsky | Nov 2004 | B2 |
6849555 | Lee et al. | Feb 2005 | B2 |
6872259 | Strang | Mar 2005 | B2 |
6902647 | Hasper | Jun 2005 | B2 |
6979168 | Uchimaki et al. | Dec 2005 | B2 |
7010388 | Mitchell et al. | Mar 2006 | B2 |
7042553 | An et al. | May 2006 | B2 |
7128516 | Sugiyama et al. | Oct 2006 | B2 |
7195673 | Shimizu et al. | Mar 2007 | B2 |
7214027 | Stone | May 2007 | B2 |
7270713 | Blonigan et al. | Sep 2007 | B2 |
7283660 | Ganot et al. | Oct 2007 | B2 |
7290978 | Tran | Nov 2007 | B2 |
7695233 | Toshima | Apr 2010 | B2 |
7806641 | Guo et al. | Oct 2010 | B2 |
7841820 | Bonora et al. | Nov 2010 | B2 |
7845529 | Okajima et al. | Dec 2010 | B2 |
7854820 | De La Llera et al. | Dec 2010 | B2 |
8152923 | Mitrovic et al. | Apr 2012 | B2 |
8246284 | Borden | Aug 2012 | B2 |
8287646 | Mitrovic et al. | Oct 2012 | B2 |
8307972 | Horn et al. | Nov 2012 | B2 |
8408858 | Guo et al. | Apr 2013 | B2 |
8444364 | Blonigan et al. | May 2013 | B2 |
8454850 | Dong et al. | Jun 2013 | B2 |
8459276 | Stevens et al. | Jun 2013 | B2 |
8617349 | Law et al. | Dec 2013 | B2 |
8672603 | Blonigan et al. | Mar 2014 | B2 |
8998552 | Toshima et al. | Apr 2015 | B2 |
9287152 | Blonigan et al. | Mar 2016 | B2 |
20010000747 | White et al. | May 2001 | A1 |
20010009141 | Kong et al. | Jul 2001 | A1 |
20020000196 | Park | Jan 2002 | A1 |
20020080291 | Takahashi | Jun 2002 | A1 |
20030003767 | Kim et al. | Jan 2003 | A1 |
20030068215 | Mori et al. | Apr 2003 | A1 |
20030106574 | Krolak | Jun 2003 | A1 |
20030111961 | Katz et al. | Jun 2003 | A1 |
20030113187 | Lei et al. | Jun 2003 | A1 |
20030140851 | Janakiraman et al. | Jul 2003 | A1 |
20030201723 | Katz et al. | Oct 2003 | A1 |
20040060514 | Janakiraman et al. | Apr 2004 | A1 |
20040163761 | Strang | Aug 2004 | A1 |
20040197184 | Sugiyama et al. | Oct 2004 | A1 |
20050011447 | Fink | Jan 2005 | A1 |
20050150601 | Srivastava | Jul 2005 | A1 |
20050160991 | Miyamoto et al. | Jul 2005 | A1 |
20050183666 | Tsuji et al. | Aug 2005 | A1 |
20050263066 | Lubomirsky et al. | Dec 2005 | A1 |
20060102081 | Ueno et al. | May 2006 | A1 |
20060137609 | Puchacz et al. | Jun 2006 | A1 |
20060177288 | Parker et al. | Aug 2006 | A1 |
20060197235 | Farnworth et al. | Sep 2006 | A1 |
20060236929 | Katsuoka et al. | Oct 2006 | A1 |
20060286193 | Ando et al. | Dec 2006 | A1 |
20070017445 | Takehara et al. | Jan 2007 | A1 |
20070119393 | Ashizawa | May 2007 | A1 |
20070151516 | Law et al. | Jul 2007 | A1 |
20070181531 | Horiguchi et al. | Aug 2007 | A1 |
20070207014 | Toshima | Sep 2007 | A1 |
20070215048 | Suzuki et al. | Sep 2007 | A1 |
20070261956 | Ulrich | Nov 2007 | A1 |
20080014055 | van der Meulen | Jan 2008 | A1 |
20080066683 | Fujimura et al. | Mar 2008 | A1 |
20080090417 | De La Llera et al. | Apr 2008 | A1 |
20080093341 | Turlot et al. | Apr 2008 | A1 |
20080099448 | Larson et al. | May 2008 | A1 |
20080138175 | Mitchell et al. | Jun 2008 | A1 |
20080196666 | Toshima | Aug 2008 | A1 |
20080213477 | Zindel et al. | Sep 2008 | A1 |
20080233283 | Choi et al. | Sep 2008 | A1 |
20090045182 | Lerner et al. | Feb 2009 | A1 |
20090104374 | Kumagai | Apr 2009 | A1 |
20090106968 | Heinz | Apr 2009 | A1 |
20090179085 | Carducci et al. | Jul 2009 | A1 |
20090181593 | Kim | Jul 2009 | A1 |
20090309905 | Yoshioka et al. | Dec 2009 | A1 |
20100068011 | Tanaka | Mar 2010 | A1 |
20100076601 | Matsuo et al. | Mar 2010 | A1 |
20100087028 | Porthouse et al. | Apr 2010 | A1 |
20100089319 | Sorensen et al. | Apr 2010 | A1 |
20100136261 | Tso et al. | Jun 2010 | A1 |
20100202860 | Reed et al. | Aug 2010 | A1 |
20100203242 | Borden | Aug 2010 | A1 |
20100220304 | Mukai et al. | Sep 2010 | A1 |
20100301088 | Purdy et al. | Dec 2010 | A1 |
20110011338 | Chuc et al. | Jan 2011 | A1 |
20110188974 | Diamond | Aug 2011 | A1 |
20110313565 | Yoo et al. | Dec 2011 | A1 |
20110315081 | Law et al. | Dec 2011 | A1 |
20120267049 | Stevens et al. | Oct 2012 | A1 |
20130294678 | Blonigan et al. | Nov 2013 | A1 |
20140064886 | Toshima et al. | Mar 2014 | A1 |
Number | Date | Country |
---|---|---|
1250490 | Apr 2000 | CN |
1330507 | Sep 2002 | CN |
1446742 | Oct 2003 | CN |
1582488 | Feb 2005 | CN |
1650416 | Aug 2005 | CN |
1674220 | Sep 2005 | CN |
1734711 | Feb 2006 | CN |
101360988 | Feb 2009 | CN |
101413112 | Apr 2009 | CN |
101423936 | May 2009 | CN |
101423937 | May 2009 | CN |
102051600 | May 2011 | CN |
102122609 | Jul 2011 | CN |
102122610 | Jul 2011 | CN |
102296277 | Dec 2011 | CN |
ZL200980119052.8 | Aug 2012 | CN |
102751158 | Oct 2012 | CN |
102760631 | Oct 2012 | CN |
102810497 | Dec 2012 | CN |
ZL201210207818.1 | May 2015 | CN |
102051600 | Jul 2015 | CN |
102122609 | Aug 2015 | CN |
35 08 516 | Sep 1986 | DE |
0 768 702 | Apr 1997 | EP |
1 278 230 | Jan 2003 | EP |
2 261 391 | Dec 2010 | EP |
2 312 613 | Apr 2011 | EP |
2 333 813 | Jun 2011 | EP |
2 333 814 | Jun 2011 | EP |
2 400 537 | Dec 2011 | EP |
2 518 763 | Oct 2012 | EP |
2 528 088 | Nov 2012 | EP |
2518763 | Sep 2015 | EP |
2312613 | Apr 2016 | EP |
2003-338492 | Nov 2003 | JO |
57-211746 | Dec 1982 | JP |
60-178639 | Sep 1985 | JP |
63-276239 | Nov 1988 | JP |
01-139771 | Jun 1989 | JP |
01-294868 | Nov 1989 | JP |
4-78125 | Mar 1992 | JP |
5-109683 | Apr 1993 | JP |
05-69162 | Sep 1993 | JP |
8-8586 | Jan 1996 | JP |
8-316286 | Nov 1996 | JP |
09-176856 | Jul 1997 | JP |
9-283983 | Oct 1997 | JP |
10-98089 | Apr 1998 | JP |
11-204813 | Jul 1999 | JP |
2000-208587 | Jul 2000 | JP |
2001-210695 | Aug 2001 | JP |
2001-284258 | Oct 2001 | JP |
2002-43404 | Feb 2002 | JP |
2002-516239 | Jun 2002 | JP |
2002-203885 | Jul 2002 | JP |
2002-256439 | Sep 2002 | JP |
2002-270880 | Sep 2002 | JP |
2002-288888 | Oct 2002 | JP |
2003-007682 | Jan 2003 | JP |
2003-028142 | Jan 2003 | JP |
2003-059999 | Feb 2003 | JP |
2003-068819 | Mar 2003 | JP |
2003-258058 | Sep 2003 | JP |
2003-282462 | Oct 2003 | JP |
2004-200421 | Jul 2004 | JP |
2004-327761 | Nov 2004 | JP |
2005-019739 | Jan 2005 | JP |
2005-516407 | Jun 2005 | JP |
2005-211865 | Aug 2005 | JP |
2006-058769 | Mar 2006 | JP |
2006-332536 | Dec 2006 | JP |
2007-112626 | May 2007 | JP |
2007-123684 | May 2007 | JP |
2007-242648 | Sep 2007 | JP |
2008-205219 | Sep 2008 | JP |
2009-267012 | Nov 2009 | JP |
2009-540561 | Nov 2009 | JP |
2011-124579 | Jun 2011 | JP |
2012-009854 | Jan 2012 | JP |
2012-230900 | Nov 2012 | JP |
2012-248837 | Dec 2012 | JP |
53-30721 | Oct 2013 | JP |
2000-223546 | Oct 2014 | JP |
5613302 | Oct 2014 | JP |
5835722 | Nov 2015 | JP |
10-2010-0130838 | Dec 2010 | KR |
10-2010-0134062 | Dec 2010 | KR |
10-2011-0041427 | Apr 2011 | KR |
10-2011-0066111 | Jun 2011 | KR |
10-2011-0066113 | Jun 2011 | KR |
10-2012-0000501 | Jan 2012 | KR |
10-2012-0120909 | Nov 2012 | KR |
10-2012-0131105 | Dec 2012 | KR |
200710928 | Mar 2007 | TW |
200835638 | Sep 2008 | TW |
M366667 | Oct 2009 | TW |
201026583 | Jul 2010 | TW |
201102235 | Jan 2011 | TW |
201140733 | Nov 2011 | TW |
201201319 | Jan 2012 | TW |
201243982 | Nov 2012 | TW |
I417984 | Dec 2013 | TW |
I430714 | Mar 2014 | TW |
201425189 | Jul 2014 | TW |
I470729 | Jan 2015 | TW |
I485799 | May 2015 | TW |
WO 0022655 | Apr 2000 | WO |
WO 03064725 | Aug 2003 | WO |
WO 2005001925 | Jan 2005 | WO |
2007077765 | Jul 2007 | WO |
WO 2007084124 | Jul 2007 | WO |
WO 2007126289 | Nov 2007 | WO |
WO 2008048543 | Apr 2008 | WO |
WO 2009119096 | Jan 2009 | WO |
WO 2009052002 | Apr 2009 | WO |
WO 2009119580 | Oct 2009 | WO |
WO 2009130790 | Oct 2009 | WO |
WO 2010091205 | Aug 2010 | WO |
WO 2010127038 | Nov 2010 | WO |
WO 2011035820 | Mar 2011 | WO |
WO 2014035768 | Mar 2014 | WO |
Entry |
---|
Restriction Requirement in U.S. Appl. No. 11/826,336 dated Dec. 24, 2008. |
Office Action in U.S. Appl. No. 11/826,336 dated May 1, 2009. |
Office Action in U.S. Appl. No. 11/826,336 dated Jan. 5, 2010. |
Office Action in U.S. Appl. No. 11/826,336 dated May 25, 2010. |
Restriction Requirement in U.S. Appl. No. 12/906,053 dated Mar. 26, 2013. |
Notice of Allowance in U.S. Appl. No. 12/906,053 dated Aug. 14, 2013. |
Restriction Requirement in U.S. Appl. No. 11/322,334 dated Sep. 13, 2007. |
Office Action in U.S. Appl. No. 11/322,334 dated Nov. 27, 2007. |
Office Action in U.S. Appl. No. 11/322,334 dated Nov. 4, 2008. |
Office Action in U.S. Appl. No. 11/322,334 dated May 22, 2008. |
Office Action in U.S. Appl. No. 11/322,334 dated Aug. 12, 2009. |
Office Action in U.S. Appl. No. 11/477,931 dated Oct. 15, 2008. |
Office Action in U.S. Appl. No. 11/477,931 dated Jul. 14, 2009. |
Notice of Allowance in U.S. Appl. No. 11/477,931 dated Dec. 29, 2009. |
Office Action in U.S. Appl. No. 12/965,791 dated Sep. 25, 2012. |
Office Action in U.S. Appl. No. 12/965,791 dated Dec. 28, 2012. |
Office Action in U.S. Appl. No. 12/965,791 dated Feb. 27, 2013. |
Office Action in U.S. Appl. No. 12/965,791 dated Aug. 14, 2013. |
Notice of Allowance in U.S. Appl. No. 12/965,791 dated Oct. 24, 2013. |
Notice of Allowance in U.S. Appl. No. 12/965,798 dated Jan. 17, 2013. |
Office Action in U.S. Appl. No. 12/934,629 dated Oct. 3, 2013. |
Office Action in U.S. Appl. No. 12/934,629 dated May 16, 2014. |
Notice of Allowance in U.S. Appl. No. 12/934,629 dated Nov. 28, 2014. |
Office Action in U.S. Appl. No. 13/149,828 dated Jul. 2, 2013. |
Restriction Requirement in U.S. Appl. No. 13/093,698 dated Aug. 20, 2012. |
Office Action in U.S. Appl. No. 13/093,698 dated Nov. 7, 2012. |
Office Action in U.S. Appl. No. 13/093,698 dated May 28, 2013. |
Advisory Action in U.S. Appl. No. 13/093,698 dated Sep. 4, 2013. |
Restriction Requirement in U.S. Appl. No. 13/115,064 dated Jul. 6, 2012. |
Office Action in U.S. Appl. No. 13/115,064 dated Aug. 2, 2012. |
Office Action in U.S. Appl. No. 13/115,064 dated Dec. 4, 2012. |
Notice of Allowance in U.S. Appl. No. 13/115,064 dated Feb. 8, 2013. |
Supplemental Notice of Allowance in U.S. Appl. No. 13/115,064 dated Mar. 14, 2013. |
First Office Action & Examination Report in Chinese Patent Application No. 201010552244.2, dated Dec. 27, 2013. |
Second Office Action & Examination Report in Chinese Patent Application No. 201010552244.2 dated Jan. 7, 2014. |
Third Office Action in Chinese Patent Application No. 201010552244.2 dated Oct. 23, 2014. |
First Office Action and Examination Opinion in Taiwanese Patent Application No. 99135138 dated Aug. 13, 2013. |
Notice of Rejection for Japanese Patent Application No. 2006-058769 dated Aug. 9, 2011. |
European Extended Search Report for Application No. 10194525.1 dated Apr. 22, 2015. |
First Office Action & Examination Report in Chinese Patent Application No. 201010625048.3 dated Jun. 11, 2014. |
Second Office Action & Examination Report in Chinese Patent Application No. 201010625048.3 dated Jan. 22, 2015. |
Notification for Reasons for Refusal for Japanese Patent Application No. 2010-275100 dated Oct. 7, 2014. |
Office Action and Examination Report for Taiwanese Patent Application No. 99143048 dated Jul. 8, 2014. |
European Extended Search Report for Application No. 10194527.7 dated Apr. 28, 2015. |
First Office Action & Examination Report in Chinese Patent Application No. 201010625047.9 dated Jun. 30, 2014. |
Second Office Action & Examination Report in Chinese Patent Application No. 201010625047.9 dated Dec. 15, 2014. |
International Search Report for PCT/JP2009/055818 dated Jun. 16, 2009. |
International Preliminary Report on Patentability for PCT/JP2009/055818 dated Oct. 7, 2010. |
Extended Search Report for European Application No. 09725876 dated Dec. 20, 2012. |
First Office Action in Chinese Patent Application No. 200980119052.8 dated Oct. 27, 2011. |
Notice of Allowance in Chinese Patent Application No. 200980119052.8 dated Apr. 1, 2012. |
Fist Office Action & Examination Report in Chinese Patent Application No. 201210207818.1 dated Jun. 17, 2014. |
Notice of Allowance for Japanese Patent Application No. 2008-078764 dated May 28, 2013. |
Notice of Allowance for Japanese Patent Application No. 2013-154164 dated Aug. 12, 2014. |
Notice of Rejection for Japanese Patent Application No. P2005-316213 dated Mar. 6, 2012. |
Examination Report in Taiwanese Patent Application No. 100119927 dated Sep. 25, 2013. |
Extended Search Report and Opinion for European Application No. 12165448.7 dated Jul. 5. 2012. |
Notice of Intention to Grant in European Application No. 12165448.7 dated Jan. 6, 2015. |
Office Action and Examination Report for Taiwanese Patent Application No. 101112986 dated Sep. 30, 2014. |
Extended Search Report and Opinion for European Application No. 12168068.0 dated May 21, 2014. |
Office Action and Examination Report for Taiwanese Patent Application No. 101116209 dated May 13, 2014. |
Second Office Action and Examination Report for Taiwanese Patent Application No. 101116209 dated Aug. 15, 2014. |
International Search Report for PCT/US2013/056030 dated Feb. 3, 2014. |
International Preliminary Report on Patentability for PCT/US2013/056030 dated Mar. 12, 2015. |
Fukada, T. et al., “Uniform RF Discharge Plasmas Produced by a Square Hollow Cathode with Tapered Shape”, Jpn. J. Appl. Phys., Part 2: No. 1A/B, vol. 37, Jan. 15, 1998, pp. L81-L84. |
Zhang, D. et al., University of Illinois: Optical and Discharge Physics, “Optimization of Plasma Uniformity Using Hollow-Cathode Structure in RF Discharges”, 51st Gaseous Electronics Conference & 4th International Conference on Reactive Plasmas, Oct. 1923, 1998, Maui, Hawaii, pp. GEC98-01 thru GEC98-15. |
Office Action in U.S. Appl. No. 13/898,353 dated May 28, 2015. |
Third Office Action for Chinese Patent Application No. 201010625048.3 dated Jul. 15, 2015. |
Examination Report for European Patent Application No. 09725876.8 dated Jun. 19, 2015. |
Office Action for Korean Patent Application No. 2010-7023727 dated Aug. 18, 2015. |
Notice of Allowance in U.S. Appl. No. 13/898,353 dated Oct. 26, 2015. |
Restriction Requirement for U.S. Appl. No. 13/912,126 dated Sep. 28, 2015. |
Office Action for U.S. Appl. No. 13/972,282 dated Sep. 18, 2015. |
Decision of Grant for Japanese Patent Application No. 2010-275100 dated Oct. 6, 2015, Not in English. Considered to the extent is could be understood. |
First Office Action for Chinese Patent Application No. 201210124533.1 dated Jul. 28, 2015. |
Extended Search Report for European Application No. 10013687.8 dated Feb. 5, 2014. |
Fourth Office Action for Chinese Patent Application No. 201010625048.3 dated Jan. 18, 2016. |
Final Refusal for Japanese Patent Application No. 2010-275100 dated Apr. 14, 2015. |
Office Action for Chinese Patent Application No. 2012101639363.7 dated Dec. 4, 2015. |
Final Rejection for Korean Patent Application No. 10-2010-7023727 dated Mar. 25, 2016. |
Notice of Grant for Chinese Patent Application No. 201210124533.1 dated Mar. 2, 2016. |
Office Action for Japanese Patent Application No. 2012-98537 dated Mar. 22, 2016. |
Examination Report for European Patent Application No. 12168068.0 dated Apr. 15, 2016. |
Office Action in Korean Patent Application No. 10-2010-0100808 dated Jun. 30, 2016. |
Office Action for Japanese Patent Application No. 2012-117853 dated Jun. 7, 2016. |
Number | Date | Country | |
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20130269149 A1 | Oct 2013 | US |
Number | Date | Country | |
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Parent | 13115064 | May 2011 | US |
Child | 13912126 | US |