1. Field
The present disclosure relates to a carrier for carrying a packaged chip and a test handler equipped with the carrier.
2. Background
A handler puts packaged chips through electrical tests at the conclusion of a packaging process. The handler transfers the packaged chips from a user tray to a test tray and supplies the test tray containing the packaged chips to a tester. The tester includes a test board with a plurality of sockets. The handler makes the packaged chips in the test tray individually contact with sockets of the test board. The tester then performs the electrical tests on the packaged chips. After sorting the packaged chips according to test results, the handler transfers them from the test tray to the corresponding user trays.
The packaged chips are held in the test tray while they are being transferred to various locations in the handler. Each test tray is equipped with a plurality of carriers that hold the chips firmly in place. This is done to prevent the packaged chips from dropping from the test tray while the tray is being moved.
The carriers are arranged in rows and columns on a test tray. One packaged chip is placed into each carrier. When a packaged chip is placed into a carrier, a latch of the carrier holds it firmly in place. When the latch releases the packaged chip, the chip can be picked up from the carrier.
The carrier 1 is subject to outside impact or shock in most environments. When the coil spring 18 does not have sufficient strength to resist such impacts, the latch fails to hold the packaged chips firmly in place. Thus, the packaged chip may be dropped from the carrier 1.
The embodiments will be described in detail with reference to the following drawings, in which like reference numerals refer to like elements, and wherein:
One end of the guiding hole 116 is closed. An elastic member 180 is inserted into the guiding hole 116. The elastic member 180 abuts a moving block 140. The elastic member 180 applies a biasing force against the moving block 140 and the latch 130.
The moving block 140 ascends and descends within the guiding hole 116. The latch 130 is mounted to a bottom side of the moving block 140. A moving block pin 151 connects the latch 130 to the moving block 140. The latch 130 is also inserted into the guiding hole 116. A hinge pin 120 crosses the guiding hole 116 and pivotally mounts the latch 130 in the guiding hole 116. Thus, the hinge pin 120 connects the latch 130 to a body 110 of the carrier 100. The latch 130 rotates about the hinge pin 120.
The moving block 140 has a first step 154 on the bottom side which comes in contact with an upper side of the latch 130. The latch 130 has a second step 153 on its upper side, which comes in contact with the bottom side of the moving block 140. The first and second steps 154 and 153 engage with each other. The engagement of the first and second steps 154, 153 prevents the latch 130 from rotating about the hinge pin 120, in response to shocks or impacts.
The space 111 is a hole vertically pierced through the housing 110. The space 111 is where the packaged chip S is placed. The housing 110 also includes a supporting part 114 protruding from the inside lateral surface thereof toward the space 111. The supporting part 114 serves to support the packaged chip S placed into the space 111.
The latch 130 has a first hole 132 and a longitudinal hole 156. The hinge pin 120 is inserted into the first hole 132. Thus, the latch 130 rotates about the hinge pin 120.
The moving block pin 151 is inserted into the longitudinal hole 156. The moving block pin 151 moves along the longitudinal hole 156. When the moving block 140 ascends along the guiding hole 116, the moving block pin 151 travels down the longitudinal hole 156 and causes the latch 130 to rotate about the hinge pin 120, which causes the latch to release the packaged chip S.
As shown in
When a pushing pin 170, positioned under the latch 130, pushes the moving block 140 upward in the guiding hole, the moving block 140 ascends to rotate the latch 130 about the hinge pin 120, resulting in releasing the package chip S. That is, when the moving block 140 ascends, the moving block pin 151 moves along the longitudinal hole 156 to rotate the latch 130
The moving block 140 has a first step 154 on the bottom side thereof which engages with a second step on the upper side of the latch 130 to prevent the latch 130 from rotating during the initial upward movement of the moving block 140. The first and second steps 154 and 153 are the same in height. The height of the first and second steps 154 and 153 is hereinafter referred to as a “critical height.” When the moving block 140 moves upward by the critical height, as shown in
The longitudinal hole 156 in the latch includes a first longitudinal section 157 and a second longitudinal section 158. The first longitudinal section 157 serves to provide a path which the moving block pin 151 follows to move upwards by the amount of the critical height while the latch 156 remain in the latched position. The second longitudinal section 158 serves as a path which the moving blocks pin 151 follows when the moving block 140 has passed the critical height. When the moving block pin 151 moves along the second longitudinal section 158, the latch 130 rotates about the hinge pin 120 to release the packaged chip S.
When the latch 130 holds the packaged chip firmly in place, the first longitudinal section 157 remains upright and the second longitudinal section 158 remains inclined upwards toward a pressing part 135 of the latch 130. The length of the first longitudinal section 157 may be equal to or greater than the critical height to permit the first and second steps 154 and 153 to remain engaged with each other when the moving block 140 ascends short distances up the guiding hole 116.
As shown in
The head part 144 is inserted into the guiding hole 116. The leg part 142 includes four legs, each of which protrudes downward from each of the bottom corners of the head part 144. Two of the legs protruding from one side have the second holes 152. The latch 130 is inserted between the two legs having the second holes 152. The moving block pin 151 passes through the second holes 152 and the longitudinal hole 156 on the latch to connect the moving block 140 to the latch 130. The second holes 152 serve only to fix the moving block pin 151 to the moving block 140. Therefore, the moving block pin 151 and the two legs may be formed as a single body. Otherwise, the moving block pin 151 may be connected to the two legs, with a connecting means such as a rivet.
As shown in
Until the pushing pin 170 pushes the moving block 140 upward more than the critical height, the first step 154 on the moving block 140 and the second step 153 on the latch 130 remain engaged with each other and the latch 130 does not rotate. When the pushing pin 170 pushes the moving block 140 upward more than the critical height, as shown in
When the moving block pin 151 moves to an upper end of the second longitudinal hole 158, the latch 130 does not protrude into the space 111, which allows the packaged chip S to be loaded into or removed from the space 111. During a loading step, a vacuum nozzle of a picker places a packaged chip S into the space 111, and the pushing pin 170 descends. When the pushing pin 170 descends, the moving block 140 descends by virtue of spring pressure of the coil spring 180 provided into the guiding hole 116, which rotates the latch 130 back to the closed and latched position, as shown in
As shown in
The test tray 205 includes the carriers 100 described above. The packaged chips are placed into the carriers 100.
The handler includes at least one picker (250a, 250b, 250c, or 250d) to load the packaged chips S into or unload them from the test tray. The loading picker picks up the packaged chip S from the trays 210 to place them into the carriers of the test tray 205, and the unloading picker picks up the tested packaged chip S from the carriers 100 of the test tray 205 to place them into the second user tray 220.
As shown in
The handler may further include a test system 240. The test system 240 includes several chambers, provided behind the handler, where the packaged chips contained in the test tray are heated or cooled to extremely high or low temperatures, tested, and cooled or heated to room temperature. Among them, the test chamber is where the packaged chips come in contact with sockets of a test board in an outside tester to receive electrical tests.
The carriers 100 are provided on the test tray 205. The carriers 100 hold the packaged chips S firmly in place while the test tray 205 containing them moves in the handler. As shown in
A pushing plate 290 is positioned under the test tray 205. The pushing plate 290 releases the latches of the carriers provided on the test tray 205 as described above. As shown in
The base plate 291 may further include guiding pins 293. The guiding pins 293 are also provided on an upper side of the base plate 291, adjacent to the pushing pins 292. The guiding pin 293, which are longer than the pushing pins 292, are inserted into guiding holes ahead of the pushing pins 282. Thus, the guiding pins 293 guide the pushing pins 292 to exactly push the latch.
One pushing plate may ascend to push the moving blocks 140 of all of the carriers at the same time.
The carrier described above provides an advantage of holding the packaged chips firmly in place when shocks or jolts cause small movements of the moving blocks. Thus the packaged chips are prevented from dropping from the carrier while the test tray containing them moves in the handler.
Any reference in this specification to “one embodiment,” “an embodiment,” “example embodiment,” etc., means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the invention. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment. Further, when a particular feature, structure, or characteristic is described in connection with any embodiment, it is submitted that it is within the purview of one skilled in the art to effect such feature, structure, or characteristic in connection with other ones of the embodiments.
Although a number of embodiments have been described, it should be understood that numerous other modifications and embodiments can be devised by those skilled in the art that will fall within the spirit and scope of the principles of this disclosure. More particularly, variations and modifications are possible in the component parts and/or arrangements that would fall within the scope of the disclosure, the drawings and the appended claims. In addition to variations and modifications in the component parts and/or arrangements, alternative uses will also be apparent to those skilled in the art.
Number | Date | Country | Kind |
---|---|---|---|
10-2007-0038048 | Apr 2007 | KR | national |