This invention relates to the field of transaction cards and, more particularly, transaction cards having at least one layer or coating of ceramic.
Conventional transaction cards are made from thermoplastic materials, such as polyvinyl chloride (PVC) and polyethylene terephthalate (PET). These “standard” transaction cards suffer from low durability and are susceptible to degradation and/or destruction due to environmental factors. For example, exposure to sunlight and/or moisture can result in the disruption of the chemical bonds in the plastic, causing the transaction card to warp, crack, and/or fade. Similarly, plastic cards are easily bent or severed. In both cases, a plastic transaction card may become unusable due to this damage.
In the modern transactional card market, it is often desirable to obtain a “premium” feel, look, or tactile feature that may be marketed to an affluent market. These transactional cards may be used as debit cards, credit cards, or pre-paid cards. As part of this premium feel, a card that is heavier than a standard plastic card is often desired, as well as an increased durability of the card body due to the cost of card.
Existing premium transaction cards are typically made entirely or partially from metal. Metal cards demonstrate an enhanced durability as compared to the standard plastic card. However, some metal cards may disadvantageously: 1) require extensive machining; 2) produce electrostatic discharge; and 3) interfere with radio frequency radiation for contactless transactions.
Various aspects of the invention relate to transaction cards.
One aspect of the invention comprises a transaction card having a monolithic ceramic card body including one or more pockets, and at least one of a magnetic stripe, a barcode, and a laser signature portion.
Another aspect of the invention comprises a transaction card having a substrate layer having a first side and a second side. A first ceramic layer is connected to the first side of the substrate layer.
Yet another aspect of the invention comprises a transaction card having a substrate core layer having a first side and a second side. A first ceramic layer is connected to the first side of the substrate core layer. A second ceramic layer is connected to the second side of the substrate core layer.
Still another aspect of the invention comprises a transaction card having a substrate core layer having a first side and a second side. A first ceramic layer is connected to the first side of the substrate core layer. A second ceramic layer is connected to the second side of the substrate core layer. The first side and the second side of the substrate core layer define pockets on each side of the substrate core layer, and the first ceramic layer and the second ceramic layer are disposed in the pockets.
It is to be understood that both the foregoing general description and the following detailed description are exemplary, but are not restrictive, of the invention.
The invention is best understood from the following detailed description when read in connection with the accompanying drawings, with like elements having the same reference numerals. When a plurality of similar elements are present, a single reference numeral may be assigned to the plurality of similar elements with a small letter designation referring to specific elements. When referring to the elements collectively or to a non-specific one or more of the elements, the small letter designation may be dropped. This emphasizes that according to common practice, the various features of the drawings are not drawn to scale unless otherwise indicated. On the contrary, the dimensions of the various features may be expanded or reduced for clarity. Included in the drawings are the following figures:
Aspects of the invention relate to transaction cards. As used herein, transaction cards, also known as data cards or smart cards, include credit cards, debit cards, check cards, stored-value cards, gift cards, retail cards, or any other transaction card. Both “contact” and “contactless” bi-directional communication data transaction cards are included. Transaction cards may be provided with either with electrical contacts for effecting direct electrical contact with a card reader, or with an antenna coil for effecting contactless bi-directional communication with a remote card reader. Transaction cards may also be provided with both “contact” and “contactless” platforms, e.g., dual interface cards.
The inventors have recognized that it would be useful to provide a transaction card that provides a premium feel, look, or tactile feature and that avoids the disadvantages associated with some metal-based transaction cards. The inventors have further recognized that, by employing transaction cards comprised entirely of ceramic, having ceramic inserts, or utilizing a ceramic coating, that transaction cards may be obtained in a variety of colors and with a variety of desired features such as, e.g., laser signatures or decorative designs. The inventors have also realized that the use of ceramic materials offers new possibilities to increase card lifespan and to make counterfeiting more challenging. The inventors have recognized that these benefits may be realized in transaction cards created entirely of ceramic, having ceramic inserts, or utilizing a ceramic coating.
Monolithic ceramic body 105 may be manufactured from one or more materials including zirconia, alumina, beryllia, ceria, ceramide, carbide, boride, nitride, and silicide. In one embodiment, monolithic ceramic body 105 is a yttrium-stabilized zirconia. One of ordinary skill in the art will understand that other ceramic materials may be used without departing from the spirit of the invention disclosed herein.
One or more pockets 110 in monolithic ceramic body 105 are configured to receive a variety of components including, e.g., at least one of a magnetic stripe, a barcode, one or more embedded microchips, a hologram, a signature panel, commercial indicia, or any other component typically contained on or within a transaction card. Embedded microchip 120 may comprise a contact chip module, a contactless chip module, a dual interface chip module, or a booster antenna. One or more pockets 110 may also be provided for decorative purposes.
In one embodiment, a magnetic stripe is bonded directly to a polished surface of monolithic ceramic body 105. A variety of adhesives are suitable to perform this bonding including, but not limited to heat-curable vinyl acetate.
Transaction card 100 may further include at least one security feature 120. The security feature 120 may comprise, for example, one or more through holes, windows, microtext, lumiphores, or combination thereof, as well as other such features known in the art. In an exemplary embodiment, all or a portion of monolithic ceramic body 105 is doped with a lumiphore, such as for example inorganic materials including NaGdF4:Yb/Tm, Y2SiO5:Pr/Li, Y2O3:Eu, LaPO4:Ce/Tb, and organic/inorganic hybrid materials including quantum dots and CU dots without limitation thereto, such that incident wavelengths of light are quenched, upconverted, or downconverted. In this respect, the inclusion of lumiphores permits the creation of a unique light-based “watermark”.
Various colors and textures may be imparted to transaction card 100. Color may be introduced to transaction card 100 by an overcoat or by adding pigments and/or dyes into the ceramic body. In one embodiment, the ceramic material used to fabricate transaction card 100 is substantially optically transparent (e.g., having an optical transparency greater than 70%).
Additional decorative features may be machined or produced using inkjet, drop on demand printing, or laser ablation. In one embodiment, a signature panel 115 is produced by ablating/etching a portion of monolithic ceramic body 105, thereby making that particular area of monolithic ceramic body 105 receptive to ink or dye. A user can then authenticate transaction card 100 by executing a signature directly onto monolithic card body 105. Alternatively, the user's signature can be digitized and then laser engraved onto the monolithic card body 105. By manufacturing signature panel 115 in this manner, cost savings are realized in the elimination of additional components and steps (e.g., a separate polymeric signature panel and the adhesive necessary to hold this separate component in place).
Other functional features (e.g., magnetic stripe, branding, hologram, etc.) and/or decorative designs may be applied directly to the surface of monolithic ceramic body or a pocket may be engraved into monolithic ceramic body 105 via laser or mechanical engraving to receive such features or designs.
Transaction card 100 may be characterized by the nominal dimensions of a standard sized card (e.g., 3.37″×2.125″×0.03″). One of ordinary skill in the art will understand that transaction cards of different dimensions may be made without departing from the scope of the invention disclosed herein.
Turning to
Substrate layer 210 may be any suitable metal, such as stainless steel, bronze, copper, titanium, tungsten carbide, nickel, palladium, silver, gold, platinum, aluminum, or any alloy which gives the card most of its body (structure) and weight. Additionally, or alternatively, substrate layer 210 may be one or a composite of any suitable polymeric (e.g., polycarbonate, polyester, PVC, PETG, PLA, and blends thereof) and inorganic (e.g., glass, ceramic, cellulosic) material. The invention is not limited, however, to any particular substrate material. In one embodiment, substrate layer 210 includes both a layer of metal connected to a second layer of polymeric or inorganic material. In another embodiment, substrate layer 210 includes a plurality of bonded metal layers.
The materials of a composite substrate layer 210 may be selected such that a specific weight is achieved or to display a particular color upon exposure of the ceramic layer(s) to laser marking. The materials may also be selected as a function of cost efficiency or other desirable benefits (e.g., metal/plastic composite cards with single and dual ceramic coatings may achieve desired manufacturing costs, weights, and artistic effects).
Substrate layer 210 may have a thickness ranging of 0.0005″ to 0.0325″. Where substrate layer 210 is a composite (e.g. multiple layers of metal, multiple layers of metal and another component), the first layer of substrate layer 210 may range from 0.0001″ to 0.0315″ and the second layer of substrate layer 210 may range from 0.0001″ to 0.0315″. Other suitable thicknesses for substrate layer 210 are within the scope of the invention and will become apparent upon review of the information and teachings disclosed herein.
First ceramic layer 205 is connected to first side 215 of substrate layer 210. It should be noted that any sort of direct or indirect connection between first ceramic layer 205 and the first side 215 of substrate layer will suffice. For example, the requisite connection could be achieved where first ceramic layer 205 is directly attached to or coated on an intermediary substrate (not shown), which intermediary substrate is adhered to substrate layer 210.
First ceramic layer 205 may have, for example, a thickness ranging from about 0.00075″ to about 0.003″ for sprayed ceramic and about 0.001″ to about 0.0032″ for solid ceramic, but the invention is not limited to any particular range of thicknesses.
A variety of methods may be used to connect first ceramic layer 205 and substrate layer 210. In one embodiment, first ceramic layer 205 is spray coated to a sufficient thickness onto substrate layer 210. The spray coated layer is then thermally, air, or UV cured.
In another embodiment, first ceramic layer 205 is press-fit into pocket 240 in substrate layer 210. Press-fitting is intended to refer to any suitable means by which the ceramic insert is geometrically secured into pocket 240 in substrate layer 210. For example, one method of press-fitting includes “dove tailing” (not shown), in which one or more shapes in the edge of first ceramic layer 205 interlock with mating shapes in the inner edge of substrate layer 210. For example, a male feature in first ceramic layer may fit into a female receptor in the substrate, the ceramic layer may have a female receptor sized to receive a male feature in the substrate, or a combination thereof.
Turning to
Turning back to
In other embodiments, one or more pockets 225a,b may extend into substrate layer 210 without breaching the surface of first ceramic layer 205 (e.g., to contain a hidden component such as a booster antenna).
In still other embodiments, one or more pockets may also be produced in substrate layer 210 that ultimately result in depressions in the ceramic coating into which later components may be set to produce a smooth surface in transaction card 200.
For example, in an embodiment in which first ceramic layer 205 is spray coated onto substrate layer 210, one or more pockets 225a,b may be created by providing one or more pockets 225a,b in substrate layer 210 prior to spray-coating. However, it is not necessary to first create pockets in substrate layer 210; one or more pockets may be produced alternatively after spray-coating. Any suitable process may be used to create the one or more pockets 225a,b in substrate layer 210 such as, e.g., mechanical engraving, chemical laser etching, milling, etc.
In one embodiment, first ceramic layer 205 is a sprayed ceramic layer applied to substrate layer 210, which is a polycarbonate sheet. The polycarbonate sheet may be laminated to a desired thickness, bead blasted, sprayed with ceramic to create first ceramic layer 205, and then cured. Individual transaction cards 200 may be produced through punching, lasering, machining, or any other method known in the art.
As described above, various colors and textures may be imparted to transaction card 100. Color may be introduced to transaction card 200 by an overcoat or by adding pigments and/or dyes into the ceramic body. In one embodiment, the ceramic material used to fabricate transaction card 200 is substantially optically transparent, revealing the color and appearance of underlying substrate layer 210.
First ceramic layer 405 is connected to first side 415 of substrate layer 410.
Second ceramic layer 407 is connected to second side 420 of substrate layer 410. As described above, any sort of direct or indirect connection between first ceramic layer 405, second ceramic layer 407, and the respective sides of substrate layer 410 (including through intermediary layers) will suffice.
Any of the connection methods, or combination of these methods, described above (e.g., coating on, press-fitting in, or adhering to the substrate layer) may be used to connect first ceramic layer 405 and second ceramic layer 407 with substrate layer 410. For example, first ceramic layer 405 may be spray coated on first side 415 of substrate layer 410, while second ceramic layer 407 may be press-fit into a pocket defined in the second side 420 of substrate layer 410. As another example, shown in
Similar to the card depicted in
In one exemplary embodiment, 0.02″ thick metal core (such as steel) may be bonded to a 0.007″ thick PVC layer on one side with a ceramic coating on the un-bonded surface of the metal core. The ceramic may be applied as a spray coating, which is then cured. After curing, the coating may range from, e.g., 0.001″ to 0.003″ thick, depending on the desired look and texture of the coating. The coatings may, as described above, be produced in a variety of colors. The coating may be comprised of ceramic microparticles and a curable resin binder suspended in a carrier solution. Exemplary ceramic micropartide or nanoparticle materials may include one or more of the following: zirconia dioxide, aluminum disilicide, aluminum cerium oxide, aluminum oxide, aluminum titanate, antimony(III) oxide, antimony tin oxide, barium ferrite, barium strontium titanium oxide, barium titanate(IV), barium zirconate, bismuth cobalt zinc oxide (Bi2O3)0.07(CoO)0.03(ZnO)0.90 bismuth(III) oxide, boron nitride, calcium oxide, calcium phosphate, calcium titanate, calcium zirconate, cerium iron oxide hydroxide aqueous nanoparticlde dispersion, cerium(IV) oxide, cerium(IV)-zirconium(IV) oxide, chromium(III) oxide, cobalt aluminum oxide, cobalt(II,III) oxide, copper iron oxide, copper zinc iron oxide, dysprosium(III) oxide, erbium(III) oxide, europium(III) oxide, titania, silica, ceria, alumina, iron oxide, vanadia, zinc oxide, tin oxide, nickel oxide, and combinations thereof, but the invention is not limited to any particular ceramic materials. Commercial examples of polyceramic coatings containing both polymeric and ceramic components include those sold in connection with the trade names CERAKOTE by NIC Industries, Inc., Ceraset™ by KION International, and DuraCoat, DuraBake, DuraHeat, by Dura Coat Products, Inc. the manufacturer's specifications for which are hereby incorporated by reference. Once sprayed and cured, the coating provides a unique color and texture to the cards along with a durable finish, typically reaching several thousand Taber abrader cycles. The ceramic coating may be modified with mechanical or chemical engraving, inkjet printing, laser marking and other methods known in the art to provide a desired artistic effect. One example of such an effect is depicted in
The ceramic portions of the transaction cards disclosed herein may be manufactured using, e.g., injection molding to achieve a desired shaped, followed by sintering/firing of the molded unit. One or more pockets (
Additionally, Instead of injection molding, the ceramic portions of the transaction cards disclosed herein may be stamped or tape cast prior to firing. One of ordinary skill in the art will understand that additional methods may be used to manufacture transaction cards according to the present invention. For example, such cards may be created from larger blocks of ceramic and be machined to a desired size using an endmill, laser, waterjet, 3D printing, or any other means known in the art.
Turning to
In step 810, a substrate layer, e.g., a metal core sheet, is provided. Optionally, this step may include laminating a suitable metal foil, such as an aluminum foil, to one or more surfaces of an inner sub-core (which may be, e.g., metal, polymeric, or inorganic).
In step 820, fixtures are added to the substrate layer to hold the layer in place while subsequent steps are performed.
In step 830, one or more pockets are provided in the substrate layer for receiving functional or decorative features. For example, a pocket may be defined to receive a booster antenna for use in connection with an RFID chip, which can be disposed below the ceramic layer. Pockets may also be produced in the substrate layer that ultimately result in depressions in the ceramic coating into which later components (such as the RFID chip) can be attached at the end of processing, to provide for a smooth surface in the final product.
In step 840, the substrate layer receives a surface finish. Surface finishing can include any method suitable for the particle materials of the substrate layer such as, e.g., bead blasting, tumbling, brushing, etc.
In step 850, one or more ceramic layers and/or coatings are applied to the substrate layer through, e.g., spray coating. The one or more ceramic layers/coatings may also be connected, as described above, through defining pocket(s) in the side(s) of the substrate layer and press-fitting or adhering ceramic insert(s) Into the pocket(s).
In step 860, the ceramic layer(s)/coatings are laser marked with designs or other surface features. Additional mechanical, chemical, or laser modifications needed to facilitate later attachment of other features or design components is also performed. For example, edges of any pockets or depressions may be processed for a better fit of features to be added in a subsequent step or areas where an adhesive is later applied may be roughened for better adhesion.
In step 870, the composite sheet is cut into card blanks using, e.g., a CNC (computer numerical control) machine.
In step 880, functional and security features are applied to the individual card blanks. As noted above, such features may fit in a pocket created earlier in the process or adhesively attached to an area that has been roughened. In one embodiment, the magnetic stripe is applied directly on the ceramic layer. This desirably optimizes the planar and flat characteristics of the transaction card surface
Although the invention is illustrated and described herein with reference to specific embodiments, the invention is not intended to be limited to the details shown. Rather, various modifications may be made in the details within the scope and range of equivalents of the claims and without departing from the invention.
This application is a continuation of U.S. application Ser. No. 15/521,519, which is a National Stage application filed Apr. 24, 2017, as a U.S. National Stage under 35 U.S.C. § 371 of International App. No. PCT/US2015/058820, filed Nov. 3, 2015, which is a Continuation-in-Part of U.S. patent application Ser. No. 14/718,596, filed May 21, 2015, and which claims priority to U.S. Provisional Patent Application No. 62/074,305, filed Nov. 3, 2014. The disclosures of all of the foregoing are incorporated herein by reference in their entirety for all purposes.
Number | Name | Date | Kind |
---|---|---|---|
1601287 | Bertinetti | Sep 1926 | A |
2123612 | Obert | Jul 1938 | A |
2205466 | Caprio et al. | Jun 1940 | A |
4278377 | Elineau | Jul 1981 | A |
4343851 | Sheptak | Aug 1982 | A |
4499126 | Suzuki et al. | Feb 1985 | A |
4692394 | Drexler | Sep 1987 | A |
4711690 | Haghiri-Tehrani | Dec 1987 | A |
4971646 | Schell et al. | Nov 1990 | A |
5045511 | Bosomworth et al. | Sep 1991 | A |
5173133 | Morin et al. | Dec 1992 | A |
5292616 | Fujita et al. | Mar 1994 | A |
5526664 | Vetter | Jun 1996 | A |
5543269 | Chatterjee et al. | Aug 1996 | A |
5549953 | Li | Aug 1996 | A |
5574309 | Papapietro et al. | Nov 1996 | A |
5702666 | Hatakeyama et al. | Dec 1997 | A |
5804285 | Kobayashi et al. | Sep 1998 | A |
5843599 | Paz-Pujalt et al. | Dec 1998 | A |
5892661 | Stafford et al. | Apr 1999 | A |
6158663 | Ochiai | Dec 2000 | A |
6198155 | Verhaegh et al. | Mar 2001 | B1 |
6214155 | Leighton | Apr 2001 | B1 |
6254951 | Marmalich | Jul 2001 | B1 |
6364983 | Kay | Apr 2002 | B1 |
6478228 | Ikefuji et al. | Nov 2002 | B1 |
6581839 | Lasch et al. | Jun 2003 | B1 |
6589642 | Miller et al. | Jul 2003 | B1 |
6607135 | Hirai et al. | Aug 2003 | B1 |
6644552 | Herslow | Nov 2003 | B1 |
6764005 | Cooper | Jul 2004 | B2 |
6853286 | Nikawa et al. | Feb 2005 | B2 |
6857569 | Smith et al. | Feb 2005 | B1 |
7022202 | Goertzen | Apr 2006 | B2 |
7029547 | Biller | Apr 2006 | B2 |
7063924 | Kaminsky et al. | Jun 2006 | B2 |
7134603 | Batoha | Nov 2006 | B2 |
7287704 | Herslow | Oct 2007 | B2 |
D573182 | Ricketts et al. | Jul 2008 | S |
7398917 | Aibazov et al. | Jul 2008 | B2 |
7494057 | Lasch et al. | Feb 2009 | B2 |
7503503 | Riedl et al. | Mar 2009 | B2 |
7530491 | Lasch et al. | May 2009 | B2 |
7544266 | Herring et al. | Jun 2009 | B2 |
7588184 | Gandel et al. | Sep 2009 | B2 |
7757957 | Cranston et al. | Jul 2010 | B2 |
7763179 | Levy et al. | Jul 2010 | B2 |
7823777 | Varga et al. | Nov 2010 | B2 |
D632735 | McGrane et al. | Feb 2011 | S |
7909258 | Kim | Mar 2011 | B2 |
8033457 | Varga et al. | Oct 2011 | B2 |
8087698 | Jones et al. | Jan 2012 | B2 |
8356757 | Sonoda et al. | Jan 2013 | B2 |
8397998 | Mann et al. | Mar 2013 | B1 |
D687886 | Ahrabian | Aug 2013 | S |
8579201 | Akesson | Nov 2013 | B2 |
8672232 | Herslow | Mar 2014 | B2 |
8725589 | Skelding et al. | May 2014 | B1 |
8752277 | Orihara et al. | Jun 2014 | B2 |
8755121 | Cape et al. | Jun 2014 | B2 |
8944810 | Herslow | Feb 2015 | B2 |
9016591 | Herslow et al. | Apr 2015 | B2 |
9070053 | Mosteller | Jun 2015 | B2 |
9300251 | Khitun et al. | Mar 2016 | B2 |
9327484 | Herring et al. | May 2016 | B2 |
9390363 | Herslow et al. | Jul 2016 | B1 |
9390366 | Herslow et al. | Jul 2016 | B1 |
9542635 | Herslow | Jan 2017 | B2 |
9569718 | Herslow | Feb 2017 | B2 |
10399905 | Ketcham et al. | Sep 2019 | B2 |
10783422 | Herslow et al. | Sep 2020 | B2 |
20010035588 | Aga | Nov 2001 | A1 |
20010049004 | Wilkie | Dec 2001 | A1 |
20020007906 | Droz | Jan 2002 | A1 |
20020096569 | Boutaghou et al. | Jul 2002 | A1 |
20030038174 | Jones | Feb 2003 | A1 |
20030065938 | Kitamura et al. | Apr 2003 | A1 |
20030136848 | Kiekhaefer | Jul 2003 | A1 |
20030223616 | D'Amato et al. | Dec 2003 | A1 |
20030234286 | Labrec et al. | Dec 2003 | A1 |
20040031855 | Takahashi | Feb 2004 | A1 |
20040131756 | Skierski et al. | Jul 2004 | A1 |
20040217178 | Lasch et al. | Nov 2004 | A1 |
20050003297 | Labrec | Jan 2005 | A1 |
20050040243 | Bi et al. | Feb 2005 | A1 |
20050095408 | LeBrec et al. | May 2005 | A1 |
20050242194 | Jones et al. | Nov 2005 | A1 |
20060102729 | Gandel et al. | May 2006 | A1 |
20070089831 | Florentino et al. | Apr 2007 | A1 |
20080129037 | Roth et al. | Jun 2008 | A1 |
20080164307 | Silverstein | Jul 2008 | A1 |
20080166482 | Frye et al. | Jul 2008 | A1 |
20080274225 | Bharadwai et al. | Nov 2008 | A1 |
20080296887 | Baggenstos | Dec 2008 | A1 |
20080309064 | Herlin et al. | Dec 2008 | A1 |
20090020523 | DeMichael et al. | Jan 2009 | A1 |
20090032602 | Nishi et al. | Feb 2009 | A1 |
20090169776 | Herslow | Jul 2009 | A1 |
20090179817 | Yin | Jul 2009 | A1 |
20090208766 | Suzuki et al. | Aug 2009 | A1 |
20090213149 | Barton et al. | Aug 2009 | A1 |
20090218401 | Moran et al. | Sep 2009 | A1 |
20090294543 | Varga et al. | Dec 2009 | A1 |
20090314424 | Herring et al. | Dec 2009 | A1 |
20090315316 | Staub et al. | Dec 2009 | A1 |
20100021740 | Tanaka et al. | Jan 2010 | A1 |
20100059266 | Yoo et al. | Mar 2010 | A1 |
20100068395 | Moriya et al. | Mar 2010 | A1 |
20100116891 | Yano et al. | May 2010 | A1 |
20100224959 | Scherabon et al. | Sep 2010 | A1 |
20100276497 | Seban et al. | Nov 2010 | A1 |
20110020606 | Herslow et al. | Jan 2011 | A1 |
20110031319 | Kiekhaefer et al. | Feb 2011 | A1 |
20110079344 | Sheu | Apr 2011 | A1 |
20110101113 | Konjima et al. | May 2011 | A1 |
20110226858 | Lasch et al. | Sep 2011 | A1 |
20110309146 | Zazzu et al. | Dec 2011 | A1 |
20120208030 | Audenaert | Aug 2012 | A1 |
20120270019 | Wachter et al. | Oct 2012 | A1 |
20120325914 | Herslow | Dec 2012 | A1 |
20130008796 | Silverman et al. | Jan 2013 | A1 |
20130029155 | Nair | Jan 2013 | A1 |
20130033407 | Chae et al. | Feb 2013 | A1 |
20130067842 | Meersseman et al. | Mar 2013 | A1 |
20130119147 | Varga et al. | May 2013 | A1 |
20130126622 | Finn | May 2013 | A1 |
20130221089 | Kreutzer | Aug 2013 | A1 |
20130248607 | Zlotnik | Sep 2013 | A1 |
20130258622 | Cox | Oct 2013 | A1 |
20130287267 | Varone | Oct 2013 | A1 |
20140144993 | Seo et al. | May 2014 | A1 |
20140224881 | Herslow | Aug 2014 | A1 |
20150115039 | Mosteller | Apr 2015 | A1 |
20150119502 | Nam et al. | Apr 2015 | A1 |
20150136856 | Herslow et al. | May 2015 | A1 |
20150180229 | Herslow | Jun 2015 | A1 |
20150206047 | Herslow et al. | Jul 2015 | A1 |
20150236235 | Ladizinsky et al. | Aug 2015 | A1 |
20150298429 | Ricketts et al. | Oct 2015 | A1 |
20150339564 | Herslow et al. | Nov 2015 | A1 |
20160042268 | Puttkammer | Feb 2016 | A1 |
20160110639 | Finn et al. | Apr 2016 | A1 |
20160180212 | Herslow et al. | Jun 2016 | A1 |
20160229081 | Williams et al. | Aug 2016 | A1 |
20160232438 | Williams et al. | Aug 2016 | A1 |
20160357062 | Li | Dec 2016 | A1 |
20170017871 | Finn et al. | Jan 2017 | A1 |
20170077589 | Finn et al. | Mar 2017 | A1 |
20170185885 | Skelding et al. | Jun 2017 | A1 |
20180269352 | Tian et al. | Sep 2018 | A1 |
20190204812 | Cox | Jul 2019 | A1 |
20190233655 | Kimpel et al. | Aug 2019 | A1 |
20190324574 | Schooley et al. | Oct 2019 | A1 |
20200082396 | Chow | Mar 2020 | A1 |
Number | Date | Country |
---|---|---|
1172141 | Feb 1998 | CN |
1234888 | Nov 1999 | CN |
1241969 | Jan 2000 | CN |
2521676 | Nov 2002 | CN |
102263327 | Nov 2011 | CN |
4131617 | Apr 1992 | DE |
0559115 | Sep 1993 | EP |
2405311 | Jan 2012 | EP |
5430908 | Feb 1979 | JP |
63007534 | Jan 1988 | JP |
199663 | Jul 1989 | JP |
0615993 | Jan 1994 | JP |
0672082 | Mar 1994 | JP |
07155970 | Jun 1995 | JP |
11345298 | Dec 1999 | JP |
3066278 | Feb 2000 | JP |
2000168276 | Jun 2000 | JP |
2001096959 | Apr 2001 | JP |
2002189433 | Jul 2002 | JP |
2002259933 | Sep 2002 | JP |
2002352213 | Dec 2002 | JP |
2002370457 | Dec 2002 | JP |
2004025546 | Jan 2004 | JP |
2004063551 | Feb 2004 | JP |
2004114350 | Apr 2004 | JP |
2004265176 | Sep 2004 | JP |
2005104105 | Apr 2005 | JP |
2007128393 | May 2007 | JP |
3144889 | Sep 2008 | JP |
2009096027 | May 2009 | JP |
2011521377 | Jul 2011 | JP |
2012018324 | Jan 2012 | JP |
2015512348 | Apr 2015 | JP |
20100066148 | Jun 2010 | KR |
20130006358 | Jan 2013 | KR |
20140083067 | Jul 2014 | KR |
101699412 | Jan 2017 | KR |
2004063977 | Jul 2004 | WO |
2006081385 | Aug 2006 | WO |
2007133163 | Nov 2007 | WO |
2012121494 | Sep 2012 | WO |
2015179639 | Nov 2015 | WO |
2016073473 | May 2016 | WO |
Entry |
---|
Extended European Search Report for European Application No. 20206167.7, dated Feb. 16, 2021, 7 pages. |
Japanese Notice of Reasons for Rejection for Japanese Application No. 2020-038027, dated Apr. 13, 2021 with translation, 14 pages. |
Japanese Notice of Reasons for Rejection for Japanese Application No. 2019-003489, dated May 12, 2020 with translation, 16 pages. |
Indian Examination Report for Indian Application No. 201717017958, dated Oct. 20, 2020 with translation, 7 pages. |
Non Final Office Action for U.S. Appl. No. 15/861,321, dated Apr. 17, 2020, 50 pages. |
Non Final Office Action for U.S. Appl. No. 15/860,286, dated Apr. 16, 2020, 68 pages. |
Japanese Notice of Reasons for Rejection for Japanese Application No. 2019-178994, dated Oct. 5, 2021 with translation, 9 pages. |
Japanese Notice of Reasons for Rejection for Japanese Application No. 2019-178994, dated Oct. 27, 2020 with translation, 9 pages. |
Non Final Office Action for U.S. Appl. No. 14/718,596, dated Jul. 23, 2020, 38 pages. |
Indonesian Substantive Examination Result for Indonesian Application No. PID201702718, dated Jul. 22, 2021, with translation, 4 pages. |
New Zealand Patent Examination Report for New Zealand Application No. 743934, dated Aug. 12, 2021, 5 pages. |
Final Office Action for U.S. Appl. No. 15/861,321, dated Jul. 21, 2021, 19 pages. |
Australian Examination Report for Australian Application No. 2020213417, dated Jul. 22, 2021, 4 pages. |
Notice of Allowance for U.S. Appl. No. 14/718,596, dated Oct. 16, 2020, 30 pages. |
Australian Examination Report for Australian Application No. 2015264126, dated Jan. 31, 2018, 4 pages. |
Chinese Office Action for Chinese Application No. 201580026503.9, dated Nov. 23, 2018, 13 pages. |
Chinese Office Action for Chinese Application No. 201580059209.8, dated Jun. 10, 2019, 15 pages. |
Chinese Office Action for Chinese Application No. 201580026503.9, dated Jun. 21, 2019, with translation, 18 pages. |
Chinese Office Action for Chinese Application No. 201580059209.8, dated Feb. 3, 2020, with partial translation, 15 pages. |
Columbian Office Action for Columbian Application No. NC2017/0004295, dated Aug. 16, 2018, with English language remarks, 20 pages. |
Columbian Office Action for Columbian Application No. NC2017/0004295, dated Dec. 19, 2018, 13 pages. |
Dai Dahuang, “Films and Coatings”, Modern Surface Technology, 2008, 10 pages. |
European Communication for European Application No. 15796355.4, dated Aug. 2, 2018, 4 pages. |
European Communication for European Application No. 15856207.4, dated Jun. 6, 2018, 9 pages. |
European Communication for European Application No. 15856207.4, dated Mar. 25, 2019, 5 pages. |
Extended European Search Report for European Application No. 15796355.4, dated Nov. 13, 2017, 8 pages. |
Final Office Action for U.S. Appl. No. 14/718,596, dated Jan. 30, 2018, 22 pages. |
Final Office Action for U.S. Appl. No. 15/379,569, dated Feb. 20, 2019, 26 pages. |
International Preliminary Report on Patentability for International Application No. PCT/US2015/058820, dated May 9, 2017, 8 pages. |
International Search Report and Written Opinion of the International Searching Authority for International Application No. PCT/US2015/031971, dated Sep. 30, 2015, 20 pages. |
International Search Report and Written Opinion of the International Searching Authority for International Application No. PCT/US2015/058820, dated Feb. 19, 2016, 11 pages. |
Japanese Decision of Final Rejection for Japanese Application No. 2017-543283, dated Nov. 20, 2018, with translation, 5 pages. |
Notice of Reasons for Rejection for Japanese Application No. 2017-543283, dated May 8, 2018, with translation, 7 pages. |
Notice of Reasons for Rejection for Japanese Application No. 2017-513610, dated Jul. 10, 2018, with translation, 12 pages. |
Notice of Reasons for Rejection for Japanese Application No. 2019-045862, dated Oct. 15, 2019, with translation, 8 pages. |
New Zealand Examination Report for New Zealand Application No. 726408, dated Sep. 25, 2017, 15 pages. |
New Zealand Examination Report for New Zealand Application No. 726408, dated Mar. 1, 2018, 5 pages. |
New Zealand Examination Report for New Zealand Application No. 726408, dated Jul. 20, 2018, 5 pages. |
New Zealand Examination Report for New Zealand Application No. 726408, dated Aug. 22, 2018, 4 pages. |
Non Final Office Action for U.S. Appl. No. 14/718,596, dated Aug. 11, 2017, 24 pages. |
Non Final Office Action for U.S. Appl. No. 15/379,569, dated May 17, 2018, 46 pages. |
Non Final Office Action for U.S. Appl. No. 14/718,596, dated May 22, 2018, 18 pages. |
Non Final Office Action for U.S. Appl. No. 14/718,596, dated Apr. 8, 2019, 29 pages. |
Notice of Allowance for U.S. Appl. No. 15/379,569, dated Dec. 2, 2019, 33 pages. |
Singapore Written Opinion for Singapore Application No. 1120160969OY, dated Jul. 13, 2017, 8 pages. |
Singapore Written Opinion for Singapore Application No. 11201703216R, dated Jan. 16, 2018, 5 pages. |
Wikipedia.com, Tetraethyl Orthosilicate, downloaded from https://en.wikipedia.org/wiki/Tetraethyl_orthosilicate, Dec. 21, 2018, 3 pages. |
Japanese Decision of Final Rejection for Japanese Application No. 2017-513610, dated May 28, 2017, with translation, 9 pages. |
Entire patent prosecution history for U.S. Appl. No. 14/718,596, filed May 21, 2015, entitled “Transaction and ID Cards Having Selected Texture and Coloring”. |
Entire patent prosecution history for U.S. Appl. No. 15/379,569, filed Dec. 15, 2016, entitled “Transaction and ID Cards Having Selected Texture and Coloring”. |
Entire patent prosecution history for U.S. Appl. No. 12/460,829, filed Jul. 24, 2009, entitled “Card With Embedded Image”. |
Entire patent prosecution history for U.S. Appl. No. 14/977,553, filed Dec. 21, 2015, entitled “Smart Metal Card With Radio Frequency (RF) Transmission Capability”. |
Entire patent prosecution history for U.S. Appl. No. 14/178,436, filed Feb. 12, 2014 entitled “Durable Card”. |
Entire patent prosecution history for U.S. Appl. No. 15/637,092, filed Jun. 29, 2017, entitled “Durable Card”. |
Entire patent prosecution history for U.S. Appl. No. 12/006,68, filed Dec. 31, 2007, entitled “Foil Composite Card”, now U.S. Pat. No. 9,542,635, issued Jan. 10, 2017. |
Entire patent prosecution history for U.S. Appl. No. 14/183,868, filed Feb. 19, 2014, entitled “Foil Composite Card”. |
Entire patent prosecution history for U.S. Appl. No. 15/355,018, filed Nov. 17, 2016, entitled “Foil Composite Card”. |
Entire patent prosecution history for U.S. Appl. No. 15/356,586, filed Nov. 19, 2016, entitled, “Foil Composite Card”. |
Entire patent prosecution history for U.S. Appl. No. 15/521,519, filed Apr. 24, 2017, entitled, “Ceramic-containing and Ceramic Composite Transaction Cards”. |
Notice of Allowance for U.S. Appl. No. 15/860,286, dated Sep. 4, 2020, 25 pages. |
Japanese Notice of Reasons for Rejection for Japanese Application No. 2017-543283, dated Aug. 25, 2020 with translation, 13 pages. |
European Communication Pursuant to Article 94(3) for European Application No. 15856207.4, dated Sep. 4, 2020, 4 pages. |
Final Office Action for U.S. Appl. No. 15/861,321, dated Apr. 14, 2022, 32 pages. |
Japanese Notice of Reasons for Rejection for Japanese Application No. 2021-187145, dated Aug. 16, 2022 with translation, 8 pages. |
Number | Date | Country | |
---|---|---|---|
20200184303 A1 | Jun 2020 | US |
Number | Date | Country | |
---|---|---|---|
62074305 | Nov 2014 | US |
Number | Date | Country | |
---|---|---|---|
Parent | 15521519 | US | |
Child | 16790868 | US |
Number | Date | Country | |
---|---|---|---|
Parent | 14718596 | May 2015 | US |
Child | 15521519 | US |