Claims
- 1. A method of manufacturing insulated gate type transistors, comprising the steps of:forming at least two insulated gate type transistors that differ from each other only in mask channel width; measuring drain current characteristics of said two insulated gate type transistors by changing a gate voltage and a source-drain voltage; determining an effective channel width of said two insulated gate type transistors using a predetermined characteristic evaluation method for insulated gate type transistors; and judging whether said effective channel width satisfies a specification, wherein one of said at least two insulated gate type transistors having a wider mask channel width is defined as a first insulated gate type transistor and the other having a more narrow mask channel width is defined as a second insulated gate type transistor, said predetermined characteristic evaluation method for insulted gate type transistors comprising steps of: extracting a threshold voltage of said first transistor, estimating the threshold voltage of said second transistor, and employing a value as estimated as a first estimated value; (i) defining a difference between a gate voltage of said first transistor and said extracted threshold voltage of said first transistor as a first gate overdrive, and defining a difference between a gate voltage of said second transistor and said first estimated value as a second gate overdrive, (ii) under the condition that said first and second gate overdrives are the same in an X-Y plane whose X-axis is said mask channel width and whose Y-axis is source-drain resistance, estimating and extracting a virtual point at which a change in Y coordinate value to be approximately zero even if said first and second gate overdrives are finely changed from points on a straight line passing through a first point whose X coordinate is said mask channel width of said first transistor and whose Y coordinate is said source-drain resistance of said second transistor, and a second point whose X coordinate is said mask channel width of said second transistor and whose Y coordinate is said source-drain resistance of said first transistor, (iii) defining values of the X coordinate and the Y coordinate at said virtual points as second and third estimated values, respectively, and (iv) extracting a slope of said straight line at said virtual points and employing a value of said slope as a fourth estimated value; determining a true threshold voltage of said second transistor by using said first to fourth estimated values; and determining a difference between said mask channel width and an effective channel width based on said true threshold voltage.
Priority Claims (1)
Number |
Date |
Country |
Kind |
10-239148 |
Aug 1998 |
JP |
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CROSS-REFERENCE TO RELATED APPLICATIONS
This application is a divisional application of U.S. application Ser. No. 10/093,936 filed Mar. 11, 2002, now U.S. Pat. No. 6,559,672, which in turn is a divisional application of U.S. application Ser. No. 09/714,148, filed Nov. 17, 2000, now U.S. Pat. No. 6,373,274, which is a continuation application of U.S. patent application Ser. No. 09/249,139, filed Feb. 12, 1999, now U.S. Pat. No. 6,169,415.
US Referenced Citations (1)
Number |
Name |
Date |
Kind |
6188233 |
Michael et al. |
Feb 2001 |
B1 |
Continuations (2)
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Number |
Date |
Country |
Parent |
09/714148 |
Nov 2000 |
US |
Child |
10/093936 |
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US |
Parent |
09/249139 |
Feb 1999 |
US |
Child |
09/714148 |
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US |