BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 schematically shows a ball grid array (BGA) package on a circuit board substrate and electrically connected with ground connections to a sealed fluid-filled heatspreader, which is located at a surface of the substrate and forms part of the ground plane of the substrate in accordance with a first embodiment of the invention.
FIG. 2A schematically shows a BGA package on a circuit board substrate and a sealed fluid-filled heatspreader located at a surface of the substrate and forming part of the ground plane of the substrate, wherein ground connections of the package are electrically connected to an extension of the heatspreader that is separated from surface areas of the substrate containing power and signal traces in accordance with a second embodiment of the invention.
FIG. 2B is a fragmentary top view of FIG. 2A, with the package represented in phantom to show the region containing the ground, power, and signal connections between the package, the heatspreader, and power/signal traces on the surface of the substrate.
FIG. 3 schematically shows a BGA package on a circuit board substrate and a sealed fluid-filled heatspreader located beneath a surface of the substrate and forming part of the ground plane of the substrate, wherein the package has a staggered array of solder bumps and the package are electrically connected to the heatspreader through longer solder bumps that extend through an outer layer of the substrate in accordance with a third embodiment of the invention.
FIG. 4 is similar to FIG. 3, but further includes a second BGA package on an opposite surface of the circuit board substrate and electrically connected to the heatspreader through longer solder bumps that extend through an outer layer of the substrate in accordance with a fourth embodiment of the invention.
FIG. 5 is similar to FIG. 3, but further shows the heatspreader as having an extension that protrudes from the circuit board substrate, and fins on the extension to promote heat transfer from the package to the environment in accordance with a fifth embodiment of the invention.
FIG. 6 is similar to FIG. 3, but further shows the heatspreader as having two extensions that protrude from and wrap around an edge of the circuit board substrate, and fins on one of the extensions to promote heat transfer from the package to the environment in accordance with a sixth embodiment of the invention.
DETAILED DESCRIPTION OF THE INVENTION
FIGS. 1 through 6 depict multiple configurations of heatspreaders in accordance with various embodiments of this invention. For convenience, consistent reference numbers are used to identify functionally similar structures throughout these Figures.
The present invention is represented in FIGS. 1 through 6 as a heatspreader 20 that also serves as part of the ground plane of a circuit board assembly 10. As described in more detail below, the heatspreader 20 is adapted for dissipating heat from electronic components mounted to the circuit board substrate 12, which may be a printed circuit board (PCB) or another suitable substrate. The electronic components may include various devices, the example shown in the Figures being a BGA package 14 carrying an IC die 16 and attached to the substrate 12 with solder connections 18 (only one row of which is visible in FIG. 1). The heatspreader 20 is particularly beneficial if the package 14 has a high power density. The heatspreader 20 is integrated into the circuit board substrate 12 to enable the heatspreader 20 to simultaneously function as a ground plane in the power and ground buses. Heat exchange between the package 14 and heatspreader 20 is through ground connections of the package 14, which in FIG. 1 are the visible solder connections 18 contacting the upper/exposed surface 22 of the heatspreader 20. As such, additional electrical connections (e.g., 18B in FIG. 2) are necessary to electrically connect the package 14 to power and signal traces (e.g., 50 in FIG. 2) on the substrate 12. For other types of electronic components, additional packaging may be omitted and solder bumps on an IC die may be directly bonded to the heatspreader 20.
As shown in FIG. 1, the heatspreader 20 is a self-contained, closed-loop, fluid-cooling device having a composite laminate construction, in which a relatively pliant screen or mesh 26 is sandwiched between two foils or plates 28 and 30 that are substantially parallel to each other. The mesh 26 is represented as being composed of individual strands 32 that are woven together, generally transverse to each other and conventionally referred to as warp and weft strands 32. The mesh 26 and plates 28 and 30 are preferably formed of materials having physically and chemically compatible properties, including materials having the same composition, though various material combinations are possible. For example, individual strands 32 of the mesh 26 can be formed by an individual wire, braided wires, bundled wires, etc., of copper, silver, aluminum, carbon, or alloys thereof, and the plates 28 and 30 can be formed of the same or similar materials. As discussed below, heat transfer occurs by conduction through the plates 28 and 30 and mesh 26, such that preferred materials for these components are thermally conductive, though the use of other materials including polymeric and nonmetallic materials is also foreseeable. Suitable thicknesses for the plates 28 and 30 and mesh 26, suitable cross-sectional shapes and dimensions for the mesh strands 32, and suitable weaves (including strands per inch) for the mesh 26 may depend on the particular application and the materials from which these components are formed.
As evident from FIG. 1, peripheral edge portions 34 of both plates 28 and 30 are preferably raised relative to the remainder of the plates 28 and 30, such as by embossing, to form a relief in each plate 28 and 30 that promotes their rigidity and further defines a continuous peripheral surface at which the plates 28 and 30 can be bonded to each other, such as with a solder alloy, braze alloy, adhesive, etc. With the plates 28 and 30 laminated together, the reliefs define a cavity 36 between the plates 28 and 30 that contains the cooling fluid of the heatspreader 20. Additional embossing can be performed on one or both plates 28 and 30 to define within the cavity 36 a channel system (not shown) between the plates 28 and 30, by which particular flow routes can be established within the heatspreader 20. Three-dimensional structures formed by such additional embossing have the further advantage of increasing the mechanical stability of the heatspreader 20.
As evident from FIG. 1, the mesh 26 within the cavity 36 may have approximately the same thickness as the height of the cavity 36 (as measured in the direction normal to the surface 22 of the plate 28). The peaks 38 projecting from both sides of the mesh 26 are preferably bonded, such as by soldering or brazing, to the plates 28 and 30 to establish a highly-conductive thermal contact between the mesh 26 and both plates 28 and 30. Bonding also serves to cross-link the plates 28 and 30, which resists any shearing forces to which the plates 28 and 30 are subjected and contributes additional mechanical stability and rigidity to the heatspreader 20. The warp and weft strands 32 of the mesh 26 form interstices that are more or less freely penetrable by any fluid, yet define tortuous paths that avoid laminar flow conditions within the cavity 36 that would reduce the heat transfer rate between the cooling fluid, the plates 28 and 30, and the mesh 26.
As generally known in the art, suitable coolant fluids include liquids such as water, mineral spirits/oils, alcohols, and fluorocarbonate derivatives, though various other fluids could also be used, including air, vapor, etc., depending on the required temperature range of operation. For example, in extremely cold environments, a fluid with lower viscosity is a better choice than in extremely hot environments. Various other parameters for choosing a cooling fluid exist and are well known, and therefore will not be discussed in any further detail here.
As evident from FIG. 1, the heatspreader 20 is self-contained with the cooling fluid being hermetically sealed within the cavity 36, such that cooling of the package 14 is achieved by providing a thermal conductive path between the package 14 with one of the plates 28/30 (plate 28 in the embodiment of FIG. 1). With the plate 28 in thermal contact with the package 14 as shown in FIG. 1, heat transfer from the package 14 is through the ground connections 18 and into the plate 28, the cavity 36 containing the mesh 26 and fluid, and the plate 28, which together cooperate to conduct heat away from the package 14, for example, to an edge (not shown) of the circuit board substrate 12. More particularly, heat transfer through the heatspreader 20 is by thermal conduction through the plate 28, mesh 26, and plate 30, and by convention between the plate 28 and the cooling fluid and between the cooling fluid and the plate 30, as well as convection through the cooling fluid from the plate 28 to the mesh 26 and convection through the cooling fluid from the mesh 26 to the plate 30. Accordingly, heat transfer is generally in a direction parallel to the plane of the heatspreader 20, and the fluid acts as a secondary heat absorbent and a thermal transport media capable of transporting thermal energy to the mesh 26 at a distance from the plate 28 nearest the heat source (the BGA package 14).
The cooling fluid may be recirculated through the cavity 36 with a pump (not shown) mounted on the substrate 12 or external to the circuit board assembly 10. A wide variety of pumps are possible and suitable for use in the heatspreader 20, and the choice of which will be primarily dependent on the specific application since pressure and noise requirements need to be taken into consideration. Notable but nonlimiting examples of suitable pump types include centrifugal, positive displacement, rotary, and osmotic pumps that are commercially available and have been used in prior cooling systems for electronic components.
Because the cooling fluid assists the plates 28 and 30 in conducting heat from the package 14, the coefficient of thermal conductance of the material(s) used to form the plates 28 and 30 is less important than in structures that rely on passive heat transfer. As such, a wider variety of materials could be used to form the heatspreader 20 and its individual components. Moreover, because the heatspreader 20 is hollow, the total amount of material used is substantially lower than in a comparable solid structure, resulting in reduced material costs for manufacturing the heatspreader 20. A related issue is the mechanical stability of the heatspreader 20. Hollow structures generally exhibit only a minor reduction in rigidity as compared to a solid body of the same dimensions. The rigidity of the heatspreader 20 is promoted as a result of the peripheral edge portions 34 of the plates 28 and 30 being bonded together, as well as bonding of the mesh 26 to both plates 28 and 30. Consequently, the heatspreader 20 can be much lighter but yet nearly as strong and rigid as a solid heatspreader of comparable size.
In the embodiment of FIG. 1, the heatspreader 20 is shown embedded in a surface layer 40 and an immediately adjacent subsurface layer 42 of the circuit board substrate 12, such that the surface 22 of the heatspreader 20 is generally flush with the substrate surface 44 at which the package 14 is mounted. The opposite surface 24 of the heatspreader 20 is buried within the substrate 12, and not exposed at the surface 46 of the substrate 12 opposite the surface 44.
In FIG. 2A, the solder connections 18 of the BGA package 14 are shown as being arranged as a group of ground solder connections 18A and signal and power solder connections 18B. The ground solder connections 18A directly contact an extension 48 of the heatspreader 20 that is formed by the plate 28 and contiguous with the surface 22 of the heatspreader 20. The extension 48 extends beneath a limited portion of the package 14 corresponding to the ground solder connections 18A, but not beneath portions of the package 14 where the signal/power solder connections 18B and their traces 50 are located. As in FIG. 1, the surface 22 of the heatspreader 20 is approximately flush with the substrate surface 44, such that the ground and power/signal solder connections 18A and 18B have approximately equal heights (lengths perpendicular to the plane of the substrate 12). The heatspreader 20 is further shown as including fins 52 that project above the surface 44 of the substrate 12 and promote convective and radiative heat transfer to the surrounding environment.
As represented in FIG. 2B, the extension 48 of the heatspreader 20 is one of multiple finger-like extensions 48 that collect heat from the ground solder connections 18A. The extensions 48 are preferably interdigitated with the signal/power solder connections 18B and their traces 50 (not shown) to avoid electrical shorting between the ground plane, power, and signal lines of the substrate 12. The embodiment of FIG. 1 will also typically require physical separation between the heatspreader 20 and the signal/power solder connections 18B and their traces 50, depending on the manner in which the package 14 is electrically connected to its power and signal traces on the substrate 12. The embodiments of FIGS. 3 through 6 are capable of avoiding this limitation.
FIG. 3 shows the integration of the heatspreader 20 into subsurface (internal) layers of the circuit board substrate 12, such that both surfaces 22 and 24 of the heatspreader 20 are embedded in the substrate 12 and the surface 22 nearest the heat source (package 14) is beneath the outer surface 44 of the substrate 12. The solder connections 18 of the BGA package 14 are shown as being vertically staggered, with the ground solder connections 18A being slightly elongated compared to the signal/power solder connections 18B in order to penetrate the surface layer 40 of the circuit board substrate 12. An advantage of this configuration is that the shape of the heatspreader 20 in the plane of the substrate 12 can be relatively simple, since there is no need to meander around the signal and power traces 50 to avoid electrical shorting with the ground plane. As such, the signal and power traces 50 can be located on the outer surface 44 of the substrate 12 between the package 14 and heatspreader 20, and the package 14 can lie entirely above the heatspreader 20. Furthermore, the ground solder connections 18A are situated directly beneath the IC die 16 for optimal heat transfer to the heatspreader 20.
The embodiment of FIG. 4 is similar to that of FIG. 3, but further includes a second BGA package 15 on the lower surface 46 of the circuit board substrate 12. As in FIG. 3, the package 15 is electrically connected to the heatspreader 20 through longer ground solder bumps 19A that extend through an outer layer 54 of the substrate 12, while shorter signal/power solder bumps 19B contact signal and power traces 56 located on the substrate's lower surface 46. The packages 14 and 15 can mounted to the substrate 12 in a clamshell configuration.
In the embodiment of FIG. 5, a pair of the peripheral edge portions 34 of the plates 28 and 30 are shown elongated and protruding beyond an edge 56 of the substrate 12, providing a location for two oppositely-disposed sets of fins 52 that promote convection heat transfer to the environment.
Finally, FIG. 6 shows a configuration in which a pair of the peripheral edge portions 34 of the plates 28 and 30 are elongated and wrapped around an edge 56 of the circuit board substrate 12, with fins 52 provided on one of the edge portions 34. With this configuration, the heatspreader 20 and its fins 52 do not significantly increase the length of the circuit board assembly 10 beyond that of the substrate 12.
While the invention has been described in terms of specific embodiments, it is apparent that other forms could be adopted by one skilled in the art. For example, additional embodiments could be constructed that differ in appearance and construction from the embodiments shown in the Figures, and appropriate materials could be substituted for those noted. Therefore, the scope of the invention is to be limited only by the following claims.
Patent Application
20080087456
