The disclosure generally relates to the technical field of display equipment, and more particularly relates to a circuit board assembly and a display device.
Currently, the display devices, such as liquid crystal televisions and liquid crystal displays, usually need to use a timing control circuit board for controlling timing signal. The timing control circuit board includes a circuit board body, and a timing-controller (T-CON) chip defined on the circuit board body. The circuit board body further defines a grounded metal shield cover, the metal shield cover covers the T-CON chip to prevent the T-CON chip from being affected by static electricity.
In an exemplary technique, the metal shield cover and the circuit board body are fixed by screws passing through the metal shield cover and the circuit board body and then connecting to the metal housing of the display device, and the metal shield cover is grounded. The way of grounding the metal shield cover requires the metal shield cover to have a larger size, which would result in a higher cost of the metal shell.
It is therefore one main object of the present disclosure to provide a circuit board assembly, which aims to reduce the cost of the circuit board assembly.
In order to achieve the aim, the present disclosure provides a circuit board assembly, which includes:
a circuit board main body, the circuit board main body is printed with a ground line, the ground line is grounded;
an electronic component, defined at a side surface of the circuit board main body; and
an electrostatic shield cover, defined on the side surface of the circuit board main body and covering the electronic component, and the electrostatic shield cover electrically connects with the ground line.
Optionally, the ground line is defined at the side of the circuit board main body away from the electrostatic shield cover, the circuit board defines a conductive through hole running through the circuit board, and the ground line electrically connects to the electrostatic shield cover through the conductive through hole.
Optionally, there are a plurality of conductive through holes, and the plurality of conductive through holes are defined along a circumferential direction of the electrostatic shield cover.
Optionally, the plurality of the conductive through holes includes a plurality of pairs of the conductive through holes, there are a plurality of ground lines, and each of the ground lines electrically connects with the electrostatic shield cover through at least one pair of the conductive through holes.
Optionally, a surface of the circuit board defines a conductive region, and a ground terminal of the ground line electrically connects to the conductive region.
Optionally, the conductive region is located on the side of the circuit board main body away from the electrostatic shield cover.
Optionally, the electrostatic shield cover connects to the circuit board main body by a patch. The electronic component includes a chip, a heat conducting member is defined between the electrostatic shielding cover and the electronic component, and the heat conducting member respectively resists surfaces of the electrostatic shielding cover and the electronic component.
The present disclosure provides a circuit board assembly, which includes:
a circuit board main body, a ground line, which is configured to be grounded, is printed on the circuit board main body;
an electronic component, defined at a side surface of the circuit board main body; and
an electrostatic shield cover, defined on the side surface of the circuit board main body and covering the electronic component, and the electrostatic shield cover electrically connects with the ground line.
The present disclosure provides a display device, which includes the circuit board assembly as described as above, the circuit board assembly includes:
a circuit board main body, a ground line, which is configured to be grounded, is printed on the circuit board main body;
an electronic component, defined at a side surface of the circuit board main body; and
an electrostatic shield cover, defined on the side surface of the circuit board main body and covering the electronic component, and the electrostatic shield cover electrically connects with the ground line.
The present disclosure prints the ground line on the circuit board main body, and enables the ground line to electrically connect with the electrostatic shield cover defined on the circuit board main body. Therefore, the grounding of the electrostatic shield cover is more convenient, and the size of the electrostatic shield cover can be reduced, so that the electrostatic shield cover covers only the electronic component on the circuit board main body to reduce the size of the electrostatic shield cover, thereby not only reducing the cost of the electrostatic shield cover, but also reducing the overall cost of the circuit board assembly and the overall volume of the circuit board assembly.
To better illustrate the technical solutions that are reflected in various embodiments according to this disclosure or that are found in the prior art, the accompanying drawings intended for the description of the embodiments herein or for the prior art will now be briefly described, it is evident that the accompanying drawings listed in the following description show merely some embodiments according to this disclosure, and that those having ordinary skill in the art will be able to obtain other drawings based on the arrangements shown in these drawings without making inventive efforts.
Labels illustration for drawings:
The realization of the aim, functional characteristics, advantages of the present disclosure are further described specifically with reference to the accompanying drawings and embodiments.
The technical solutions of the embodiments of the present disclosure will be clearly and completely described in the following with reference to the accompanying drawings. It is obvious that the embodiments to be described are only a part rather than all of the embodiments of the present disclosure. All other embodiments obtained by persons skilled in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.
It is to be understood that, all of the directional instructions in the exemplary embodiments of the present disclosure (such as top, down, left, right, front, back . . . ) can only be used for explaining relative position relations, moving condition of the elements under a special form (referring to figures), and so on, if the special form changes, the directional instructions changes accordingly.
In addition, the descriptions, such as the “first”, the “second” in the exemplary embodiment of present disclosure, can only be used for describing the aim of description, and cannot be understood as indicating or suggesting relative importance or impliedly indicating the number of the indicated technical character. Therefore, the character indicated by the “first”, the “second” can express or impliedly include at least one character. In addition, the “and/or” in the present disclosure means including three paratactic solutions, for example, taking “A and/or B” as an example, the “A and/or B” includes A solution, B solution, or solution of A and B. In addition, the technical proposal of each exemplary embodiment can be combined with each other, however the technical proposal must base on that the ordinary skill in that art can realize the technical proposal, when the combination of the technical proposals occurs contradiction or cannot realize, it should consider that the combination of the technical proposals does not existed, and is not contained in the protection scope required by the present disclosure.
The present disclosure provides a circuit board assembly.
Referring to
It can be understood that, by providing the ground line 111 on the circuit board main body 11, the electrostatic shield cover 13 can cover only the electronic component 12, thereby making the electrostatic shield cover 13 smaller in size, not only the cost of the electrostatic shield cover 13 is reduced, but also the overall volume of the circuit board assembly 10 is reduced, and further the volume of products mounting the circuit board assembly 10 is reduced, especially when the circuit board assembly 10 is used in a display device, the display device can be much more thinner.
It should be noted that the above-mentioned electronic component 12 includes any electrostatic sensitive components such as chip, thin film resistor, etc. The type of electronic components 12 included in the circuit board assembly 10 may depend on the function of the circuit board assembly 10. For example, when the circuit board assembly 10 is a timing control circuit board used in the display device, the electronic component 12 on the circuit board main body 11 includes the timing control (T-CON) chip. When the circuit board assembly 10 is a motherboard used in the display device or other product, the electronic component 12 on the circuit board main body 11 includes a CPU provided on the motherboard.
In addition, the electrostatic shield cover 13 may be made of metal such as iron, aluminum or other conductive non-metallic materials, and the exemplary embodiment does not limit this.
In one exemplary embodiment, as shown in
Specifically, an exposed copper area may be printed on the side surface of the circuit board main body 11 to form the conductive area 112, or a metal layer may be coated on the side surface of the circuit board main body 11 to form the conductive area 112, or a metal sheet may be pasted on the side surface of the circuit board main body 11 to form the conductive area 112.
The conductive region 112 and the ground line 111 can be located on the same side of the circuit board main body 11 to facilitate the processing of the circuit board main body 11. For example, as shown in
As shown in
Optionally, there are a plurality of conductive through holes 114, and the plurality of conductive through holes 114 may extend in the circumferential direction of the electrostatic shield cover 13. Thus, when one of the conductive through holes 114 is damaged, the other ground line 111 remains electrically connect to the electrostatic shield cover 13 through the other conductive through hole 114.
Optionally, as shown in
As shown in
Among them, there are various arrangements of the plurality of conductive through holes 114 in the pair of the conductive through holes 115. For example, as shown in
In one exemplary embodiment, the electrostatic shield cover 13 can be connected with the side surface of the circuit board main body 11 through a patch, so that the electrostatic shield cover 13 can be installed more conveniently, the volume of the circuit board assembly 10 can be reduced, and the electrostatic shield cover 13 can be processed more conveniently.
Specifically, as shown in
As shown in
The flange 132 may be provided at the end of the side plate 131 in the longitudinal direction to save materials and reduce the cost of the electrostatic shield cover 13.
In one exemplary embodiment, as shown in
As shown in
The specific structure of the surface to be mounted may depend on the type of product using the circuit board assembly 10 of the present disclosure. Taking the display device as an example, as shown in
Among them, the whole of the back plate 21 may be made of a metal material, or the conductive surface 212 of the back plate 21 may be made of a metal material or a conductive non-metal material. Of course, the former can make the processing of the back plate 21 more convenient and make the strength of the back plate 21 higher.
In addition, the above fasteners 14 include screws, pins, etc. The exemplary embodiment does not limit this.
In one exemplary embodiment, as shown in
In one exemplary embodiment, as shown in
Optionally, the heat conducting member 22 may be arranged in a sheet shape, and the side of the heat conducting member 22 facing the electronic component 12 may be attached to the surface of the electronic component 12 away from the circuit board main body 11, and the side surface of the heat conducting member 22 facing the electrostatic shield cover 13 may abut the surface of the side of the electrostatic shield cover 13 facing the circuit board main body 11 to improve the heat conducting effect of the heat conducting member 22.
The present disclosure also provides a display device, the display device includes a circuit board assembly, the specific structure of the circuit board assembly is referred to the above-mentioned embodiments. As the display device provided by the present disclosure adopts all the technical proposals of the above exemplary embodiments of the circuit board assembly, the display device at least has all of the beneficial effects of the technical proposals of the above exemplary embodiments, no need to repeat again.
The foregoing description merely depicts some embodiments of the present application and therefore is not intended to limit the scope of the application. An equivalent structural or flow changes made by using the content of the specification and drawings of the present application, or any direct or indirect applications of the disclosure on any other related fields shall all fall in the scope of the application.
Number | Date | Country | Kind |
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201821436069.9 | Sep 2018 | CN | national |
The present application is a Continuation Application of PCT Application No. PCT/CN2018/114609 filed on Nov. 8, 2018, which claims the benefit of Chinese Patent Application No. 201821436069.9 filed on Sep. 3, 2018. All the above are hereby incorporated by reference.
Number | Date | Country | |
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Parent | PCT/CN2018/114609 | Nov 2018 | US |
Child | 16254627 | US |