Patent Application
20080020605
The invention will become more fully understood from the detailed description given herein below illustration only, and thus is not limitative of the present invention, and wherein:
The present invention will be apparent from the following detailed description, which proceeds with reference to the accompanying drawings, wherein the same references relate to the same elements.
The circuit board module according to the preferred embodiment of the invention will be described with reference to the accompanying drawings.
Referring to
The first glass circuit board 11 has a first glass substrate G01, and a first electrically connecting pad P01 and an integrated circuit IC1, both of which are disposed on the first glass substrate G01 and electrically connected with each other. In this embodiment, the first integrated circuit IC1 may include an opto-electronic converting circuit, a control circuit or a driving circuit, and the first integrated circuit may be made by the low-temperature polysilicon technology or the amorphous silicon technology. That is, when the first glass circuit board 11 is to be formed, a silicon layer is first formed on the first glass substrate G01 by the low-temperature polysilicon technology or the amorphous silicon technology, and then the semiconductor manufacturing processes are performed on the silicon layer.
The second glass circuit board 12 has a second glass substrate G02 and a second electrically connecting pad P02, which is disposed on the second glass substrate G02 and electrically connected with the first electrically connecting pad of the first glass circuit board 11. In this embodiment, the second glass circuit board 12 may further include at least one active electronic element E01, such as a transistor or a diode, or a passive electronic element E02, such as a resistor or a capacitor. More specifically, the second glass circuit board 12 may further include a second integrated circuit IC2, which is electrically connected with the second electrically connecting pad P02. Similar to the first integrated circuit IC1, the second integrated circuit IC2 may also be manufactured by the polysilicon technology or the amorphous silicon technology. That is, when the second glass circuit board 12 is being manufactured, a silicon layer is first formed on the second glass substrate G02 by the low-temperature polysilicon technology or the amorphous silicon technology, and then the semiconductor manufacturing processes are performed on the silicon layer.
In this embodiment, the first glass circuit board 11 may be bonded to the second glass circuit board 12 by way of flip-chip bonding (see
Referring to
Similar to the second glass circuit board 12, an active electronic element E11, a passive electronic element E12 or a third integrated circuit IC3 may be additionally disposed on the substrate 131 and may be electrically connected with the third electrically connecting pad P03. The third integrated circuit IC3 also includes a silicon layer formed on the substrate 131. Furthermore, similar to the bonding between the first glass circuit board 11 and the second glass circuit board 12, the circuit board 13 may be bonded to the second glass circuit board 12 by way of flip-chip bonding, wire bonding or adhering. Also, the third electrically connecting pad P03 may be electrically connected with the second electrically connecting pad P02 through a bump, a conductive adhesive, a connecting wire, a flexible cable or a flexible circuit board.
In this embodiment, the circuit board 13 may be electrically connected with the second glass circuit board 12 and also may be electrically connected with the first glass circuit board 11. When only the circuit board 13 is electrically connected with the first glass circuit board 11, the combination method is the same as that mentioned hereinabove, so detailed descriptions thereof will be omitted. When the circuit board 13 and the first glass circuit board 11 are simultaneously disposed on the second glass circuit board, the circuit board 13 may be electrically connected with the first glass circuit board 11 through a connecting wire (e.g., a flexible cable).
In summary, the first glass circuit board having the first integrated circuit is directly electrically connected with the second glass circuit board in the circuit board module according to the invention. Consequently, the first glass circuit board and the second glass circuit board, which are made of the same material, have the similar heat expansion coefficients, and are free from being influenced by the thermal stresses so that the circuit board module will not be influenced. In addition, the circuit board module of the invention may be applied to the electronic device such as the solar energy battery or the flat panel display, so that the used efficiency of the electronic device can also be enhanced.
Although the invention has been described with reference to specific embodiments, this description is not meant to be construed in a limiting sense. Various modifications of the disclosed embodiments, as well as alternative embodiments, will be apparent to persons skilled in the art. It is, therefore, contemplated that the appended claims will cover all modifications that fall within the true scope of the invention.
| Number | Date | Country | Kind |
|---|---|---|---|
| 095127035 | Jul 2006 | TW | national |
| 200610104248.8 | Aug 2006 | CN | national |
