Principles of Electronic Packaging, pp. 340-345, Donald P. Seraphim, Ed., 1989. |
Hawley's Condensed Chemical Dictionary, 11th Ed., p. 1001 and p. 965 (1987). |
IBM Technical Disclosure Bulletin, vol. 31, No. 7, Dec. 1988 "Fabrication Of Printed Circuit Wiring Boards Using Insulation Layers With Low Dielectric Constant" by Chandrashekhar et al., pp. 25-56. |
IBM Technical Disclosure Bulletin, vol. 22, No. 5, Oct. 1979 "Low Dielectric Constant Material For Printed Circuit Boards" by Haining et al. |
Handbook of Fillers for Plastics, published by Van Nostrand Reinhold Company, New York, 1988, edited by Katz and Milewski, pp. 437-452. |
IBM Corporate Specification, Flammability Test Methods, Materials and Components/Assemblies, May 1974. |
IBM Internal Document "Characterization and Non-Destructive Testing of Thin Dielectrics" as cited in File Wrapper History of U.S. Pat. No. 5,126,192. |
IPC Test Methods Manual (IPC-TMM-650) entitled: Glass Transition Temperature Dec. 1987. |
IPC Test Methods Manual (IPC-TMM-650) entitled: Peel Strength, Flexible Printed Wiring Materials Jul. 1985. |
IPC Test Methods Manual (IPC-TMM-650) entitled: Inner Layer Bond Strength of Multilayer Printed Circuit Boards Oct. 1987. |
IPC Test Methods Manual (IPC-TMM-650) entitled: Coefficient of Linear Thermal Expansion of Electrical Insulating Materials Mar. 1986. |
IPC Test Methods Manual (IPC-TMM-650) entitled: Dielectric Constant and Dissipation Factor of Printed Wiring Board Material--Chip Method Dec. 1987. |
IPC Test Methods Manual (IPC-TMM-650) entitled: Dielectric Withstanding Voltage, Printed Wiring Material Dec. 1987. |
IPC Test Methods Manual (IPC-TMM-650) entitled: Pressure Vessel Method for Glass Epoxy Laminate Integrity Jul. 1985. |