Claims
- 1. A circuit material for the formation of circuits or multi-layer circuits, the circuit material comprising a liquid crystalline polymer and a POSS filler.
- 2. A circuit material for the formation of circuits or multi-layer circuits, the circuit material comprising
a first conductive layer; and a dielectric layer disposed on the first conductive layer, wherein the dielectric layer comprises a liquid crystalline polymer and a POSS filler.
- 3. The circuit material of claim 1, wherein the liquid crystalline polymer further comprises a particulate filler, a fibrous web, or a combination comprising at least one of the foregoing.
- 4. The circuit material of claim 1, wherein the liquid crystalline polymer composition is flowable at temperatures greater than about 200° C.
- 5. The circuit material of claim 1, further comprising a second conductive layer disposed on the dielectric layer on a side opposite the first conductive layer.
- 6. The circuit material of claim 1, wherein the POSS is of the generic formula (RSiO1.5)n, wherein R is an organic moiety and n is 6, 8, 10, 12, or higher.
- 7. The circuit material of claim 6, wherein the organic moiety may be the same or different, and is a hydrocarbon or comprises a functional group selected from the group consisting of epoxy, hydroxy, ester, acrylate or a combination comprising at least one of the foregoing groups.
- 8. The circuit material of claim 1, having at least one covalent bond between the POSS and liquid crystalline polymer.
- 9. The circuit material of claim 8, wherein the at least one covalent bond comprises a functionalized divalent linking group having 1 to about 36 carbon atoms.
- 10. The circuit material of claim 9, wherein the divalent linking group comprises an alkylene group, a dialkylene ether group, a trialkylsilyloxy group, or a combination comprising at least one of the foregoing groups.
- 11. The circuit material of claim 1, having a dielectric constant of less than about 3.8 and a dissipation factor of less than or equal to about 0.007 when measured from 1 to 10 GHz.
- 12. A dielectric material for a circuit material, circuit, or multi-layer circuit, comprising a liquid crystalline polymer and a POSS filler.
- 13. The dielectric material of claim 11, having at least one covalent bond between the POSS and liquid crystalline polymer.
- 14. A method of forming a circuit material, comprising contacting a liquid crystalline polymer comprising a POSS filler with a conductive layer; and
optionally reacting liquid crystalline polymer with the filler.
- 15. A circuit comprising the circuit material of claim 1.
- 16. A multi-layer circuit comprising the circuit material of claim 1.
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims the benefit of U.S. Provisional Application Ser. No. 60/480,111, filed Jun. 19, 2003, which is incorporated by reference herein in its entirety.
Provisional Applications (1)
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Number |
Date |
Country |
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60480111 |
Jun 2003 |
US |