Patent Application
20090160580
This Non-provisional application claims priority under 35 U.S.C. ยง119(a) on Patent Application No(s). 096221612 filed in Taiwan, Republic of China on Dec. 19, 2007, the entire contents of which are hereby incorporated by reference.
1. Field of the Invention
The invention relates to a coil leading structure and a filter thereof.
2. Description of the Related Art
As electronic products become more elaborate, the surface mount device (SMD) technology is usually used for connecting electronic elements to the printed circuit board of the electronic products. Conventional connecting technology via magnetic elements actually comprises two methods as follows.
One method is wrapping a wire on a core to form a coil. The coil is manually soldered on a pad of a printed circuit board via a soldering iron. A surface mount device (SMD) element is adhered to the printed circuit board. Then, a pin to electrically connect to an outer device is soldered in a hole of the printed circuit board. The coil is covered via a silica gel. Finally, the entire printed circuit board and elements thereon are sealed via an epoxy resin.
The other method is wrapping a wire on a core to form a coil. The coil is covered on a leadframe forming a mold of an SMD transformer. Thereafter, related electronic elements and the mold of the SMD transformer are adhered to a printed circuit board. Then, a pin to electrically connect to the outer device is soldered in a hole of the printed circuit board. Finally, the printed circuit board is assembled with a housing and sealed via an adhesive.
However, the two above-mentioned methods have some problems that must be solved. For example, in the first method, as coil integration increases, the amount of the coil increases. Thus, complexity of the manual manufacturing process increases, resulting in requirement for more skilled manual workers. However, even if skilled manual workers are provided, the soldering process is still repeated many times for ensuring a plurality of coil soldered completely. Thus, product reliability decreases and time for completion of the manufacturing process increases. The pins are inserted for connection and then are soldered manually. As integration increases, the amount of the pins increases. Difficulty of manual soldering increases, easily resulting in products with various length pins or inclined pins. Additionally, the silica gel used for manual mounting is inconsistent, thus, the quality of the soldered products are inconsistent. Furthermore, when a wrong proportion of the adhesive is used in potting and sealing processes, potting and sealing processes fail, affecting product appearance and property.
For the above-mentioned method, when molding the mold of the SMD transformer, a great quantity of lead in the solder pass muster does not pass environmental muster. Meanwhile, because elements of electronic products with high integration have limited space, the volume of the mold of the transformer decreases, resulting in lower reliability, lower yields and higher costs. Thus, probability for product failure increases for consumers. Similarly, because of limited space, the interval between pins of electric capacities on a printed circuit board and a mold of a transformer decreases, increasing failure probability, and decreasing stress resistance. Manually inserting pins and potting and sealing the adhesive generate disadvantages of the first method.
The invention provides a coil leading structure and a filter thereof that can solve the problem of difficult coil arrangements because of high integration of electronic elements so that the reliability and the manufacturing speed can be increased.
In order to achieve the above-mentioned objects, the invention provides a coil leading structure used with at least a coil, including a board and at least a pin. The coil is disposed on the board. The pin is disposed at a side of the board and formed integrally with the board as a monolithic piece. The coil includes at least an end coupled to the pin.
In order to achieve the above-mentioned, the invention provides a filter including a coil leading structure and at least a coil. The coil leading structure includes a board and at least a pin. The pin is disposed at a side of the board and formed integrally with the board as a monolithic piece. The coil includes at least an end coupled to the pin.
For the above-mentioned coil leading structure and filter thereof, the coil is vertically or horizontally disposed on the board. The end is correspondingly connected to the pin by welding, clipping or wrapping. Because the pin includes a recess so that the end of the coil is wound onto the recess and fixed by soldering. The recess has a semicircular, square, rectangular, cambered or other shape. Further, an adhesive covers the coil and is filled between the coil and the board. The board is a printed circuit board.
For the above-mentioned filter, the filter further includes a housing. The housing covers the outer portion of the coil leading structure. The filter can be applied to an electronic equipment of local area network or ethernet.
The present invention will become more fully understood from the detailed description given herein below and the accompanying drawings which are given by way of illustration only, and thus are not limitative of the present invention, and wherein:
Referring to
To solve the problem of difficult coil arrangements during the manufacturing process, the plurality of pins 10 are protruded from at least a side of board 20 of the coil leading structure 40. The plurality of pins 10 are formed integrally with the board 20 as a monolithic piece. The coil 30 includes at least an end 31 directly fixed to the pins 10 by welding, clipping or wrapping for electrical connection. Thus, the embodiment according to the present invention avoids the conventional method that the coil 18 is manually soldered on the board 12, eliminating the variable affecting inconsistent quality. The fixation with that via the pins saves the area of the board 12 occupied by the conventional mold so that the free area can be provided for other electronic elements such as resistors or electric capacitors. Compared with the conventional filter, the reliability and the manufacturing speed of the filter of the embodiment can be increased.
The present invention is not limited to the above-mentioned embodiments. The coil 30 can be vertically or horizontally disposed on the board 20 of the coil leading structure 40 according to product requirements. To enhance the combination of the coil 30 and board 20, the adhesive covers the coil 30 and is filled in the gap between the coil 30 and the board 20, not only protecting the coil 30 but also improving the stability of the coil 30 and the board 20.
In summary, compared with the conventional manually soldered structure, skilled workers for manufacturing the filter of the present invention do not need special training. Additionally, the filter of the present invention has high soldering efficiency and soldering quality so that the quality of integration of the electronic devices can be improved. The filter of the present invention does not spend costs for additional molding and eliminates additional procedures. The filter of the present invention shows outstanding properties which may be applied to related products such as electric devices of local area network or ethernet.
While the invention has been described by way of example and in terms of the preferred embodiments, it is to be understood that the invention is not limited to the disclosed embodiments. To the contrary, it is intended to cover various modifications and similar arrangements (as would be apparent to those skilled in the art). Therefore, the scope of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements.
| Number | Date | Country | Kind |
|---|---|---|---|
| 96221612 | Dec 2007 | TW | national |
