This disclosure generally relates to a cooling structure for cooling electronic components. More particularly, this disclosure relates to a cooling structure including a cold plate support assembly.
Electronic components onboard aircraft or other vehicles that operate in extreme temperatures are typically protected from overheating by a cooling device. In some environments, air flow is either not available or insufficient to handle the thermal loads generated by the electronic components. In such applications, a cold plate is utilized through which a cooling fluid flows to remove heat from the electronic component. The cold plate is mounted adjacent the electronic component and supplied with fluid flow through appropriate conduits that lead to a fluid delivery system.
An example cold plate assembly according to an exemplary embodiment of this disclosure, among other possible things includes a heat spreader assembly that defines a mounting surface for heat generating devices and provides an improved thermal conduction of heat away from the heat generating devices. The example cold plate assembly with the integral heat spreading device spreads heat throughout the area of the mounting surface to reduce non-uniform thermal gradients across the cold plate assembly. Accordingly, the example heat spreader assembly provides a more uniform thermal gradient across the mounting surface of the cold plate assembly and improves thermal conductivity and cooling provided by the cold plate assembly.
Although the different examples have the specific components shown in the illustrations, embodiments of this invention are not limited to those particular combinations. It is possible to use some of the components or features from one of the examples in combination with features or components from another one of the examples.
These and other features disclosed herein can be best understood from the following specification and drawings, the following of which is a brief description.
Referring to
As appreciated, the heat generating devices 12 are mounted to a specific location on the mounting surface 14. Accordingly, generated heat is not evenly produced across the mounting surface 14.
The example mounting surface 14 is part of an upper skin 22 of a heat spreading assembly 20. A heat spreading assembly 20 provides for not only the dissipation of heat within a localized area but a spreading of the heat across a much wider area or surface to evenly distribute thermal energy produced by locally mounted heat generating devices 12. The example heat spreader assembly 20 is an integral part of the cold plate assembly 10 and defines the mounting surface 14 on which the various heat generating devices 12 are mounted.
As appreciated, the example mounting surface 14 is indicated as a planar surface for mounting of the various heat generating devices 12. However, the mounting surface 14 could be of any shape desired to accommodate application specific mounting requirements for the various heat generating devices. Moreover, although the example heat generating devices 12 are described as electronic components they may also comprise any other devices that generate heat that are desired to be cooled through a passive means as is provided by the example cold plate assembly 10.
Referring to
The example cold plate assembly 10 includes the heat spreader 20 that is attached to a top parting sheet 38. The parting sheet 38 provides a top layer to seal a conduit through which a fluid medium is provided through inlets 42. A middle parting sheet 36 is disposed in a middle portion of the cold plate assembly and supports a closure bar 32. The closure bar 32 surrounds a finned layer 28. Fluid flows through the fins 28 to remove thermal energy produced by the heat generating devices 12. Although a single heat spreader 20 is shown, it is within the contemplation of this disclosure that additional heat spreaders could be included within the example cold plate assembly 10. For example, an additional heat spreader could be installed between the finned layers 28, 30 to further enhance heat removal.
The example cold plate assembly includes a first layer 28 of fins and a second layer 30 of fins. Each of the layers of fins 28, 30 are bounded by closure bars 32, 34. The closure bars 32, 34 define a boundary for the various fluid passages that are defined between the plurality of fins 50 (
In this example, each of the parting sheets 36, 38, and 40 comprise an aluminum sheet material that is brazed in place to form the desired fluid conduits through which a cooling medium is provided. Each of the parting sheets 36, 38, and 40 of the example cold plate assembly 10 are brazed to each other at brazed joints indicated at 48. The heat spreader assembly 20 is further attached by a brazed joint 46 with the top parting sheet 38.
The example heat spreader assembly 20 includes the upper skin 22, a middle skin 24, and a lower skin 26. The middle skin 24 comprises a material that is selected from a group of materials that provides for the dissipation in a direction transverse to a thickness of the sheet. In other words, the heat spreader assembly 20 is comprised of layers of material that not only provide a low thermal resistance in a direction through the thickness of the material but also spreads the heat in a direction perpendicular to the thickness of the material about the area of the mounting surface 14. The outer skins 22, 26 are of a material brazeable and that mechanically encapsulate the center skin 24.
In this example, the heat spreader 20 comprises a material including graphite. The graphite provides for the spreading of thermal energy produced by the various heat generating components 12 across the area of the mounting surface 14 as indicated by arrows shown in
Referring to
Referring to
The brazed joint 46 between the heat spreader assembly and the remainder of the cold plate assembly 10 provides a less restrictive thermal conduit through which heat may be dissipated from the mounting surface 14 through the top or first parting sheet 38 into the fin sections 28, 30 where the heat may be carried off by a flow of cooling medium indicated at 58 in
Referring to
The example heat spreader assembly 20 is assembled as a separate unit by attaching the upper skin 22 and the lower skin 26 to the middle layer 24. The attachment may be performed utilizing welding, brazing, or any other attachment means as is known. Once the heat spreader assembly 20 is completed it is mounted by way of the brazed joint 46 to the partially assembled parts to complete the example cold plate assembly 10. All of the joints are brazed to provide the desired fluid tightness and thermal conductivity.
The example cold plate assembly 10 includes the heat spreader assembly 20 that defines the mounting surface 14 and provides an improved thermal conduction of heat away from the heat generating devices 12. The example cold plate assembly 10 with the heat spreading assembly 20 spreads heat throughout the area of the mounting surface 14 produced by the heat generating devices 12 to reduce non-uniform thermal gradients across the cold plate assembly 10. Utilizing the example heat spreader assembly 20, the thermal gradient across the mounting surface 14 of the cold plate assembly 10 is substantially uniform and improves thermal conductivity and cooling provided by the cold plate assembly.
Although an example embodiment has been disclosed, a worker of ordinary skill in this art would recognize that certain modifications would come within the scope of this disclosure. For that reason, the following claims should be studied to determine the scope and content of this disclosure.
This subject of this disclosure was made with government support under Contract No.: NNJO6TA25C awarded by the National Aeronautics and Space Administration. The government therefore may have certain rights in the disclosed subject matter.