Patent Grant
12078657
The below table sets forth priority claims for the instant application. Each of the listed applications is incorporated herein by reference as if set forth in full herein.
Embodiments of the present invention relate to probes for testing electronic circuits (e.g. for use in the wafer level testing, chip scale package testing, or socket testing of integrated circuits, or for use in making electrical connections to PCBs or other electronic components). In some embodiments, the probes are microprobes and they may be pin-like probes with spring elements supported by relatively rigid elements wherein the probe heights may be much greater than their lateral dimensions or such dimensions may be comparable. The probes may have single contact elements or multiple contact elements, Embodiments include, or provide, probes having at least one extension spring and may or may not also include one or more compression springs. Probe tips compress toward one another under an elastic return force provided by one or more flat extension springs or segments that provide a return force wherein in some embodiments the extension springs are pre-biased prior to contacting a DUT to be tested and in some embodiments the probe includes relatively movable rigid elements with operational gaps that are smaller than can be generally formed in an assembled state or that have varying gap widths that provide for effective formation as well as stabilized probe operation, while still other embodiments are directed to methods for making probes and/or assembling the probes into probe arrays.
Numerous electrical contact probe and pin configurations have been commercially used or proposed, some of which may qualify as prior art while others may not. Examples of such pins, probes, and methods of making are set forth in the following patent applications, publications of applications, and patents. Each of these applications, publications, and patents is incorporated herein by reference as if set forth in full herein and such applications may or may not be prior art against the present application.
Electrochemical Fabrication:
Electrochemical fabrication techniques for forming three-dimensional structures from a plurality of adhered layers have been, and are being, commercially pursued by Microfabrica® Inc. (formerly MEMGen Corporation) of Van Nuys, California under the process names EFAB and MICA FREEFORM®.
Various electrochemical fabrication techniques were described in U.S. Pat. No. 6,027,630, issued on Feb. 22, 2000 to Adam Cohen.
A related method for forming microstructures using electrochemical fabrication techniques is taught in U.S. Pat. No. 5,190,637 to Henry Guckel, entitled “Formation of Microstructures by Multiple Level Deep X-ray Lithography with Sacrificial Metal Layers”.
Electrochemical Fabrication provides the ability to form prototypes and commercial quantities of miniature objects, parts, structures, devices, and the like at reasonable costs and in reasonable times. In fact, Electrochemical Fabrication is an enabler for the formation of many structures that were hitherto impossible to produce. Electrochemical Fabrication opens the spectrum for new designs and products in many industrial fields. Even though Electrochemical Fabrication offers this capability, and it is understood that Electrochemical Fabrication techniques can be combined with designs and structures known within various fields to produce new structures, certain uses for Electrochemical Fabrication provide designs, structures, capabilities and/or features not known or obvious in view of the state of the art.
A need exists in various fields for miniature devices having improved characteristics, improved operational capabilities, reduced fabrication times, reduced fabrication costs, simplified fabrication processes, greater versatility in device design, improved selection of materials, improved material properties, more cost effective and less risky production of such devices, and/or more independence between geometric configuration and the selected fabrication process.
It is an object of some embodiments of the invention to provide improved compliant pin probes (e.g. with barrel and plunger type operation or sheath and double plunger operation) with one or more substantially planar spring segments with at least one of the segments being operated in tension with the probes further including sheaths or other rails, slots, channels, spring connector arms, and/or other engagement structures providing enhanced stability of probe performance.
It is an object of some embodiments of the invention to provide a probe including a plurality of spring segments, with at least one being a tensional or extension spring and with the combinations of segments being connected in series and/or in parallel.
It is an object of some embodiments of the invention to provide a probe including multiple spring segments with at least two of the spring segments being spaced from one another but at least partially overlaying one another with a side-to-side or face-to-face orientation.
It is an object of some embodiments of the invention to provide improved probe arrays.
It is an object of some embodiments of the invention to provide methods for making improved probes.
It is an object of some embodiments of the invention to provide a probe having at least one movable contact tip with an opposite end of the probe having a structure that is to be bonded or attached to an electrical interface, or contact to an electrical interface via a tip that forms part of a probe body, sheath or barrel.
It is an object of some embodiments of the invention to provide a probe with a sheath that has at least one end cap that restrains excessive longitudinal movement of at least one tip from that end of the probe.
It is an object of some embodiments of the invention to provide a probe that has at least two movable contact tips for contacting different electronic components or different pads or bumps on the same electronic component relative to a sheath, barrel or other non-moving portion of the probe.
It is an object of some embodiments of the invention to provide a probe with the sheath having at least two end caps that restrain excessive longitudinal movement of the tips from either end of the probe.
It is an object of some embodiments of the invention to provide a pin-like probe having two tips, with at least one being a contact tip wherein the probe has a configuration that enhances pointing accuracy of the two tips (i.e. reduces lateral misplacement of tips when making contact or undergoing compression and/or reduces angular misalignment of longitudinal elements that hold the tips and allow their longitudinal movement with respect to one another wherein, for example, the configuration provides for reduced gaps or clearance between one or more longitudinal arms or plungers relative to channels or barrels they move through after an initial compression of the tips toward one another (which may be a pre-biasing compression or a compression while in a working state).
It is an object of some embodiments of the invention to provide probes with enhanced pointing accuracy by providing narrowed gaps or clearance at one or more (e.g., starting, periodic, or ending) locations along a length of a channel or barrel relative to an arm or plunger.
It is an object of some embodiments of the invention to provide probes with enhanced pointing accuracy by providing narrowed channel or barrel dimensions at one or more (e.g., starting, periodic, and/or ending) locations along a length of a channel or barrel.
It is an object of some embodiments of the invention to provide probes with enhanced pointing accuracy by providing widened arm or plunger dimensions at one or more (e.g., starting, periodic, or ending) locations along a length of the arm, arms, plunger, or plungers.
It is an object of some embodiments of the invention to form probes on their sides, e.g., with the longitudinal axis of the probe being perpendicular to a normal direction of the planes of layers from which the probes are formed
It is an object of some embodiments of the invention to form probes on their sides wherein any smooth curved features of the probe are formed within individual layers while changes in probe configuration from layer to layer are provided with stair stepped or at least partially discontinuous transitions.
It is an object of some embodiments of the invention to provide configurations that improve pointing alignment within a single layer, while it is an object of other embodiments to provide configurations that improve pointing alignment via multiple adjacent layers, while it is an object of still other embodiments to provide configurations that improve pointing alignment that are located on non-adjacent layers.
It is an object of some embodiments of the invention to provide a probe that is configured to provide shunting of a majority of the current through a sheath as opposed to through a majority of the length of the spring elements.
It is an object of some embodiments of the invention to provide a probe with a configuration that provides a compliant element attached to the sheath that is in direct or indirect sliding contact with the moving tip.
It is an object of some embodiments of the invention to provide a probe with a configuration that provides a compliant element attached directly or indirectly to the moving tip and is in direct or indirect sliding contact with a sheath.
It is an object of some embodiments of the invention to provide a method of forming a probe, or a plurality of probes simultaneously, with at least a portion of each of the plurality of spring segments of a probe formed within an opening in a sheath.
It is an object of some embodiments of the invention to provide a method of forming a probe, or a plurality of probes simultaneously, with all of the plurality of spring segments of a probe formed within an opening in a sheath.
It is an object of some embodiments of the invention to provide a probe with a sheath that is formed as multiple components, with the components pushed longitudinally together after formation to load the spring segments and to join the multiple components.
It is an object of some embodiments of the invention to provide a probe with a joining structure or structures that are configured to allow the moving of a compliant element through an engagement feature that inhibits unjoining.
It is an object of some embodiments of the invention to provide a probe with at least some spring segments that undergo tensional loading when transitioning from a build configuration to a working configuration.
It is an object of some embodiments of the invention to provide transitioning that includes moving a compliant element through an engagement feature that inhibits movement back to a build configuration.
It is an object of some embodiments of the invention to provide probes with sheaths that include one or more ratcheting or stepped locking mechanisms and a fixed extension stop that allow the probe to be formed in a compressed or compacted state (using less batch wafer real estate for a body or sheath portion of the probe) and then two portions of the sheath pulled apart longitudinally to engage the at least one ratcheting mechanism without risk of overextending the springs or sheath components such that the probe is held in an elongated or stretched state with at least one pre-biased extension spring.
It is an object of some embodiments of the invention to provide probes with sheaths that include one or more ratcheting or stepped locking mechanisms, a fixed extension stop as well as a secondary retention lock that allow the probes to be formed in a compressed or compacted state (using less batch wafer real estate for a body or sheath portion of the probe) and then two portions of the sheaths pulled apart longitudinally to engage the at least one ratcheting mechanism and the secondary lock without risk of overextending the springs or sheath components such that the probes are held in an elongated or stretched state with at least one pre-biased extension spring.
It is an object of some embodiments of the invention to provide extension probes with arm-to-spring mounting plates with openings therein that probe tip arms or probe tip extensions can extend, with the probe arms including at least one ratcheting feature that can be formed between the mounting plates and that can be moved beyond the mounting plates to permanently bias at least one extension spring such that during use, the extension spring always has a non-zero initial bias or pre-load.
Other objects and advantages of various embodiments of the invention will be apparent to those of skill in the art upon review of the teachings herein. The various embodiments of the invention, set forth explicitly herein or otherwise ascertained from the teachings herein, may address one or more of the above objects alone or in combination, or alternatively they may address some other object ascertained from the teachings herein. It is not intended that any particular object, let alone all objects, be addressed by any single aspect of the invention.
In a first aspect of the invention, a probe for testing a DUT, includes: (a) a first tip for making electrical contact to an electrical circuit element, the first tip having a contact region and an attachment region; (b) a first extension arm connecting directly or indirectly to the attachment region of the first tip; (c) a compliant structure including at least one spring segment, wherein a first region of the compliant structure joins the first extension arm; (d) a second extension arm joining a second region of the compliant structure such that relative displacement of the first and second extension arms results in elastic movement of the at least one spring segment of the compliant structure; and (e) a second tip having an first attachment region and a second region (e.g. a contact region region) wherein the first attachment region joins the second extension arm, wherein the at least one spring segment operates under tension to provide an elastic restoration force.
Numerous variations of the first aspect of the invention are possible and include, for example: (1) the at least one spring segment including a plurality of spring segments; (2) the at least one spring segment including a plurality of spring segments with at least one of the plurality of spring segments operating under compression to provide a restoring force; (3) the probe further including at least two stop structures to allow pre-biasing of at least one of the spring segments; (4) the probe further including at least two movable stop structures to allow pre-biasing of at least one of the spring segments; (5) the probe additionally including features that can engage with features on an array structure to allow for pre-biasing of at least one spring segment; (6) the probe additionally including at least one shunting element that directs current from one of the first or second extension arms through a non-compliant structure and then through the other of the first or second extension arms; (7) the sixth variation wherein the at least one shunting structure is a surface against which the extension arms slide; (8) the probe further including at least one guidance element that limits relative movement of the first tip and the second tip along a substantially longitudinal axis of the probe; (9) the at least one spring segment includes at least two spring segments that are joined together in a serial configuration; (10) the ninth variation with the at least two joined spring segments operating in tension; (11) the ninth variation with at least one of the at least two joined segments operating in tension while another of the at least two joined segments operates in compression; (12) the ninth variation with the at least two spring segments being flat spring segments and being spaced from one another but at least partially overlay one another in a face-to-face configuration; (13) the ninth variation with the at least two spring segments being flat springs and being separated from one another by an intermediate surface against which at least one of the spring segments can slide; and (14) the probe including a sheath in which at least a portion of the at least one segment of the compliant structure moves. Many further variations are possible and will be understood by those of skill in the art upon reviewing the teachings herein.
In a second aspect of the invention, a probe for testing a DUT, includes: (a) a first tip for making electrical contact to an electrical circuit element, the first tip having a first contact region and a first connection region; (b) a first extension arm connecting directly or indirectly to the first connection region of the first tip; (c) a compliant structure including at least one first spring segment, wherein a first region of the compliant structure connects directly or indirectly to the first extension arm; (d) a second extension arm connecting directly or indirectly to a second connection region of the compliant structure such that relative displacement of the first extension arm and the second extension arm results in elastic movement of the at least one first spring segment of the compliant structure; and (e) a second tip having a first connection region and a second region wherein the first connection region joins the second extension arm, wherein the at least one spring undergoes increased extension upon relative displacement of the first tip and the second tip toward one another along the longitudinal axis of the probe, and wherein the second region of the second tip is configured for making an electrical connection to a second circuit element, wherein the configuration is selected from the group consisting of: (1) a tip for making a contact connection, and (2) a tip for making an attached connection.
Numerous variations of the second aspect of the invention are possible and include, for example, those noted with regard to the first aspect. Additional variations include, for example: (1) the probe further including at least one structure that is directly or indirectly attached to an end of the at least one spring for providing a function selected from the group consisting of: (1) providing a stop structure that moves with the end of the spring as a first tip and second tip are moved relative to one another; and (2) providing for relative longitudinal motion of the first tip relative to the second tip while inhibiting excessive lateral motion of at least one of the first tip or the second tip, and/or (2) a rigid probe body providing a frame which supports the relative lateral positioning of the compliant structure, the first extension arm, and the second tip extension arm while allowing at least one of the first extension arm and first tip or the second extension arm and second tip to move longitudinally, via an external compressive force applied to the first and/or second tips, through a working range of longitudinally extended probe length to longitudinally compressed probe length while increasing a tensional force on the at least one first spring segment and moving longitudinally through a working range of longitudinally compressed probe length to extended probe length under a force of extension provided, at least in part, by the tensional force stored in the at least one first spring segment.
In a third aspect of the invention, a probe for testing a DUT, includes: (a) a first tip for making electrical contact to an electrical circuit element, the first tip having a contact region and a first extension arm having an attachment region; (b) a first structure connecting directly or indirectly to the attachment region of the first extension arm; (c) a compliant structure comprising at least one spring segment, wherein a first region of the compliant structure joins the first extension arm; (d) a second region of the compliant structure, different from the first region, joining, directly or indirectly, a second structure that is configured for longitudinal sliding relative to the first structure such that relative displacement of the first and second structures results in elastic movement of the at least one spring segment of the compliant structure; and (e) a second tip joining, directly or indirectly, the second structure, wherein the first and second structures move relative to each other via at least one guidance structure that may be part of a structure selected from the group consisting of: (1) the first, (2) the second structure, and (3) a third structure, wherein the at least one guidance structure limits movement of the first and second structures to substantially longitudinal movement wherein the at least one guidance structure provides features that provide enhanced stability and/or pointing accuracy of the tips after a relatively small amount of compressive movement of the tips relative to one another such that the majority of compressive movement of the tips occurs with an increased level of stability and/or pointing accuracy, wherein at least one of the features that provides enhanced stability and/or pointing accuracy comprises an effective narrowing of a clearance between an element that slides that is smaller than an effective clearance prior to the spring being biased, wherein the at least one spring segment operates under tension to provide an elastic restoration force, and wherein the second region of the second tip is configured for making an electrical connection to a second circuit element, wherein the configuration is selected from the group consisting of: (1) a tip for making a contact connection, and (2) a tip for making an attached connection.
Numerous variation of the probe of the third aspect are possible and include, for example: (1) any of the variations noted for the first or second aspects, (2) the at least one of the features that provides enhanced stability and/or pointing accuracy comprises a plurality of features that are located at spaced longitudinal portions of the probe; (3) the probe of the first variation wherein the plurality is selected from the group consisting of: (a) at least two, (b) at least three, and (c) at least four; (4) the probe of the third aspect or its variations wherein the probe has a length selected from the group consisting of: (a) less than 1 mm, (b) less than 2 mm, (c) less than 3 mm, (d) less than 5 mm, (e) less than 8 mm, (f) more than 0.5 mm, (g) more than 1 mm, (h) more than 2 mm, (i) more than 3 mm, (j) more than 5 mm, and (k) more than 8 mm; (5) the probe of the third aspect or its variations wherein the probe has a width selected from the group consisting of: (a) less than 100 um (microns), (b) less than 200 um, (c) less than 300 microns, (d) less than 400 um, and (e) less than 600 microns; (6) the probe of the third aspect or its variations wherein the probe is configured in an array for wafer level testing; (7) the probe of the third aspect or its variations wherein the probe is configured in an array for socket testing of one or more packaged ICs; (8) the probe of the third aspect or its variations wherein the probe does not induce tip-to-tip rotation during compression.
Additional variations of the third aspect or its variations include the enhanced level of stability and/or pointing accuracy being selected from the group consisting of: (1) higher than the stability and/or pointing accuracy in absence of the at least one feature that provides an effective narrowing of a clearance between an element that slides that is smaller than an effective clearance prior to the spring being biased, wherein the smaller clearance is smaller by an amount selected from the group consisting of (a) at least two microns, (b) at least four microns, (c) at least 6 microns, (d) at least eight microns, and (e) at least 10 microns, (f) less than ⅞ of the clearance prior to biasing, (g) less than ¾ of the clearance prior to biasing, (h) less than ¾ of the clearance prior to biasing, (i) less than ⅝ of the clearance prior to biasing, (j) less than ½ of the clearance prior to biasing, (k) less than ⅜ of the clearance prior to biasing, (l) less than ¼ of the clearance prior to biasing, (m) less than ⅛ of the clearance prior to biasing; (2) the stability and/or pointing accuracy when making to an electronic component for a given level of spring compression is selected from the group consisting of: (a) less than ten microns, (b) less than eight microns, (c) less than six microns, (d) less than four microns, and (e) less than two microns, (f) less than ⅞ of the stability and/or pointing accuracy in absence of the clearance reduction, (g) less than ⅞ of the stability and/or pointing accuracy in absence of the clearance reduction, (h) less than ¾ of the stability and/or pointing accuracy in absence of the clearance reduction, (i) less than ⅝ of the stability and/or pointing accuracy in absence of the clearance reduction, (j) less than ½ of the stability and/or pointing accuracy in absence of the clearance reduction, (k) less than ⅜ of the stability and/or pointing accuracy in absence of the clearance reduction, (l) less than ¼ of the stability and/or pointing accuracy in absence of the clearance reduction, (m) less than ⅛ of the stability and/or pointing accuracy in absence of the clearance reduction.
In a fourth aspect of the invention, a probe for testing a DUT includes: (a) a first tip for making electrical contact to an electrical circuit element, the first tip having a contact region and an attachment region; (b) a first tip arm connecting directly or indirectly to the attachment region of the first tip, wherein the first tip arm holds, directly or indirectly, at least one first ratcheting element; (c) a first engagement plate with a first hole, joined directly or indirectly to the first tip arm; (d) a compliant structure, including at least one extension spring, wherein a first region of the compliant structure joins directly or indirectly the first engagement plate; (e) a second engagement plate with a second hole, joined directly or indirectly to the compliant structure and with the first tip arm passing through the hole of the second engagement plate with the at least one first ratcheting element on the opposite side of the second engagement plate relative to the compliant structure when in an as built state, and on the same side of the second engagement plate when in a pre-biased working state; (f) a second tip arm directly or indirectly joined to the second engagement plate, and wherein the second tip arm passes through the first opening in the first engagement plate; (g) a second tip having a first attachment region and a second region wherein the first attachment region of the second tip joins the second tip arm; and wherein the at least one extension spring operates under tension to provide an elastic restoration force, and wherein the second region of the second tip is configured for making an electrical connection to a second circuit element, wherein the configuration is selected from the group consisting of: (1) a tip for making a contact connection, and (2) a tip for making an attached connection.
Numerous variations of the four aspect of the invention are possible and include, for example the second tip arm holding, directly or indirectly, at least one second ratcheting element and wherein the at least one second ratcheting element of the second arm being on the opposite side of the first engagement plate relative to the compliant structure when in an as built state, and on the same side of the first engagement plate when in a pre-biased working state. Other variations include features set forth in other aspects and embodiments of the invention as well as in variations of those aspects and embodiments.
In a fifth aspect of the invention a probe for testing a DUT, includes: (a) a first tip for making electrical contact to an electrical circuit element, the first tip having a contact region and an attachment region; (b) a first tip arm connecting directly or indirectly to the attachment region of the first tip; (c) a first engagement plate with a first hole, joined directly or indirectly to the first tip arm; (d) a compliant structure, including at least one extension spring, wherein a first region of the compliant structure joins directly or indirectly the first engagement plate; (e) a second engagement plate with a second hole, joined directly or indirectly to the compliant structure and with first tip arm passing through the hole of the second engagement plate; (f) a second tip arm directly or indirectly joined to the second engagement plate, wherein the second tip arm passes through the first opening in the first engagement plate; (g) a second tip having a first attachment region and a second region wherein the first attachment region of the second tip joins the second tip arm; and (h) a multi-part sheath having a first biasing portion and a second biasing portion wherein the first biasing portion includes a first feature that engages the compliant structure side of the first engagement plate and the second biasing portion includes a second feature that engages the compliant structure side of the second engagement plate and wherein the first and second biasing portions include first and second ratcheting features on first and second longitudinally extended elements, respectively, that can move at least partially passed one another wherein at least one first ratcheting feature and at least one second ratcheting feature have initial positions with respect to one another while the probe is in an as built state, and final position with respect to one another while in a pre-biased working state, wherein the initial position locates the first ratcheting feature at a position selected from the group consisting of: (i) closer to the second engagement plate than when in the final position, (ii) further from the first engagement plate than when in a final position, and (iii) less centrally, longitudinally located than when in the final position, wherein the at least one extension spring operates under tension to provide an elastic restoration force, and wherein the second region of the second tip is configured for making an electrical connection to a second circuit element, wherein the configuration is selected from the group consisting of: (1) a tip for making a contact connection, and (2) a tip for making an attached connection.
Numerous variations of the fifth aspect of the invention are possible and include, for example: (1) the initial position locates the second ratcheting feature closer to the first engagement plate than when in the final position; (2) the initial position locates the second ratcheting feature further from the second engagement plate than when in a final position, and (3) the initial position locates the second ratcheting feature less centrally, longitudinally located than when in the final position, and (4) the at least one first ratcheting feature comprises at least two ratcheting features on opposite sides of the probe and wherein the at least one second ratcheting feature comprises at least two ratcheting features on opposite sides of the probe. Other variations include features set forth in other aspects and embodiments of the invention as well as in variations of those aspects and embodiments.
In a sixth aspect of the invention, a probe array for testing a DUT, includes: (1) at least one array structure having a plurality of openings defining at least in part lateral positions of a plurality of probes; and (2) a plurality of probes located in the plurality of openings, wherein each of the plurality of probes comprises a probe selected from the group consisting of: (1) the first aspect, (2) the second aspect, (3) the third aspect, (4) the fourth aspect, (5) the fifth aspect, (6) a variation of any of the first to fifth aspects.
Numerous variations of the sixth aspect of the invention are possible and include, for example variations of the first to fifth aspects as noted above, mutatis mutandis. Additional variations include, for example: (1) the at least one array structure being a guide plate; (16) the at least one array structure being a plurality of plates; (2) the probes including fixed flange-like structures for engaging perimeters of the openings; (3) the probes including movable flange-like structures for engaging perimeters of the openings; (4) the probes including lower flange-like structures with upper surfaces which engage at least portions of lower perimeter surfaces of an opening in a lower array structure; (5) the probes including upper flange-like structures with lower surfaces which engage at least portions of upper perimeter surfaces of openings in an upper array structure; (6) the probes including the features of both the fifth and sixth variations of the first aspect; (7) the array structure including a lower biasing assembly and an upper biasing assembly with each biasing assembly including two longitudinally stacked plates with openings that can be laterally slid relative to one another to align openings for loading of probes and can be laterally slid to partially close the openings to allow engagement of at least portions of perimeter edges of at least one of the stacked plates with features on the probes to retain the probes; (8) the seventh variation where the lower biasing assembly and the upper biasing assembly include at least two plates with slots into which bridging structures extend which hold the plates together in the direction of their normals while allowing lateral sliding to occur along the planes of the plates; (9) the array structure including multiple spaced plates or assemblies along with standoffs that set a longitudinal (or normal direction) spacing of the plates or assemblies; and (10) the ninth variation wherein the standoffs set a distance between the spaced plates that hold at least one spring segment of each of a plurality of probes in a biased state without the probe tips being compressed toward one another. Still numerous other variations are possible and will be apparent to those skill in the art upon review of the teachings herein.
In a seventh aspect of the invention, a method of forming at least a portion of a plurality of probes using a multi-layer, multi-material fabrication process, includes: (a) forming a plurality of multi-material layers representing at least portions of cross-sections of the plurality of probes, wherein each successive layer formed is formed on and adhered to an immediately preceding layer, with each layer formed from at least two materials with at least one being a structural material and at least one being a sacrificial material, wherein the formation of each such multi-material layer includes: (i) depositing a first of the at least two materials; (ii) depositing a second of the at least two materials; and (b) after the forming of the plurality of successive layers, separating at least a portion of the sacrificial material from the structural material to reveal the three-dimensional structure, wherein the plurality of probes comprises a probe selected from the group consisting of: (1) the first aspect, (2) the second aspect, (3) the third aspect, (4) the fourth aspect, (5) the fifth aspect, and (6) a variation of any of the first to fifth aspects.
Numerous variations of the seventh aspect of the invention are possible and include, for example, variations of the first to fifth aspects. Additional variations include, for example: (1) each of the at least one structural material being a metal; (2) at least one structural material including at least two structural materials with at least one of the at least two structural materials being a dielectric; (3) a longitudinal axis of the plurality of probes extending parallel to a build axis during formation of the probes; (4) a longitudinal axis of the plurality of probes extending perpendicular to a build axis during formation of the probes; (5) the portion of the probes formed by the multi-layer, multi-material fabrication process include the compliant structures which are stacked and combined with the relatively rigid structure after layer fabrication and release has been completed; (6) the portion of the probes formed by the multi-layer, multi-material fabrication process includes the entire probes; (7) the portion of the probes formed by the multi-layer, multi-material fabrication process includes at least the compliant structures; (8) during the multi-layer, multi-material fabrication process, at least a portion of the layers are planarized after deposition of the materials forming those respective layers; (9) the portion of the probes formed by the multi-layer, multi-material fabrication process are subjected to heat treatment to improve one or more properties of the probes; (10) the portion of the probes formed by the multi-layer, multi-material fabrication process are released as individual separate probes from a build substrate prior to assembly into an array configuration; and (11) the portion of the probes formed by the multi-layer, multi-material fabrication process are formed in groups with a lateral spacing of probes in each group during formation corresponding to a lateral spacing to be used in a probe array wherein the probes are released from a build substrate in groups and the groups are assembled into array configurations.
In an eighth aspect of the invention, a method of forming a probe array, includes: (a) providing at least one array structure that includes a plurality of openings for receiving probes wherein the openings are laterally located in an array pattern; (b) providing a plurality of probes, formed using a multi-layer, multi-material fabrication process, including: (i) forming a plurality of multi-material layers representing at least portions of cross-sections of the plurality of probes, wherein each successive layer formed is formed on and adhered to an immediately preceding layer, with each layer formed from at least two materials with at least one being a structural material and at least one being a sacrificial material, wherein the formation of each such multi-material layer includes: (1) depositing a first of the at least two materials; (2) depositing a second of the at least two materials; and (ii) after the forming of the plurality of successive layers, separating at least a portion of the sacrificial material from the structural material to reveal the three-dimensional structure, wherein the probe includes the probe of any of the first to fifth aspects or variations of such aspects; and (c) loading the probes into the openings in the at least one array structure and securing the probes in position in a fixed or longitudinally movable manner.
Numerous variations of the eighth aspect of the invention are possible and include, for example, those noted with regard to the seventh aspect. Still other variations are possible and will be apparent to those skill in the art upon review of the teachings herein.
In a ninth aspect of the invention, a method of forming a probe array, includes: (a) providing at least two plate-like structures with each including a plurality of openings for receiving probes wherein the openings are laterally located in an array pattern; (b) providing a plurality of probes, formed using a multi-layer, multi-material fabrication process, including: (i) forming a plurality of multi-material layers representing at least portions of cross-sections of the plurality of probes, wherein each successive layer formed is formed on and adhered to an immediately preceding layer, with each layer formed from at least two materials with at least one being a structural material and at least one being a sacrificial material, wherein the formation of each such multi-material layer includes: (1) depositing a first of the at least two materials; (2) depositing a second of the at least two materials; and (ii) after the forming of the plurality of successive layers, separating at least a portion of the sacrificial material from the structural material to reveal the three-dimensional structure, wherein the probe includes the probe of any of the first to fifth aspects or variations of such aspects; and (c) loading the probes into the openings in the two plate-like structures and setting a desired longitudinal spacing between the plate-like structures.
Numerous variations of the ninth aspect of the invention are possible and include, for example, those noted with regard to the seventh aspect. Still numerous other variations are possible and will be apparent to those skill in the art upon review of the teachings herein.
In a tenth aspect of the invention, a method of forming a probe array, includes: (a) providing at least first and second plate-like assemblies with each including at least first and second plate-like structures that are held together longitudinally but are capable of lateral sliding relative to one another, the assemblies also including a plurality of openings for receiving probes that extend through the structures of the first and second plate-like assemblies; (b) providing at least one standoff; (c) providing at least one base plate; (d) providing a plurality of probes with each having features set forth in any of the first—fifth aspect including at least one tensional spring segment and at least first and second movable stops; (e) laterally positioning the probes with respect to the base; (f) longitudinally moving the probes and the base together such that the probes have first ends that extend into an opening in the base and the first moving stop of the probe engages a surface of base; (g) laterally positioning and longitudinally loading the first plate-like assembly over the base; (h) laterally shifting at least two plate-like structures of the first assembly so as to engage and hold the first movable stop of the probe to the base; (i) laterally positioning the at least one standoff and the second of the plate-like assemblies in line with the probes and thereafter longitudinally bringing the at least one standoff into contact with the first plate-like assembly and the second plate-like assembly in contact with the other end of the at least one standoff; (j) contacting a biasing tool to the probe tips that extend into the base and then longitudinally moving the biasing tool relative to the base to cause further separation of the at least two moving stops so that they are separated by an amount that is equal to or greater than a standoff height of inner most plate-like structures of the plate-like assemblies; (k) while the moving stops are separated, laterally displacing the plate-like structures of the second plate-like assembly so as to inhibit the second movable stop from moving back to a position between the second plate-like assembly and the first plate-like assembly; (l) moving the biasing tool away from the base so that a tension induced return force of the at least one spring segment brings the movable stop into contact with the outer surfaces of each of the two plate-like assemblies, and (m) separating the base on the first plate-like assembly to yield a probe array having a plurality of probes, a pair of plate-like assemblies holding the plurality of probes in a biased state.
Numerous variations of the tenth aspect of the invention are possible and include, for example, those noted with regard to the other aspects of the invention. Further variations exist and include, for example, both plate-like assemblies and the at least one intermediate standoff being loaded onto the probes at the same time. Still numerous other variations are possible and will be apparent to those skill in the art upon review of the teachings herein.
Still other aspects of the invention will be understood by those of skill in the art upon review of the teachings herein. Other aspects of the invention may involve combinations of the above noted aspects of the invention. These other aspects of the invention may provide various combinations of the aspects presented above as well as provide other configurations, structures, functional relationships, and processes that have not been specifically set forth above but are taught by other specific teachings set forth herein or by the teachings set forth herein as a whole.
FIGS. 13A1 to 13D4 provide a number of isometric views of a probe and views of expanded sections of the probe according to another embodiment of the invention where the probe provides a specific implementation of spring and guide functionality of the probe of
13E1 to 13E6 provide top views of individual layers that define the probe of FIGS. 13A1-13D4 wherein FIG. 13E1 shows the features of probe layers 1 and 11, FIG. 13E2 shows the features of probe layers 2 and 10, FIG. 13E3 shows the features of probe layers 3 and 9, FIG. 13E4 shows the features of probe layers 4 and 8, FIG. 13E5 shows the features of probe layers 5 and 7, and FIG. 13E6 shows the features of probe layer 6 wherein each figure also provides a dashed rectangular alignment guide that correlates the relative positions of the features from layer-to-layer.
15A1 to 15C2 provide three sample configurations of a layer with features that provide for enhanced pointing accuracy or probe stability wherein FIG. 15A1 provides a similar configuration to that of layers 3 and 9 of the embodiment of FIGS. 13A1 to 13E6 as shown in FIG. 13E3 with FIG. 15A2 showing the arm and channel after longitudinal tip-to-tip compression that provides for engagement of the enhanced features that narrows the effective clearance or gap near the left end of the channel, with FIGS. 15B1 and 15B2 provide similar initial (e.g. as formed) and engaged (e.g. after some tip-to-tip compression) views of a second example wherein clearance tightening elements can be found at both the left and right ends of the arm/channel engagement providing even more enhancement in pointing accuracy than the example of FIGS. 15A1 and 15A2, and with FIGS. 15C1 and 15C2 providing similar views but with gap narrowing features found not only at the left and right ends but at two intermediate locations as well wherein prior to initial compression of the tips, normal gaps provide a certain level of probe stability and/or pointing accuracy (as well as possibly allowing engaged formation by providing gaps at least as great as a minimum feature size requirement or MFS requirement) while after some amount of tip compression, engagement of features with smaller effective clearances contribute to the pointing accuracy or otherwise assist in providing stabilized probe functionality.
Electrochemical Fabrication in General
In some variations, the structure may be separated from the substrate. For example, release of the structure (or multiple structures if formed in a batch process) from the substrate may occur when releasing the structure from the sacrificial material particularly when a layer of sacrificial material is positioned between the first layer of the structure and the substrate. Alternative methods may involve, for example, the use of a dissolvable substrate that may be separated before, during or after removal of the sacrificial material, machining off the substrate before or after removal of the sacrificial material, or use of a different intermediate material that can be dissolved, melted or otherwise used to separate the structure(s) from the substrate before, during, or after removal of the sacrificial material that surround the structure(s).
Various embodiments of various aspects of the invention are directed to formation of three-dimensional structures from materials, some, or all, of which may be electrodeposited or electroless deposited (as illustrated in
The various embodiments, alternatives, and techniques disclosed herein may form multi-layer structures using a single patterning technique on all layers or using different patterning techniques on different layers. For example, various embodiments of the invention may perform selective patterning operations using conformable contact masks and masking operations (i.e. operations that use masks which are contacted to but not adhered to a substrate), proximity masks and masking operations (i.e. operations that use masks that at least partially selectively shield a substrate by their proximity to the substrate even if contact is not made), non-conformable masks and masking operations (i.e. masks and operations based on masks whose contact surfaces are not significantly conformable), adhered masks and masking operations (masks and operations that use masks that are adhered to a substrate onto which selective deposition or etching is to occur as opposed to only being contacted to it), and/or selective patterned deposition of materials (e.g. via extrusion, jetting, or controlled electrodeposition) as opposed to masked patterned deposition. Conformable contact masks, proximity masks, and non-conformable contact masks share the property that they are preformed and brought to, or in proximity to, a surface which is to be treated (i.e. the exposed portions of the surface are to be treated). These masks can generally be removed without damaging the mask or the surface that received treatment to which they were contacted or located in proximity to. Adhered masks are generally formed on the surface to be treated (i.e. the portion of that surface that is to be masked) and bonded to that surface such that they cannot be separated from that surface without being completely destroyed or damaged beyond any point of reuse. Adhered masks may be formed in a number of ways including: (1) by application of a photoresist, selective exposure of the photoresist, and then development of the photoresist, (2) selective transfer of pre-patterned masking material, and/or (3) direct formation of masks from computer-controlled depositions of material. In some embodiments adhered mask material may be used as a sacrificial for the layer or may be used only as a masking material which is replaced by another material (e.g., dielectric or conductive material prior to completing formation of a layer where the replacement material will be considered the sacrificial material of the respective layer. Masking material may or may not be planarized before or after deposition of material into voids or openings included therein.
Patterning operations may be used in selectively depositing material and/or may be used in the selective etching of material. Selectively etched regions may be selectively filled in or filled in via blanket deposition, or the like, with a different desired material. In some embodiments, the layer-by-layer build up may involve the simultaneous formation of portions of multiple layers. In some embodiments, depositions made in association with some layer levels may result in depositions to regions associated with other layer levels (i.e. regions that lie within the top and bottom boundary levels that define a different layer's geometric configuration). Such use of selective etching and/or interlaced material deposition in association with multiple layers is described in U.S. patent application Ser. No. 10/434,519, by Smalley, filed May 7, 2003, which is now U.S. Pat. No. 7,252,861, and which is entitled “Methods of and Apparatus for Electrochemically Fabricating Structures Via Interlaced Layers or Via Selective Etching and Filling of Voids”. This referenced application is incorporated herein by reference.
Temporary substrates on which structures may be formed may be of the sacrificial-type (i.e. destroyed or damaged during separation of deposited materials to the extent they cannot be reused) or non-sacrificial-type (i.e. not destroyed or excessively damaged, i.e. not damaged to the extent they may not be reused, e.g. with a sacrificial or release layer located between the substrate and the initial layers of a structure that is formed). Non-sacrificial substrates may be considered reusable, with little or no rework (e.g., replanarizing one or more selected surfaces or applying a release layer, and the like) though they may or may not be reused for a variety of reasons.
Definitions of various terms and concepts that may be used in understanding the embodiments of the invention (either for the devices themselves, certain methods for making the devices, or certain methods for using the devices) will be understood by those of skill in the art. Some such terms and concepts are discussed herein while other such terms are addressed in the various patent applications to which the present application claims priority and/or which are incorporated herein by reference (e.g., U.S. patent application Ser. No. 16/584,818).
Probes of the various embodiments of the invention can take on a variety of forms. Each probe includes at least one substantially flat tensional spring segment that biases a test contact tip relative to a second tip that may or may not be a contact tip wherein the probes generally include structural elements for ensuring stable and robust probe functionality. In some embodiments, the probes further include a plurality of substantially flat spring segments, either of the extension type only or of a combination of one or more extension springs and one or more compression springs. In some embodiments, springs are configured to operate functionally in series or in parallel with the spring segments at least partially lying side-by-side or face-to-face as opposed to edge-to-edge or end-to-end. In some embodiments, probe deformation is limited to a compression along the axis of the probe (e.g., substantially longitudinal compression as probe tips or circuit joining elements move to more proximal positions).
Numerous variations of the probe embodiments are possible; including for example:
Numerous other variations are possible, some of which are explicitly or implicitly set forth herein while others will be apparent to those of skill in the art after review of the teachings herein. Some variations include using such probes in testing integrated circuits, dies on semiconductor wafers, or other electronic circuits. Other variations include assembly of a plurality of such probes into arrays for use in testing applications or for use in permanent contact applications. Further embodiments include methods for making such probes or making such arrays.
Reference numbers are included in many of
First Group of Embodiments: Probes with at Least One Tensional Spring Element or Segment without a Sheath:
Second Group of Embodiments: Probe with First and Second Extension Springs Held within Sheath
The probes 500C of
In some variations of the embodiments of
In some variations of the embodiments of
Third Group of Embodiments: Assembly of Multi-Spring Probes into Arrays with Pre-loading of Tensional Springs
Fourth Group of Embodiments: Probes with a Multiple Springs and Stabilizing Guide Elements
Numerous variations of the embodiment of
Fifth Group of Embodiments: Probes with a Single Spring and Multiple and Stabilizing Guide Elements
FIGS. 13A1 to 13E4 provide a number of different isometric, plane, and section views of a probe 1300 according to another embodiment of the invention where the probe provides a specific implementation of spring and guide functionality similar to the probe 1200 of
FIGS. 13A1 provides a side view of probe 1300 so the 11 layers making up the probe can be seen with layers 2, 4, 8, and 10 being thin and shown by thicker blackened lines. FIG. 13A1 points out several probe elements or features including relatively moveable frames 1361 and 1363 with respective tips 1311T and 1312T and frame ends or lateral connecting elements 1362-1, 1362-2 for frame 1361 and frame ends or lateral connecting elements 1364-1 and 1364-2 for frame 1363. FIG. 13A1 also shows spring 1301 as well as a left side gap 1370-1 and a right side gap 1370-2 that allow for relative movement of the frame elements as a left side tip 1311T and a right side tip 1312T are compressed toward one another.
FIG. 13A2 provides an isometric view of the probe 1300 of FIG. 13A1 tilted forward so that the top of the probe can be seen which provides a view of guide tabs or guide extensions 1361E that form part of frame 1361 and slots with wider regions 1302W and narrower regions 1302N that form part of frame 1363 where the guide extension 1361E can slide with a relatively large clearance in the wider regions 1302W and with a tighter clearance in the narrow regions 1302N. Frame 1363 not only includes relative long arms 1363A that longitudinally extend the length of frame 1363 but also bridging elements 13638 that connect the arms that are located on opposite sides of the slots. Near the right end of frame element 1363, a widened region 1381 of element 1361 is shown which reduces to a narrower region that extends into a channel or slot in frame 1363 with the beginning of the narrower region 1383 shown. As the probe tips are pressed together, wider region 1381 enters the channel to provide another structural configuration that narrows the clearance to improve operational stability. In embodiments where the two frame elements are to be formed in a pre-assembled state, the wider regions can allow for sufficient clearance such that MFS requirements can be met while the narrow regions can allow for an operational range of motion with tighter tolerances and more precise relative movement for frames 1361 and 1363. Since the probe is symmetric about a plane cutting through the center layer of the probe, a view of the bottom of the probe would show features similar to that shown in the view of FIG. 13A2.
FIG. 13A3 shows a top view (or bottom view) of the probe of FIGS. 13A1 and 13A2 with locations of frame extensions 1361E, narrower slot regions 1302N, wider slot regions 1302W, widened structural feature 1381 and the beginning of narrower structural feature 1383 again referenced.
FIG. 13A4 shows an isometric view of the probe showing the left, upper, and front side view of the probe while FIG. 13A5 shows an isometric view of the probe showing the right, lower, and front side view of the probe wherein features noted in FIGS. 13A2 and 13A3 are again referenced.
FIGS. 13B1 and 13B2 show views of the upper half of the probe 1300 that has been sectioned through the middle of the middle layer of the probe. FIG. 13B1 shows the probe with a slight tilt so that the top of the probe can be seen along with an edge of the top half of the probe. FIG. 13B2 shows upper half of probe 1300 with a slight backward tilt with the left end being slightly forward of the right end so that the edge of the probe may be seen along with the bottom of the upper half of the probe and left side of the probe. Because the probe was sectioned in the middle, the upper half of spring 1301 and its general configuration can be seen in FIG. 13B2 along with the connection location/connection structure 1367 which joins the spring to frame element 1361 and connection location/connection structure 1368 which joins the spring to frame element 1363.
FIGS. 13C1 and 13C2 show the probe 1300 of FIGS. 13A1 to 13A4 with the bottom half cut away and with the front half cut away, thus providing views of the upper, back, left quarter of probe 1300. FIG. 13C1 provides a side view and FIG. 13C2 provides an isometric view of the left end of the probe 1300 wherein the connection 1368 between the right end of spring 1301 and frame 1363 can be clearly seen.
FIGS. 13D1-13D4 show the probe 1300 of FIGS. 13A1 to 13A4 with the bottom half cut away, with the front half cut away, and with the left half cut away, thus providing views of the upper, back, right quarter of probe 1300. FIG. 13D1 provides a side view while FIGS. 13D2 to 13D4 provides several isometric views wherein the connection 1367 between the right end of spring 1301 and frame 1361 can be clearly seen.
FIGS. 13E1 to 13E6 provide top views of individual layers that define the probe of FIGS. 13A1-13D4 wherein FIG. 13E1 shows the features of layers 1 and 11, FIG. 13E2 shows the features of layers 2 and 10, FIG. 13E3 shows the features of layers 3 and 9, FIG. 13E4 shows the features of layers 4 and 8, FIG. 13E5 shows the features of layers 5 and 7, and FIG. 13E6 shows the features of layer 6 wherein each figure also provides a dashed rectangular alignment guide that correlates the relative positions of the features from layer-to-layer. The layer views of FIGS. 13E1 to 13E6 help illustrate some of the harder to see features of probe 1300. Element 1367 of FIG. 13D4 (for each of layers 4 and 8) shows the structure that attaches the right end of the spring 1301 to the first frame structure 1381 as part of frame 1361 while 1368 shows the pair of elements (for each of layers 4 and 8) that join the left end of spring 1301 to the left end of arms 1363A of layers 3 and 9. Element 1381 of element 1361 distinguishes the wider part of 1361 from the narrower part 1383 that extends toward the right end of the channel in 1363.
The various views of probe 1300 of FIGS. 13A1 to 13E6 illustrate various features of the probe 1300. Probe 1300 includes first and second frame structures 1361 and 1363, which can be longitudinally moved relative to one another and which are connected by a spring 1301. A left end of structure 1361 joins a tip arm 1311 which connects to, or becomes, a tip 1311T while the right end of structure 1363 connects to a tip arm 1312 which in turn connects to, or becomes, a tip 1312T. The right end of 1361 connects to the right end of spring 1301 at 1367 while the left end of 1363 connects to the left end of the spring at 1368 wherein structures 1361 and 1363 are engaged with one another by sliding arms (or plungers) and channels (or barrels) such that when the tips are pressed toward one another, the spring is biased in extension that provides an increasing force that attempts to drive the tips apart. Upon release of the compressive force, the biased spring attempts to drive the tips back to an unbiased separation.
Probe 1300 also includes a feature 1362-1 that has lateral dimensions larger than tip arm 1311 and tip 1311T that may engage an array structure (e.g., a guide plate or a mounting structure) by sliding the tip 1311T through the structure such that engagement of 1362-1 and the structure can provide preload compression of the spring or provide other engagement functionality.
The first frame structure 1361 includes upper and lower longitudinal arms or plungers (e.g. 1381, 1383, and 1361E that correlate to vertical arms 1261-1 and 1261-2 of
Numerous variations of this embodiment are possible and include for example: (1) adding to the present embodiment features associated other embodiments or replacing some of the features of the present embodiment with those from one or more other embodiments, (2) using, or including, a different number of stabilizing guides, (3) using, or including, a different configuration of stabilizing guides, (4) using, or including, a different number of springs and with different configurations, including different numbers of segments and/or types of segments and our positional relationships between segments, and/or different connection relationships between segments and other segments or between segments and coupling structures or sliding guides, (5) using or including different tip configurations, (6) using or including different connecting elements that join the spring segments where the connecting elements may or may not provide guide features, (7) using or including fixed stop features, (8) using or including different or additional moving stop features, (9) using or including interface features that aid in aligning with and engaging fixed stop features that are part of array structures, (10) using or including interface features that aid in array loading and retention, (11) using or including additional features for aiding in the pre-biasing of spring segments, and (12) using or including different materials and/or configurations in different portions of the probe to provide one or more operational enhancements, such as, for example, improved conductivity, electrical isolation, improved wearability, tailored spring constants, improved material strength, decreased contact resistance, improved scrubbing without excess scrubbing, inhibition of working stress reaching or approaching yield strength limits, and the like.
Still other variations may provide, or include, for example: (1) instead of just intermediate side to side bridges 1363B, top to bottom bridge elements (that are either located in the interior of the probe or located on the exterior of the probe) may be included that provide further structural integrity where such bridges may be formed from one or both conductive and/or dielectric materials; (2) the probe may be formed such that an external frame exists that allows movement of both tips relative to the frame as opposed to allowing only the tips on one end of the probe to be movable; (3) different numbers of and/or different lengths of bridging elements and/or channel segments may be used; (4) different lengths, widths, working ranges, and materials for structural elements may be used; (5) enhanced alignment tolerances (e.g. smaller or more uniform effective gap sizes) may be obtained by widening selected portions of a slide segment in addition to or opposed to narrowing certain portions of slide channels; and (6) layers may be added or removed to either add in additional features, make larger parts, to remove unneeded features, and the like.
FIGS. 15A1 to 15C2 provide three sample configurations of a layer with features that provide for enhanced pointing accuracy or probe stability wherein FIG. 15A1 provides a similar configuration to that of layers 3 and 9 of the embodiment of FIGS. 13A1 to 13E6 as shown in FIG. 13E3 with FIG. 15A2 showing arm 1581, narrowed arm 1583, and channel 1502 after longitudinal tip-to-tip compression provides for engagement of the widened or enhanced feature 1581 with slot 1502. Upon engagement, the effective clearance or gap formed between 1581 and 1502 near the left end of the channel is narrowed compared to what it was based on only 1583 engaging 1502. In this embodiment, no narrowing is provided near the right end of the arm/channel or plunger/barrel.
FIGS. 15B1 and 15B2 provide a similar left end initial clearance (e.g. as formed) and engaged clearance views (e.g. after some tip-to-tip compression) as were found in FIGS. 15A1 and 15A2 but where the right end of channel 1502 narrows to become channel 1502N which provides the probe not only with a left end clearance reduction but also a right end clearance reduction as the right end of arm 1583 engages the narrowed channel region 1502N. The clearance reduction embodiment of FIGS. 15B1 and 15B2 significantly improve the pointing accuracy of the probe tips compared to that provided by the embodiment of FIGS. 15A1 and 15A2 which in turn provide a significant improvement compared to what would have existed with no clearance reduction.
FIGS. 15C1 and 15C2 provide similar views as shown in FIGS. 15A1-15B2 and with similar clearance reduction features as shown in FIGS. 15B1 and 15B2 but with gap narrowing features found not only at the left and right ends but at two intermediate locations as a result of two intermediate widened channel regions 1502W that can co-exist during formation with widened portions of arm 1583 that provide width comparable to that of 1581 which upon tip compression move to narrower channel regions. Prior to initial compression of the tips, normal gaps provide a certain level of probe stability and/or pointing accuracy while after some amount of tip compression, engagement of the features provide smaller effective clearances that contribute to the pointing accuracy or otherwise assist in providing stabilized probe functionality. The intermediate widened and narrow regions may or may not provide an increase in overall pointing accuracy, may reduce arm or channel bending, provide improve stability of sliding movement, and distribute stress more uniformly across the moving elements which may be useful in extending useful probe life and/or inhibiting premature failure.
Numerous variations of the ratcheting or locking based pre-biasing embodiments of
Still other embodiments may be created by combining the various embodiments and their alternatives with other embodiments and their alternatives as set forth herein.
Various other embodiments of the present invention exist. Some of these embodiments may be based on a combination of the teachings herein with various teachings incorporated herein by reference. For example, some fabrication embodiments may not use any blanket deposition process. Some embodiments may use selective deposition processes or blanket deposition processes on some layers that are not electrodeposition processes. Some embodiments may use nickel or nickel-cobalt as a structural material while other embodiments may use different materials. For example, preferred spring materials include nickel (Ni), copper (Cu) in combination with one or more other materials, beryllium copper (BeCu), nickel phosphorous (Ni—P), tungsten (W), aluminum copper (Al—Cu), steel, P7 alloy, palladium, palladium-cobalt, silver, molybdenum, manganese, brass, chrome, chromium copper (Cr—Cu), and combinations of these. Some embodiments may use copper as the structural material with or without a sacrificial material.
Structural or sacrificial dielectric materials may be incorporated into embodiments of the present invention in a variety of different ways. Such materials may form a third material or higher deposited material on selected layers or may form one of the first two materials deposited on some layers. Additional teachings concerning the formation of structures on dielectric substrates and/or the formation of structures that incorporate dielectric materials into the formation process and possibility into the final structures as formed are set forth in a number of patent applications filed Dec. 31, 2003: (1) U.S. Patent Application No. 60/534,184 (P-US032-A-SC), which is entitled “Electrochemical Fabrication Methods Incorporating Dielectric Materials and/or Using Dielectric Substrates”; (2) U.S. Patent Application No. 60/533,932 (P-US033-A-MF), which is entitled “Electrochemical Fabrication Methods Using Dielectric Substrates”; (3) U.S. Patent Application No. 60/534,157 (P-US041-A-MF), which is entitled “Electrochemical Fabrication Methods Incorporating Dielectric Materials”; (4) U.S. Patent Application No. 60/533,891 (P-US052-A-MF), which is entitled “Methods for Electrochemically Fabricating Structures Incorporating Dielectric Sheets and/or Seed layers That Are Partially Removed Via Planarization”; and (5) U.S. Patent Application No. 60/533,895 (P-US070-B-MF), which is entitled “Electrochemical Fabrication Method for Producing Multi-layer Three-Dimensional Structures on a Porous Dielectric”. These patent filings are each hereby incorporated herein by reference as if set forth in full herein.
Additional patent filings that provide, intra alia, teachings concerning incorporation of dielectrics into electrochemical fabrication processes include: (1) U.S. patent application Ser. No. 11/139,262 (P-US144-A-MF), filed May 26, 2005, now U.S. Pat. No. 7,501,328, by Lockard, et al., and which is entitled “Methods for Electrochemically Fabricating Structures Using Adhered Masks, Incorporating Dielectric Sheets, and/or Seed Layers that are Partially Removed Via Planarization”; (2) U.S. patent application Ser. No. 11/029,216 (P-US128-A-MF), filed Jan. 3, 2005 by Cohen, et al., now abandoned, and which is entitled “Electrochemical Fabrication Methods Incorporating Dielectric Materials and/or Using Dielectric Substrates”; (3) U.S. patent application Ser. No. 11/028,957 (P-US127-A-SC), by Cohen, which was filed on Jan. 3, 2005, now abandoned, and which is entitled “Incorporating Dielectric Materials and/or Using Dielectric Substrates”; (4) U.S. patent application Ser. No. 10/841,300 (P-US099-A-MF), by Lockard et al., which was filed on May 7, 2004, now abandoned, and which is entitled “Methods for Electrochemically Fabricating Structures Using Adhered Masks, Incorporating Dielectric Sheets, and/or Seed Layers that are Partially Removed Via Planarization”; (5) U.S. patent application Ser. No. 10/841,378 (P-US106-A-MF), by Lembrikov et al., which was filed on May 7, 2004, now U.S. Pat. No. 7,527,721, and which is entitled “Electrochemical Fabrication Method for Producing Multi-layer Three-Dimensional Structures on a Porous Dielectric”; (6) U.S. patent application Ser. No. 11/325,405 (P-US152-A-MF), filed Jan. 3, 2006 by Dennis R. Smalley, now abandoned, and which is entitled “Method of Forming Electrically Isolated Structures Using Thin Dielectric Coatings”; (7) U.S. patent application Ser. No. 10/607,931 (P-US075-A-MG), by Brown, et al., which was filed on Jun. 27, 2003, now U.S. Pat. No. 7,239,219, and which is entitled “Miniature RF and Microwave Components and Methods for Fabricating Such Components”, (8) U.S. patent application Ser. No. 10/841,006 (P-US104-A-MF), by Thompson, et al., which was filed on May 7, 2004, now abandoned, and which is entitled “Electrochemically Fabricated Structures Having Dielectric or Active Bases and Methods of and Apparatus for Producing Such Structures”; (9) U.S. patent application Ser. No. 10/434,295 (P-US061-A-MG), by Cohen, which was filed on May 7, 2003, now abandoned, and which is entitled “Method of and Apparatus for Forming Three-Dimensional Structures Integral With Semiconductor Based Circuitry”; and (10) U.S. patent application Ser. No. 10/677,556 (P-US081-A-MG), by Cohen, et al., filed Oct. 1, 2003, now abandoned, and which is entitled “Monolithic Structures Including Alignment and/or Retention Fixtures for Accepting Components”. These patent filings are each hereby incorporated herein by reference as if set forth in full herein.
Some embodiments may employ diffusion bonding or the like to enhance adhesion between successive layers of material or to reduce stress. Various teachings concerning the use of diffusion bonding in electrochemical fabrication processes are set forth in U.S. patent application Ser. No. 10/841,384 (P-US103-A-SC), which was filed May 7, 2004 by Cohen et al., now abandoned, which is entitled “Method of Electrochemically Fabricating Multilayer Structures Having Improved Interlayer Adhesion” and which is hereby incorporated herein by reference as if set forth in full.
The patent applications and patents set forth below are hereby incorporated by reference herein as if set forth in full. The teachings in these incorporated applications can be combined with the teachings of the instant application in many ways: For example, enhanced methods of producing structures may be derived from some combinations of teachings, enhanced structures may be obtainable, enhanced apparatus may be derived, enhanced methods of using may be implemented, and the like.
Various other embodiments of the present invention exist. Some of these embodiments may be based on a combination of the teachings herein with various teachings incorporated herein by reference. Some method of making embodiments may not use any blanket deposition process and/or they may not use a planarization process. Some embodiments may use selective deposition processes or blanket deposition processes on some layers that are not electrodeposition processes. Some embodiments, for example, may use nickel, nickel-phosphorous, nickel-cobalt, palladium, palladium-cobalt, gold, copper, tin, silver, zinc, solder, rhodium, rhenium as structural materials while other embodiments may use different materials. Some embodiments, for example, may use copper, tin, zinc, solder or other materials as sacrificial materials. Some embodiments may use different structural materials on different layers or on different portions of single layers. Some embodiments may remove a sacrificial material while other embodiments may not. Some embodiments may use photoresist, polyimide, glass, ceramics, other polymers, and the like as dielectric structural materials.
It will be understood by those of skill in the art that additional operations may be used in variations of the above presented method of making embodiments. These additional operations may, for example, perform cleaning functions (e.g. between the primary operations discussed herein or discussed in the various materials incorporated herein by reference), and they may perform activation functions and monitoring functions, and the like.
It will also be understood that the probe elements of some aspects of the invention may be formed with processes which are very different from the processes set forth herein, and it is not intended that structural aspects of the invention need to be formed by only those processes taught herein or by processes made obvious by those taught herein.
Though various portions of this specification have been provided with headers, it is not intended that the headers be used to limit the application of teachings found in one portion of the specification from applying to other portions of the specification. For example, alternatives acknowledged in association with one embodiment are intended to apply to all embodiments to the extent that the features of the different embodiments make such applications functional and do not otherwise contradict or remove all benefits of the adopted embodiment. Various other embodiments of the present invention exist. Some of these embodiments may be based on a combination of the teachings set forth herein with various teachings incorporated herein by reference.
It is intended that any aspects of the invention set forth herein represent independent invention descriptions which Applicant contemplates as full and complete invention descriptions that Applicant believes may be set forth as independent claims without need of importing additional limitations or elements, from other embodiments or aspects set forth herein, for interpretation or clarification other than when explicitly set forth in such independent claims once written. It is also understood that any variations of the aspects set forth herein represent individual and separate features that may form separate independent claims, be individually added to independent claims, or added as dependent claims to further define an invention being claimed by those respective dependent claims should they be written.
In view of the teachings herein, many further embodiments, alternatives in design and uses of the embodiments of the instant invention will be apparent to those of skill in the art. As such, it is not intended that the invention be limited to the particular illustrative embodiments, alternatives, and uses described above but instead that it be solely limited by the claims presented hereafter.
| Number | Name | Date | Kind |
|---|---|---|---|
| 2306082 | Prest | Dec 1942 | A |
| 3240685 | Maissel, I | Mar 1966 | A |
| 3697401 | Lucas et al. | Oct 1972 | A |
| 3723197 | Buschow et al. | Mar 1973 | A |
| 3745105 | Kosowsky et al. | Jul 1973 | A |
| 3832632 | Ardezzone | Aug 1974 | A |
| 3835017 | Mentone et al. | Sep 1974 | A |
| 3874855 | Legrand | Apr 1975 | A |
| 3926916 | Mastrangelo | Dec 1975 | A |
| 4027935 | Bymes et al. | Jun 1977 | A |
| 4043891 | Alkire et al. | Aug 1977 | A |
| 4080267 | Castellani et al. | Mar 1978 | A |
| 4116523 | Coberly et al. | Sep 1978 | A |
| 4126533 | Lukyanchikov et al. | Nov 1978 | A |
| 4155815 | Francis et al. | May 1979 | A |
| 4187553 | Ahn et al. | Feb 1980 | A |
| 4294669 | Lincoln et al. | Oct 1981 | A |
| 4298436 | Thomas | Nov 1981 | A |
| 4370941 | Belton | Feb 1983 | A |
| 4376017 | Urion | Mar 1983 | A |
| 4404080 | Jahani | Sep 1983 | A |
| 4452684 | Palnik | Jun 1984 | A |
| 4537647 | Foster | Aug 1985 | A |
| 4575330 | Hull | Mar 1986 | A |
| 4600555 | Shimizu | Jul 1986 | A |
| 4737114 | Yaegashi | Apr 1988 | A |
| 4752352 | Feygin | Jun 1988 | A |
| 4764449 | Vanlseghem | Aug 1988 | A |
| 4770754 | Meuldijk et al. | Sep 1988 | A |
| 4773877 | Krüger et al. | Sep 1988 | A |
| 4821411 | Yaegashi | Apr 1989 | A |
| 4920639 | Yee | May 1990 | A |
| 4921583 | Sewell et al. | May 1990 | A |
| 4952272 | Okino et al. | Aug 1990 | A |
| 4954192 | Dziekan | Sep 1990 | A |
| 4955523 | Carlommagno et al. | Sep 1990 | A |
| 4961052 | Tada et al. | Oct 1990 | A |
| 4961154 | Pomerantz et al. | Oct 1990 | A |
| 4985116 | Mettler et al. | Jan 1991 | A |
| 5011580 | Pan et al. | Apr 1991 | A |
| 5020219 | Leedy | Jun 1991 | A |
| 5059359 | Hull et al. | Oct 1991 | A |
| 5070297 | Kwon et al. | Dec 1991 | A |
| 5177438 | Littlebury et al. | Jan 1993 | A |
| 5189507 | Carlomagno et al. | Feb 1993 | A |
| 5190637 | Guckel | Mar 1993 | A |
| 5209817 | Ahmad et al. | May 1993 | A |
| 5209878 | Smalley et al. | May 1993 | A |
| 5271822 | Nolan et al. | Dec 1993 | A |
| 5273691 | Hull et al. | Dec 1993 | A |
| 5286208 | Matsuoka | Feb 1994 | A |
| 5301415 | Prinz et al. | Apr 1994 | A |
| 5321685 | Nose et al. | Jun 1994 | A |
| 5354712 | Ho et al. | Oct 1994 | A |
| 5369881 | Inaba et al. | Dec 1994 | A |
| 5378583 | Guckel et al. | Jan 1995 | A |
| 5395508 | Jolly et al. | Mar 1995 | A |
| 5413668 | Aslam et al. | May 1995 | A |
| 5435902 | Andre, Sr. | Jul 1995 | A |
| 5436412 | Ahmad et al. | Jul 1995 | A |
| 5472539 | Saia et al. | Dec 1995 | A |
| 5476211 | Khandros | Dec 1995 | A |
| 5476818 | Yanof et al. | Dec 1995 | A |
| 5478699 | Blessington et al. | Dec 1995 | A |
| 5501784 | Ilmann et al. | Mar 1996 | A |
| 5512162 | Sachs et al. | Apr 1996 | A |
| 5512163 | Warfield | Apr 1996 | A |
| 5513430 | Yanof et al. | May 1996 | A |
| 5545045 | Wakamatsu | Aug 1996 | A |
| 5560837 | Trueba | Oct 1996 | A |
| 5578185 | Bergeron et al. | Nov 1996 | A |
| 5596504 | Tata et al. | Jan 1997 | A |
| 5599194 | Ozawa et al. | Feb 1997 | A |
| 5605614 | Bornand | Feb 1997 | A |
| 5614075 | Andre, Sr. | Mar 1997 | A |
| 5641391 | Hunter et al. | Jun 1997 | A |
| 5686689 | Snedeker et al. | Nov 1997 | A |
| 5700607 | Rath et al. | Dec 1997 | A |
| 5766441 | Arndt et al. | Jun 1998 | A |
| 5772451 | Dozier, II et al. | Jun 1998 | A |
| 5805971 | Akedo | Sep 1998 | A |
| 5806181 | Khandros et al. | Sep 1998 | A |
| 5811982 | Beaman et al. | Sep 1998 | A |
| 5820014 | Dozier, II et al. | Oct 1998 | A |
| 5829128 | Eldridge et al. | Nov 1998 | A |
| 5832834 | Nishino et al. | Nov 1998 | A |
| 5864946 | Eldridge et al. | Feb 1999 | A |
| 5865641 | Swart et al. | Feb 1999 | A |
| 5874011 | Ehrlich | Feb 1999 | A |
| 5876424 | Michael | Mar 1999 | A |
| 5892223 | Karpov et al. | Apr 1999 | A |
| 5917707 | Khandros et al. | Jun 1999 | A |
| 5923637 | Shimada et al. | Jul 1999 | A |
| 5945058 | Manners et al. | Aug 1999 | A |
| 5952843 | Vinh | Sep 1999 | A |
| 5967856 | Meller | Oct 1999 | A |
| 5974662 | Eldridge et al. | Nov 1999 | A |
| 5989994 | Khoury et al. | Nov 1999 | A |
| 5994152 | Khandros et al. | Nov 1999 | A |
| 5999184 | Smalley et al. | Dec 1999 | A |
| 6016000 | Moslehi | Jan 2000 | A |
| 6019784 | Hines | Feb 2000 | A |
| 6023103 | Chang et al. | Feb 2000 | A |
| 6027630 | Cohen | Feb 2000 | A |
| 6029096 | Manners et al. | Feb 2000 | A |
| 6043563 | Eldridge et al. | Mar 2000 | A |
| 6044548 | DiStefano et al. | Apr 2000 | A |
| 6064213 | Khandros et al. | May 2000 | A |
| 6184053 | Eldridge et al. | Feb 2001 | B1 |
| 6190181 | Affolter et al. | Feb 2001 | B1 |
| 6197180 | Kelly | Mar 2001 | B1 |
| 6208155 | Barabi et al. | Mar 2001 | B1 |
| 6208225 | Miller | Mar 2001 | B1 |
| 6218203 | Khoury et al. | Apr 2001 | B1 |
| 6218910 | Miller | Apr 2001 | B1 |
| 6239385 | Schwiebert et al. | May 2001 | B1 |
| 6250933 | Khoury et al. | Jun 2001 | B1 |
| 6255126 | Mathieu et al. | Jul 2001 | B1 |
| 6264477 | Smith et al. | Jul 2001 | B1 |
| 6268015 | Mathieu et al. | Jul 2001 | B1 |
| 6268261 | Petrarca et al. | Jul 2001 | B1 |
| 6289781 | Cohen | Sep 2001 | B1 |
| 6299458 | Yamagami et al. | Oct 2001 | B1 |
| 6329827 | Beaman et al. | Dec 2001 | B1 |
| 6333741 | Snead et al. | Dec 2001 | B1 |
| 6336269 | Eldridge et al. | Jan 2002 | B1 |
| 6358097 | Peters | Mar 2002 | B1 |
| 6359455 | Takekoshi | Mar 2002 | B1 |
| 6413852 | Grill et al. | Jul 2002 | B1 |
| 6414501 | Kim et al. | Jul 2002 | B2 |
| 6426638 | Di Stefano | Jul 2002 | B1 |
| 6441315 | Eldridge et al. | Aug 2002 | B1 |
| 6456099 | Eldridge et al. | Sep 2002 | B1 |
| 6471524 | Nakano et al. | Oct 2002 | B1 |
| 6475369 | Cohen | Nov 2002 | B1 |
| 6482013 | Eldridge et al. | Nov 2002 | B2 |
| 6483328 | Eldridge et al. | Nov 2002 | B1 |
| 6491968 | Mathieu et al. | Dec 2002 | B1 |
| 6499216 | Fjelstad | Dec 2002 | B1 |
| 6507207 | Nguyen | Jan 2003 | B2 |
| 6509751 | Mathieu et al. | Jan 2003 | B1 |
| 6520778 | Eldridge et al. | Feb 2003 | B1 |
| 6539531 | Miller et al. | Mar 2003 | B2 |
| 6560861 | Fork et al. | May 2003 | B2 |
| 6573738 | Matsuo et al. | Jun 2003 | B1 |
| 6596624 | Romankiw | Jul 2003 | B1 |
| 6624645 | Haseyama et al. | Sep 2003 | B2 |
| 6624648 | Eldridge et al. | Sep 2003 | B2 |
| 6626708 | Phillips | Sep 2003 | B2 |
| 6627483 | Ondricek et al. | Sep 2003 | B2 |
| 6640415 | Eslamy et al. | Nov 2003 | B2 |
| 6651325 | Lee et al. | Nov 2003 | B2 |
| 6672875 | Mathieu et al. | Jan 2004 | B1 |
| 6672876 | Takekoshi | Jan 2004 | B1 |
| 6677772 | Faull | Jan 2004 | B1 |
| 6690185 | Khandros et al. | Feb 2004 | B1 |
| 6690186 | Fjelstad | Feb 2004 | B2 |
| 6692145 | Gianchandani et al. | Feb 2004 | B2 |
| 6705876 | Eldridge | Mar 2004 | B2 |
| 6713374 | Eldridge et al. | Mar 2004 | B2 |
| 6720781 | Ott et al. | Apr 2004 | B2 |
| 6729019 | Grube et al. | May 2004 | B2 |
| 6758682 | Kosmala | Jul 2004 | B1 |
| 6771084 | Di Stefano | Aug 2004 | B2 |
| 6777319 | Grube et al. | Aug 2004 | B2 |
| 6783405 | Yen | Aug 2004 | B1 |
| 6784378 | Zhu et al. | Aug 2004 | B2 |
| 6787456 | Kripesh et al. | Sep 2004 | B1 |
| 6790377 | Cohen | Sep 2004 | B1 |
| 6807734 | Eldridge et al. | Oct 2004 | B2 |
| 6811406 | Grube | Nov 2004 | B2 |
| 6817052 | Grube | Nov 2004 | B2 |
| 6838893 | Khandros, Jr. et al. | Jan 2005 | B2 |
| 6838894 | Macintyre | Jan 2005 | B2 |
| 6844748 | Sato et al. | Jan 2005 | B2 |
| 6855010 | Yen | Feb 2005 | B1 |
| D507198 | Kister | Jul 2005 | S |
| 6913468 | Dozier, II et al. | Jul 2005 | B2 |
| 6935901 | Simpson et al. | Aug 2005 | B2 |
| 6948940 | Lindsey et al. | Sep 2005 | B2 |
| 6967492 | Tsui et al. | Nov 2005 | B2 |
| 6998857 | Terada et al. | Feb 2006 | B2 |
| 7047638 | Eldridge et al. | May 2006 | B2 |
| 7063541 | Grube et al. | Jun 2006 | B2 |
| 7086149 | Eldridge et al. | Aug 2006 | B2 |
| 7091729 | Kister | Aug 2006 | B2 |
| 7098540 | Mohan et al. | Aug 2006 | B1 |
| 7126220 | Lahiri et al. | Oct 2006 | B2 |
| 7131848 | Lindsey et al. | Nov 2006 | B2 |
| 7142000 | Eldridge et al. | Nov 2006 | B2 |
| 7148709 | Kister | Dec 2006 | B2 |
| 7172431 | Beaman et al. | Feb 2007 | B2 |
| 7195989 | Lockard et al. | Mar 2007 | B2 |
| 7220134 | Goodman et al. | May 2007 | B2 |
| 7239219 | Brown et al. | Jul 2007 | B2 |
| 7252861 | Smalley | Aug 2007 | B2 |
| 7256593 | Treibergs | Aug 2007 | B2 |
| 7265565 | Chen et al. | Sep 2007 | B2 |
| 7271888 | Frodis et al. | Sep 2007 | B2 |
| 7273812 | Kim et al. | Sep 2007 | B2 |
| 7279917 | Williams et al. | Oct 2007 | B2 |
| 7287322 | Mathieu et al. | Oct 2007 | B2 |
| 7326327 | Armstrong et al. | Feb 2008 | B2 |
| 7412767 | Kim et al. | Aug 2008 | B2 |
| 7435102 | Goodman | Oct 2008 | B2 |
| 7436192 | Kister | Oct 2008 | B2 |
| 7437813 | Tunaboylu et al. | Oct 2008 | B2 |
| 7446548 | Chen | Nov 2008 | B2 |
| 7449910 | Kirby et al. | Nov 2008 | B2 |
| 7456642 | Saulnier et al. | Nov 2008 | B2 |
| 7462800 | Tunaboylu et al. | Dec 2008 | B2 |
| 7498714 | Lockard et al. | Mar 2009 | B2 |
| 7504839 | Feigenbaum et al. | Mar 2009 | B2 |
| 7504840 | Arat et al. | Mar 2009 | B2 |
| 7527721 | Lembrikov et al. | May 2009 | B2 |
| 7531077 | Cohen et al. | May 2009 | B2 |
| 7533462 | Gleason et al. | May 2009 | B2 |
| 7557595 | Chen et al. | Jul 2009 | B2 |
| 7579856 | Khandros et al. | Aug 2009 | B2 |
| 7583098 | Tunaboylu et al. | Sep 2009 | B2 |
| 7628620 | Gritters | Dec 2009 | B2 |
| 7629807 | Hirakawa et al. | Dec 2009 | B2 |
| 7637007 | Tunaboylu et al. | Dec 2009 | B2 |
| 7638028 | Tunaboylu et al. | Dec 2009 | B2 |
| 7640651 | Cohen et al. | Jan 2010 | B2 |
| 7674112 | Gritters et al. | Mar 2010 | B2 |
| 7690925 | Goodman | Apr 2010 | B2 |
| 7721430 | Chartarifsky et al. | May 2010 | B2 |
| 7731546 | Grube et al. | Jun 2010 | B2 |
| 7733101 | Kister | Jun 2010 | B2 |
| 7798822 | Eldridge et al. | Sep 2010 | B2 |
| 7808261 | Kimoto | Oct 2010 | B2 |
| 7841863 | Mathieu et al. | Nov 2010 | B2 |
| 7850460 | Weiland et al. | Dec 2010 | B2 |
| 7851794 | Hobbs | Dec 2010 | B2 |
| 7888958 | Souma et al. | Feb 2011 | B2 |
| 7922544 | Chung | Apr 2011 | B2 |
| 7928751 | Hsu | Apr 2011 | B2 |
| 7956288 | Kazama et al. | Jun 2011 | B2 |
| 8012331 | Lee et al. | Sep 2011 | B2 |
| 8111080 | Kister | Feb 2012 | B2 |
| 8299394 | Theppakuttai et al. | Oct 2012 | B2 |
| 8415963 | Kister | Apr 2013 | B2 |
| 8427186 | McFarland | Apr 2013 | B2 |
| 8451017 | Gleason et al. | May 2013 | B2 |
| 8613846 | Wu et al. | Dec 2013 | B2 |
| 8717054 | Chen et al. | May 2014 | B2 |
| 8717055 | Chen et al. | May 2014 | B2 |
| 8723543 | Chen et al. | May 2014 | B2 |
| 8729916 | Chen et al. | May 2014 | B2 |
| 8742272 | English et al. | Jun 2014 | B2 |
| 8926379 | Vinther | Jan 2015 | B2 |
| 9030222 | Eldridge et al. | May 2015 | B2 |
| 9052342 | Fan et al. | Jun 2015 | B2 |
| 9097740 | Kister | Aug 2015 | B2 |
| 9121868 | Kister | Sep 2015 | B2 |
| 9244101 | Cohen et al. | Jan 2016 | B2 |
| 9316670 | Kister | Apr 2016 | B2 |
| 9476911 | Kister | Oct 2016 | B2 |
| RE46221 | Kister | Nov 2016 | E |
| 9540233 | Kumar et al. | Jan 2017 | B2 |
| 9671429 | Wu et al. | Jun 2017 | B2 |
| 9702904 | Breinlinger et al. | Jul 2017 | B2 |
| 9972933 | Kimura et al. | May 2018 | B2 |
| 10215775 | Wu et al. | Feb 2019 | B2 |
| 10416192 | Chen et al. | Sep 2019 | B2 |
| 10641792 | Wu et al. | May 2020 | B2 |
| 10788512 | Chen et al. | Sep 2020 | B2 |
| 10877067 | Chen et al. | Dec 2020 | B2 |
| 11131690 | Crippa | Sep 2021 | B2 |
| 20020013085 | Boyle et al. | Jan 2002 | A1 |
| 20020053734 | Eldridge et al. | May 2002 | A1 |
| 20020067181 | Eldridge et al. | Jun 2002 | A1 |
| 20020196038 | Okuno et al. | Dec 2002 | A1 |
| 20030001606 | Bende et al. | Jan 2003 | A1 |
| 20030143492 | Sexton | Jul 2003 | A1 |
| 20030161750 | Moxson et al. | Aug 2003 | A1 |
| 20030186405 | Lee et al. | Oct 2003 | A1 |
| 20040004001 | Cohen et al. | Jan 2004 | A1 |
| 20040007470 | Smalley | Jan 2004 | A1 |
| 20040051541 | Zhou et al. | Mar 2004 | A1 |
| 20040072452 | Eldridge et al. | Apr 2004 | A1 |
| 20040112637 | Kim et al. | Jun 2004 | A1 |
| 20040239355 | Kazama | Dec 2004 | A1 |
| 20050029109 | Zhang et al. | Feb 2005 | A1 |
| 20050029225 | Zhang | Feb 2005 | A1 |
| 20050032375 | Lockard et al. | Feb 2005 | A1 |
| 20050045585 | Zhang et al. | Mar 2005 | A1 |
| 20050067292 | Thompson et al. | Mar 2005 | A1 |
| 20050070170 | Zhang et al. | Mar 2005 | A1 |
| 20050072681 | Cohen et al. | Apr 2005 | A1 |
| 20050104609 | Arat et al. | May 2005 | A1 |
| 20050110505 | Stanley Tsui | May 2005 | A1 |
| 20050142846 | Frodis et al. | Jun 2005 | A1 |
| 20050148214 | Mathieu et al. | Jul 2005 | A1 |
| 20050176285 | Chen et al. | Aug 2005 | A1 |
| 20050179458 | Chen et al. | Aug 2005 | A1 |
| 20050184748 | Chen et al. | Aug 2005 | A1 |
| 20050189958 | Chen et al. | Sep 2005 | A1 |
| 20050202667 | Cohen et al. | Sep 2005 | A1 |
| 20050215023 | Cohen et al. | Sep 2005 | A1 |
| 20050230261 | Cohen et al. | Oct 2005 | A1 |
| 20050253606 | Kim et al. | Nov 2005 | A1 |
| 20060006888 | Kruglick et al. | Jan 2006 | A1 |
| 20060051948 | Kim et al. | Mar 2006 | A1 |
| 20060053625 | Kim et al. | Mar 2006 | A1 |
| 20060108678 | Kumar et al. | May 2006 | A1 |
| 20060170440 | Sudin | Aug 2006 | A1 |
| 20060216920 | Kojima | Sep 2006 | A1 |
| 20060226015 | Smalley et al. | Oct 2006 | A1 |
| 20060238209 | Chen et al. | Oct 2006 | A1 |
| 20060279301 | Treibergs | Dec 2006 | A1 |
| 20070144841 | Chong et al. | Jun 2007 | A1 |
| 20070200576 | Laurent et al. | Aug 2007 | A1 |
| 20080050524 | Kumar et al. | Feb 2008 | A1 |
| 20080106280 | Chen et al. | May 2008 | A1 |
| 20080108221 | Kim et al. | May 2008 | A1 |
| 20080111573 | Chen et al. | May 2008 | A1 |
| 20080121343 | Cohen et al. | May 2008 | A1 |
| 20080174332 | Arat et al. | Jul 2008 | A1 |
| 20080211524 | Chen et al. | Sep 2008 | A1 |
| 20090066351 | Arat et al. | Mar 2009 | A1 |
| 20090079455 | Gritters | Mar 2009 | A1 |
| 20090144971 | Takekoshi | Jun 2009 | A1 |
| 20090256583 | Chen et al. | Oct 2009 | A1 |
| 20100051466 | Smalley et al. | Mar 2010 | A1 |
| 20100088888 | Mathieu et al. | Apr 2010 | A1 |
| 20100134131 | Chen et al. | Jun 2010 | A1 |
| 20100155253 | Kim et al. | Jun 2010 | A1 |
| 20100176834 | Chen et al. | Jul 2010 | A1 |
| 20110050263 | Sato et al. | Mar 2011 | A1 |
| 20110147223 | Kumar et al. | Jun 2011 | A1 |
| 20110187397 | Chen et al. | Aug 2011 | A1 |
| 20110187398 | Chen et al. | Aug 2011 | A1 |
| 20120176122 | Hirata et al. | Jul 2012 | A1 |
| 20140065893 | Vinther | Mar 2014 | A1 |
| 20140132298 | Cros et al. | May 2014 | A1 |
| 20140197145 | Veeramani et al. | Jul 2014 | A1 |
| 20140227912 | Sakai et al. | Aug 2014 | A1 |
| 20140231264 | Chen et al. | Aug 2014 | A1 |
| 20150160265 | Nakamura et al. | Jun 2015 | A1 |
| 20170219623 | Choi et al. | Aug 2017 | A1 |
| 20190204354 | Chen et al. | Jul 2019 | A1 |
| 20190383857 | Kister et al. | Dec 2019 | A1 |
| 20200064373 | Treibergs | Feb 2020 | A1 |
| 20200241042 | Jeong et al. | Jul 2020 | A1 |
| 20210190822 | Jun et al. | Jun 2021 | A1 |
| Number | Date | Country |
|---|---|---|
| 627282 | Dec 1981 | CH |
| 3906691 | Sep 1989 | DE |
| 0897655 | Jul 2000 | EP |
| 2734412 | Mar 1998 | JP |
| 2001337110 | Dec 2001 | JP |
| 2004156993 | Jun 2004 | JP |
| 2004340617 | Dec 2004 | JP |
| 2004340654 | Dec 2004 | JP |
| 4014040 | Nov 2007 | JP |
| 2008032400 | Feb 2008 | JP |
| 20180095315 | Aug 2018 | KR |
| 20190012965 | Oct 2019 | KR |
| 2007097559 | Aug 2007 | WO |
| 2015023062 | Feb 2015 | WO |
| WO-2024006446 | Jan 2024 | WO |
| WO-2024006449 | Jan 2024 | WO |
| WO-2024025700 | Feb 2024 | WO |
| Entry |
|---|
| (01) Cohen, et al., “EFAB: Batch Production of Functional, Fully-Dense Metal Parts with Micron-Scale Features”, Proc. 9th Solid Freeform Fabrication, The University of Texas at Austin, Aug. 1998, pp. 161-168. |
| (02) Adam L. Cohen, et al., “EFAB: Rapid, Low-Cost Desktop Micromachining of High Aspect Ratio True 3-D MEMS”, Proc. 12th IEEE Micro Electro Mechanical Systems Workshop, IEEE, Jan. 17-21, 1999, pp. 244-251. |
| (03) “Microfabrication—Rapid Prototyping's Killer Application”, Rapid Prototyping Report, CAD/CAM Publishing, Inc., Jun. 1999, pp. 1-5. |
| (04) Adam L. Cohen, “3-D Micromachining by Electrochemical Fabrication”, Micromachine Devices, Mar. 1999, pp. 6-7. |
| (05) Gang Zhang, et al., “EFAB: Rapid Desktop Manufacturing of True 3-D Microstructures”, Proc. 2nd International Conference on Integrated MicroNanotechnology for Space Applications, The Aerospace Co., Apr. 1999. |
| (06) F. Tseng, et al., “EFAB: High Aspect Ratio, Arbitrary 3-D Metal Microstructures Using a Low-Cost Automated Batch Process”, 3rd International Workshop on High Aspect Ratio Microstructure Technology (HARMST'99), Jun. 1999. |
| (07) Adam L. Cohen, et al., “EFAB: Low-Cost, Automated Electrochemical Batch Fabrication of Arbitrary 3-D Microstructures”, Micromachining and Microfabrication Process Technology, SPIE 1999 Symposium on Micromachining and Microfabrication, Sep. 1999. |
| (08) F. Tseng, et al., “EFAB: High Aspect Ratio, Arbitrary 3-D Metal Microstructures Using a Low-Cost Automated Batch Process”, MEMS Symposium, ASME 1999 International Mechanical Engineering Congress and Exposition, Nov. 1999, pp. 55-60. |
| (09) Adam L. Cohen, “Electrochemical Fabrication (EFABTM)”, Chapter 19 of the MEMS Handbook, edited by Mohamed Gad-El-Hak, CRC Press, 2002, pp. 19/1-19/23. |
| Hill, Dr. Steve, “An E-FAB Way for Making the Micro World”, Materials World is the journal of The Institute of Materials, Sep. 1999, vol. 7, No. 9, pp. 538-539. |
| Kumar, et al., “Features of gold having micrometer to centimeter dimensions can be formed through a combination of stamping with an elastomeric stamp . . .” Appln. Phys. Lett., Jul. 1993, 63(14):2002-2004. |
| Madden, John D. et al., “Three-Dimensional Microfabrication by Localized, Electrochemical Deposition”, J. of Micro. Sys., Mar. 1996, 5(1):24-32. |
| Madou, Mark J., “Fundamentals of Microfabrication—The Science of Miniaturization”, 2nd ed., 2001, pp. 402-412. |
| Marques, et al., “Fabrication of High-Aspect-Ratio Microstructures on Planar and Nonplanar Surfaces Using a Modified LIGA Process”, Dec. 1997, 6(4):329-336. |
| Osterberg, Peter M., et al., “MEMBUILDER: An Automated 3D Solid Model Construction Program For Microelectromechanical Structures”, The 8th Int'l Conference on Solid-State Sensors and Actuators, and Eurosensors IX; Jun. 25-29, 1995; pp. 21-24; Stockholm, Sweden. |
| Taylor, et al., “‘Spatial Forming’ A Three Dimensional Printing Process”, IEEE, 1995, pp. 203-208. |
| Weeden, Otto, Keithley Instruments, Inc. “Probe Card Tutorial”, pp. 1-40. |
| International Search Report and Written Opinion dated Jan. 3, 2024, European Patent Office, Int'l App. No. PCT/US2023/026588 filed Jun. 29, 2023, 10 pages. |
| International Search Report and Written Opinion dated Oct. 11, 2023, European Patent Office, Int'l App. No. PCT/US2023/026590 filed Jun. 29, 2023, 10 pages. |
| International Search Report and Written Opinion dated Nov. 28, 2023, European Patent Office, Int'l App. No. PCT/US2023/026593 filed Jun. 29, 2023, 16 pages. |
| Number | Date | Country | |
|---|---|---|---|
| 20240094249 A1 | Mar 2024 | US |
| Number | Date | Country | |
|---|---|---|---|
| 63238209 | Aug 2021 | US | |
| 63217721 | Jul 2021 | US | |
| 63217265 | Jun 2021 | US | |
| 62961678 | Jan 2020 | US | |
| 62961675 | Jan 2020 | US | |
| 62961672 | Jan 2020 | US | |
| 62956124 | Dec 2019 | US | |
| 62956122 | Dec 2019 | US |
| Number | Date | Country | |
|---|---|---|---|
| Parent | 17139940 | Dec 2020 | US |
| Child | 17682340 | US |
| Number | Date | Country | |
|---|---|---|---|
| Parent | 17682340 | Feb 2022 | US |
| Child | 17854756 | US | |
| Parent | 17139936 | Dec 2020 | US |
| Child | 17854756 | US |
