S. Oktay et al., "A Conduction-Cooled Module for High-Performance LSI Devices", published in IBM J. Res. Develop., vol. 26, No. 1, Jan. 1982, pp. 55-66. |
IBM Technical Disclosure Bulletin, vol. 33, No. 1A, Jun. 1990, pp. 293-295, "Fault-Tolerant Immersion Cooling". |
IBM Technical Disclosure Bulletin, vol. 31, No. 5, Oct. 1988, pp. 141-142, "Multi-Chip Package with Cooling by a Spreader Plate In Contact with a Chip Having Cylindrical Holes Mating with an Inverse Frame Providing Flow Within Its Pins". |