Number | Name | Date | Kind |
---|---|---|---|
2707166 | Brown et al. | Apr 1955 | |
3124520 | Juda | Mar 1964 | |
3328273 | Creutz et al. | Jun 1967 | |
3537961 | White et al. | Nov 1970 | |
4073708 | Hicks | Feb 1978 | |
4269670 | Smith | May 1981 | |
4310391 | Okinaka et al. | Jan 1982 |
Number | Date | Country |
---|---|---|
591894 | Feb 1960 | CAX |
Entry |
---|
Proceedings of the 8th Congress of the International Union for Electrodeposition and Surface Finishing, "Function and Structure of Organic Additives in Electroplating", H. Brown, pp. 114-121, 1973. |
Plating and Surface Finishing, vol. 68, pp. 46-49, 1981, "Characteristics of Acid Copper Sulfate Deposits for Printed Wiring Board Applications", L. Mayer and S. Barbieri. |
Encyclopedia of Electrochemistry, pp. 726-735, 1964. |