TREA

Electroplating

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Industry

  • CPC
  • H05K2203/0723
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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/0723Electroplating
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    Circuit board
    • Publication number 20240422920
    • Publication date Dec 19, 2024
    • Avary Holding (Shenzhen) Co., Limited.
    • WEN-ZHU WEI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
    • Publication number 20240421471
    • Publication date Dec 19, 2024
    • DAI NIPPON PRINTING CO., LTD.
    • Koichi SUZUKI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20240407086
    • Publication date Dec 5, 2024
    • Sumitomo Electric Industries, Ltd.
    • Yukie TSUDA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING CIRCUIT BOARD AND METHOD OF PRODUCING THE WIRING CIRCUIT BOARD
    • Publication number 20240397609
    • Publication date Nov 28, 2024
    • Nitto Denko Corporation
    • Tomoaki TANAKA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD OF SEGMENTED ELECTROPLATING GOLD FINGER
    • Publication number 20240397631
    • Publication date Nov 28, 2024
    • Gold Circuit Electronics Ltd.
    • Chen-Tse Yang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING STRUCTURE, METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR...
    • Publication number 20240397635
    • Publication date Nov 28, 2024
    • Resonac Corporation
    • Masaya TOBA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT BOARD, DISPLAY APPARATUS, AND MANUFACTURING METHOD FOR CIRC...
    • Publication number 20240365478
    • Publication date Oct 31, 2024
    • BOE TECHNOLOGY GROUP CO., LTD.
    • Guoteng LI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MULTILAYER WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE MULTILA...
    • Publication number 20240349427
    • Publication date Oct 17, 2024
    • TOPPAN Holdings Inc.
    • Takehisa TAKADA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
    • Publication number 20240349430
    • Publication date Oct 17, 2024
    • IBIDEN CO., LTD.
    • Kentaro WADA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240341034
    • Publication date Oct 10, 2024
    • IBIDEN CO., LTD.
    • Masashi KUWABARA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD OF PREPARING A HIGH DENSITY INTERCONNECT PRINTED CIRCUIT BOA...
    • Publication number 20240341042
    • Publication date Oct 10, 2024
    • Atotech Deutschland GmbH & Co. KG
    • Bert REENTS
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    WIRING BOARD
    • Publication number 20240332772
    • Publication date Oct 3, 2024
    • Shinko Electric Industries Co., Ltd.
    • Hiroshi TANEDA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240334598
    • Publication date Oct 3, 2024
    • Shinko Electric Industries Co., Ltd.
    • Yuki KOBAYASHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PLATING APPARATUS
    • Publication number 20240314936
    • Publication date Sep 19, 2024
    • EBARA CORPORATION
    • Tsubasa ISHII
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PATTERNED CONDUCTIVE ARTICLE
    • Publication number 20240306290
    • Publication date Sep 12, 2024
    • 3M Innovative Properties Company
    • Raymond P. Johnston
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20240298410
    • Publication date Sep 5, 2024
    • LG Innotek Co., Ltd.
    • Min Young HWANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Circuit board
    • Publication number 20240298412
    • Publication date Sep 5, 2024
    • AAC MICROTECH (CHANGZHOU) CO., LTD.
    • Guohui Chen
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD FOR PRODUCING WIRING CIRCUIT BOARD
    • Publication number 20240284600
    • Publication date Aug 22, 2024
    • Nitto Denko Corporation
    • Hayato TAKAKURA
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20240268021
    • Publication date Aug 8, 2024
    • IBIDEN CO., LTD.
    • Susumu KAGOHASHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20240260179
    • Publication date Aug 1, 2024
    • IBIDEN CO., LTD.
    • Jun SAKAI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20240251510
    • Publication date Jul 25, 2024
    • IBIDEN CO., LTD.
    • Susumu KAGOHASHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD, ELECTRONIC DEVICE HAVING THE CIRCUIT BOARD AND METHO...
    • Publication number 20240244749
    • Publication date Jul 18, 2024
    • QUAN MEI TECHNOLOGY CO., LTD.
    • Ching-Ming FANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Single Step Electrolytic Method of Filling Through-Holes in Printed...
    • Publication number 20240224432
    • Publication date Jul 4, 2024
    • MacDermid Enthone Inc.
    • Donald Desalvo
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
    • Publication number 20240215158
    • Publication date Jun 27, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Mi Jeong JEON
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD
    • Publication number 20240215164
    • Publication date Jun 27, 2024
    • Shinko Electric Industries Co., Ltd.
    • Kyota YAMAMURA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20240215157
    • Publication date Jun 27, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Ki Ran PARK
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WET TREATMENT APPARATUS AND METHOD OF MANUFACTURING FLEXIBLE PRINTE...
    • Publication number 20240200220
    • Publication date Jun 20, 2024
    • Sumitomo Electric Industries, Ltd.
    • Kousuke MIURA
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20240196546
    • Publication date Jun 13, 2024
    • IBIDEN CO., LTD.
    • Jun SAKAI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRICAL INTERCONNECT STRUCTURE WITH CIRCUIT BEARING DIELECTRIC L...
    • Publication number 20240196542
    • Publication date Jun 13, 2024
    • LCP Medical Technologies, LLC
    • James Rathburn
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SYSTEMS AND METHODS FOR FORMING STUBLESS PLATED THROUGH HOLES HAVIN...
    • Publication number 20240188217
    • Publication date Jun 6, 2024
    • TTM TECHNOLOGIES INC.
    • Matthew Douglas Neely
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR