Claims
- 1. A method for manufacturing a printed board on which a semiconductor device is mounted, the method comprising:
preparing a resin sealed semiconductor device which includes a semiconductor substrate on which a CPU, a serial communication interface and a flash memory are formed, wherein the semiconductor device has (i) a first mode for writing data supplied from outside of the semiconductor substrate into the flash memory by a PROM writer, and (ii) a second mode for writing data supplied from outside of the semiconductor substrate to the flash memory by executing a write control program with the CPU; in the first mode, writing the control program to the flash memory by the RPROM writer; mounting the semiconductor device on the printed board; and after mounting, in the second mode, rewriting the flash memory with externally inputted data via the serial communication interface.
- 2. A method according to claim 1, wherein the rewriting includes:
erasing data stored in the flash memory; writing data into the flash memory; and verifying data in the flash memory.
- 3. A method according to claim 1,
wherein the resin sealed semiconductor device includes a flat package having external terminals in four directions.
- 4. A method according to claim 3,
wherein the distance between adjacent external terminals is 0.5 mm or less.
- 5. A method according to claim 1,
wherein the flash memory has a plurality of memory blocks, each block being defined as a simultaneously erasable unit, and wherein ones of the plurality of memory blocks are rewritten in the second mode.
- 6. A method according to claim 5, wherein the rewriting includes:
erasing data stored in the flash memory; writing data into the flash memory; and verifying data in the flash memory.
- 7. A method according to claim 6,
wherein the resin sealed semiconductor device includes a flat package having external terminals in four directions.
- 8. A method according to claim 7,
wherein the distance between adjacent external terminals is 0.5 mm or less.
- 9. A method according to claim 5,
wherein the resin sealed semiconductor device includes a flat package having external terminals in four directions.
- 10. A method according to claim 9,
wherein the distance between adjacent external terminals is 0.5 mm or less.
Priority Claims (2)
Number |
Date |
Country |
Kind |
04-091919 |
Mar 1992 |
JP |
|
04-093908 |
Mar 1992 |
JP |
|
Parent Case Info
[0001] This application is a continuation of U.S. application Ser. No. 09/987,957, filed Nov. 16, 2001, which, in turn, is a continuation of U.S. application Ser. No. 09/705,835, filed Nov. 6, 2000, now U.S. Pat. No. 6,335,879; which, in turn, was a continuation of application Ser. No. 09/414,944, filed Oct. 8, 1999, now U.S. Pat. No. 6,166,953; which, in turn, was a continuation of application Ser. No. 09/144,194, filed Aug. 31, 1998, now U.S. Pat. No. 6,064,593; which, in turn, was a continuation of application Ser. No. 08/788,198, filed Jan. 24, 1997, now U.S. Pat. No. 6,026,020; which, in turn, was a continuation of application Ser. No. 08/473,114, filed Jun. 7, 1995, now U.S. Pat. No. 5,768,194; and which, in turn, was a continuation of application Ser. No. 08/031,877, filed Mar. 16, 1993, now abandoned; and the entire disclosures of all of which are incorporated herein by reference.
Continuations (7)
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09987957 |
Nov 2001 |
US |
Child |
10252438 |
Sep 2002 |
US |
Parent |
09705835 |
Nov 2000 |
US |
Child |
09987957 |
Nov 2001 |
US |
Parent |
09414944 |
Oct 1999 |
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Child |
09705835 |
Nov 2000 |
US |
Parent |
09144194 |
Aug 1998 |
US |
Child |
09414944 |
Oct 1999 |
US |
Parent |
08788198 |
Jan 1997 |
US |
Child |
09144194 |
Aug 1998 |
US |
Parent |
08473114 |
Jun 1995 |
US |
Child |
08788198 |
Jan 1997 |
US |
Parent |
08031877 |
Mar 1993 |
US |
Child |
08788198 |
Jan 1997 |
US |