Claims
- 1. A structure comprising:
- a semiconductor substrate having a principal surface;
- a conductive registration mark on said principal surface of said semiconductor substrate;
- at least one layer applied over said conductive registration mark, said at least one layer having a top surface; and
- a structure on said substrate which couples a voltage to said conductive registration mark, whereby said conductive registration mark is capacitively coupled to said top surface of said at least one layer.
- 2. The structure of claim 1, further comprising at least one layer disposed between said semiconductor substrate and said conductive registration mark.
- 3. The structure of claim 1, wherein said structure comprises an electrical lead directly connected to said conductive registration mark, said electrical lead providing said voltage to said conductive registration mark.
- 4. The structure of claim 1, wherein said structure further comprises a conductive plate on an opposing surface of said semiconductor substrate, said conductive plate being capacitively coupled with said conductive registration mark.
- 5. The structure of claim 1, wherein the location of said conductive registration mark on said semiconductor substrate is determined by the capacitive coupling between said conductive registration mark and said top surface of said at least one layer.
- 6. The structure of claim 1, further comprising a plurality of conductive registration marks, wherein said structure on said substrate couples said voltage to said plurality of registration marks, whereby said plurality of said conductive registration marks are capacitively coupled to said top surface of said at least one layer.
Parent Case Info
This application is a divisional of Ser. No. 09/060,496 filed Apr. 15, 1998.
US Referenced Citations (6)
Foreign Referenced Citations (1)
Number |
Date |
Country |
0 342 316 |
Nov 1989 |
EPX |
Divisions (1)
|
Number |
Date |
Country |
Parent |
060496 |
Apr 1998 |
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