The present invention relates generally to methods and apparatus for detecting and characterizing areas on medical devices which are affected by heat. More particularly, the present invention relates generally to methods and apparatus for detecting and characterizing heated zones on polymer based devices, such as stents, which are affected by laser-induced instruments.
Femtosecond laser machining process have been used in fabrication of bioabsorbable polymeric devices, especially implantable stents, with great success. It is generally assumed that the ultra short pulse of these lasers have a negligible effect on polymer properties; however, the actual results depends highly on the nature of the polymer, dimensions of the machined device, geometry of the device, as well as operating parameters of the laser.
In many cases, the heat induced from femtosecond laser machining can diffuse into the cutting area and leave a heat affected zone. For micro-sized devices, this affected zone can be significant such that the performance of the device is influenced.
The depth of this heat affected zone can be related to the amount of energy used by the laser in cutting through the area. Therefore, on a polymeric stent the heat affected zone may be deeper in those segments of the geometry having acute angles (as the laser speed may slow down in these areas and may therefore disperse more energy) than in those segments to be machined having relatively straight areas.
However, it is very difficult to detect any differences in the polymer property in such a small zone. The use of Nano Thermal Analysis (NTA) can be one method to detect and characterize the effects of laser energy on polymer based micro-sized devices.
Nano Thermal Analysis (NTA) is a localized thermal analysis technique that may be used with the high spatial resolution imaging capability of atomic force microscopy (AFM) to obtain the thermal behavior of materials with a spatial resolution of under, e.g., 100 nm. The AFM enables a surface to be visualized at nanoscale resolution while applying heat locally via a probe tip and measuring the thermal-mechanical response using NTA.
A poly-L-lactide (PLLA) based polymeric stent was cut using a 2 kHz laser and the cross section of an area of the polymeric stent having acute angles (e.g., W link), relatively less angulations (e.g., V link), and relatively straight areas (e.g., bar arm) were micro-toned followed by measurement of the nano-area thermal property using NTA (manufactured by Anasys Instruments, Santa Barbara). The results indicate thermal transitions which affect the material properties can be detected along the stent sample.
The Nano Thermal Analysis (NTA) is a localized thermal analysis technique that combines the high spatial resolution imaging capability of atomic force microscopy (AFM) and the ability to obtain the thermal behavior of materials with a spatial resolution of under, e.g., 100 nm. As shown in assembly 10 of
A poly-L-lactide (PLLA) based polymeric stent was cut using a 2 kHz laser. The cross section of an area of the polymeric stent having acute angles (e.g., W link), relatively less angulations (e.g., V link), and relatively straight areas (e.g., bar arm) were micro-toned followed by measurement of the nano-area thermal property using NTA (manufactured by Anasys Instruments, Santa Barbara).
From one edge of the cross section to the other end, the probe 16 was applied onto the surface and heat was transferred to the material 12 and the response was recorded while the glass transition temperature, Tg, and/or melting temperature, Tm, of the local area was recorded. The probe 16 was then moved about 10 μm away to take another measurement. This was repeated in a straight line to the other edge of the cross section.
A set of thermal transitions were recorded as shown in
As shown in
Based on these results, NTA can be an effective method for detection and characterization of heat affected zones induced by laser ablation on a polymeric micro-sized device. Moreover, this data may be utilized to guide design of the device in such a manner to reduce thermal effects due to geometry. Furthermore, the information can be utilized to optimize the laser processing parameters to achieve the lowest possible thermal damage to the material.
The applications of the disclosed invention discussed above are not limited to certain processes, treatments, or placement in certain regions of the body, but may include any number of other processes, treatments, and areas of the body. Modification of the above-described methods and devices for carrying out the invention, and variations of aspects of the invention that are obvious to those of skill in the arts are intended to be within the scope of this disclosure. Moreover, various combinations of aspects between examples are also contemplated and are considered to be within the scope of this disclosure as well.
This application claims benefit of priority to U.S. Provisional Patent Application No. 61/351,485 filed Jun. 4, 2010, the contents of which is incorporated herein by reference in its entirety.
Number | Date | Country | |
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61351485 | Jun 2010 | US |