Number | Date | Country | Kind |
---|---|---|---|
3527208 | Jul 1985 | DEX |
Filing Document | Filing Date | Country | Kind | 102e Date | 371c Date |
---|---|---|---|---|---|
PCT/DE86/00110 | 3/14/1986 | 3/23/1987 | 3/23/1987 |
Publishing Document | Publishing Date | Country | Kind |
---|---|---|---|
WO87/01007 | 2/12/1987 |
Number | Name | Date | Kind |
---|---|---|---|
2759133 | Mueller | Aug 1956 | |
3390226 | Beyerlein | Jun 1968 | |
3549783 | Bendrick | Dec 1970 | |
3846823 | Matthews et al. | Nov 1974 | |
3987344 | Ambruoso et al. | Oct 1976 | |
4266267 | Ruegg | May 1981 | |
4646203 | Ngo et al. | Feb 1987 | |
4675784 | Dahlberg et al. | Jun 1987 |
Entry |
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Balderes et al., "Heat Dissipation from IC Chips through Module Package", IBM Technical Disclosure Bulletin, vol. 19, No. 11, 4/77, pp. 4165-4166. |