Number | Name | Date | Kind |
---|---|---|---|
3095340 | Triller | Jun 1963 | |
3788911 | Unger | Jan 1974 | |
3953556 | Gore | Apr 1976 | |
4348253 | Subbarao et al. | Sep 1982 | |
4445978 | Whartenby et al. | May 1984 | |
4473737 | Anthony | Sep 1984 | |
4482516 | Bowman et al. | Nov 1984 | |
4547836 | Anthony | Oct 1985 | |
4595428 | Anthony et al. | Jun 1986 | |
4647476 | Anthony | Mar 1987 | |
4705762 | Ota et al. | Nov 1987 | |
4720308 | Anthony et al. | Jan 1988 | |
4901136 | Neugebauer et al. | Feb 1990 | |
4913656 | Gordon et al. | Apr 1990 | |
4943032 | Zdeblick | Jul 1990 | |
4959119 | Lantzer | Sep 1990 | |
4985296 | Mortimer, Jr. | Jan 1991 | |
5009607 | Gordon et al. | Apr 1991 | |
5019997 | Haller | May 1991 | |
5071359 | Arnio et al. | Dec 1991 | |
5108785 | Lincoln et al. | Apr 1992 | |
5171964 | Booke et al. | Dec 1992 | |
5224265 | Dux et al. | Jul 1993 | |
5227012 | Brandli et al. | Jul 1993 | |
5245751 | Locke et al. | Sep 1993 | |
5251097 | Simmons et al. | Oct 1993 | |
5293025 | Wang | Mar 1994 | |
5293626 | Priest et al. | Mar 1994 | |
5331203 | Wojnarowski et al. | Jul 1994 | |
5355397 | Hanson et al. | Oct 1994 | |
5377404 | Berg | Jan 1995 | |
5378313 | Pace | Jan 1995 | |
5378318 | Weling et al. | Jan 1995 | |
5391516 | Wojnarowski et al. | Feb 1995 | |
5428803 | Chen et al. | Jun 1995 | |
5442475 | Bausman et al. | Aug 1995 | |
5459634 | Nelson et al. | Oct 1995 | |
5466892 | Howard et al. | Nov 1995 | |
5509553 | Hunter, Jr. et al. | Apr 1996 | |
5541367 | Swamy | Jul 1996 | |
5541731 | Freedenberg et al. | Jul 1996 |
Number | Date | Country |
---|---|---|
WO 9001374 | Feb 1990 | WOX |
Entry |
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Article, Lizotte et al., "Laser drilling speeds BGA packaging", Solid State Technology, Sep. 1996, pp. 120-128. |
Article, Eskew et al., "Laser drill and patterning system for low cost, rapid prototyping", ICEMCM '95, pp. 314-319. |
Brochure, "Impact--Laser Processing Systems", Lumonics Corporation, 4 pages. |
Article, Tourne, "Laser Via Technologies for High Density MCM-L Fabrication", ICEMCM '95, pp. 71-76. |
Article, Cary, "MCM-L Substrates for a 300 MHZ Workstation", ICEMCM '95, pp. 537-542. |
Article, Patel et al., "Projection Laser Ablation Mask Alternatives", ICEMCM '95, pp. 32-326. |
Technical Paper, Kosto et al., "Low Cost Through-Hole Activation Method for PTFE Based Substrates", IPC, pp. P6-5-1 through P6-5-8. |
Article, Jain et al., "Large-Area, High Throughput, High-Resolution Patternmaking and Via-Drilling System", ICEMCM '95, pp. 327-335. |
Article, Lemke, "Recent Developments in the Production and Application of Advanced Laminate Based MCMs and Chip Carriers", ICEMCM '95, pp. 235-240. |
Article, Freda et al. "Laminate Based Substrates in Semiconductor Packages", ICEMCM '95, pp. 559-566. |