Patent Grant
9005409
The disclosed embodiment relates generally to a method and apparatus for electro chemical deposition, and more particularly to a method and apparatus for electro chemical deposition and replenishment.
Electro deposition, among other processes, is used as a manufacturing technique for the application of films, for example, tin, tin silver, nickel, copper or otherwise to various structures and surfaces, such as semiconductor wafers and silicon work pieces or substrates. An important feature of systems used for such processes is their ability to produce films with uniform and repeatable characteristics such as film thickness, composition, and profile relative to the underlying workpiece profile. Electro deposition systems may utilize a primary electrolyte that requires replenishment upon depletion. By way of example, in tin silver applications a tin salt solution liquid replenishment may be required upon depletion. Such replenishment may be expensive as a function of the application and may require significant down time of the electro deposition tool or sub module for service and process re qualification that adversely affects the cost of ownership of the deposition tool. Accordingly, there is a desire for new and improved methods and apparatus for replenishment of depleted process electrolyte in electro deposition tools.
The foregoing aspects and other features of the disclosed embodiment are explained in the following description, taken in connection with the accompanying drawings, wherein:
Referring now to
One or more controller(s) 222 may be provided and communicably coupled to each station or module to sequence the process and/or transport within the station or module. A system controller(s) 222 may be provided within the system 200 to sequence substrates between the stations or process modules and to coordinate system actions, such as, host communication, lot loading and unloading or otherwise those actions that are required to control the system 200. Controller 222 may be programmable to plate the workpiece with a suitable metal, metal alloy, and/or other plating material, for example, with one or more of tin, (Sn), Tin-Silver (SnAg), Copper (Cu), Nickel (Ni) in process module(s) disposed to accept an anode and support a plating bath. Accordingly, the controller for process module 212 may be programmed for plating Tin onto a workpiece. Controller 222 may be further programmable to rinse the workpiece in a rinse tank disposed to support rinsing substantially all of the plating chemistry from the workpiece. Controller 222 may further be programmable, for example, to plate the workpiece with tin and silver in process module 210 disposed to accept an anode and support a plating bath. Controller 222 may further be programmable, for example, to thermally treat the workpiece in a thermal treatment module disposed to thermally treat the workpiece to cause the tin and tin-silver layers to intermix and form a substantially uniform tin-silver alloy feature. Controller 222 may be further programmable, for example, to deposit copper on the workpiece with copper electrodeposition module 216. Controller 222 may further be programmable, for example, to deposit nickel on the workpiece with nickel electrodeposition module 214. Controller 222 may further be programmable to clean the workpiece with clean module 262. In the disclosed embodiment, as previously noted, four electrodeposition modules 210, 212, 214, 216, are shown and cleaning modules 262, 266, and chemical replenishment modules 260, 264 identified in the figure in a general manner for example purposes only. In accordance with another aspect of the disclosed embodiment, one system may have more or less modules disposed in any suitable configuration. By way of example, system 200 may have tin (Sn) electrodeposition module(s) and tin-silver (SnAg) electrodeposition module(s) with the chemistry being replenished from one or more remote or off board from apparatus 200M (e.g. one or more chemistry replenishment or productivity modules 260′, 264′ are shown in
Referring now also to
Referring now to
In various aspects of the disclosed embodiment, the member 318 may be referred to for purposes of description as a paddle assembly or a fluid agitation paddle. In one aspect of the disclosed embodiment, the member 318 is a SHEAR PLATE agitation paddle. The member 318 can be moved substantially parallel to a surface 30, for example of a workpiece being retained by the workpiece holder 272. The member 318 can be moved with a non-uniform oscillatory motion to agitate the fluid (for example a motion having a profile as illustrated in
Referring now again to
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Electro-osmosis is used as a method and apparatus to supply metal ions (e.g. replenish metal ions to process fluid) for wafer electrodeposition. As described previously, electro chemical deposition apparatus 200 may have a substrate deposition module 210-216 (see also
In the embodiment shown in
Referring now to
Wafers, which may deposit impurities into primary the bath in a process known as “drag-in,” or which cause leach-out of chemical additives into the primary bath are a potential source of variation such as:
Total deposition activity (amp-hours): cathodic deposition of metal from primary bath and cathodic reaction of organic species (breakdown generation) is also a potential sources of variation.
Time: reactions within the primary bath, evaporation, oxidation in primary reservoirs is a potential source of variation
Material build-up on membranes or electro-dissolution of anode metal is a potential source of process variation.
Process interrupt, for example for manual addition of metal pellets to anode compartments, is another potential source of process variation.
Referring now to
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In the aspects of the disclosed embodiment shown, the purpose of the plating cell is to deposit metal from solution to a substrate or loaded wafer. In general, the half reaction for this may be expressed as Mz++ze−→M0 (Eq. 1). Here, electrons, e− are supplied by the current flowing through the cell. Here, there may be at least one accompanying reaction that provides the electrons and that occurs at the anode where the substrate or wafer may be the cathode. The anode may also provide metal ions to replace those consumed in Eq. 1. In addition, another source of those ions may be provided by dosing of liquid solution to the cell. Potential sources of these ionic species include VMS (Virgin Makeup Solution), which contains a number of species present at a specified concentration, and separate metal ion concentrates. These concentrates include the metal itself but also may include counterions (e.g., sulfate or methane sulfonate) and, may also include an appropriate acid. Here, a user may provide the appropriate concentrations to achieve desired process results. With respect to the disclosed aspects of the disclosed embodiment, SnAg plating may be described, however in accordance with another aspect of the disclosed embodiment any suitable species may be provided. For example, the metal in question may be Cu, Sn, or other suitable species, depending on the application where the system may be configurable and expandable. In the disclosed aspects of the disclosed embodiment, a plating cell may consist of one solution or two. In the case when two solutions are present, they may be separated by a membrane. The membrane allows some species to transfer across and blocks others. The selectivity of the membrane, or the degree to which it favors particular species, varies with membrane type and the actual chemistry being used. In addition to the metal ions, the plating solution may contain an acid, possibly other minor metallic species, and additives of a usually organic nature (but which can be inorganic, e.g., chloride); each of which may be tracked and controlled. In the plating cell, species are generated or consumed. As noted above, an example of consumption is the plating half-reaction. Here, the other species may be consumed as well. Here, some species have both an idle and an electrolytic mode of consumption. Each of these consumption modes has a rate associated with it. For example, idle consumption may be proportional to the time the cell sits and does not actively process wafers. Alternately, electrolytic consumption occurs when current is being passed through the cell (i.e., when wafers are being processed), and can be considered as proportional to the charge (Amp·hours) passed through the cell. To compensate for the consumption of the species in the cell, replenishment may be performed by dosing with solutions containing those species. Additionally, dosing of the inorganic species may be provided. Such dosing may be necessary when the inorganic species are consumed by plating and not replenished by dissolution of a corresponding anode. Also, dosing may be provided for makeup of species lost to dilution or as the feed in a feed and bleed scheme. The consumption of the additives and, in some cases, contamination from substrates or wafers, may lead to the build up, over time, of unwanted by-products in the bath. Here, by-products can be detrimental to plating quality and, so, must be kept to acceptable levels. To accomplish this, various forms of Bleed and Feed may be used with the central approach being dilution where portions of a bath are discarded and replaced by fresh solution in a controlled manner. The implementations may vary. One implementation may involve “Feed and Bleed” where new VMS (Virgin Makeup Solution) may be added and other constituents until a predetermined bath volume is established with subsequent drain off of excess volume of bath. Another implementation may involve “Bleed and Feed” where a predetermined portion of the bath may be bled off, for example, once per day and with feed during the rest of the time. Another implementation may involve “Continuous Bleed and Feed” where bleed and feed may be applied simultaneously, according to a determined rate. Another implementation may involve “Occasional Dumps” where the bath may be dumped as needed—possibly triggered by a set of criteria, for example, TOC (total organic carbon) level or otherwise. Another implementation may involve “No Bleed and Feed” where, in this scenario, there may be a requirement to run until a certain condition is reached, for example, the concentration of a particular species reaches a critical value. In each case, there may be restrictions around bleeding, feeding, or both, such as an imposed constraint to not disturb the bath while a wafer is being processed or otherwise as needed. In the disclosed aspects of the disclosed embodiment, anodes may be soluble or insoluble. A soluble anode, as the name implies, dissolves in solution at a rate proportional the current.
In the aspects of the disclosed embodiment shown, wafers or substrates may be wetted prior to entering a plating bath, for example, with water. This provides an additional water source to the plating bath. The term used to designate this source may be “Drag In”. A corresponding loss of plating solution may occur when a wafer or substrate is removed from the bath. The term used to designate this source may be “Drag Out”. Each wafer or substrate may be plated at current settings specified in a Recipe. In actual use, the recipes may include a number of steps. In a control scenario, the current and plating time history of each wafer or substrate may be available from a database. There are a number of scenarios may be simulated or incorporated into a control algorithm, including various chemistries and hardware configurations (in the form of connections between the various tanks and the presence or absence of membrane separators) where an implementation of the controller may be able to accommodate these various scenarios. For example, interfacing with scripts (or routines) to redefine the behavior of the membranes, as models or otherwise.
In the aspects of the disclosed embodiment shown, replenishment module and Plating Bath Control may be provided by a controller. For example, sampling measurement and control based on usage, concentration and suitable bleed and feed, bleed/cross bleed may be done by monitoring of concentrations by standard methods, off board chemical analysis systems, for example, supplied by ECI or Ancosys augmented by models developed from first principles or accumulating empirical data, as appropriate. Predictive control of one or all reservoirs may be provided accounting for factors such as tool loading, component consumption models, membrane transfer models or otherwise may be provided. Here, models may be developed from first principles or accumulating empirical data, as appropriate. Controller may have control software for a number of different purposes. For example, one mode of use may be Simulation, where different scenarios can be modeled and compared. A second mode may be Control, where most parameters of the model are fixed and the Software is used as part of a predictive dosing scheme allowing tight control of plating baths, as well as maintaining a record of interventions. Finally, the Software, in one version of simulation mode, may further be useful for correlating experimental data to allow the determination of, e.g, transfer parameters or decomposition rates.
In the aspects of the disclosed embodiment shown, membrane fouling may be reduced and managed. The fouling of the membranes may be defined as obstruction of the membrane either within the “pores” or at one or both of the membrane surfaces. The result being that fouling increases the resistance of the membrane to the point where the membrane may be unusable. Fouling is a particular concern with Sn-containing solutions of the type used in plating processes (whether anolytes or catholytes), since the solutions are often prone to formation of suspended solids (through the production of sparingly soluble Sn(IV) species). Features may be provided, for example with in the replenishment module to manage fouling, for example, a number of precautions may be taken to minimize the formation of Sn(IV). Minimization of this Sn(II) loss pathway has a number of potential benefits including: 1. Reducing the amount of suspended solids in the solutions (such solids can adhere to surfaces and form an impeding film, or Sn(IV) species can precipitate within membrane pores—either way, fouling). And, ancillary to fouling, 2. Reducing the amount of Sn required for replenishment (either by dosing of concentrate or through dissolution of a solid source), and 3. reduction of plating defects. Here, Sn(IV) may form from the oxidation of Sn(II) via one of two possible pathways: (1) reaction of Sn(II) with dissolved O2 gas, or (2) direct oxidation at an anode. The use of a soluble Sn anode minimizes formation of Sn(IV) via oxidation at the anode. The reason for this can be seen from consideration of the standard potentials for primary reactions occurring at soluble and insoluble anodes and the standard potential for Sn(II) oxidation. The net driving force towards Sn oxidation is much higher at an insoluble anode than at a Sn anode. Furthermore, in the aspects of the disclosed embodiment, the anode may be isolated from the bulk plating solution by a membrane (or membranes), substantially eliminating the anodic oxidation of Sn(II).
2H2O
Sn0
Sn2+
hydroquinone
Elimination of the inert anode may also be seen to reduce the generation of dissolved O2 in the plating solution. The aspects of the disclosed embodiment include use of inert anodes in anolytes substantially free of Sn(II) and isolated from the plating solution by a membrane, thus restricting dissolved oxygen formation to solutions where it has little effect. Sn(IV) formation via dissolved oxygen may be further reduced by allowing for a mechanism of actively excluding oxygen from the atmosphere. This can include N2, or other inert gas, sparging or blanketing; or solution degas to remove dissolved oxygen. In addition, anti-oxidant compounds may be included in Sn or SnAg bath formulations. For example, a typical anti-oxidant is hydroquinone. Such anti-oxidants may scavenge oxygen from the plating baths by being oxidized themselves and may then be regenerated at the plating piece. Use of an inert anode provides a pathway for anti-oxidant oxidation, reducing the amount of anti-oxidant available in the bath. Use of a soluble Sn anode may eliminate or reduce the amount of anti-oxidant oxidation at the anode, for example, e.g., see the standard potentials in table 1. To further reduce the chances of fouling at the anode, the anti-oxidants, or anti-oxidant containing components of a given plating formulation, may be added to the anolyte, thus protecting the anolyte as well as catholyte. This is possible to do in the Sn or SnAg chemistries, unlike in Cu applications, since the motivators leading to the use of a distinct anolyte are different than in the case of Cu where the purpose is not to reduce the consumption of organic additives at the anode. With Sn-containing plating formulations, the organic components typically do not degrade even at inert anodes; the lower anodic potentials typical of soluble anodes should then pose little or no concern as to additive stability. Also, inclusion of the organic components in the anolyte makes for more efficient cross-bleeding, since the cross-bleed solution will be nearer in composition to the receiving (plating) solution. In addition, as Sn(II) is stable at low pH, the acidity of the anolyte needs to be maintained. For example, a preferred acidity may be pH less than or equal to 1. In accordance with another aspect of the disclosed embodiment, any suitable fouling reduction may be used, for example, further mitigating Sn(IV) formation with the associated benefits to membrane fouling and process efficiency.
In the aspects of the disclosed embodiment shown, anolyte composition may also be managed. The adjustment and choice of anolyte may be selected for optimum performance of cells configured, for example, to use soluble Sn. There is some latitude in selecting an anolyte composition, but there are considerations dictating that choice. For example, one consideration as disclosed previously may be mitigating Sn(IV) formation with the associated benefits to membrane fouling and process efficiency. An additional consideration may be maximizing Sn transport efficiency across the membrane.
In the aspects of the disclosed embodiment shown, plating solution volume reduction may also be managed. In some aspects of the disclosed embodiment, the imperfect efficiency of Sn ion transport across the membrane may require that periodic adjustments be made to keep the respective solutions within required control limits. One approach may be to periodically cross-bleed small amounts of anolyte to the plating solution, with the plating solution then back-fed with appropriate material, for example, which may include water, acid, additives, anti-oxidants, or Sn concentrate or otherwise. Here, the anolyte to plating solution cross-bleed, while providing a means of controlling the concentration of selected bath components, can result in increased plating solution bath volume over time. While that additional bath volume can be controlled by adapting a bleed and feed strategy, such an approach may not be desirable in some cases, notably where the cost of the discarded chemistry is a concern. An alternative approach to mitigating bath volume is water extraction by ultrafiltration through a suitably selected membrane. An alternative approach to reducing plating solution volume buildup is by substantially eliminating the need for anolyte to plating solution cross bleeds through use of a replenishment booster module. Here, the booster module current can be adjusted to make up for the inefficiency of the Sn transport across the anolyte to plating solution membrane. In addition, since the replenishment module cathodic reaction is substantially acid consumption, the replenishment module may also serve to reduce the acid accumulation in the plating solution.
Although the aspects of the disclosed embodiment may be described with respect to SnAg plating, any suitable material may be used. For example, Cu or other suitable metal may be provided instead of SnAg. Here, changes may include the chemistries in each cell, the membrane material, the bleed-and-feed or other bath maintenance method or otherwise. Here, for Cu, the chemistries may be either sulfuric acid or methanesulfonic acid (MSA) based. An objective for Cu plating may be to keep the additives from contacting the anode, in order to reduce additive consumption and the formation of detrimental by-products. With Cu, oxidation and formation of metal oxides is not as much an issue as with SnAg, so anolyte maintenance may be somewhat simplified, although a high Cu/Acid ratio may be maintained in the anolyte to favor Cu transport and minimize cross-bleed. Here, the configurations may remain substantially the same, with the main modifications being in the chemistry and the nature of the soluble anode. Within the configurations described there is room to implement a number of chemistry management scenarios, for example, degree and frequency of cross-bleed, anolyte and catholyte bleed and feed, other dosing requirements, or otherwise where these may be dictated by the particular application and chemical package. Further, for Sn, the nature of operation is much the same as for SnAg. Here, where there is no Ag, the benefit of the disclosed aspects of the disclosed embodiment may be mainly in the reduction of Sn oxides where the need may not be as acute as for SnAg, since soluble Sn anodes are already used for Sn. For SnAg, the Sn chemistries may be any of the commercially available chemical packages, for example, MSA based or otherwise. Further, for Cu, there may be a benefit to moving the anode maintenance off-board as disclosed where the benefit may be predominantly in additive consumption, by-product minimization, bleed and feed reduction, and ease of maintenance, possibly eliminating on-tool anode changes and increasing availability.
The aspects of the disclosed embodiment may use a soluble Sn anode for SnAg plating. In accordance with another aspect of the disclosed embodiment, a soluble anode may be provided for any suitable plating material. Here, the use of a soluble Sn anode for SnAg plating poses potential benefits where implementation requires a separation of the Sn anode from the plating since Ag can plate out on Sn, with the separation via a membrane thus isolating the plating chemistry from anode. Further, a separate shear plate may be provided in a replenishment module. Further, the plating module(s) and/or replenishment module(s) may be N2 purged modules or otherwise isolated. Features of a soluble anode may include reduced formation of Sn(IV) resulting in lower particles, reduced fouling, and additional available Sn for plating. Here, lower anodic potentials reduce water oxidation as compared to use of an insoluble/inert anode and results in elimination of O2. Additional features of a soluble anode may include reduced anti-oxidant “consumption. Here, the standard potential of HQ (Hydroquinone being an anti oxidant example) may be more “anodic” than Sn(0)→Sn(II) but less anodic than water oxidation where the membrane reduces exposure of the plating bath to the anode. Additional features of a soluble anode may include savings in Sn replenishment costs where Sn replenishment may be Sn liquid solution high in Sn concentration. Additional features of a soluble anode may include reduction of a bleed requirement. For example, using a soluble Sn source, the plating bath volume does not build as rapidly as with a liquid Sn source. By way of further example, a better preserved bath may exhibit a longer life. Further, in some applications, decreased occurrence of unwanted anodic reactions may be provided.
Accumulation of Sn in anolyte may require cross-bleed of anolyte to catholyte where the anolyte may be back fed with acid, water, and possibly minor components, for example, additive, anti-oxidant or otherwise. Some electro-osmotic water transport of water across membrane, depending on membrane type, may occur. Here, water may transport from the anolyte to the plating solution, for example, at a rate ˜1-2 ml/A*hr, depending on conditions. Here, volume accumulation can be mitigated by Water Extraction, Replenishment or otherwise. Here, although the description is particular to tin silver; the aspects of the disclosed embodiment may be used for other metals where Sn is exemplary.
In an aspect of the disclosed embodiment, an electro chemical deposition apparatus 800 deposits metal onto a surface of a substrate 820. The electro chemical deposition apparatus 800 has a frame 811 configured for holding a process electrolyte 818, 838. A substrate holder (see for example, holder 272 as previously described or holder 1320 below) is removably coupled to the frame 811, the substrate holder supporting the substrate 820 in the process electrolyte. A anode fluid compartment 828 is removably coupled to the frame 811 and defining a fluid boundary envelope containing an anolyte 812 in the frame, and separating the anolyte from the process electrolyte, the fluid compartment having within the boundary envelope an anode, 810 facing the surface of the substrate 820, and an ion exchange membrane, 814 disposed between the anode 810 and the surface of the substrate 820, the anode fluid compartment fluid boundary envelope being 828 removable from the frame 811 as a unit with the ion exchange membrane 814 and the anode 810, for example, as will be described with respect to
Referring now to
As previously described, system 900 provides for a Modified Cell 800 with a replenishment module 912 that may act as a booster module, for example where metal ions may be provided by both plating module 800 and replenishment module 912. Here, plating cell 800 may have a soluble anode, distinct anolyte, membrane and a cross bleed. Here, replenishment module 912 may be used as a secondary source or booster module with respect to plating cell 800 where module 912 anolyte may selectively be shared with the plating cell anolyte. As will be described, electro chemical deposition system 900 has module 912 that operates to supplement plating ions provided by deposition module 800, for example, where both deposition module 800 and replenishment module 912 may utilize soluble Sn, for example, each with a solid soluble Sn plate anode and/or anode pellets or otherwise. In this manner, replenishment module 912 acts as a secondary source of Sn or as a booster source of Sn with respect to deposition module 800. In alternate aspects of the disclosed embodiments, any suitable deposition metal or material may be provided, for example, Sn, SnAg, Cu or otherwise. The sharing may be continuous, intermittent or on an as needed basis. As seen, the plating cell is shown as a two-compartment cell, in accordance with another aspect of the disclosed embodiment, insoluble or soluble anode(s) may still be maintained. For example, both the plating cell 800 anode and the replenishment module 912 anode may be soluble. Additionally, the aspect of the disclosed embodiment shown does not preclude the possibility that some anolyte is also periodically bled 816 into the plating solution (PCC). In the aspects of the disclosed embodiment shown, replenishment module 912 may have features as previously described with respect to replenishment modules 260, 260′ or otherwise. In other aspects of the disclosed embodiment shown, replenishment module 912 may have features as described with respect to modules 1500 as will be described. Further, in the aspects of the disclosed embodiment shown, deposition module 800 may have features as described and as will be described, for example, having an ion exchange membrane or with no ion exchange membrane. In accordance with one aspect of the disclosed embodiment, replenishment module 912 may have secondary cathode compartment 914, plating solution replenishment channel 916, and secondary anode compartment 918. Secondary cathode compartment 914 may contain inert cathode 920. Secondary anode compartment 918 may contain soluble or insoluble anode 922. Secondary cathode compartment 914 may be separated from plating solution replenishment channel 916 by membrane 924, for example, a monovalent selective membrane. Similarly, secondary anode compartment 918 may be separated from plating solution replenishment channel 916 by cationic membrane 926. Power source 928 may selectively provide bias between anode 922 and cathode 920. Pump 930 may circulate shared anolyte 932 between secondary anode compartment 918, deposition anode compartment 828 and anolyte reservoir 834. Pump 836 may recirculate plating solution 838 between plating solution replenishment channel 916 and deposition cathode compartment 832 and reservoir 954. Pump 940 may circulate replenishment module catholyte 942 between secondary cathode compartment 914 and catholyte reservoir 944. Water Extraction Unit 946 may be provided having circulation pump 948 and ultra-filtration or other similar membrane 950 where pressure across water selective membrane 950 allows for the selective extraction of water 952 where extraction is driven across size-exclusion membrane 950. Although the water extraction unit is shown with respect to reservoir 954 as exemplary, any suitable portion(s) of the system may utilize a water extraction unit or other suitable extraction unit as needed. One or more shear or agitation plate(s) 956 may be provided with respect to the membrane(s) 926, 924 or otherwise. Plating cell 910 has soluble anode 810, shared anolyte 812 in compartment 828, membrane 814, cross bleed 816, wafer cathode 820 and shear or agitation plate 852. Plating solution 938 may be replenished 986 as previously described and where the anolyte of replenishment module 912 may in addition be shared with the anolyte of the ECD module 800. Line 983 shows a sharing of the anolyte between the anode compartment of replenishment module 912 and the anode compartment of deposition module 800. Such sharing reduces the number of pumps and reservoirs required where fluid may be pumped in series, from the anolyte tank through the two respective anolyte compartments. Alternately, the liquid may be pumped in parallel rather than series, for example, requiring additional lines, for example, parallel source and return lines to and from the deposition module and the replenishment unit, for example, where line 983 may be removed, but the effect of sharing fluid between the two compartments would remain. In the embodiment shown, replenishment cell 912 acts as a secondary or booster Sn source selectively replenishing either continuously, intermittently or on an as needed basis. Further, solution 938 may be replenished 967 with Ag salts, MAS or other suitable additives as required. Further, solution may be replenished 982, for example, with anti oxidants, H2O or otherwise from chamber 914 or otherwise. Line 982 shows a sharing of fluid between the cathode compartment of replenishment module 912 and the anode compartment of deposition module 800. Such sharing reduces the number of pumps and reservoirs required where fluid may be pumped in series, from a fluid tank through the two respective compartments. Alternately, the liquid may be pumped in parallel rather than series, for example, requiring additional lines, for example, parallel source and return lines to and from the deposition module and the replenishment unit, for example, where line 982 may be removed, but the effect of sharing fluid between the two compartments would remain. Here, replenishment module 912 allows for supplementary replenishment or rebalancing of a plating solution via exchange with two auxiliary solutions, an anolyte and catholyte. In the exemplary embodiment, electro chemical deposition apparatus 900 may be provided adapted to deposit Sn or Sn alloy onto a surface of a substrate 820 in a configurable fashion. Here, electro chemical deposition apparatus 900 has a deposition module 800 having a deposition module frame 811 configured to hold a process electrolyte 938. As previously described, a substrate holder may be removably coupled to the deposition module frame 811, the substrate holder supporting the substrate 820 with the process electrolyte 938 contacting the surface of the substrate 820, the substrate acting as a first cathode. A first soluble anode 810 is coupled to the deposition module frame 811. The deposition module 800 has a configurable process electrolyte replenishment module interface port 985 configured in a first configuration, for example, as seen in
In an aspect of the disclosed embodiment a process electrolyte replenishment module 912 replenishes ions in a process electrolyte 938 in a substrate electro chemical deposition apparatus 800 having a first anode 810 and a first cathode 820, the replenishment module having a second anode 922. The process electrolyte replenishment module 912 has a frame 915 offset from the chemical deposition apparatus 800. A process electrolyte recirculation compartment 916 is disposed in the frame 915 configured so that the process electrolyte 938 is recirculating between the replenishment module 912 and the deposition apparatus 800. An anode compartment 918 in the frame 915 is coupled to the process electrolyte recirculation compartment 916, the anode compartment 918 having the second anode 922, that is a soluble anode, disposed therein for immersion in a secondary anolyte 932, and having a first ion exchange membrane 926 separating the secondary anolyte 932 from the process electrolyte 938, the first ion exchange membrane 926 being a cationic membrane. A cathode compartment 914 is provided in the frame 915 coupled to the process electrolyte recirculation compartment 916, the cathode compartment 914 having a second cathode 920 disposed therein for immersion in a secondary catholyte 942, and having a second ion exchange membrane 924 separating the secondary catholyte 942 from the process electrolyte 938, the second ion exchange membrane 924 being a monovalent selective membrane. In another aspect, an agitation member 957 is moveably coupled to the frame 915 in the cathode compartment 914 in close proximity to the second cathode 920 to agitate the secondary catholyte 942 proximate the second cathode 920. In another aspect, the soluble second anode 922 and the first ion exchange membrane 926 are arranged so that ions from the soluble second anode 922 pass through the first ion exchange membrane 926 into the process electrolyte 938. In another aspect, the process electrolyte 938 comprises a SnAg bath, and wherein ions are replenished in the process electrolyte 938 without Ag contamination of the second anode 922.
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In an aspect of the disclosed embodiment, an electro chemical deposition apparatus 1300 deposits a metal onto a surface of a substrate 1321. The electro chemical deposition apparatus 1300 has a frame 1326 configured for holding a process electrolyte 1327. A substrate holder 1320 is coupled to the frame 1326, the substrate holder 1320 supporting the substrate 1321 so that the process electrolyte 1327 contacts the surface of substrate 1321. An anode 1384 is coupled to the frame 1326 in a anolyte 1311, and an ion exchange membrane 1390 is coupled to the frame 1326 so that the ion exchange membrane 1390 separates the anolyte 1311 from the process electrolyte 1327. The ion exchange membrane 1390 is supported on a first side by a first membrane support 1386 coupled to the frame 1326 and having a plurality of first arrayed supports 1396. The ion exchange membrane 1390 is supported on a second side by a second membrane support 1392 coupled to the frame 1326 and having a plurality of second arrayed supports 1398 substantially aligned with the plurality of first arrayed supports 1396. In another aspect, the plurality of first arrayed supports 1396 comprises a first array of vertical bars, and where the plurality of second arrayed supports 1398 comprises a second array of vertical bars, and wherein the first arrayed vertical bars are substantially aligned with the second arrayed vertical bars. In another aspect, the substrate holder 1320, the anode 1384 and the ion exchange membrane 1390 are arranged in the frame 1326 so that metal ions pass through the ion exchange membrane 1390 into the process electrolyte 1327 replenishing metal ions depleted by deposition onto the substrate 1321 and wherein the first and second arrayed supports 1396, 1398 have a configuration that prevents bubble entrapment. In another aspect, the surface of the substrate 1321 is in a substantially vertical orientation.
In an aspect of the disclosed embodiment, an electro chemical deposition apparatus 1300 is provided adapted to deposit a metal onto a surface of a substrate 1321. The electro chemical deposition apparatus 1300 has a frame 1326 configured for holding a process electrolyte 1327. A substrate holder 1320 is removably coupled to the frame 1326 and supporting the substrate 1321 so that the process electrolyte 1327 contacts the surface of the substrate 1321. An anode module 1310 is coupled to the frame 1326 and configured for containing an anolyte 1311, the anode module 1310 having a module frame 1380, an anode 1384 and an ion exchange membrane 1390 coupled to the module frame 1380 for removal from and insertion in the frame 1326 as a unit with the anode 1384 and the ion exchange membrane 1390. The ion exchange membrane 1390 is coupled to the module frame being 1380 disposed between the anode 1384 and the surface of the substrate 1321.
In one aspect of the disclosed embodiment, an electro chemical deposition apparatus is provided adapted to deposit metal onto a surface of a substrate. The electro chemical deposition apparatus has a frame configured for holding a process electrolyte. A substrate holder is removably coupled to the frame, the substrate holder supporting the substrate in the process electrolyte. An anode fluid compartment removably coupled to the frame and defining a fluid boundary envelope containing an anolyte in the frame, and separating the anolyte from the process electrolyte, the fluid compartment having within the boundary envelope an anode, facing the surface of the substrate, and an ion exchange membrane, disposed between the anode and the surface of the substrate. The anode fluid compartment fluid boundary envelope being removable from the frame as a unit with the ion exchange membrane and the anode;
In another aspect of the disclosed embodiment, the electro chemical deposition apparatus is provided where the surface of the substrate is in a substantially vertical orientation.
In another aspect of the disclosed embodiment, the electro chemical deposition apparatus is provided where the ion exchange membrane comprises a cationic membrane.
In another aspect of the disclosed embodiment, the electro chemical deposition apparatus is provided where the anode comprises a soluble anode.
In another aspect of the disclosed embodiment, the electro chemical deposition apparatus is provided where the anode comprises an insoluble anode.
In another aspect of the disclosed embodiment, the electro chemical deposition apparatus is provided where the process electrolyte comprises a SnAg bath.
In another aspect of the disclosed embodiment, the electro chemical deposition apparatus is provided where the anode comprises a Sn anode.
In another aspect of the disclosed embodiment, the electro chemical deposition apparatus is provided where the anode comprises a Cu anode.
In another aspect of the disclosed embodiment, the electro chemical deposition apparatus is provided where the ion exchange membrane separates the anolyte from the process electrolyte.
In another aspect of the disclosed embodiment, an electro chemical deposition apparatus is provided adapted to deposit a metal onto a surface of a substrate. The electro chemical deposition apparatus has a frame configured for holding a process electrolyte. A substrate holder is coupled to the frame, the substrate holder supporting the substrate so that the process electrolyte contacts the surface. An anode is coupled to the frame in a anolyte, and an ion exchange membrane is coupled to the frame so that the ion exchange membrane separates the anolyte from the process electrolyte. The ion exchange membrane is supported on a first side by a first membrane support coupled to the frame and having a plurality of first arrayed supports. The ion exchange membrane is supported on a second side by a second membrane support coupled to the frame and having a plurality of second arrayed supports substantially aligned with the plurality of first arrayed supports.
In another aspect of the disclosed embodiment, an electro chemical deposition apparatus is provided where the plurality of first arrayed supports comprises a first array of vertical bars, and where the plurality of second arrayed supports comprises a second array of vertical bars, and wherein the first arrayed vertical bars are substantially aligned with the second arrayed vertical bars.
In another aspect of the disclosed embodiment, an electro chemical deposition apparatus is provided where the substrate holder, the anode and the ion exchange membrane are arranged in the frame so that metal ions pass through the ion exchange membrane into the process electrolyte replenishing metal ions depleted by deposition onto the substrate and wherein the first and second arrayed supports have a configuration that prevents bubble entrapment.
In another aspect of the disclosed embodiment, an electro chemical deposition apparatus is provided where the surface of the substrate is in a substantially vertical orientation.
In another aspect of the disclosed embodiment, an electro chemical deposition apparatus is provided where the ion exchange membrane comprises a cationic membrane.
In another aspect of the disclosed embodiment, an electro chemical deposition apparatus is provided where the anode comprises a soluble Sn anode.
In another aspect of the disclosed embodiment, an electro chemical deposition apparatus is provided where the process electrolyte comprises a SnAg bath.
In another aspect of the disclosed embodiment, an electro chemical deposition apparatus is provided adapted to deposit a metal onto a surface of a substrate. The electro chemical deposition apparatus has a frame configured for holding a process electrolyte. A substrate holder is removably coupled to the frame and supporting the substrate so that the process electrolyte contacts the surface. An anode module is coupled to the frame and configured for containing an anolyte, the anode module having a module frame, an anode and an ion exchange membrane coupled to the module frame for removal from and insertion in the frame as a unit with the anode and the ion exchange membrane. The ion exchange membrane is coupled to the module frame being disposed between the anode and the surface of the substrate.
In another aspect of the disclosed embodiment, an electro chemical deposition apparatus is provided where the substrate holder, the anode and the ion exchange membrane are arranged in the frame so that metal ions pass through the ion exchange membrane into the process electrolyte replenishing metal ions depleted by deposition onto the substrate.
In another aspect of the disclosed embodiment, an electro chemical deposition apparatus is provided where the surface of the substrate is in a substantially vertical orientation.
In another aspect of the disclosed embodiment, an electro chemical deposition apparatus is provided where the ion exchange membrane comprises a cationic membrane.
In another aspect of the disclosed embodiment, an electro chemical deposition apparatus is provided where the anode comprises a soluble anode.
In another aspect of the disclosed embodiment, an electro chemical deposition apparatus is provided where the anode comprises a insoluble anode.
In another aspect of the disclosed embodiment, an electro chemical deposition apparatus is provided where the process electrolyte comprises a SnAg bath.
In another aspect of the disclosed embodiment, an electro chemical deposition apparatus is provided where the anode comprises a Sn anode.
In another aspect of the disclosed embodiment, an electro chemical deposition apparatus is provided where the anode comprises a Cu anode.
In another aspect of the disclosed embodiment, an electro chemical deposition apparatus is provided where the ion exchange membrane separates the anolyte from the process electrolyte.
In another aspect of the disclosed embodiment a process electrolyte replenishment module is provided adapted to replenish ions in a process electrolyte in a substrate electro chemical deposition apparatus having a first anode and a first cathode, the replenishment module having a second anode. The process electrolyte replenishment module has a frame offset from the chemical deposition apparatus. A process electrolyte recirculation compartment is disposed in the frame configured so that the process electrolyte is recirculating between the replenishment module and the deposition apparatus. An anode compartment in the frame is coupled to the process electrolyte recirculation compartment, the anode compartment having the second anode, that is a soluble anode, disposed therein for immersion in a secondary anolyte, and having a first ion exchange membrane separating the secondary anolyte from the process electrolyte, the first ion exchange membrane being a cationic membrane. A cathode compartment is provided in the frame coupled to the process electrolyte recirculation compartment, the cathode compartment having a second cathode disposed therein for immersion in a secondary catholyte, and having a second ion exchange membrane separating the secondary catholyte from the process electrolyte, the second ion exchange membrane being a monovalent selective membrane.
In another aspect of the disclosed embodiment a process electrolyte replenishment module is provided with an agitation member moveably coupled to the frame in the cathode compartment in close proximity to the second cathode to agitate the secondary catholyte proximate the second cathode.
In another aspect of the disclosed embodiment a process electrolyte replenishment module is provided where the soluble second anode and the first ion exchange membrane are arranged so that ions from the soluble second anode pass through the first ion exchange membrane into the process electrolyte.
In another aspect of the disclosed embodiment a process electrolyte replenishment module is provided where the anode comprises a soluble Sn plate.
In another aspect of the disclosed embodiment a process electrolyte replenishment module is provided where the anode comprises soluble Sn pellets.
In another aspect of the disclosed embodiment a process electrolyte replenishment module is provided where the process electrolyte comprises a SnAg bath.
In another aspect of the disclosed embodiment a process electrolyte replenishment module is provided where the process electrolyte comprises a SnAg bath, and wherein ions are replenished in the process electrolyte without Ag contamination of the second anode.
In another aspect of the disclosed embodiment a process electrolyte replenishment module is provided adapted to replenish ions in a process electrolyte in a substrate electro chemical deposition apparatus having a first anode and a first cathode, the replenishment module having a second anode. The process electrolyte replenishment module has a frame offset from the chemical deposition apparatus. A process electrolyte recirculation compartment is disposed in the frame configured so that the process electrolyte is recirculating between the replenishment module and the deposition apparatus. An anode compartment in the frame is coupled to the process electrolyte recirculation compartment, the anode compartment having the second anode, that is a soluble anode, disposed therein for immersion in a secondary anolyte, and having a first ion exchange membrane separating the secondary anolyte from the process electrolyte. A buffer compartment in the frame is coupled to the process electrolyte recirculation compartment, the buffer compartment having a buffer solution therein, and having a second ion exchange membrane separating the buffer solution from the process electrolyte. A cathode compartment in the frame is coupled to the buffer compartment, the cathode compartment having a second cathode disposed therein for immersion in a secondary catholyte, and having a third ion exchange membrane separating the secondary catholyte from the buffer solution.
In another aspect of the disclosed embodiment a process electrolyte replenishment module is provided where the soluble second anode and the first ion exchange membrane are arranged so that ions from the soluble second anode pass through the first ion exchange membrane into the process electrolyte.
In another aspect of the disclosed embodiment a process electrolyte replenishment module is provided where the first ion exchange membrane comprises a cationic membrane.
In another aspect of the disclosed embodiment a process electrolyte replenishment module is provided where the second and third ion exchange membranes comprise second and third monovalent selective membranes.
In another aspect of the disclosed embodiment a process electrolyte replenishment module is provided where the first ion exchange membrane comprises a cationic membrane, and wherein the second and third ion exchange membranes comprise second and third monovalent selective membranes.
In another aspect of the disclosed embodiment a process electrolyte replenishment module is provided where the anode comprises an insoluble anode and soluble Sn pellets.
In another aspect of the disclosed embodiment a process electrolyte replenishment module is provided where the process electrolyte comprises a SnAg bath.
In another aspect of the disclosed embodiment a process electrolyte replenishment module is provided where the first ion exchange membrane selectively passes ions from the anode to the process electrolyte.
In another aspect of the disclosed embodiment a process electrolyte replenishment module is provided where the process electrolyte comprises a SnAg bath, and wherein ions are replenished in the process electrolyte without Ag contamination of the second anode.
In another aspect of the disclosed embodiment a process electrolyte replenishment module is provided adapted to replenish ions in a process electrolyte in a substrate electro chemical deposition apparatus having a first anode and a first cathode, the replenishment module having a second anode. The process electrolyte replenishment module has a frame offset from the chemical deposition apparatus. A process electrolyte recirculation compartment is disposed in the frame configured so that the process electrolyte is recirculating between the replenishment module and the deposition apparatus. An anode compartment in the frame is coupled to the process electrolyte recirculation compartment, the anode compartment having the second anode, that is a soluble anode, disposed therein for immersion in a secondary anolyte, and having a first ion exchange membrane separating the secondary anolyte from the process electrolyte. A buffer compartment in the frame coupled to the process electrolyte recirculation compartment, the buffer compartment having a buffer solution therein, and having a second ion exchange membrane separating the buffer solution from the process electrolyte. A cathode compartment in the frame is coupled to the buffer compartment, the cathode compartment having a second cathode disposed therein for immersion in a secondary catholyte, and having a third ion exchange membrane separating the secondary catholyte from the buffer solution. An ion removal cell is coupled to the buffer compartment. Buffer solution from the buffer compartment is recirculated through the ion removal cell with the ion removal cell removing unwanted ions from the buffer solution.
In another aspect of the disclosed embodiment a process electrolyte replenishment module is provided where the soluble second anode and the first ion exchange membrane are arranged so that ions from the soluble second anode pass through the first ion exchange membrane into the process electrolyte.
In another aspect of the disclosed embodiment a process electrolyte replenishment module is provided where the first ion exchange membrane comprises a cationic membrane.
In another aspect of the disclosed embodiment a process electrolyte replenishment module is provided where the second and third ion exchange membranes comprise second and third monovalent selective membranes.
In another aspect of the disclosed embodiment a process electrolyte replenishment module is provided where the first ion exchange membrane comprises a cationic membrane, and wherein the second and third ion exchange membranes comprise second and third monovalent selective membranes.
In another aspect of the disclosed embodiment a process electrolyte replenishment module is provided where the anode comprises an insoluble anode and soluble Sn pellets.
In another aspect of the disclosed embodiment a process electrolyte replenishment module is provided where the process electrolyte comprises a SnAg bath.
In another aspect of the disclosed embodiment a process electrolyte replenishment module is provided where the first ion exchange membrane selectively passes Sn2+ ions from the anode to the process electrolyte.
In another aspect of the disclosed embodiment a process electrolyte replenishment module is provided where the process electrolyte comprises a SnAg bath, and wherein ions are replenished in the process electrolyte without Ag contamination of the second anode.
In another aspect of the disclosed embodiment an electro chemical deposition apparatus is provided adapted to deposit metal onto a surface of a substrate. The electro chemical deposition apparatus has a deposition module having a deposition module frame configured to hold a process electrolyte. A substrate holder is removably coupled to the deposition module frame, the substrate holder supporting the substrate, the process electrolyte contacting the surface of the substrate, the substrate acting as a first cathode. A first soluble anode is coupled to the deposition module frame. A process electrolyte replenishment module is provided adapted to replenish ions in the process electrolyte, the process electrolyte replenishment module having a replenishment module frame offset from the deposition module. A process electrolyte recirculation compartment is disposed in the replenishment module frame configured so that the process electrolyte is recirculating between the replenishment module and the deposition module. An anode compartment in the replenishment module frame is coupled to the process electrolyte recirculation compartment, the anode compartment having a second soluble anode, disposed therein for immersion in a secondary anolyte, and having a first ion exchange membrane separating the secondary anolyte from the process electrolyte, the first ion exchange membrane being a cationic membrane. A cathode compartment in the replenishment module frame is coupled to the process electrolyte recirculation compartment, the cathode compartment having a second cathode disposed therein for immersion in a secondary catholyte, and having a second ion exchange membrane separating the secondary catholyte from the process electrolyte, the second ion exchange membrane being a monovalent selective membrane. Both the first soluble anode and the second soluble anode replenish ions in the process electrolyte depleted by ion deposition onto the surface.
In another aspect of the disclosed embodiment an electro chemical deposition apparatus is provided with an agitation member moveably coupled to the frame in the cathode compartment in close proximity to the second cathode to agitate the secondary catholyte proximate the second cathode.
In another aspect of the disclosed embodiment an electro chemical deposition apparatus is provided where the deposition module further has a moveable process agitation member moveably coupled to the deposition module frame in close proximity to the surface of the substrate for fluid agitation over the surface of the substrate.
In another aspect of the disclosed embodiment an electro chemical deposition apparatus is provided where the deposition module further has a process ion exchange membrane disposed between the first anode and the surface of the substrate.
In another aspect of the disclosed embodiment an electro chemical deposition apparatus is provided where the surface of the substrate is in a substantially vertical orientation.
In another aspect of the disclosed embodiment an electro chemical deposition apparatus is provided where the process electrolyte comprises a SnAg bath.
In another aspect of the disclosed embodiment an electro chemical deposition apparatus is provided where the first soluble anode comprises a first soluble Sn anode, and wherein the second soluble anode comprises a second soluble Sn anode.
In another aspect of the disclosed embodiment an electro chemical deposition apparatus is provided where the process electrolyte comprises a SnAg bath, and wherein ions are replenished in the process electrolyte without Ag contamination of the second anode.
In another aspect of the disclosed embodiment an electro chemical deposition apparatus is provided adapted to deposit metal onto a surface of a substrate. The electro chemical deposition apparatus has a deposition module having a deposition module frame configured to hold a process electrolyte. A substrate holder is removably coupled to the deposition module frame, the substrate holder supporting the substrate, the process electrolyte contacting the surface of the substrate, the substrate acting as a first cathode. A first soluble anode is coupled to the deposition module frame. A process electrolyte replenishment module is adapted to replenish ions in the process electrolyte, the process electrolyte replenishment module having a replenishment module frame offset from the deposition module. A process electrolyte recirculation compartment is disposed in the replenishment module frame configured so that the process electrolyte is recirculating between the replenishment module and the deposition module. An anode compartment in the replenishment module frame is coupled to the process electrolyte recirculation compartment, the anode compartment having a second soluble anode, disposed therein for immersion in a secondary anolyte, and having a first ion exchange membrane separating the secondary anolyte from the process electrolyte. A buffer compartment in the replenishment module frame is coupled to the process electrolyte recirculation compartment, the buffer compartment having a buffer solution therein, and having a second ion exchange membrane separating the buffer solution from the process electrolyte. A cathode compartment in the replenishment module frame is coupled to the buffer compartment, the cathode compartment having a second cathode disposed therein for immersion in a secondary catholyte, and having a third ion exchange membrane separating the secondary catholyte from the buffer solution. Both the first soluble anode and the second soluble anode replenish ions in the process electrolyte depleted by ion deposition onto the surface.
In another aspect of the disclosed embodiment an electro chemical deposition apparatus is provided having an ion removal cell coupled to the buffer compartment. Buffer solution from the buffer compartment is recirculated through the ion removal cell with the ion removal cell removing unwanted ions from the buffer solution.
In another aspect of the disclosed embodiment an electro chemical deposition apparatus is provided where the deposition module further comprises a moveable process agitation member moveably coupled to the deposition module frame in close proximity to the surface of the substrate for fluid agitation over the surface of the substrate.
In another aspect of the disclosed embodiment an electro chemical deposition apparatus is provided where the deposition module further comprises a process ion exchange membrane disposed between the first anode and the surface of the substrate.
In another aspect of the disclosed embodiment an electro chemical deposition apparatus is provided where the surface of the substrate is in a substantially vertical orientation.
In another aspect of the disclosed embodiment an electro chemical deposition apparatus is provided where the process electrolyte comprises a SnAg bath.
In another aspect of the disclosed embodiment an electro chemical deposition apparatus is provided where the first soluble anode comprises a first soluble Sn anode, and wherein the second soluble anode comprises a second soluble Sn anode.
In another aspect of the disclosed embodiment an electro chemical deposition apparatus is provided where the first ion exchange membrane comprises a cationic membrane, and wherein the second and third ion exchange membranes comprise second and third monovalent selective membranes respectively.
In another aspect of the disclosed embodiment an electro chemical deposition apparatus is provided where the process electrolyte comprises a SnAg bath, and wherein ions are replenished in the process electrolyte without Ag contamination of the second anode.
In another aspect of the disclosed embodiment an electro chemical deposition apparatus is provided adapted to deposit metal onto a surface of a substrate. The electro chemical deposition apparatus has a deposition module having a deposition module frame configured to hold a process electrolyte. A substrate holder is removably coupled to the deposition module frame, the substrate holder supporting the substrate, the process electrolyte contacting the surface of the substrate, the substrate acting as a first cathode. A first soluble anode is coupled to the deposition module frame. The deposition module has a configurable process electrolyte replenishment module interface port configured in a first configuration to interface with a process electrolyte replenishment module and configured in a second configuration to not interface with process electrolyte replenishment module where the process electrolyte replenishment module is not a portion of the electro chemical deposition apparatus. The process electrolyte replenishment module is adapted to replenish ions in the process electrolyte, the process electrolyte replenishment module having a replenishment module frame offset from the deposition module. A process electrolyte recirculation compartment is disposed in the replenishment module frame configured so that the process electrolyte is recirculating between the replenishment module and the deposition module. An anode compartment in the replenishment module frame coupled to the process electrolyte recirculation compartment, the anode compartment having a second soluble anode, disposed therein for immersion in a secondary anolyte, and having a first ion exchange membrane separating the secondary anolyte from the process electrolyte. A cathode compartment in the replenishment module frame is coupled to the process electrolyte recirculation compartment, the cathode compartment having a second cathode disposed therein for immersion in a secondary catholyte, and having a second ion exchange membrane separating the secondary catholyte from the process electrolyte. Both the first soluble anode and the second soluble anode replenish ions in the process electrolyte depleted by ion deposition onto the surface in the first configuration. The first soluble anode replenishes ions in the process electrolyte depleted by ion deposition onto the surface in the second configuration.
In another aspect of the disclosed embodiment an electro chemical deposition apparatus is provided where the configurable process electrolyte replenishment module interface port comprises a process electrolyte inlet port and a process electrolyte outlet port in fluid communication with the deposition module frame, the process electrolyte inlet port and the process electrolyte outlet port coupled in fluid communication with the replenishment module in the first configuration and with the process electrolyte inlet port and the process electrolyte outlet port de-coupled from fluid communication with the replenishment module when in the second configuration.
In another aspect of the disclosed embodiment an electro chemical deposition apparatus is provided where the deposition module further comprises a moveable process agitation member moveably coupled to the deposition module frame in close proximity to the surface of the substrate for fluid agitation over the surface of the substrate.
In another aspect of the disclosed embodiment an electro chemical deposition apparatus is provided where the deposition module further comprises a process ion exchange membrane disposed between the first anode and the surface of the substrate.
In another aspect of the disclosed embodiment an electro chemical deposition apparatus is provided where the surface of the substrate is in a substantially vertical orientation.
In another aspect of the disclosed embodiment an electro chemical deposition apparatus is provided where the process electrolyte comprises a SnAg bath.
In another aspect of the disclosed embodiment an electro chemical deposition apparatus is provided where the first soluble anode comprises a first soluble Sn anode, and wherein the second soluble anode comprises a second soluble Sn anode.
In another aspect of the disclosed embodiment an electro chemical deposition apparatus is provided where the first ion exchange membrane comprises a cationic membrane, and where the second ion exchange membrane comprises a monovalent selective membrane.
In another aspect of the disclosed embodiment an electro chemical deposition apparatus is provided where the process electrolyte comprises a SnAg bath, and wherein ions are replenished in the process electrolyte without Ag contamination of the second anode.
It should be understood that the foregoing description is only illustrative of the aspects of the disclosed embodiment. Various alternatives and modifications can be devised by those skilled in the art without departing from the aspects of the disclosed embodiment. Accordingly, the aspects of the disclosed embodiment are intended to embrace all such alternatives, modifications and variances that fall within the scope of the appended claims. Further, the mere fact that different features are recited in mutually different dependent or independent claims does not indicate that a combination of these features cannot be advantageously used, such a combination remaining within the scope of the aspects of the invention.
This application claims the benefits of and priority to U.S. Provisional Patent Application Ser. No. 61/475,417 filed on Apr. 14, 2011, entitled “ELECTRO OSMOSIS CHEMICAL PRODUCTIVITY APPARATUS AND METHOD FOR ELECTRO DEPOSITION”, U.S. patent application Ser. No. 13/445,217, filed on Apr. 12, 2012, entitled “ELECTRO CHEMICAL DEPOSITION AND REPLENISHMENT APPARATUS”, the disclosures of which are incorporated herein by reference in their entireties.
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| Number | Date | Country | |
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| Number | Date | Country | |
|---|---|---|---|
| Parent | 13445217 | Apr 2012 | US |
| Child | 13445457 | US |
