This application is based upon and claims the benefit of priority from Japanese Patent Application No. 2007-338230, filed on Dec. 27, 2007, the entire contents of which are incorporated herein by reference.
1. Field
One embodiment of the invention relates to a countermeasure art against deflection and warpage of a printed circuit board installed in a small-sized electronic apparatus and in particular to an electronic apparatus for making it possible to efficiently reinforce a printed circuit board.
2. Description of the Related Art
Hitherto, the slimming down and miniaturization of a portable personal computer and other small-sized electronic apparatuses have proceeded and usage of easily carrying out the electronic apparatuses has increased. However, as a casing of a small-sized electronic apparatus and a printed circuit board installed therein are also slimmed down, deflection or warpage occurs due to overload, etc., and the apparatus performance may be affected.
Hitherto, various printed circuit board reinforcing measures have been adopted. For example, an art has been proposed wherein a reinforcing member provided by bending sheet metal as angular U-shaped in cross section is fitted into a periphery of a printed circuit board with a spring property, thereby providing a warpage prevention structure of the printed circuit board (see JP-A-4-284692, for instance).
Described above in JP-A-4-284692 is the warpage prevention structure wherein a reinforcing member provided by bending sheet metal as angular U-shaped in cross section is fitted around a rectangular printed circuit board with a spring property, thereby providing the warpage of the printed circuit board and a structure wherein the sheet metal is attached to three edges of the rectangular printed circuit board and the printed circuit board has a connector on the remaining edge.
However, to provide a not rectangular but polygonal printed circuit board, for example, with such a reinforcing member, dedicated components to the polygonal printed circuit board is required and the number of components and a weight are increased. The art is hard to apply to an electronic apparatus including a certain shaped board having an area where the bending stress in a board thickness direction concentrates because of the difference of at least either of the board width and the length, such as the polygonal printed circuit board.
A general architecture that implements the various feature of the invention will now be described with reference to the drawings. The drawings and the associated descriptions are provided to illustrate embodiments of the invention and not to limit the scope of the invention.
Various embodiments according to the invention will be described hereinafter with reference to the accompanying drawings. In general, according to one embodiment of the invention, an electronic apparatus includes: a polygonal printed circuit board provided with a cutout portion at least in a part, the cutout portion defined by at least a first edge and a second edge; and a first electronic component mounted on the printed circuit board; wherein the first electronic component is mounted at a position crossing a line defined by the first edge on the printed circuit board.
An embodiment of an electronic apparatus according to the invention will be discussed with reference to the accompanying drawings.
As shown in
The cutout portion 20 is a part of a battery housing area 4 of the casing 2, for example, and the area adjacent to the battery housing area 4 is a housing area 5 of a hard disk drive, etc.
Three corners other than the corner to which the cutout portion 20 belongs in the printed circuit board 3 are fixed to the casing 2 with fasteners 7a, 7b, 7c, and 7d of screws, etc. A connector 9 and a module board 10 are provided on a back 3g of the printed circuit board 3.
As shown in
Then, in the embodiment, the connector 9 is placed on the line X-X on which a stress concentrates on the printed circuit board 3, and is joined to the printed circuit board 3. The connector 9 is placed crossing the line X-X on which a stress concentrates, whereby it is used as a reinforcement member against deflection and warpage of the printed circuit board so as to reinforce the printed circuit board 3 and lightening the bending stress.
The module 10 is placed on the line Y-Y on which a stress concentrates like the line X-X on the printed circuit board 3, and is joined to the printed circuit board 3. The module 10 is placed crossing the line Y-Y on which a stress concentrates, whereby it is used as a reinforcement member against deflection and warpage of the printed circuit board so as to reinforce the printed circuit board 3 and lighten the bending stress.
The connector 9 includes a solder fixing terminal 11 provided in a side end part, signal connection terminals 12, and peripheral terminals (not shown) and a joint part 9a to the printed circuit board 3 is welded and joined roughly as a whole through the terminals. The printed circuit board 3 and the connector 9 are integrated into one by the welding, so that the strength against the bending of the printed circuit hoard 3 is still more enhanced. The connector 9 is provided with the signal connection terminals 12, as shown in
The connector 9 includes the solder fixing pad 11 provided in the side end part and a peripheral pad (not shown), and the joint part 9a to the printed circuit hoard 3 is welded and joined roughly as a whole through the pad. The printed circuit board 3 and the connector 9 are integrated into one by the welding, so that the strength against the bending of the printed circuit board 3 is still more enhanced. The connector 9 is provided with the signal connection terminals 12, as shown in
As shown in
The described module 10 is not directly joined to the printed circuit board 3 unlike the connector 9. However, the module 10 is placed crossing the line Y-Y on which a stress concentrates through the metal spacer 14, the screw member 15, and the housings 16 and 17, whereby it can reinforce the printed circuit board 3. Accordingly, the module 10 functions as a reinforcement member against deflection and warpage of the printed circuit board 3 as it lightens the bending stress imposed on the printed circuit board 3.
As described above, in the embodiment, the connector 9 and the module 10 as the electronic components mounted on the printed circuit board 3 are placed at the positions crossing the lines on which a stress concentrates, whereby the connector 9 and the module 10 can be used as reinforcement members against deflection and warpage of the printed circuit board. Therefore, they can also be applied as the reinforcement members against deflection and warpage of the printed circuit board 3 to the configuration including an oddly shaped board having a part on which the bending stress in the board thickness direction concentrates because of the difference of the board width, the length, etc., a special component dedicated to reinforcement is not required, an increase in the weight of the electronic apparatus 1 can be prevented, and a large mount space and sheet metal are not required. Thus, the advantages of reducing the cost, improvement of applicability to a small-sized electronic apparatus, etc., are provided.
According to the embodiment, the connector 9 of the electronic component as the reinforcement member is joined and fixed to the board face containing the part of the printed circuit board 3 on which a stress concentrates, so that a large reinforcement effect can be provided. Particularly, the connector 9 includes the solder fixing terminal 11 and the joint strength can be enhanced by welding to the printed circuit board 3.
The module 10 used as the reinforcement member is not directly joined to the printed circuit board 3, but crosses the stress concentration point through the metal spacer 14, the screw member 15, the housings 16 and 17, and the connection terminals 16a and 17a and can reinforce the printed circuit board 3.
The shape of the printed circuit board 3 to which the invention is applied is not limited to that in the embodiment described above.
For example, like a printed circuit board 21 shown in
Even in the printed circuit board 21 shown in
Like a printed circuit board 23 shown in
In the printed circuit board 23 shown in
As described above, according to the embodiment of the invention, there can be provided an electronic apparatus for making it possible to reinforce a printed circuit board without adding a dedicated reinforcement member onto the printed circuit board.
It is to be understood that the invention is not limited to the above-described specific embodiment thereof and various modifications may be made without departing from the spirit and the scope of the invention.
Number | Date | Country | Kind |
---|---|---|---|
2007-338230 | Dec 2007 | JP | national |