This application is based upon and claims the benefit of priority of the prior Japanese Patent Application No. 2017-28815, filed on Feb. 20, 2017, the entire contents of which are incorporated herein by reference.
The embodiment discussed herein is related to an electronic component.
There is a surface mount electronic component (a surface mount component) such as an aluminum electrolytic capacitor. This type of electronic component has, for example, an electronic component main body, a case that houses the electronic component main body, a seal member that seals an opening of the case, an insulation plate facing the seal member, and a pair of leads extending out from the component main body. The pair of leads penetrates through the seal member and the insulation plate, and are soldered to a board.
Here, the seal member is provided with a pair of lock members. The pair of lock members penetrate through the insulation plate, and are soldered to the board. The case is fixed onto the board with the pair of lock members, and thus vibration of the case and the leads are reduced.
However, the pair of lock members are provided on the seal member; that is, the case is fixed onto the board via the pair of lock members and the seal member. Thus, there is a possibility that the vibrations of the case and the pair of leads are not reduced enough, stress is accordingly concentrated at a joint between the pair of leads and the board, and finally the pair of leads break.
The followings are reference documents.
According to an aspect of the invention, an electronic component includes a main body mounted over a board, a case that houses the main body, a base member that is arranged between the case and the board, a lead that extends out from the main body and penetrates through the base member to be joined onto the board, and a leg that extends out from the case and penetrates through the base member to be joined to the board.
The object and advantages of the invention will be realized and attained by means of the elements and combinations particularly pointed out in the claims.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are not restrictive of the invention, as claimed.
An embodiment of the technology disclosed in the present application is hereinafter described.
[Electronic Component]
As illustrated in
[Electronic Component Main Body]
The electronic component main body 12 may be an element (an internal element) for a capacitor having anode aluminum foil, electrolytic paper, cathode aluminum foil, and electrolyte, for example. In addition, the electronic component main body 12 has a pair of leads (lead wires) 14. This electronic component main body 12 is housed in the case 20. The pair of leads 14 are described later.
[Case]
The case 20 is formed of a metal such as aluminum. This metallic case 20 is shaped as a pipe including closed one end. In specific, the case 20 has a pipe portion 22 and a bottom wall 24. The pipe portion 22 is shaped as a pipe (a cylinder). The bottom wall 24 is provided on the one end side in the axial direction of this pipe portion 22. The bottom wall 24 closes an opening at the one end side of the pipe portion 22. The pipe portion 22 has a constriction 22A, which is described later.
As illustrated in
As illustrated in
[Seal Member]
The seal member 30 is formed of an elastic body such as rubber, for example. In addition, as illustrated in
A portion of the pipe portion 22 in which the seal member 30 is fitted is swaged by processing such as raising. This forms the constriction 22A that makes a dent on the pipe portion 22, and while the seal member 30 is fixed in the pipe portion 22, the seal member 30 seals the opening 26 of the case 20.
After the seal member 30 seals the opening 26 of the case 20, the folded portions 28 are formed on the case 20 as depicted by a long dashed double-short dashed line. These folded portions 28 support the seal member 30, and thus the seal member 30 is inhibited from being dropped out.
[Base Member]
As illustrated in
A height adjuster 32 protruding toward the base member 40 is provided on the seal member 30. The height adjuster 32 is integrally formed with the seal member 30. As appropriate, it is possible to omit the seal member 30 and the height adjuster 32.
As illustrated in
As depicted by a long dashed double-short dashed line in
Meanwhile, a portion on a further proximal side (the electronic component main body 12 side) of the lead 14 from the bend portion 14B may be a wiring portion 14A that connects the electronic component main body 12 and the terminal 14C. The wiring portion 14A extends out from the electronic component main body 12 and passes through the lead through-hole 42.
As illustrated in
The multiple leg through-holes 44 are formed in the outer periphery of the base member 40. Each of the multiple leg through-holes 44 may be a rectangular through-hole penetrating through the base member 40 in the thickness direction. These multiple leg through-holes 44 are arranged at a distance from each other in the outer periphery of the base member 40 so as to surround the lead through-holes 42. Each of the legs 50 of the case 20 passes through the corresponding leg through-hole 44.
[Leg]
As illustrated in
As depicted by a long dashed double-short dashed line in
Meanwhile, a portion on a further proximal side (the opening 26 side) of the leg 50 from the bend portion 50B may be a stopper 50A. The stopper 50A extends out from the periphery 26E of the opening 26 (see
As illustrated in
A surface of the joint 50C on the board 60 side (the opposite side of the base member 40) may be a joint surface 50C1. Meanwhile, as illustrated in
As illustrated in
Likewise, an edge 42E1 of the lead through-hole 42 is arranged on one side in the predetermined direction (the direction of arrow K) of the wiring portion 14A of the lead 14. A clearance S1 is formed between this edge 42E1 and the wiring portion 14A. Meanwhile, an edge 42E2 of the lead through-hole 42 is arranged on the other side in the predetermined direction of the wiring portion 14A of the lead 14. A clearance S2 is formed between this edge 42E2 and the wiring portion 14A.
In this case, the clearance S1 on the one side in the predetermined direction of the wiring portion 14A may be equal to or larger than the clearance T1 on the one side in the predetermined direction of the stopper 50A (S1≥T1). Likewise, the clearance S2 on the other side in the predetermined direction of the wiring portion 14A may be equal to or larger than the clearance T2 on the other side in the predetermined direction of the stopper 50A (S2≥T2). Thus, when the base member 40 vibrates in a predetermined direction, the stopper 50A contacts the edges 44E1 and 44E2 of the leg through-hole 44 before the wiring portion 14A contacts the edges 42E1 and 42E2 of the lead through-hole 42.
Note that, in this embodiment, a size of a portion such as the leg through-hole 44 is set such that the stopper 50A contacts the edges of the leg through-hole 44 before the wiring portion 14A contacts the edges of the lead through-hole 42 even when the base member 40 vibrates in a direction crossing the predetermined direction.
[Operations]
Next, operations of this embodiment are described.
In addition, when the base member 40 vibrates in the orthogonal (the direction of arrow V) direction, there is a possibility that the edge 42E of the lead through-hole 42 contacts the bend portion 14B of the lead 14 and finally that bend portion 14B breaks.
On the other hand, in this embodiment, the case 20 of the electronic component 10 has the multiple legs 50, as illustrated in
With this, vibrations of the case 20 and the pair of leads 14 extending out from the electronic component main body 12 housed in the case 20 are reduced. This lessens the stress applied to the bend portions 14B of the pair of leads 14. Thus, the bend portions 14B of the pair of leads 14 are inhibited from being broken.
In addition, the legs 50 may be formed integrally with the case 20. In other words, the legs 50 may be a portion of the case 20. In this embodiment, the number of parts of the electronic component 10 is accordingly less than that in the case where the legs 50 and the case 20 are formed as different pieces. Thus, for example, the number of steps for assembling the electronic component 10 is decreased.
Moreover, the surface processing for soldering is applied to the joint surface 50C1 of the joint 50C of each leg 50. This makes soldering-joint between the joint 50 and the corresponding leg pattern 64 easy.
Further, the joint 50C of the leg 50 is arranged along the facing surface 40A of the base member 40. The base member 40 is held between this joint 50C and the folded portion 28 of the case 20. This also reduces vibration of the base member 40. As a result, contact between each bend portion 14B of the lead 14 and the edge 42E of the corresponding lead through-hole 42 is inhibited. Thus, the bend portion 14B of the lead 14 is inhibited from being broken.
In this case, for example, a desirable vibration strength desirable for an electronic component used in a vehicle and the like having severe vibrations is an acceleration of at least 500 m/s2. Regarding this, a vibration strength of the electronic component 10 according to this embodiment is an acceleration of about 700 m/s2, and thus it is possible to meet the above desirable vibration strength. On the other hand, a vibration strength of an electronic component having no legs such as the legs 50 in this embodiment is an acceleration of about 100 m/s2, which does not meet the above desirable vibration strength.
In addition, as illustrated in
With this, when the base member 40 vibrates in the predetermined direction (the direction of arrow K), the stopper 50A contacts the edges 44E1 and 44E2 of the leg through-hole 44 before the wiring portion 14A contacts the edges 42E1 and 42E2 of the lead through-hole 42. Thus, the bend portion 14B of the lead 14 is inhibited from being broken.
Likewise, also when the base member 40 vibrates in the direction orthogonal to the predetermined direction, the stopper 50A contacts the edges of the leg through-hole 44 before the wiring portion 14A contacts the edges of the lead through-hole 42. Thus, the bend portion 14B of the lead 14 is inhibited from being broken.
If the stopper 50A is allowed to contact the edges of the leg through-hole 44 before the wiring portion 14A contacts the edges of the lead through-hole 42 like this, it is possible to increase the vibration strength of the above-described electronic component 10 as an acceleration of about 1000 m/s2.
In addition, in this embodiment, the base member 40 insulates the terminals 14C of the pair of leads 14 from the case 20. Further, each of the terminals 14C of the leads 14 and each of the joints 50C of the legs 50 are arranged at a distance from each other. This inhibits short-circuit of the terminals 14C of the pair of leads 14.
[Modification]
Next, a modification of the above embodiment is described.
In the above embodiment, the joints 50C of the legs 50 are bent toward the center side of the base member 40; however, the joints 50C of the legs 50 may be bent toward the outer periphery side of the base member 40.
In addition, in the above embodiment, the leads 14 and the legs 50 are soldered to the board 60 while the distal sides thereof are bent; however, the leads and the legs may be joined onto the board 60 without being bent.
Moreover, as appropriate, shapes and arrangements of the legs 50 may be changed. Further, the case 20 may be provided with at least one leg 50.
Furthermore, in the above embodiment, the leads 14 and the legs 50 are soldered to the board 60; however, the leads 14 may be electrically joined onto the board 60 by brazing, bonding, or the like. In addition, the legs 50 may be joined onto the board 60 by brazing, bonding, or the like. Note that it is unnecessary to electrically join the legs 50 and the board 60.
In the above embodiment, the clearance S1 on the one side in the predetermined direction of the wiring portion 14A may be equal to or larger than the clearance T1 on the one side in the predetermined direction of the stopper 50A (S1 T1); however, the clearance S1 of the wiring portion 14A may be smaller than the clearance T1 of the stopper 50A (S1<T1). Likewise, although the clearance S2 on the other side in the predetermined direction of the wiring portion 14A may be equal to or larger than the clearance T2 on the other side in the predetermined direction of the stopper 50A (S2≥T2), the clearance S2 of the wiring portion 14A may be smaller than the clearance T2 of the stopper 50A (S2<T2).
In the above embodiment, when the base member 40 vibrates in the direction orthogonal to the predetermined direction, the stopper 50A contacts the edges of the leg through-hole 44 before the wiring portion 14A contacts the edges of the lead through-hole 42; however, when the base member 40 vibrates in the direction orthogonal to the predetermined direction, the wiring portion 14A may contact the edges of the lead through-hole 42 before the stopper 50A contacts the edges of the leg through-hole 44.
In the above embodiment, the case 20 may be made of a metal; however, the case may be made of resin or the like. For example, when the leads 14 have insulating coating, the base member may not be limited to be an insulation plate and may be another member.
As appropriate, the above embodiment is not limited to be applied to an aluminum electrolytic capacitor, and it is possible to apply the above embodiment to another electronic component.
All examples and conditional language recited herein are intended for pedagogical purposes to aid the reader in understanding the invention and the concepts contributed by the inventor to furthering the art, and are to be construed as being without limitation to such specifically recited examples and conditions, nor does the organization of such examples in the specification relate to a showing of the superiority and inferiority of the invention. Although the embodiment of the present invention has been described in detail, it should be understood that the various changes, substitutions, and alterations could be made hereto without departing from the spirit and scope of the invention.
Number | Date | Country | Kind |
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2017-028815 | Feb 2017 | JP | national |