Electronic device

Abstract

By reducing the number of inspection lands, a substrate is downsized, so that it is possible to downsize an electronic device as securing the connection reliability. Therefore, the electronic device according to the present invention is configured in such a manner that a plurality of inspection circuits is arranged to inspect the connection condition of an IC and the substrate, and respective inspection circuits are connected by the wire on the IC or the substrate. As a result, the electronic device according to the present invention allows the conditions of a plurality of inspection circuits to be inspected all at once by means of inspection lands at two positions.

Description

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention relates to an electronic device, in which a semiconductor element is utilized. Particularly, the present invention relates to a circuit, on which a driver IC for driving a display panel as a functional element used in a portable device or the like and an electronic databook, a memory and a controller or the like are bare-chip mounted, and an electronic device having this circuit.

[0003] 2. Description of the Related Art

[0004] Conventionally, in the case of mounting a semiconductor chip, by using a bump formed on a pat of an IC chip, the semiconductor chip is welded by pressure on a substrate by means of an anisotropic conductive film, or a silver paste is printed on the bump to be connected to the substrate with underfill filled therebetween, so that the semiconductor chip is connected on the substrate. As a bump, a stud bump and a plating bump formed by plating the Au bump are used.

[0005] In addition, by using a metal diffusion contact, the semiconductor chip could be mounted on the substrate. In this case, according to one known method, by using solder as a bump on the IC, the semiconductor chip is soldered on an electrode of a substrate and the underfill is filled therebetween. In addition, according to another known method, by using Au as a bump on the IC, Sn plating is provided on the electrode of the substrate, Au—Sn diffusion connection is performed between the Au bump of the IC and the Sn plating electrode of the substrate, and then, the underfill is filled therebetween.

[0006] In the case of evaluating the connection condition of the semiconductor IC that has been mounted as described above, a method is utilized such that a signal is inputted to confirm an output waveform and another method is utilized such that the connection condition is judged by its appearance. As a defect of mounting, the connection defect when the inclination of a bonding head is deviated and a mounting positional deviation may be considered.

[0007] In a face down mounting of the semiconductor IC, since a circuit surface of the IC and a terminal surface of the substrate are bonded, the connection part is invisible, so that this defect cannot be confirmed. Therefore, in order to confirm the connection condition, the bonded part is broken down to observe the connection part. However, this method has a problem such that a product is not capable of being inspected one by one.

[0008] In addition, according to the method for confirming the output waveform inputting a signal to the IC, an inspection device becomes expensive and it takes a long time to inspect all products. Furthermore, the connection appearance is not unobservable, so that it is not possible to inspect the positional deviation.

[0009] Therefore, in order to inspect the connection and the positional deviation, an inspection bump and an inspection pattern are disposed at each corner of the semiconductor IC and on a flexible substrate, respectively, and the connection is confirmed in an open or short condition. If the connection at each corner is established, the correlation data may be utilized such that there is no problem in the connection. In this case, making a prober contact a land for inspection, which is derived from each corner, the inspection is performed. As shown in FIG. 11, at each corner of the IC1 which is mounted on a flexible substrate connected to the display panel 6, the inspection land 4 is provided, respectively. However, it is the often the case that it is difficult to arrange the inspection land at each corner in the product design. In the case that the inspection land is installed at each corner, as seen by the display unit shown in FIG. 11, it involves a problem such that the outer shape of the product becomes large due to the installation of the inspection land. In order to reduce the size of the outer shape of the product, from two opposing corners of the IC or from two positions on a longer side of the IC, the inspection land is derived to perform the inspection. However, the mounting-defect of the corner at an uninspected portion was not capable of being inspected, so that a defective flow is observed. In the case of automatic mounting, the mounting of the IC involves a problem of loose amount of defective products during the positional deviation and the parallelism deviation.

SUMMARY OF THE INVENTION

[0010] The present invention has been made taking the foregoing problems into consideration, an object of the present invention is to make the mounting density of a flexible substrate higher by reducing the number of lands for inspection at respective corners and further, by making the flexible substrate smaller, to improve a degree of accuracy of the inspection in the connection inspection.

[0011] In order to attain the above described object, an IC for controlling the driving of a functional element is face-down mounted on a substrate, on which a pattern is printed, and further, in an electronic device, in which this substrate is electrically connected to the functional element, in order to electrically inspect the mounting position of the IC bumps and the pattern on the substrate at a plurality of positions, an inspection circuit is configured by an electrode and a wire, which are formed on the IC and the substrate, respectively. The inspection circuit is formed on the IC and the flexible substrate of each position where the inspection is performed, and depending on the connection condition, the inspection circuit is electrically open or short. In addition, in order to inspect a plurality of the inspection circuits together, the plural inspection circuits are connected to each other through the wire of the IC or the wire of the flexible substrate so as to inspect the plural inspection circuits at the same time, so that, independent of the number of the inspection parts, the number of the inspection lands could be reduced to two.

[0012] In addition, a dummy bump is installed on the IC. By connecting at least one of the inspection circuits to this dummy bump, and connecting the dummy bump and the inspection land of the flexible substrate, a pattern provided with the inspection land may be derived at an arbitrary position in the above-described configuration of the inspection circuit. In the display unit that is produced based on such a configuration, it is easy to dispose the land for inspecting the IC mounting, and in accordance with this, the density of the mounted parts can be higher. In addition, this leads to downsizing of the flexible substrate. Further, since the inspection of the positional deviation is capable of being performed reliably, the feedback of mounting in a step becomes easier, and the defect may be reduced, which is generated by the delay of the feedback. In addition, a quality of the product has been improved.

BRIEF DESCRIPTION OF THE DRAWINGS

[0013] FIG. 1 is a top view of a circuit surface of an IC according to a first embodiment of the present invention;

[0014] FIG. 2 is a top view of a flexible substrate according to the first embodiment of the present invention;

[0015] FIG. 3 is a perspective view for showing a configuration of an inspection circuit according to the first embodiment of the present invention;

[0016] FIG. 4 is a top view of a display unit according to the first embodiment of the present invention;

[0017] FIG. 5 is a top view of an IC circuit surface according to a second embodiment of the present invention;

[0018] FIG. 6 is a top view of a flexible substrate according to the second embodiment of the present invention;

[0019] FIG. 7 is a perspective view for showing a configuration of an inspection circuit according to the second embodiment of the present invention;

[0020] FIG. 8 is a top view of an IC circuit surface according to a third embodiment of the present invention;

[0021] FIG. 9 is a top view of a flexible substrate according to the third embodiment of the present invention;

[0022] FIG. 10 is a perspective view for showing a configuration of an inspection circuit according to the third embodiment of the present invention; and

[0023] FIG. 11 is a schematic view for showing a conventional display unit.

DETAILED DESCRIPTION OF THE INVENTION

[0024] In an electronic device according to the present invention, an IC, in which an inspection bump used for mounting inspection, or a bump that does not interfere with other signal electrode is provided, is used.

[0025] The electronic device according to the present invention may include a substrate, on which an IC is mounted; a plurality of inspection circuits for electrically inspecting a mounting condition, which is located at a plurality of positions on the IC and the substrate; a plurality of inspection lands, which is connected to the inspection circuits of the flexible substrate; and a functional element, which is connected to the substrate; wherein, the inspection circuit is provided with a plurality of inspection pads formed on the IC and a plurality of inspection patterns formed on the substrate so as to correspond to the inspection pads; and the inspection pad and the inspection pattern are formed so that the inspection lands are electrically connected with each other only by mounting the IC on the substrate.

[0026] In addition, the electronic device according to the present invention may include an IC, on which a plurality of inspection pads is formed; a substrate, on which a plurality of inspection patterns formed so as to correspond to the inspection pads, and a pair of inspection lands connected to some of the inspection patterns, are formed; and a functional element connected to the substrate and is activated by the IC; wherein the inspection pad and the inspection pattern are arranged and wired so that the inspection lands are electrically connected with each other only by mounting the IC on the substrate.

[0027] In addition, the inspection pad and the inspection pattern are formed at a corner of the IC. Alternatively, the inspection pad is disposed at the midstream of the pad array of the IC and the inspection land is connected to the inspection pattern corresponding to the inspection pad at the midstream.

[0028] In addition, the inspection pattern is formed deviated from the right position of the inspection pad, the inspection pad and the inspection pattern are arranged and wired so that it is between the inspection lands open electrically when the IC is mounted on the substrate with deviation. Accordingly, when the deviation amount is set to the limitation value of a positional deviation allowable range, it is possible to judge whether or not the position adjustment is achieved. In addition, the patter for inspection may be arranged with deviation by a margin amount of the positional deviation.

[0029] On the contrary to the above-described configuration, in the case that the IC is mounted on the substrate with deviation, the inspection pad and the inspection pattern may be arranged and wired so that the inspection lands are conducted with each other. In other words, the electronic device according to the present invention may be designed so that it is defined as good in open and is defined as no-good in conduction.

[0030] In this way, in the case of detecting the mounting positional deviation, it is desirable that the inspection pad portion at each corner is configured by a pad arranged along the direction of the X axis and a pad along the Y axis. This enables the positional deviation in either of the direction of X axis or the Y axis to be detected with a high degree of accuracy.

[0031] In addition, in order to further improve the degree of accuracy in the positional deviation, the inspection pads of the IC are continuously formed with the same pitch as that, of the signal electrode pad of the IC. The IC inspection pads are connected through the pattern that is placed in the area outside of the IC bump or the pattern that is placed within the circuit, in accordance with the number of aluminum layers. On the other hand, the inspection patterns are connected to the surface of the substrate through a pattern wire formed on the substrate. It is made open between the inspection patterns in one location. Then, by using the inspection lands derived from its opposite ends, the inspection is carried out. Even the product that was defined as no-good by the electrical inspection using the above inspection land may be good in an external view inspection and an conduction inspection depending on measure accuracy of a bump and pattern accuracy.

[0032] In addition, without arranging the inspection land at the corner of the IC, it is possible to derive the inspection land through a pad, which is electrically independent and is located in the vicinity of the area where the inspection land is desirably placed, or a pad, which counts for nothing in the conduction inspection operation. This enables the inspection land to be located at an arbitrary position in accordance with the design of the circuit of the substrate, so that it is possible to make the density of the mounting of the substrate higher.

[0033] A display unit according to an embodiment of the present invention will be described with reference to the drawings below.

[0034] (A First Embodiment)

[0035] FIG. 1 is a top view of a circuit surface of an IC1. On the IC1, a pad 2 is formed on the outer periphery thereof. On the pad 2, a bump made of gold is placed. At each corner of the IC, inspection pad portions 21, 22, 23, and 24 are formed. Each inspection pad portion is configured by two pads along the X-axis and two pads along the Y-axis, namely, a total of four inspection pads. As shown in the drawing, according to the present embodiment, a pad 212 and a pad 213, which are arranged at the end portions along the X-axis and the Y-axis in the inspection pad portion 21, are electrically connected through an aluminum electrode. In addition, a pad 211 configuring the inspection pad portion 21 is connected to a pad 241 configuring the adjacent inspection pad portion 24 through the wire on the outer periphery of the IC1. In the same way, the pad 214 configuring the inspection pad portion 21 is connected to a pad 224 configuring the adjacent inspection pad portion 22 through the wire on the outer periphery of the IC1. Basically the same applies to the other inspection bump portions 22, 23, and 24. FIG. 2 is a top view of a pattern 3, which is the IC connection portion of a flexible substrate 5. In the flexible substrate 5, on a polyimide film of 25 μm, a seed layer is deposited in order to improve the adhesiveness, Cu is deposited by about 2000 μ, a base material to which an electrolytic Cu plating of about 8 μm is patterned, and a pure Sn layer of 0.2 μm is formed by an electroless Sn plating. Inspection patterns 31, 32, 33, and 34 are disposed, respectively, so as to be opposed to each inspection pad of the IC1. Each inspection pattern is provided with four pads. As shown in the drawing, two pads arranged on the X-axis side are electrically connected, and two pads arranged on the Y-axis side are electrically connected. According to the present embodiment, two pads on the Y-axis side configuring the inspection pattern 31 are not electrically connected but they are used as an inspection land 4. The IC1 and the flexible substrate 5, which are configured in this way, are connected to each other through the Au—Sn eutectic bonding. The wiring after connection is shown by a pattern diagram when the IC is seen through in FIG. 3. As being apparent from the drawing, the inspection lands are electrically connected with each other only by mounting the IC1 on the flexible substrate 5. Then, when the electrical characteristics between two inspection lands 4 is open the product can be judged to be no-good, and when the electrical characteristics between two inspection lands 4 is conductive, the product can be judged to be good. In this way, the inspection circuit is configured by wiring between the inspection pad disposed on the IC and the pad formed by necessity, and the wiring between the inspection pattern applied to the substrate and the pad formed by necessity.

[0036] In the case that the product is judged to be good, the underfill is injected to harden the semiconductor IC. Further, the parts such as a capacitor or the like are connected to the substrate by soldering and the substrate is connected to the display panel by means of an anisotropic conductive film. A molding appearance of the display module that is produced in this way is shown in FIG. 4. As shown in the drawing, the flexible substrate 5, on which the IC1 and a part 7 are mounted, is connected to the display panel 6. In addition, the device is further downsized as a result of reduction of the number of inspection lands 4 from eight places to two places compared with the conventional configuration as shown in FIG. 11.

[0037] The inspection circuits are not necessarily placed at four corners but they may be placed at two places in the case of a slim-type IC. In addition, the inspection circuits may be placed at four and more places. The wiring to connect the inspection circuits with each other is not necessarily disposed to either of the IC or the flexible substrate. The inspection circuits may be connected by wirings formed at the both of the IC and the flexible substrate.

[0038] (A Second Embodiment)

[0039] FIG. 5 is a top view of a circuit surface of the IC1. FIG. 6 is a top view of the pattern 3 of the IC connection portion on the flexible substrate 5. In the present embodiment, the inspection pattern of the flexible substrate 5 and the wiring of the inspection pad of the IC1 are configured contrary to the first embodiment, so that the same description as the first embodiment will be omitted.

[0040] As shown in FIG. 5, two pads 211 and 212, which are arranged on the X axis side in the inspection pad portion 21 of the IC1, are electrically connected through the aluminum electrode, and two pads 213 and 214, which are arranged on the Y axis side in the inspection pad portion 21 of the IC1, are electrically connected through the aluminum electrode. On the other hand, the inspection patterns 31, 32, 33, and 34 are disposed, respectively, so as to be opposed to each inspection pad of the IC1. Each inspection pattern is provided with four pads in the same way as the inspection pad. As shown in the drawing, the pads 322 and 323 arranged at the end portions on the X axis side and on the Y axis side are electrically connected, and the pad 321 configuring the inspection pattern 32 is electrically connected to the pad 331 of the adjacent inspection pattern 33. According to the present embodiment, two pads 312 and 313 configuring the inspection pattern 31 are not electrically connected but they are used as an inspection 1 and 4. The position where the inspection 1 and is derived is not limited to this position. The ICI and the flexible substrate 5, which are configured in this way, are connected to each other through the Au—Sn eutectic bonding. The wiring after connection is shown by a pattern diagram when the IC is seen through in FIG. 7. As being apparent from the drawing, the inspection lands are electrically connected with each other only by mounting the IC on the flexible substrate 5. Then, when the electrical property between two inspection lands 4 is open, the product can be judged to be no-good and when the electrical property between two inspection lands 4 is conductive, the product can be judged to be good.

[0041] Further, since the positional deviation is inspected with the mounting margin included, the inspection patterns 31, 32, 33, and 34 of the flexible substrate 5 are arranged in advance so that they do not overlap the inspection pads of the IC. It is judged whether or not the product judged to be no-good is substantially no-good depending on its molding appearance.

[0042] (A Third Embodiment)

[0043] FIG. 8 is a top view of a circuit surface of the IC1. FIG. 9 is a top view of the pattern 3 of the IC connection portion on the flexible substrate 5. According to the present embodiment, a dummy pad 25 is provided at the position except for the corner portion of the IC, and by using this dummy pad, the inspection land is derived on the flexible substrate 5. Here, the same description as the first embodiment will be appropriately omitted. As shown in the drawing, on the flexible substrate 5, the inspection patterns 31, 32, 33, and 34 are disposed, respectively, so as to be opposed to each inspection pad of the IC1. The inspection land 4 is derived through the position connecting the dummy pad 25 of the IC1. The position where the inspection land is derived is not restricted to this position. The ICI and the flexible substrate 5, which are configured in this way, are connected to each other through Au—Sn eutectic bonding. The wiring after connection is shown by the pattern diagram when the IC is seen through in FIG. 10. When the electrical property between two inspection lands 4 is open, the product can be judged to be no-good and when the electrical property between two inspection lands 4 is conductive, the product can be judged to be good. Since the positional deviation is inspected with the mounting margin included, the inspection patterns 31, 32, 33, and 34 of the flexible substrate 5 are arranged in advance, so that they do not overlap the inspection pads of the IC1. It is judged whether or not the product judged to be no-good is substantially no-good depending on its molding appearance.

[0044] Such a configuration facilitates the position where the inspection land 4 is derived, so that the device is capable of being more downsized.

[0045] According to each of the above described embodiments, the position where the inspection pad of the IC1 and the inspection pattern of the flexible substrate are formed is determined so that the inspection lands are electrically connected with each other in the case that the IC1 is mounted on the flexible substrate 5 with the favorable positioning and the favorable connection condition. On the other hand, the position where the inspection pad of the IC and the inspection pattern of the flexible substrate are formed may be determined so that the inspection lands are electrically connected with each other in the case that the IC is mounted on the flexible substrate 5 with the unfavorable positioning. In this case, it is possible to detect whether or not the positioning is favorable, however, it impossible to detect whether or not the connection condition of the IC and the substrate is favorable by itself.

[0046] According to the present invention, the number of the inspection lands is reduced from eight to two compared with the conventional configuration shown in FIG. 11, so that the mounting area is reduced. As a result, the size of the flexible substrate 5 is downsized, the display module is downsized, and a price of the flexible substrate is decreased, so that it is possible to provide a cheep display module.

Claims

1. An electronic device comprising: a substrate, on which an IC is mounted; a plurality of inspection circuits for electrically inspecting a mounting condition, which is located at a plurality of positions on the IC and the substrate; a plurality of inspection lands, which is connected to the inspection circuits of the flexible substrate; and a functional element, which is connected to the substrate, wherein, the inspection circuit is provided with a plurality of inspection pads, which is formed on the IC, and a plurality of inspection patterns, which is formed on the substrate so as to correspond to the inspection pads; and the inspection pad and the inspection pattern are formed so that the inspection lands are electrically connected with each other only by mounting the IC on the substrate.

2. An electronic device comprising: an IC, on which a plurality of inspection pads is formed; a substrate, on which a plurality of inspection patterns, which is formed so as to correspond to the inspection pads, and a pair of inspection lands, which is connected to some of the inspection patterns, are formed; and a functional element, which is connected to the substrate and is activated by the IC, wherein the inspection pad and the inspection pattern are arranged and wired so that the inspection lands are electrically connected with each other only by mounting the IC on the substrate.

3. An electronic device according to claim 2, wherein the inspection pad and the inspection pattern are formed at a corner of the IC.

4. An electronic device according to claim 2, wherein the inspection pad is provided at the midstream of the pad array of the IC and the inspection land is connected to the inspection pattern corresponding to the inspection pad at the midstream.

5. An electronic device according to claim 2, wherein the inspection pattern is formed with deviation from the inspection pad, and the inspection pad and the inspection pattern are arranged and wired so that the spacing between the inspection lands is made open electrically when the IC is mounted on the substrate with deviation.

6. An electronic device; comprising: an IC, on which a plurality of inspection pads is formed; a substrate, on which a plurality of inspection patterns, which is formed so as to correspond to the inspection pads, and a pair of inspection lands, which is connected to some of the inspection patterns, are formed; and a functional element, which is connected to the substrate and is activated by the IC, wherein the inspection pad and the inspection pattern are arranged so that the inspection lands are connected electrically when the IC is mounted on the substrate with deviation.