Details concerning testing solder joints

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CPC
G01R31/048

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GPHYSICS G01Measuring instruments G01RMEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES G01R31/00Arrangements for testing electric properties Arrangements for locating electric faults Arrangements for electrical testing characterised by what is being tested not provided for elsewhere

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G01R31/048Details concerning testing solder joints

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Patents Grantslast 30 patents

Information Patent Grant
Screening methodology to eliminate wire sweep in bond and assembly...
- Patent number 10,605,850
- Issue date Mar 31, 2020
- International Business Machines Corporation
- Stephen Peter Ayotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated self-coining probe
- Patent number 10,585,119
- Issue date Mar 10, 2020
- International Business Machines Corporation
- Yang Liu
- G01 - MEASURING TESTING
Information Patent Grant
Inspection apparatus and quality control system for surface mountin...
- Patent number 10,542,651
- Issue date Jan 21, 2020
- Omron Corporation
- Hiroyuki Mori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for validation of a fuse head in an electronic detonator
- Patent number 10,416,191
- Issue date Sep 17, 2019
- MAXAMCORP HOLDING, S.L.
- Luis Diego Montaño Rueda
- F42 - AMMUNITION BLASTING
Information Patent Grant
Device and method for detecting damage of electric product using di...
- Patent number 10,386,404
- Issue date Aug 20, 2019
- UNIST(ULSAN NATIONAL INSTITUTE OF SCIENCE AND TECHNOLOGY)
- Daeil Kwon
- G01 - MEASURING TESTING
Information Patent Grant
DC-DC device soldering detecting apparatus and method using the same
- Patent number 9,874,599
- Issue date Jan 23, 2018
- BOE Technology Group Co., Ltd.
- Wenkai Zhai
- G01 - MEASURING TESTING
Information Patent Grant
Ball grid array system
- Patent number 9,867,295
- Issue date Jan 9, 2018
- Dell Products L.P.
- Bhavesh Patel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of manufacturing a printed circuit...
- Patent number 9,854,672
- Issue date Dec 26, 2017
- Samsung Display Co., Ltd.
- Jung-Hoon Ku
- G02 - OPTICS
Information Patent Grant
Connection verification technique
- Patent number 9,827,629
- Issue date Nov 28, 2017
- Micron Technology, Inc.
- Thomas Kinsley
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Information output apparatus
- Patent number 9,823,292
- Issue date Nov 21, 2017
- Toyota Jidosha Kabushiki Kaisha
- Yukio Onishi
- G01 - MEASURING TESTING
Information Patent Grant
Electronic device
- Patent number 9,706,666
- Issue date Jul 11, 2017
- Kabushiki Kaisha Toshiba
- Tomoko Monda
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
System and method to monitor contact joint integrity
- Patent number 9,678,137
- Issue date Jun 13, 2017
- Dell Products L.P.
- Bhyrav M. Mutnury
- G01 - MEASURING TESTING
Information Patent Grant
Electronic apparatus, measuring method, and monitoring apparatus
- Patent number 9,500,693
- Issue date Nov 22, 2016
- Kabushiki Kaisha Toshiba
- Tomoko Monda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Screening methodology to eliminate wire sweep in bond and assembly...
- Patent number 9,470,740
- Issue date Oct 18, 2016
- International Business Machines Corporation
- Stephen Peter Ayotte
- G01 - MEASURING TESTING
Information Patent Grant
Circuit and method for detection of IC connection failure
- Patent number 9,435,842
- Issue date Sep 6, 2016
- NXP B.V.
- Cicero Silveira Vaucher
- G01 - MEASURING TESTING
Information Patent Grant
Device and system detecting breakage in dummy bumps and method thereof
- Patent number 9,383,401
- Issue date Jul 5, 2016
- Kabushiki Kaisha Toshiba
- Takahiro Omori
- G11 - INFORMATION STORAGE
Information Patent Grant
Method and apparatus for testing interconnection reliability of a b...
- Patent number 9,329,227
- Issue date May 3, 2016
- NVIDIA Corporation
- Dongji Xie
- G01 - MEASURING TESTING
Information Patent Grant
Stack including inspection circuit, inspection method and inspectio...
- Patent number 9,229,052
- Issue date Jan 5, 2016
- Kabushiki Kaisha Toshiba
- Mitsuyoshi Endo
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus and method for detecting the abnormal soldering of an ele...
- Patent number 9,103,867
- Issue date Aug 11, 2015
- Shenzhen China Star Optoelectronics Technology Co., Ltd.
- Mingfeng Deng
- G01 - MEASURING TESTING
Information Patent Grant
Electronic apparatus, a method for estimating a break, and a method...
- Patent number 9,091,610
- Issue date Jul 28, 2015
- Kabushiki Kaisha Toshiba
- Yousuke Hisakuni
- G01 - MEASURING TESTING
Information Patent Grant
Inspection of ball grid array soldering with boundary detection usi...
- Patent number 9,084,386
- Issue date Jul 14, 2015
- Saki Corporation
- Takahiko Wada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Life predicting method for solder joint, life predicting apparatus...
- Patent number 8,965,712
- Issue date Feb 24, 2015
- Kabushiki Kaisha Toshiba
- Takahiro Omori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of simultaneous testing of multiple...
- Patent number 8,921,127
- Issue date Dec 30, 2014
- STATS ChipPAC, Ltd.
- Robert C. Frye
- G01 - MEASURING TESTING
Information Patent Grant
Solder bump testing apparatus and methods of use
- Patent number 8,917,105
- Issue date Dec 23, 2014
- International Business Machines Corporation
- David L. Gardell
- G01 - MEASURING TESTING
Information Patent Grant
Component-embedded circuit substrate and method of inspecting the same
- Patent number 8,912,802
- Issue date Dec 16, 2014
- Taiyo Yuden Co., Ltd.
- Shigeo Sakurai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit testing device and method for implementing same
- Patent number 8,901,952
- Issue date Dec 2, 2014
- European Aeronautics Defence and Space Company Eads France
- Katell Moreau
- G01 - MEASURING TESTING
Information Patent Grant
Die connection monitoring system and method
- Patent number 8,829,918
- Issue date Sep 9, 2014
- Hewlett-Packard Development Company, L.P.
- Jeffry S. Sylvester
- G01 - MEASURING TESTING
Information Patent Grant
Mechanisms for resistivity measurement of bump structures
- Patent number 8,742,776
- Issue date Jun 3, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- You-Hua Chou
- G01 - MEASURING TESTING
Information Patent Grant
Connection verification technique
- Patent number 8,590,146
- Issue date Nov 26, 2013
- Micron Technology, Inc.
- Thomas Kinsley
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 8,581,616
- Issue date Nov 12, 2013
- Kabushiki Kaisha Toshiba
- Tomoko Monda
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
SMART DECISION FEEDBACK DEVICE AND METHOD FOR INSPECTING CIRCUIT BOARD
- Publication number 20200225279
- Publication date Jul 16, 2020
- HONGFUJIN PRECISION ELECTRONICS (TIANJIN) CO.,LTD.
- QIAO-ZHONG ZHAO
- G01 - MEASURING TESTING
Information Patent Application
TEST SYSTEM FOR CHECKING ELECTRICAL CONNECTIONS OF ELECTRONIC COMPO...
- Publication number 20190265290
- Publication date Aug 29, 2019
- Endress + Hauser Flowtec AG
- Thomas Böhler
- G01 - MEASURING TESTING
Information Patent Application
TEST SYSTEM FOR CHECKING ELECTRONIC CONNECTIONS OF COMPONENTS WITH...
- Publication number 20190265289
- Publication date Aug 29, 2019
- Endress + Hauser Flowtec AG
- Thomas Böhler
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PRINTED CIRCUIT BOARD WITH CONTACTING ARRANGEMENT
- Publication number 20190235015
- Publication date Aug 1, 2019
- Endress + Hauser Flowtec AG
- Thomas Böhler
- G01 - MEASURING TESTING
Information Patent Application
LOW CYCLE FATIGUE PREVENTION
- Publication number 20190215951
- Publication date Jul 11, 2019
- HAMILTON SUNDSTRAND CORPORATION
- Mark Hamilton Severson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSOR AND CHIPSET CONTINUITY TESTING OF PACKAGE INTERCONNECT FO...
- Publication number 20190049510
- Publication date Feb 14, 2019
- Intel Corporation
- MATTHEW LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR DETECTING DAMAGE OF ELECTRIC PRODUCT USING DI...
- Publication number 20180203055
- Publication date Jul 19, 2018
- UNIST (ULSAN NATIONAL INSTITUTE OF SCIENCE AND TECHNOLOGY)
- Daeil Kwon
- G01 - MEASURING TESTING
Information Patent Application
FAULT DETECTION APPARATUS
- Publication number 20180136272
- Publication date May 17, 2018
- Toshiba Memory Corporation
- Motoshi Seto
- G01 - MEASURING TESTING
Information Patent Application
CONNECTION VERIFICATION TECHNIQUE
- Publication number 20180043450
- Publication date Feb 15, 2018
- Micron Technology, Inc.
- Thomas Kinsley
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Assembly for Prognostics of Solder Joint
- Publication number 20160146878
- Publication date May 26, 2016
- Hitachi, Ltd
- Lina Jaya DIGUNA
- G01 - MEASURING TESTING
Information Patent Application
FAULT DETECTION APPARATUS
- Publication number 20140372068
- Publication date Dec 18, 2014
- KABUSHIKI KAISHA TOSHIBA
- Motoshi SETO
- G01 - MEASURING TESTING
Information Patent Application
OPTICAL NON-DESTRUCTIVE INSPECTION APPARATUS AND OPTICAL NON-DESTRU...
- Publication number 20140321497
- Publication date Oct 30, 2014
- JTEKT Corporation
- Naoki MATSUMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT-EMBEDDED CIRCUIT SUBSTRATE AND METHOD OF INSPECTING THE SAME
- Publication number 20140285213
- Publication date Sep 25, 2014
- Taiyo Yuden Co., Ltd.
- Shigeo SAKURAI
- G01 - MEASURING TESTING
Information Patent Application
SCREENING METHODOLOGY TO ELIMINATE WIRE SWEEP IN BOND AND ASSEMBLY...
- Publication number 20140266242
- Publication date Sep 18, 2014
- International Business Machines Corporation
- Stephen Peter Ayotte
- G01 - MEASURING TESTING
Information Patent Application
STACK INCLUDING INSPECTION CIRCUIT, INSPECTION METHOD AND INSPECTIO...
- Publication number 20140210497
- Publication date Jul 31, 2014
- Mitsuyoshi ENDO
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND APPARATUS FOR TESTING INTERCONNECTION RELIABILITY OF A B...
- Publication number 20140111242
- Publication date Apr 24, 2014
- NVIDIA Corporation
- Dongji Xie
- G01 - MEASURING TESTING
Information Patent Application
CONNECTION VERIFICATION TECHNIQUE
- Publication number 20140061285
- Publication date Mar 6, 2014
- Micron Technology, Inc.
- Thomas Kinsley
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
TECHNIQUE FOR MONITORING STRUCTURAL HEALTH OF A SOLDER JOINT IN NO-...
- Publication number 20140052392
- Publication date Feb 20, 2014
- Joseph Barry BERNSTEIN
- G01 - MEASURING TESTING
Information Patent Application
Apparatus and method for detecting the abnormal soldering of an ele...
- Publication number 20140043040
- Publication date Feb 13, 2014
- Shenzhen China Star Optoelectronics Technology Co. Ltd.
- Mingfeng Deng
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC APPARATUS, A METHOD FOR ESTIMATING A BREAK, AND A METHOD...
- Publication number 20130312523
- Publication date Nov 28, 2013
- Yousuke HISAKUNI
- G01 - MEASURING TESTING
Information Patent Application
SOLDER BUMP TESTING APPARATUS AND METHODS OF USE
- Publication number 20130314117
- Publication date Nov 28, 2013
- International Business Machines Corporation
- David L. GARDELL
- G01 - MEASURING TESTING
Information Patent Application
Solder Joint Fatigue Life Prediction Method
- Publication number 20130275096
- Publication date Oct 17, 2013
- Akifumi Yoshimura
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor Device and Method of Simultaneous Testing of Multiple...
- Publication number 20130248859
- Publication date Sep 26, 2013
- STATS ChipPAC, Ltd.
- Robert C. Frye
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC APPARATUS, MEASURING METHOD, AND MONITORING APPARATUS
- Publication number 20130124118
- Publication date May 16, 2013
- Tomoko Monda
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC DEVICE AND ELECTRONIC SYSTEM
- Publication number 20120306529
- Publication date Dec 6, 2012
- Kabushiki Kaisha Toshiba
- Takahiro Omori
- G01 - MEASURING TESTING
Information Patent Application
INSPECTION APPARATUS
- Publication number 20120294508
- Publication date Nov 22, 2012
- Takahiko Wada
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
STRUCTURE FOR MEASURING BUMP RESISTANCE AND PACKAGE SUBSTRATE COMPR...
- Publication number 20120268147
- Publication date Oct 25, 2012
- Chih CHEN
- G01 - MEASURING TESTING
Information Patent Application
CIRCUIT FOR DETECTION OF FAILED SOLDER-JOINTS ON ARRAY PACKAGES
- Publication number 20120217976
- Publication date Aug 30, 2012
- Robert R. CLARKSON
- G01 - MEASURING TESTING
Information Patent Application
MECHANISMS FOR RESISTIVITY MEASUREMENT OF BUMP STRUCTURES
- Publication number 20120133379
- Publication date May 31, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- You-Hua CHOU
- G01 - MEASURING TESTING
Information Patent Application
LIFE PREDICTING METHOD FOR SOLDER JOINT, LIFE PREDICTING APPARATUS...
- Publication number 20120072129
- Publication date Mar 22, 2012
- Takahiro OMORI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Details concerning testing solder joints

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Screening methodology to eliminate wire sweep in bond and assembly...

Integrated self-coining probe

Inspection apparatus and quality control system for surface mountin...

Method for validation of a fuse head in an electronic detonator

Device and method for detecting damage of electric product using di...

DC-DC device soldering detecting apparatus and method using the same

Ball grid array system

Printed circuit board and method of manufacturing a printed circuit...

Connection verification technique

Information output apparatus

Electronic device

System and method to monitor contact joint integrity

Electronic apparatus, measuring method, and monitoring apparatus

Screening methodology to eliminate wire sweep in bond and assembly...

Circuit and method for detection of IC connection failure

Device and system detecting breakage in dummy bumps and method thereof

Method and apparatus for testing interconnection reliability of a b...

Stack including inspection circuit, inspection method and inspectio...

Apparatus and method for detecting the abnormal soldering of an ele...

Electronic apparatus, a method for estimating a break, and a method...

Inspection of ball grid array soldering with boundary detection usi...

Life predicting method for solder joint, life predicting apparatus...

Semiconductor device and method of simultaneous testing of multiple...

Solder bump testing apparatus and methods of use

Component-embedded circuit substrate and method of inspecting the same

Circuit testing device and method for implementing same

Die connection monitoring system and method

Mechanisms for resistivity measurement of bump structures

Connection verification technique

Electronic device

Patents Applicationslast 30 patents

SMART DECISION FEEDBACK DEVICE AND METHOD FOR INSPECTING CIRCUIT BOARD

TEST SYSTEM FOR CHECKING ELECTRICAL CONNECTIONS OF ELECTRONIC COMPO...

TEST SYSTEM FOR CHECKING ELECTRONIC CONNECTIONS OF COMPONENTS WITH...

PRINTED CIRCUIT BOARD WITH CONTACTING ARRANGEMENT

LOW CYCLE FATIGUE PREVENTION

PROCESSOR AND CHIPSET CONTINUITY TESTING OF PACKAGE INTERCONNECT FO...

DEVICE AND METHOD FOR DETECTING DAMAGE OF ELECTRIC PRODUCT USING DI...

FAULT DETECTION APPARATUS

CONNECTION VERIFICATION TECHNIQUE

Electronic Assembly for Prognostics of Solder Joint

FAULT DETECTION APPARATUS

OPTICAL NON-DESTRUCTIVE INSPECTION APPARATUS AND OPTICAL NON-DESTRU...

COMPONENT-EMBEDDED CIRCUIT SUBSTRATE AND METHOD OF INSPECTING THE SAME

SCREENING METHODOLOGY TO ELIMINATE WIRE SWEEP IN BOND AND ASSEMBLY...

STACK INCLUDING INSPECTION CIRCUIT, INSPECTION METHOD AND INSPECTIO...

METHOD AND APPARATUS FOR TESTING INTERCONNECTION RELIABILITY OF A B...

CONNECTION VERIFICATION TECHNIQUE

TECHNIQUE FOR MONITORING STRUCTURAL HEALTH OF A SOLDER JOINT IN NO-...

Apparatus and method for detecting the abnormal soldering of an ele...

ELECTRONIC APPARATUS, A METHOD FOR ESTIMATING A BREAK, AND A METHOD...

SOLDER BUMP TESTING APPARATUS AND METHODS OF USE

Solder Joint Fatigue Life Prediction Method

Semiconductor Device and Method of Simultaneous Testing of Multiple...

ELECTRONIC APPARATUS, MEASURING METHOD, AND MONITORING APPARATUS

ELECTRONIC DEVICE AND ELECTRONIC SYSTEM

INSPECTION APPARATUS

STRUCTURE FOR MEASURING BUMP RESISTANCE AND PACKAGE SUBSTRATE COMPR...

CIRCUIT FOR DETECTION OF FAILED SOLDER-JOINTS ON ARRAY PACKAGES

MECHANISMS FOR RESISTIVITY MEASUREMENT OF BUMP STRUCTURES

LIFE PREDICTING METHOD FOR SOLDER JOINT, LIFE PREDICTING APPARATUS...