EXPOSURE APPARATUS, EXPOSURE METHOD, AND DEVICE MANUFACTURING METHOD

Abstract

A wafer is loaded on a wafer stage and unloaded from a wafer stage, using a chuck member which holds the wafer from above in a non-contact manner. Accordingly, members and the like to load/unload the wafer on/from the wafer stage do not have to be provided, which can keep the stage from increasing in size and weight. Further, by using the chuck member which holds the wafer from above in a non-contact manner, a thin, flexible wafer can be loaded onto the wafer stage as well as unloaded from the wafer stage without any problems.

Description

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to exposure apparatuses and device manufacturing methods, and more particularly to an exposure apparatus in which an object is exposed with an energy beam via an optical system, and a device manufacturing method which uses the exposure apparatus.

2. Description of the Background Art

Conventionally, in a lithography process for manufacturing electron devices (microdevices) such as semiconductor devices (integrated circuits or the like) or liquid crystal display elements, an exposure apparatus such as a projection exposure apparatus by a step-and-repeat method (a so-called stepper), or a projection exposure apparatus by a step-and-scan method (a so-called scanning stepper (which is also called a scanner)) is mainly used.

Substrates such as a wafer, a glass plate or the like subject to exposure which are used in these types of exposure apparatuses are gradually (for example, in the case of a wafer, in every ten years) becoming larger. Although a 300-mm wafer which has a diameter of 300 mm is currently the mainstream, the coming of age of a 450 mm wafer Which has a diameter of 450 mm looms near (e.g. refer to, International Technology Roadmap for Semiconductors, 2007 Edition). When the transition to 450 mm wafers occurs, the number of dies (chips) output from a single wafer becomes double or more the number of chips from the current 300 mm wafer, which contributes to reducing the cost. In addition, it is expected that through efficient use of energy, water, and other resources, cost of all resource use will be reduced.

However, because the thickness of the wafer does not increase in proportion to the size of the wafer, intensity of the 450 mm wafer is much weaker when compared to the 300 mm wafer. Accordingly, even when addressing an issue such as wafer carriage, it is anticipated that putting wafer carriage into practice in the same ways and means as in the current 300 mm wafer Would be difficult. Accordingly, appearance of a new system that can deal with the 450 mm wafer is expected.

SUMMARY OF THE INVENTION

According to a first aspect of the present invention, there is provided a first exposure apparatus that exposes an object with an energy beam via an optical system supported by a first support member, the apparatus comprising: a movable body that holds the object and is movable along a predetermined plane; a guide surface forming member that forms a guide surface used when the movable body moves along the predetermined plane; a second support member which is placed apart from the guide surface forming member on a side opposite to the optical system, via the guide surface forming member, and whose positional relation with the first support member is maintained at a predetermined relation; a position measuring system which includes a first measurement member that irradiates a measurement surface parallel to the predetermined plane with a measurement beam and receives light from the measurement surface, and which obtains positional information of the movable body within the predetermined plane based on an output of the first measurement member, the measurement surface being arranged at one of the movable body and the second support member and at least a part of the first measurement member being arranged at the other of the movable body and the second support member; a drive system which drives the movable body based on positional information of the movable body within the predetermined plane; and a carrier system which has at least one chuck member holding the object from above in a non-contact manner, and loads the object on the movable body as well as unload the object from the movable body, using the chuck member.

According to this apparatus, the carrier system loads the object on the movable body as well as unloads the object from the movable body, using the chuck member which holds the object from above in a non-contact manner. Accordingly, members and the like to load/unload the object on/from the movable body do not have to be provided, which can keep the movable body from increasing in size and weight. Further, by using the chuck member which holds the wafer from above in a non-contact manner, a thin, flexible object can be loaded onto the movable body as well as unloaded from the movable body without any problems.

In this case, the guide surface is used to guide the movable body in a direction orthogonal to the predetermined plane and can be of a contact type or a noncontact type. For example, the guide method of the noncontact type includes a configuration using static gas bearings such as air pads, a configuration using magnetic levitation, and the like. Further, the guide surface is not limited to a configuration in which the movable body is guided following the shape of the guide surface. For example, in the configuration using static gas bearings such as air pads, the opposed surface of the guide surface forming member that is opposed to the movable body is finished so as to have a high flatness degree and the movable body is guided in a noncontact manner via a predetermined gap so as to follow the shape of the opposed surface an the other hand, in the configuration in which while a part of a motor or the like that uses an electromagnetic force is placed at the guide surface forming member, a part of the motor or the like is placed also at the movable body, and a force acting in a direction orthogonal to the predetermined plane described above is generated by the guide surface forming member and the movable body cooperating, the position of the movable body is controlled by the force on a predetermined plane. For example, a configuration is also included in which a planar motor is arranged at the guide surface forming member and forces in directions which include two directions orthogonal to each other within the predetermined plane and the direction orthogonal to the predetermined plane are made to be generated on the movable body and the movable body is levitated in a noncontact manner without arranging the static gas bearings.

According to a second aspect of the present invention, there is provided a second exposure apparatus that exposes an object with an energy beam via an optical system supported by a first support member, the apparatus comprising: a movable body that holds the object and is movable along a predetermined plane; a second support member whose positional relation with the first support member is maintained in a predetermined relation; a movable body supporting member placed between the optical system and the second support member so as to be apart from the second support member, which supports the movable body at least at two points of the movable body in a direction orthogonal to a longitudinal direction of the second support member when the movable body moves along the predetermined plane; a position measuring system which includes a first measurement member that irradiates a measurement surface parallel to the predetermined plane with a measurement beam and receives light from the measurement surface, and which obtains positional information of the movable body within the predetermined plane based on an output of the first measurement member, the measurement surface being arranged at one of the movable body and the second support member and at least a part of the first measurement member being arranged at the other of the movable body and the second support member; a drive system which drives the movable body based on positional information of the movable body within the predetermined plane; and a carrier system which has at least one chuck member holding the object from above in a non-contact manner, and loads the object on the movable body as well as unload the object from the movable body, using the chuck member.

According to this apparatus, the carrier system loads the object on the movable body as well as unloads the object from the movable body, using the chuck member which holds the object from above in a non-contact manner. Accordingly, members and the like to load/unload the object on/from the movable body do not have to be provided, which can keep the movable body from increasing in size and weight. Further, by using the chuck member which holds the wafer from above in a non-contact manner, a thin, flexible object can be loaded onto the movable body as well as unloaded from the movable body without any problems.

In this case, the movable body supporting member supporting the movable body at least in two points in the direction orthogonal to the longitudinal direction of the second support member means that the movable body is supported in the direction orthogonal to the longitudinal direction of the second support member, for example, at only both ends or at both ends and a mid section in the direction orthogonal to the two-dimensional plane, at a section excluding the center and both ends in the direction orthogonal, to the longitudinal direction of the second support member, the entire section including both ends in the direction orthogonal to the longitudinal direction of the second support member, or the like. In this case, the method of the support widely includes the contact support, as a matter of course, and the noncontact support such as the support via static gas bearings such as air pads or the magnetic levitation or the like.

According to a third aspect of the present invention, there is provided a device manufacturing method, including exposing an object with one of the first and second exposure apparatus of the present invention; and developing the object which has been exposed.

BRIEF DESCRIPTION OF THE DRAWINGS

In the accompanying drawings;

FIG. 1 is a view schematically showing a configuration of an exposure apparatus of an embodiment;

FIG. 2 is a plan view of the exposure apparatus of FIG. 1;

FIG. 3 is a side view of the exposure apparatus of FIG. 1 when viewed from the +Y side;

FIG. 4A is a plan view of a wafer stage WST1 which the exposure apparatus is equipped with, FIG. 4B is an end view of the cross section taken along the line B-B of FIG. 4A, and FIG. 4C is an end view of the cross section taken along the line C-C of FIG. 4A;

FIG. 5 is a view showing a configuration of a fine movement stage position measuring system;

FIGS. 6A and 6B are views showing a configuration of a chuck unit;

FIG. 7 is a block diagram used to explain input/output relations of a main controller which the exposure apparatus of FIG. 1 is equipped with;

FIG. 8 is a view showing a state where exposure is performed on a wafer mounted on wafer stage WST1, and the second fiducial mark on measurement plate FM2 is detected on wafer stage WST2;

FIG. 9 is a view showing a state where exposure is performed on a wafer mounted on wafer stage WST1 and wafer alignment is performed to a wafer mounted on wafer stage WST2;

FIGS. 10A to 10C are views (No. 1) used to explain a procedure of wafer alignment;

FIGS. 11A to 11D are views (No. 2) used to explain procedure of wafer alignment;

FIG. 12 is a view showing a state where wafer stage WST2 moves toward a right-side scrum position on a surface plate 14B;

FIG. 13 is a view showing a state where movement of wafer stage WST1 and wafer stage WST2 to the scrum position is completed;

FIG. 14 is a view showing a state where wafer stage WST1 reaches a first unloading position UPA and wafer W on wafer stage WST1 which has undergone exposure is unloaded, and the first fiducial mark on measurement plate FM2 is detected (reticle alignment is performed) on wafer stage WST2;

FIGS. 15A to 15D are views used to explain an unloading procedure of the wafer (No. 1);

FIGS. 16A to 16D are views used to explain an unloading procedure of the wafer (No. 2);

FIG. 17 is a view showing a state where wafer stage WST1 moves from the first unloading position UPA to the first loading position, and exposure is being performed on wafer W on wafer stage WST2;

FIG. 18 is a view showing a state where wafer stage WST1 reaches the first loading position LPA and a new wafer W is loaded on wafer stage WST1, and exposure of wafer W is being performed on wafer stage WST2; and

FIG. 19 is a view showing a state where the second fiducial mark on measurement plate FM1 is detected on wafer stage WST1, and exposure is performed on wafer W on wafer stage WST2.

DESCRIPTION OF THE EMBODIMENTS

An embodiment of the present invention will be described below, with reference to FIGS. 1 to 19.

FIG. 1 schematically shows a configuration of an exposure apparatus 100 related to the embodiment. Exposure apparatus 100 is a projection exposure apparatus by a step-and-scan method, which is a so-called scanner. As described later on, a projection optical system PL is provided in the present embodiment, and in the description below, the explanation is given assuming that a direction parallel to an optical axis AX of projection optical system PL is a Z-axis direction, a direction in which a reticle and a wafer are relatively scanned within a plane orthogonal to the Z-axis direction is a Y-axis direction, and a direction orthogonal to the Z-axis and the I-axis is an X-axis direction, and rotational (tilt) directions around the X-axis, Y-axis and Z-axis are θx, θy and θz directions, respectively.

As shown in FIG. 1, exposure apparatus 100 is equipped with an exposure station (exposure processing section) 200 plated in the vicinity of the +Y side end on a base board 12, a measurement station (measurement processing section) 300 placed in the vicinity of the −Y side end on base board 12, a stage device 50 that includes two wafer stages WST1 and WST2, their control system and the like. In FIG. 1, wafer stage WST1 is located in exposure station 200 and a wafer W is held on wafer stage WST1. And, wafer stage WST2 is located in measurement station 300 and another wafer W is held on wafer stage WST2.

Exposure station 200 is equipped with an illuminations system 10, a reticle stage RST, a projection unit PU, a local liquid immersion device 8, and the like.

Illumination system 10 includes: a light source; and an illumination optical system that has an illuminance uniformity optical system including an optical integrator and the like, and a reticle blind and the like (none of which are illustrated), as disclosed in, for example, U.S. Patent Application Publication No. 2003/0025890 and the like. Illumination system 10 illuminates a slit-shaped illumination area LAR, which is defined by the reticle blind (which is also referred to as a masking system), on reticle R with illumination light (exposure light) IL with substantially uniform illuminance. As illumination light IL, ArF excimer laser light (wavelength: 193 nm) is used as an example.

On reticle stage RST, reticle R having a pattern surface (the lower surface in FIG. 1) on which a circuit pattern and the like are formed is fixed by, for example, vacuum adsorption. Reticle stage RST can be driven with a predetermined stroke at a predetermined scanning speed in a scanning direction (which is the Y-axis direction being a lateral direction of the page surface of FIG. 1) and can also be finely driven in the X-axis direction, with a reticle stage driving system 11 (not illustrated in FIG. 1, refer to FIG. 13) including, for example, a linear motor or the like.

Positional information within the XY plane (including rotational information in the θz direction) of reticle stage RST is constantly detected at a resolution of, for example, around 0.25 nm with a reticle laser interferometer (hereinafter, referred to as a “reticle interferometer”) 13 via a movable mirror 15 fixed to reticle stage RST (actually, a Y movable mirror (or a retroreflector) that has a reflection surface orthogonal to the Y-axis direction and an X movable mirror that has a reflection surface orthogonal to the X-axis direction are arranged). The measurement values of reticle interferometer 13 are sent to a main controller 20 (not illustrated in FIG. 1, refer to FIG. 13). Incidentally, the positional information of reticle stage AST can be measured by an encoder system as is disclosed in, for example, U.S. Patent Application Publication 2007/0288121 and the like.

Above reticle stage RST, a pair of reticle alignment systems RA₁ and RA₂ by an image processing method, each of which has an imaging device such as a CCD and uses light with an exposure wavelength (illumination light IL in the present embodiment) as alignment illumination light, are placed (in FIG. 1, reticle alignment system RA₂ hides behind reticle alignment system RA₁ in the depth of the page surface), as disclosed in detail in, for example, U.S. Pat. No. 5,646,413 and the like. Main controller 20 (refer to FIG. 7) detects projected images of a pair of reticle alignment marks (drawing omitted) formed on reticle R and a pair of first fiducial marks on a measurement plate, which is described later, on fine movement stage WFS1 (or WFS2), that correspond to the reticle alignment marks via projection optical system PL in a state where the measurement plate is located directly under projection optical system PL, and the pair of reticle alignment systems RA₁ and RA₂ are used to detect a positional relation between the center of a projection area of a pattern of reticle R by projection optical system PL and a fiducial position on the measurement plate, i.e. the center of the pair of the first fiducial marks, according to such detection performed by main controller 20. Detection signals of reticle alignment detection systems RA₁ and RA₂ are supplied to main controller 20 (refer to FIG. 7) via a signal processing system (not shown). Incidentally, reticle alignment systems RA₁ and RA₂ do not have to be arranged. In such a case, it is preferable that a L5 detection system that has a light-transmitting section (photodetection section) arranged at a fine movement stage, which is described later on, is installed so as to detect projected images of the reticle alignment marks, as disclosed in, for example, U.S. Patent Application Publication No. 2002/0041377 and the like.

Projection unit PU is placed below reticle stage RST FIG. 1. Projection unit PU is supported, via a flange section FLG that is fixed to the outer periphery of projection unit PU, by a main frame (which is also referred to as a metrology frame) BD that is horizontally supported by a support member that is not illustrated. Main frame BD can be configured such that vibration from the outside is not transmitted to the main frame or the main frame does not transmit vibration to the outside, by arranging a vibration isolating device or the like at the support member. Projection unit PU includes a barrel 40 and projection optical system PL held within barrel 40. As projection optical system PL, for example, a dioptric system that is composed of a plurality of optical elements (lens elements) that are disposed along optical axis AX parallel to the Z-axis direction is used. Projection optical system PL is, for example, both-side telecentric and has a predetermined projection magnification (e.g. one-quarter, one-fifth, one-eighth times, or the like). Therefore, when illumination area IAR on reticle R is illuminated with illumination light IL from illumination system 10, illumination light IL passes through reticle R whose pattern surface is placed substantially coincident with a first plane (object plane) of projection optical system PL. Then, a reduced image of a circuit pattern (a reduced image of apart of a circuit pattern) of reticle R within illumination area IAR is formed in an area (hereinafter, also referred to as an exposure area) IA that is conjugate to illumination area IAR described above on wafer W which is placed on the second plane (image plane) side of projection optical system PL and whose surface is coated with a resist (sensitive agent), via projection optical system PL (projection unit PU). Then, by moving reticle R relative to illumination area IAR (illumination light IL) in the scanning direction (Y-axis direction) and also moving wafer W relative to exposure area IA (illumination light IL) in the scanning direction (Y-axis direction) by synchronous drive of reticle stage RST and wafer stage WST1 (or WST2), scanning exposure of one shot area (divided area) on wafer W is performed. Accordingly, a pattern of reticle R is transferred onto the shot area. More specifically, in the embodiment, a pattern of reticle R is generated on wafer W by illumination system 10 and projection optical system PL, and the pattern is formed on wafer W by exposure of a sensitive layer (resist layer) on wafer W with illumination light (exposure light) IL. In this case, projection unit PU is held by main frame BD, and in the embodiment, main frame BD is substantially horizontally supported by a plurality (e.g. three or four) of support members placed on an installation surface (such as a floor surface) each via a vibration isolating mechanism. Incidentally, the vibration isolating mechanism can be placed between each of the support members and main frame BD. Further, as disclosed in, for example, PCT International Publication No. 2006/038952, main frame BD (projection unit PU) can be supported in a suspended manner by a main frame member (not illustrated) placed above projection unit PU or a reticle base or the like.

Local liquid immersion device 8 includes a liquid supply device 5, a liquid recovery device 6 (none of which are illustrated in FIG. 1, refer to FIG. 13), and a nozzle unit 32 and the like. As shown in FIG. 1, nozzle unit 32 is supported in a suspended manner by main frame BD that supports projection unit PU and the like, via a support member that is not illustrated, so as to enclose the periphery of the lower end of barrel 40 that holds an optical element closest to the image plane side (wafer W side) that configures projection optical system PL, which is a lens (hereinafter, also referred to as a “tip lens”) 191 in this case. Nozzle unit 32 is equipped with a supply opening and a recovery opening of a liquid Lq, a lower surface to which wafer W is placed so as to be opposed and at which the recovery opening is arranged, and a supply flow channel and a recovery flow channel that are respectively connected to a liquid supply pipe 31A and a liquid recovery pipe 31B (none of which are illustrated in FIG. 1, refer to FIG. 2). One end of a supply pipe (not illustrated) is connected to liquid supply pipe 31A, while the other end of the supply pipe is connected to liquid supply device 5, and one end of a recovery pipe (not illustrated) is connected to liquid recovery pipe 31B, while the other end of the recovery pipe is connected to liquid recovery device 6.

In the present embodiment, main controller 20 controls liquid supply device 5 (refer to FIG. 13) to supply the liquid to the space between tip lens 191 and wafer W and also controls liquid recovery device 6 (refer to FIG. 13) to recover the liquid from the space between tip lens 191 and wafer W. On this operation, main controller 20 controls the quantity of the supplied liquid and the quantity of the recovered liquid in order to hold a constant quantity of liquid Lq (refer to FIG. 1) while constantly replacing the liquid in the space between tip lens 191 and wafer W. In the embodiment, as the liquid described above, pure water (with a refractive index n 1.44) that transmits the ArF excimer laser light (the light with a wavelength of 193 nm) is to be used.

Measurement station 300 is equipped with an alignment device 99 arranged at main frame BD. Alignment device 99 includes five alignment systems AL1 and AL2₁ to AL2₄ shown in FIG. 2, as disclosed in, for example, U.S. Patent Application Publication No. 2008/0088843 and the like. To be more specific, as shown in FIG. 2, a primary alignment system AL1 is placed in a state where its detection center is located at a position a predetermined distance apart on the −Y side from optical axis AX, on a straight line (hereinafter, referred to as a reference axis) LV that passes through the center of projection unit PU (which is optical axis AX of projection optical system PL, and in the present embodiment, which also coincides with the center of exposure area IA described previously) and is parallel to the Y-axis. On one side and the other side in the X-axis direction with primary alignment system AL1 in between, secondary alignment systems AL2₁ and AL2₂, and AL2₃ and AL2₄, whose detection centers are substantially symmetrically placed with respect to reference axis LV, are arranged respectively. More specifically, the detection centers of the five alignment systems AL1 and AL2₁ to AL2₄ are placed along a straight line (hereinafter, referred to as a reference axis) LA that vertically intersects reference axis LV at the detection center of primary alignment system AL1 and is parallel to the X-axis. Incidentally, in FIG. 1, the five alignment systems AL1 and AL2₁ to AL2₄, including a holding device (slider) that holds these alignment systems are shown as alignment device 99. As disclosed in, for example, U.S. Patent Application Publication No. 2009/0233234 and the like, secondary alignment systems AL2₁ to AL2₄ are fixed to the lower surface of main frame BD via the movable slider (refer to FIG. 1), and the relative positions of the detection areas of the secondary alignment systems are adjustable at least in the X-axis direction with a drive mechanism that is not r7 illustrated.

In the present embodiment, as each of alignment systems AU and AL2₁ to AL2₄, for example, an FIA (Field Image Alignment) system by an image processing method is used. The configurations of alignment systems AL1 and AL2₁ to AL2₄ are disclosed in detail in, for example, PCT International Publication No. 2008/056735 and the like. The imaging signal from each of alignment Systems AL1 and AL2₁ to AL2₄ is supplied to main controller 20 (refer to FIG. 13) via a signal processing system that is not illustrated.

As shown in FIG. 1, stage device 50 is equipped with base board 12, a pair of surface plates 14A and 14B placed above base board 12 (in FIG. 1, surface plate 14B is hidden behind surface plate 14A in the depth of the page surface), two wafer stages WST1 and WST2 that move on a guide surface parallel to the XY plane formed on the upper surface of the pair of surface plates 14A and 14B, and a measuring system that measures positional information of wafer stages WST1 and WST2.

Base board 12 is made up of a member having a tabular outer shape, and as shown in FIG. 1, is substantially horizontally (parallel to the XY plane) supported via a vibration isolating mechanism (drawing omitted) on a floor surface 102. In the center portion in the X-axis direction of the upper surface of base board 12, a recessed section 12a (recessed groove) extending in a direction parallel to the Y-axis is formed, as shown in FIG. 3. On the upper surface side of base board 12 (excluding a portion where recessed section 12a is formed, in this case), a coil unit CU is housed that includes a plurality of coils placed in the shape of a matrix with the XY two-dimensional directions serving, as a row direction and a column direction. Incidentally, the vibration isolating mechanism does not necessarily have to be arranged.

As shown in FIG. 2, surface plates 14A and 14B are each made up of a rectangular plate-shaped member whose longitudinal direction is in the Y-axis direction in a planar view (when viewed from above) and are respectively placed on the −X side and the +X side of reference axis LV. Surface plate 14A and surface plate 14B are placed with a very narrow gap therebetween in the X-axis direction, symmetric with respect to reference axis LV. By finishing the upper surface (the side surface) of each of surface plates 14A and 14B such that the upper surface has a very high flatness degree, it is possible to make the upper surfaces function as the guide surface with respect to the Z-axis direction used when each of wafer stages WST1 and WST2 moves following the XY plane. Alternatively, a configuration can be employed in which a force in the Z-axis direction is made to act on wafer stages WST1 and WST2 by planar motors, which are described later on, to magnetically levitate wafer stages WST1 and WST2 above surface plates 14A and 14B. In the case of the present embodiment, the configuration that uses the planar motors is employed and static gas bearings are not used, and therefore, the flatness degree of the upper surfaces of surface plates 14A and 14B does not have to be so high as in the above description.

As shown in FIG. 3, surface plates 14A and 14B are supported on upper surfaces 12b of both side portions of recessed section 12a of base board 12 via air bearings (or rolling bearings) that are not illustrated.

Surface plates 14A and 14B respectively have first sections 14A₁ and 14B₁ each having a relatively thin plate shape on the upper surface of which the guide surface is formed, and second sections 14A₂ and 14B₂ each having a relatively thick plate shape and being short in the X-axis direction that are integrally fixed to the lower surfaces of first sections 14A₁ and 14B₁, respectively. The end on the +X side of first section 14A₁ of surface plate 14A slightly overhangs, to the +X side, the end surface on the +X side of second section 14A₂, and the end on the −X side of first section 14B₁ of surface plate 14E slightly overhangs, to the −X side, the end surface on the −X side of second section 14B₂. However, the configuration is not limited to the above-described one, and a configuration can be employed in which the overhangs are not arranged.

Inside each of first sections 14A₁ and 14B₁, a coil unit (drawing omitted) is housed that includes a plurality of coils placed in a matrix shape with the XY two-dimensional directions serving as a row direction and a column direction. The magnitude and direction of the electric current supplied to each of the plurality of coils that configure each of the coil units are controlled by main controller 20 (refer to FIG. 7).

Inside (on the bottom portion of) second section 14A₂ of surface plate 14A, a magnetic unit MUa, which is made up of a plurality of permanent magnets (and yokes not shown) placed in the shape of a matrix with the XY two-dimensional directions serving as a row direction and a column direction, is housed so as to correspond to coil unit CU housed on the upper surface side of base board 12. Magnetic unit MUa configures, together with coil unit CU of base board 12, a surface plate driving system 60A (refer to FIG. 7) that is made up of a planar motor by the electromagnetic force (Lorentz force) drive method that is disclosed in, for example, U.S. Patent Application Publication No. 2003/0005676 and the like. Surface plate driving system 60A generates a drive force that drives surface plate 14A in directions of three degrees of freedom (X, Y, θz) within the XY plane.

Similarly, inside (on the bottom portion of) second section 14B₂ of surface plate 14B, a magnetic unit MUb made up of a plurality of permanent magnets (and yokes not shown) is housed that configures, together with coil unit CU of base board 12, a surface plate driving system 60B. (refer to FIG. 7) made up of a planar motor that drives surface plate 14B in the directions of three degrees of freedom within the XY plane. Incidentally, the placement of the coil unit and the magnetic unit of the planar motor that configures each of surface plate driving systems 60A and 60B can be reverse (a moving coil type that has the magnetic unit on the base board side and the coil unit on the surface plate side) to the above-described case (a moving magnet type).

Positional information of surface plates 14A and 14B in the directions of three degrees of freedom is obtained (measured) independently from each other by a first surface plate position measuring system 69A and a second surface plate position measuring system 69B (refer to FIG. 7), respectively, which each include, for example, an encoder system. The output of each of first surface plate position measuring system 69A and second surface plate position measuring system 69B is supplied to main controller 20 (refer to FIG. 7), and main controller 20 controls the magnitude and direction of the electric current supplied to the respective coils that configure the coil units of surface plate driving systems 60A and 60B, based on the outputs of surface plate position measuring systems 69A and 69B, thereby controlling the respective positions of surface plates 14A and 14B in the directions of three degrees of freedom within the XY plane, as needed. Main controller 20 drives surface plates 14A and 14B via surface plate driving systems 60A and 60B based on the outputs of surface plate position measuring systems 69A and 69B to return surface plates 14A and 14B to the reference position of the surface plates such that the movement distance of surface plates 14A and 14B from the reference position falls within a predetermined range, when surface plates 14A and 14B function as the countermasses to be described later on. More specifically, surface plate driving systems 60A and 60B are used as trim motors.

While the configurations of first surface plate position measuring system 69A and second surface plate position measuring system 69B are not especially limited, an encoder system can be used in which, for example, encoder head sections, which obtain (measure) positional information of the respective surface plates 14A and 14B in the directions of three degrees of freedom within the KY plane by irradiating measurement beams on scales (e.g. two-dimensional gratings) placed on the lower surfaces of second sections 14A₂ and 14B₂ respectively and receiving diffraction light (reflected light) generated by the two-dimensional grating, are placed at base board 12 (or the encoder head sections are placed at second sections 14A₂ and 14B₂ and scales are placed at base board 12, respectively). Incidentally, it is also possible to obtain (measure) the positional information of surface plates 14A and 14B by, for example, an optical interferometer system or a measuring system that is a combination of an optical interferometer system and an encoder system.

One of the wafer stages, wafer stage WST1 is equipped with a fine movement stage WFS1 that holds wafer W and a coarse movement stage WCS1 having a rectangular frame shape that encloses the periphery of fine movement stage WFS1, as shown in FIG. 2. The other of the wafer stages, wafer stage WST2 is equipped with a fine movement stage WFS2 that holds wafer W and a coarse movement stage WCS2 having a rectangular frame shape that encloses the periphery of fine movement stage WFS2, as shown in FIG. 2. As is obvious from FIG. 2, wafer stage WST2 has completely the same configuration including the drive system, the position measuring system and the like, as wafer stage WST1 except that wafer stage WST2 is placed in a state laterally reversed with respect to wafer stage WST1. Consequently, in the description below, wafer stage WST1 is representatively focused on and described, and wafer stage WST2 is described only in the case where such description is especially needed.

As shown in FIG. 4A, coarse movement stage WCS1 has a pair of coarse movement slider sections 90a and 90b which are placed parallel to each other, spaced apart in the Y-axis direction, and each of which is made up of a rectangular parallelepiped member whose longitudinal direction is in the X-axis direction, and a pair of coupling members 92a and 92b each of which is made up of a rectangular parallelepiped member whose longitudinal direction is in the Y-axis direction, and which couple the pair of coarse movement slider sections 90a and 90b with one ends and the other ends thereof in the Y-axis direction. More specifically, coarse movement stage WCS1 is formed into a rectangular frame shape with a rectangular opening section, in its center portion, that penetrates in the Z-axis direction.

Inside (on the bottom portions of) coarse movement slider sections 90a and 90b, as shown in FIGS. 4B and 4C, magnetic units 96a and 96b are housed respectively. Magnetic units 96a and 96b correspond to the coil units housed inside first sections 14A₁ and 14B₁ of surface plates 14A and 14B, respectively, and are each made of up a plurality of magnets placed in the shape of a matrix with the XY two-dimensional directions serving as a row direction and a column direction. Magnetic units 96a and 96b configure, together with the coil units of surface plates 14A and 14B, a coarse movement stage driving system 62A (refer to FIG. 7) that is made up of a planar motor by an electromagnetic force (Lorentz force) drive method that is capable of generating drive forces in the X-axis direction, the Y-axis direction, the Z-axis direction, the ex direction, the θy direction, and the θz direction (hereinafter described as directions of six degrees of freedom, or directions (X, Y, Z, θx, θy, and θz) of six degrees of freedom) to coarse movement stage WCS1, which is disclosed in, for example, U.S. Patent Application Publication No. 2003/0085676 and the like. Further, similar thereto, magnetic units, which coarse movement stage WCS2 (refer to FIG. 2) of wafer stage WST2 has, and the coil units of surface plates 14A and 14B configure a coarse movement stage driving system 62B (refer to FIG. 7) made up of a planar motor. In this case, since a force in the Z-axis direction acts on coarse movement stage WCS1 (or WCS2), the coarse movement stage is magnetically levitated above surface plates 14A and 14B. Therefore, it is not necessary to use static gas bearings that require a relatively high machining accuracy, and thus it becomes unnecessary to increase the flatness degree of the upper surfaces of surface plates 14A and 14B.

Incidentally, while coarse movement stages WCS1 and WCS2 of the present embodiment have the configuration in which only coarse movement slider sections 90a and 90b have the magnetic units of the planar motors, the present embodiment is not limited to this, and the magnetic unit can be placed also at coupling members 92a and 92b. Further, the actuators to drive coarse movement stages WCS1 and WCS2 are not limited to the planar motors by the electromagnetic force (Lorentz force) drive method, but for example, planar motors by a variable magnetoresistance drive method or the like can be used. Further, the drive directions of coarse movement stages WCS1 and WCS2 are not limited to the directions of six degrees of freedom, but can be, for example, only directions of three degrees of freedom (X, Y, θz) within the XY plane. In this case, coarse movement stages WCS1 and WCS2 should be levitated above surface plates 14A and 14B, for example, using static gas bearings (e.g. air bearings). Further, in the present embodiment, while the planar motor of a moving magnet type is used as each of coarse movement stage driving systems 62A and 62B, besides this, a planar motor of a moving coil type in which the magnetic unit is placed at the surface plate and the coil unit is placed at the coarse movement stage can also be used.

On the side surface on the −Y side of coarse movement slider 90a and on the side surface on the +Y side of coarse movement slider 90b, stator sections 94a and 94b that configure a part of fine movement stage driving system 64 (refer to FIG. 13) which will be described later that finely drives fine movement stage WFS1 are respectively fixed. As shown in FIG. 4B, stator section 94a is made up of a member having an L-like sectional shape arranged extending in the X-axis direction and its lower surface is placed flush with the lower surface of coarse movement slider 90a. Guide member 94b is configured and placed similar to guide member 94a, although guide member 94b is bilaterally symmetric to guide member 94a.

Inside (on the bottom section of) stator sections 94a and 94b, a pair of coil units CUa and CUb, each of which includes a plurality of coils placed in the shape of a matrix with the XY two-dimensional directions serving as a row direction and a column direction, are housed, respectively (refer to FIG. 4A). Meanwhile, inside (on the bottom portion of) guide member 94b, one coil unit CUc, which includes a plurality of coils placed in the shape of a matrix with the XY two-dimensional directions serving as a row direction and a column direction, is housed (refer to FIG. 4A). The magnitude and direction of the electric current supplied to each of the coils that configure coil units CUa to CUc are controlled by main controller 20 (refer to FIG. 7).

Inside coupling members 92a and/or 92b, various types of optical members (e.g. an aerial image measuring instrument, an uneven illuminance measuring instrument, an illuminance monitor, a wavefront aberration measuring instrument, and the like) can be housed.

In this case, when wafer stage WST1 is driven with acceleration/deceleration in the Y-axis direction on surface plate 14A, by the planar motor that configures coarse movement stage driving system 62A (e.g. when wafer stage WST1 moves between exposure station 200 and measurement station 300), surface plate 14A moves in a direction opposite to wafer stage WST1 according to the so-called law of action and reaction (the law of conservation of momentum) due to the action of a reaction force of the drive of wafer stage WST1. Further, it is also possible to make a state where the law of action and reaction described above does not hold, by generating a drive force in the Y-axis direction with surface plate driving system 60A.

Further, when wafer stage WST2 is driven in the Y-axis direction on surface plate 14B, surface plate 14B is also driven in a direction opposite to wafer stage WST2 according to the so-called law of action and reaction (the law of conservation of momentum) due to the action of a reaction force of a drive force of wafer stage WST2. More specifically, surface plates 14A and 14B function as the countermasses and the momentum of a system composed of wafer stages WST1 and WST2 and surface plates 14A and 14B as a whole is conserved and movement of the center of gravity does not occur. Consequently, any inconveniences do not arise such as the uneven loading acting on surface plates 14A and 14B owing to the movement of wafer stages WST1 and WST2 in the Y-axis direction. Incidentally, regarding wafer stage WST2 as well, it is possible to make a state where the law of action and reaction described above does not hold, by generating a drive force in the Y-axis direction with surface plate driving system 60B.

Further, on movement in the X-axis direction of wafer stages WST1 and WST2, surface plates 14A and 14B function as the countermasses owing to the action of a reaction force of the drive force.

As shown in FIGS. 4A and 4B, fine movement stage WFS1 is equipped with a main section 80 made up of a member having a rectangular shape in a planar view, a mover section 84a fixed to the side surface on the +Y side of main section 80, and a mover section 84b fixed to the side surface on the −Y side of main section 80.

Main section 80 is formed by a material with a relatively small coefficient of thermal expansion, e.g., ceramics, glass or the like, and is supported by coarse movement stage WCS1 in a noncontact manner in a state where the bottom surface of the main section is located flush with the bottom surface of coarse movement stage WCS1. Main section 80 can be hollowed for reduction in weight. Incidentally, the bottom surface of main section 80 does not necessarily have to be flush with the bottom surface of coarse movement stage WCS1.

In the center of the upper surface of main section 80, a wafer holder (not shown) that holds wafer W by vacuum adsorption or the like is placed. In the embodiment, the wafer holder by a so-called pin chuck method is used in which a plurality of support sections (pin members) that support wafer W are formed, for example, within an annular protruding section (rim section), and the wafer holder, whose one surface (front surface) serves as a wafer mounting surface, has a two-dimensional grating RG to be described later and the like arranged on the other surface (back surface) side. Incidentally, the wafer holder can be formed integrally with fine movement stage WFS1 (main section 80), or can be fixed to main section 80 so as to be detachable via, for example, a holding mechanism such as an electrostatic chuck mechanism or a clamp mechanism. In this case, grating RG is to be arranged on the back surface side of main section 80. Further, the wafer holder can be fixed to main section 80 by an adhesive agent or the like. On the upper surface of main section 80, as shown in FIG. 4A, a plate (liquid-repellent plate) 82, in the center of which a circular opening that is slightly larger than wafer W (wafer holder) is formed and which has a rectangular outer shape (contour) that corresponds to main section 80, is attached on the outer side of the wafer holder (mounting area of wafer W). The liquid-repellent treatment against liquid Lq is applied to the surface of plate 82 (the liquid-repellent surface is formed). In the embodiment, the surface of plate 82 includes a base material made up of metal, ceramics, glass or the like, and a film of liquid-repellent material formed on the surface of the base material. The liquid-repellent material includes, for example, PFA (Tetra fluoro ethylene-perfluoro alkylvinyl ether copolymer) PTFE (Poly tetra fluoro ethylene), Teflon (registered trademark) or the like. Incidentally, the material that forms the film can be an acrylic-type resin or a silicon-series resin. Further, the entire plate 82 can be formed with at least one of the PFA, PTFE, Teflon (registered trademark), acrylic-type resin and silicon-series resin. In the present embodiment, the contact angle of the upper surface of plate 82 with respect to liquid Lq is, for example, more than or equal to 90 degrees. On the surface of coupling member 92b described previously as well, the similar liquid-repellent treatment is applied.

Plate 82 is fixed to the upper surface of main section 80 such that the entire surface (or a part of the surface) of plate 82 is flush with the surface of wafer W. Further, the surfaces of plate 82 and wafer W are located substantially flush with the surface of coupling member 92b described previously. Further, in the vicinity of a corner on the +X side located on the +Y side of plate 82, a circular opening is formed, and a measurement plate FM1 is placed in the opening without any gap therebetween in a state substantially flush with the surface of wafer W. On the upper surface of measurement plate FM1, the pair of first fiducial marks to be respectively detected by the pair of reticle alignment systems RA₁ and RA₂ (refer to FIGS. 1 and 7) described earlier and a second fiducial mark to be detected by primary alignment system AL1 (none of the marks are shown) are formed. In fine movement stage WFS2 of wafer stage WST2, as shown in FIG. 2, in the vicinity of a corner on the −X side located on the +Y side of plate 82, a measurement plate FM2 that is similar to measurement plate FM1 is fixed in a state substantially flush with the surface of wafer W. Incidentally, instead of attaching plate 82 to fine movement stage WFS1 (main section 80), it is also possible, for example, that the wafer holder is formed integrally with fine movement stage WFS1 and the liquid-repellent treatment is applied to the peripheral area, which encloses the wafer holder (the same area as plate 82 (which may include the surface of the measurement plate)) of the upper surface of fine movement stage WFS1 and the liquid repellent surface is formed.

In the center portion of the lower surface of main section 80 of fine movement stage WFS1, as shown in FIG. 4B, a plate having a predetermined thin plate shape, which is large to the extent of covering the wafer holder (mounting area of wafer W) and measurement plate FM1 (or measurement plate FM2 in the case of fine movement stage WFS2) is placed in a state where its lower surface is located substantially flush with the other section (the peripheral section) (the lower surface of the plate does not protrude below the peripheral section). On one surface (the upper surface (or the lower surface)) of the plate, two-dimensional grating RG (hereinafter, simply referred to as grating RG) is formed. Grating RG includes a reflective diffraction grating (X diffraction grating) whose periodic direction is in the X-axis direction and a reflective diffraction grating (Y diffraction grating) whose periodic direction is in the Y-axis direction. The plate is formed by, for example, glass, and grating RG is created by grating the graduations of the diffraction gratings at a pitch, for example, between 138 nm to 4 m, e.g. at a pitch of 1 m. Incidentally, grating RG can also cover the entire lower surface of main section 80. Further, the type of the diffraction grating used for grating RG is not limited to the one on which grooves or the like are formed, but for example, a diffraction grating that is created by exposing interference fringes on a photosensitive resin can also be employed. Incidentally, the configuration of the plate having a thin plate shape is not necessarily limited to the one described above.

As shown in FIG. 4A, the pair of fine movement slider sections 84a and 84b are each a plate-shaped member having a roughly square shape in a planar view, and are placed apart at a predetermined distance in the X-axis direction, on the side surface on the +Y side of main section 80. Fine movement slider section 84c is a plate-shaped member having a rectangular shape elongated in the X-axis direction in a planar view, and is fixed to the side surface on the −Y side of main section 80 in a state where one end and the other end in its longitudinal direction are located on straight lines parallel to the Y-axis that are substantially collinear with the centers of fine movement slider sections 84a and 84b.

The pair of fine movement slider sections 84a and 84b are respectively supported by guide member 94a described earlier, and fine movement slider section 84c is supported by guide member 94b. More specifically, fine movement stage WFS is supported at three noncollinear positions with respect to coarse movement stage WCS.

Inside fine movement slider sections 84a to 84c, magnetic units 98a, 98b and 98c, which are each made up of a plurality of permanent magnets (and yokes that are not illustrated) placed in the shape of a matrix with the XY two-dimensional directions serving as a row direction and a column direction, are housed, respectively, so as to correspond to coil units CUa to CUc that guide sections 94a and 94b of coarse movement stage WCS1 have. Magnetic unit 98a together with coil unit CUa, magnetic unit 98b together with coil unit CUb, and magnetic unit 98c together with coil unit CUc respectively configure three planar motors by the electromagnetic force (Lorentz force) drive method that are capable of generating drive forces in the X-axis, Y-axis and Z-axis directions, as disclosed in, for example, U.S. Patent Application Publication No. 2003/0085676 and the like, and these three planar motors configure a fine movement stage driving system 64A (refer to FIG. 7) that drives fine movement stage WFS1 in directions of six degrees of freedom (X, Y, Z, θx, θy and θz).

In wafer stage WST2 as well, three planar motors composed of coil units that coarse movement stage WCS2 has and magnetic units that fine movement stage WFS2 has are configured likewise, and these three planar motors configure a fine movement stage driving system 64B (refer to FIG. 7) that drives fine movement stage WFS2 in directions of six degrees of freedom (X, Y, Z, θx, θy and θz).

Fine movement stage WFS1 is movable in the X-axis direction, with a longer stroke compared with the directions of the other five degrees of freedom, along guide members 94a and 94b arranged extending in the X-axis direction. The same applies to fine movement stage WFS2.

With the configuration as described above, fine movement stage WFS1 is movable in the directions of six degrees of freedom with respect to coarse movement stage WCS1. Further, on this operation, the law of action and reaction (the law of conservation of momentum) that is similar to the previously described one holds owing to the action of a reaction force by drive of fine movement stage WFS1. More specifically, coarse movement stage WCS1 functions as the countermass of fine movement stage WFS1, and coarse movement stage WCS1 is driven in a direction opposite to fine movement stage WFS1. The relation between fine movement stage WFS2 and coarse movement stage WCS2 is also similar.

Further, as described earlier, since fine movement stage WFS1 is supported at the three noncollinear positions by coarse movement stage WCS1, main controller 20 can tilt fine movement stage WFS1 (i.e. wafer W) at an arbitrary angle (rotational amount) in the x direction and/or the y direction with respect to the XY plane by, for example, appropriately controlling a drive force (thrust) in the Z-axis direction that is made to act on each of fine movement slider sections 84a to 84c. Further, main controller 20 can make the center portion of fine movement stage WFS1 bend in the +Z direction (into a convex shape), for example, by making a drive force in the +x direction (a counterclockwise direction on the page surface of FIG. 4B) on each of fine movement slider sections 84a and 84b and also making a drive force in the −x direction (a clockwise direction on the page surface of FIG. 4B) on fine movement slider section 84c. Further, main controller 20 can also make the center portion of fine movement stage WFS1 bend in the +Z direction (into a convex shape), for example, by making drive forces in the −y direction and the +y direction (a counterclockwise direction and a clockwise direction when viewed from the +Y side, respectively) on fine movement slider sections 84a and 84b, respectively. Main controller 20 can also perform the similar operations with respect to fine movement stage WFS2.

Incidentally, in the embodiment, as fine movement stage driving systems 64A and 64B, the planar motors of a moving magnet type are used, but the motors are not limited to this, and planar motors of a moving coil type in which the coil units are placed at the fine movement slider sections of the fine movement stages and the magnetic units are placed at the guide members of the coarse movement stages can also be used.

Between coupling member 92a of coarse movement stage WCS1 and main section 80 of fine movement stage WFS1, as shown in FIG. 4A, a pair of tubes 86a and 86b used to transmit the power usage, which is supplied from the outside to coupling member 92a via a tube carrier, to fine movement stage WFS1 are installed. One ends of tubes 86a and 86b are connected to the side surface on the +X side of coupling member 92a and the other ends are connected to the inside of main section 80, respectively via a pair of recessed sections 80a (refer to FIG. 40) with a predetermined depth each of which is formed from the end surface on the −X side toward the +X direction with a predetermined length, on the upper surface of main section 80. As shown in FIG. 4C, tubes 86a and 86b are configured not to protrude above the upper surface of fine movement stage WFS1. Between coupling member 92a of coarse movement stage WCS2 and main section 80 of fine movement stage WFS2 as well, as shown in FIG. 2, a pair of tubes 86a and 86b used to transmit the power usage, which is supplied from the outside to coupling member 92a, to fine movement stage WFS2 are installed.

Power usage, here, is a generic term of power for various sensors and actuators such as motors, coolant for temperature adjustment to the actuators, pressurized air for air bearings and the like which is supplied from the outside to coupling member 92a via the tube carrier (not shown). In the case where a vacuum suction force is necessary, the force for vacuum (negative pressure) is also included in the power usage.

The tube carrier is arranged in a pair corresponding to wafer stages WST1 and WST2, respectively, and is actually placed each on a step portion formed at the end on the −X side and the +X side of base board 12 shown in FIG. 3, and is driven in the Y-axis direction following wafer stages WST1 and WST2 by actuators such as linear motors on the step portion.

Next, a measuring system that measures positional information of wafer stages WST1 and WST2 is described. Exposure apparatus 100 has a fine movement stage position measuring system 70 (refer to FIG. 7) to measure positional information of fine movement stages WFS1 and WFS2 and coarse movement stage position measuring systems 68A and 68B (refer to FIG. 7) to measure positional information of coarse movement stages WCS1 and WCS2 respectively.

Fine movement stage position measuring system 70 has a measurement bar 71 shown in FIG. 1. Measurement bar 71 is placed below first sections 14A₁ and 14B₁ that the pair of surface plates 14A and 14B respectively have, as shown in FIG. 3. As is obvious from FIGS. 1 and 3, measurement bar 71 is made up of a beam-like member having a rectangular sectional shape with the Y-axis direction serving as its longitudinal direction, and both ends in the longitudinal direction are each fixed to main frame BD in a suspended state via a suspended member 74. More specifically, main frame BD and measurement bar 71 are integrated.

The +Z side half (upper half) of measurement bar 71 is placed between second section 14A2 of surface plate 14A and second section 14B2 of surface plate 14B, and the −Z side half (lower half) is housed inside recessed section 12a formed at base board 12. Further, a predetermined clearance is formed between measurement bar 71 and each of surface plates 14A and 14B and base board 12, and measurement bar 71 is in a state noncontact with the members other than main frame BD. Measurement bar 71 is formed by a material with a relatively low coefficient of thermal expansion (e.g. invar, ceramics, or the like). Incidentally, the shape of measurement bar 71 is not limited in particular. For example, it is also possible that the measurement member has a circular cross section (a cylindrical shape), or a trapezoidal or triangle cross section. Further, the measurement bar does not necessarily have to be formed by a longitudinal member such as a bar-like member or a beam-like member.

At measurement bar 71, as shown in FIG. 5, a first measurement head group 72 used when measuring positional information of the fine movement stage (WFS1 or WFS2) located below projection unit PU and a second measurement head group 73 used when measuring positional information of the fine movement stage (WFS1 or WFS2) located below alignment device 99 are arranged. Incidentally, alignment systems AL1 and AL2₁ to AL2₄ are shown in virtual lines (two-dot chain lines) in FIG. 5 in order to make the drawing easy to understand. Further, in FIG. 5, the reference signs of alignment systems AL2₁ to AL2₄ are omitted.

As shown in FIG. 5, first measurement head group 72 is placed below projection unit PU and includes a one-dimensional encoder head for X-axis direction measurement (hereinafter, shortly referred to as an X head or an encoder head) 75x, a pair of one-dimensional encoder heads for Y-axis direction measurement (hereinafter, shortly referred to as Y heads or encoder heads) 75ya and 75yb, and three Z heads 76a, 76b and 76c.

X head 75x, Y heads 75ya and 75yb and the three Z heads 76e to 76c are placed in a state where their positions do not vary, inside measurement bar 71. X head 75x is placed on reference axis LV, and Y heads 75ya and 75yb are placed at the same distance away from X head 75x, on the −X side and the +X side, respectively. In the embodiment, as each of the three encoder heads 75x, 75ya and 75yb, a diffraction interference type head is used which is a head in which a light source, a photodetection system (including a photodetector) and various types of optical systems are unitized, similar to the encoder head disclosed in, for example, PCT International Publication No. 2007/083758 (the corresponding U.S. Patent Application Publication No. 2007/0288121) and the like.

When wafer stage WST1 (or WST2) is located directly under projection optical system PL (refer to FIG. 1), X head 75x and Y heads 75ya and 75yb each irradiate a measurement beam on grating RG (refer to FIG. 4B) placed on the lower surface of fine movement stage WFS1 (or WFS2), via a gap between surface plate 14A and surface plate 14B or a light-transmitting section (e.g. an opening) formed at first section 14A₁ of surface plate 14A and first section 14B₁ of surface plate 14B. Further, X head 75x and Y heads 75ya and 75yb respectively receive diffraction light from grating RG, thereby obtaining positional information within the XY plane (also including rotational information in the z direction) of fine movement stage WFS1 (or WFS2). More specifically, an X liner encoder 51 (refer to FIG. 7) is configured of X head 75x that measures the position of fine movement stage WFS1 (or WFS2) in the X-axis direction using the X diffraction grating that grating RG has. And, a pair of Y liner encoders 52 and 53 (refer to FIG. 7) are configured of the pair of Y heads 75ya and 75yb that measure the position of fine movement stage WFS1 (or WFS2) in the Y-axis direction using the Y diffraction grating of grating RG. The measurement value of each of X head 75x and Y heads 75ya and 75yb is supplied to main controller 20 (refer to FIG. 7), and main controller 20 measures (computes) the position of fine movement stage WFS1 (or WFS2) in the X-axis direction based on the measurement value of X head 75x, and the position of fine movement stage WFS1 (or WFS2) in the Y-axis direction based on the average value of the measurement values of the pair of Y head 75ya and 75yb. Main controller 20 measures (computes) the position in the θz direction (θz rotation) of fine movement stage WFS1 (or WFS2) using the measurement values of each of the pair of Y linear encoders 52 and 53.

In this case, an irradiation point (detection point), on grating RG, of the measurement beam irradiated from X head 75x coincides with the exposure position that is the center of exposure area IA (refer to FIG. 1) on wafer W. Further, a midpoint of a pair of irradiation points (detection points), on grating RG, of the measurement beams respectively irradiated from the pair of Y heads 75ya and 75yb coincides with the irradiation point (detection point), on grating RG, of the measurement beam irradiated from x head 75x. Main controller 20 computes positional information of fine movement stage WFS1 (or WFS2) in the Y-axis direction based on the average of the measurement values of the two Y heads 75ya and 75yb. Therefore, the positional information of fine movement stage WFS1 (or WFS2) in the Y-axis direction is substantially measured at the exposure position that is the center of irradiation area (exposure area) IA of illumination light IL irradiated on wafer W. More specifically, the measurement center of X head 75x and the substantial measurement center of the two Y heads 75ya and 75yb coincide with the exposure position. Consequently, by using X linear encoder 51 and Y linear encoders 52 and 53, main controller 20 can perform measurement of the positional information within the XY plane (including the rotational information in the z direction) of fine movement stage WFS1 (or WFS2) directly under (on the back side of) the exposure position at all times.

As each of Z heads 76a to 76c, for example, a head of a displacement sensor by an optical method similar to an optical pickup used in a CD drive device or the like is used. The three Z heads 76a to 76c are placed at the positions corresponding to the respective vertices of an isosceles triangle (or an equilateral triangle). Z heads 76a to 76c each irradiate the lower surface of fine movement stage WFS1 (or WFS2) with a measurement beam parallel to the Z-axis from below, and receive reflected light reflected by the surface of the plate on which grating RG is formed (or the formation surface of the reflective diffraction grating). Accordingly, Z heads 76a to 76c configure a surface position measuring system 54 (refer to FIG. 7) that measures the surface position (position in the Z-axis direction) of fine movement stage WFS1 (or WFS2) at the respective irradiation points. The measurement value of each of the three Z heads 76a to 76c is supplied to main controller 20 (refer to FIG. 7).

The center of gravity of the isosceles triangle (or the equilateral triangle) whose vertices are at the three irradiation points on grating RG of the measurement beams respectively irradiated from the three Z heads 76a to 76c coincides with the exposure position that is the center of exposure area IA (refer to FIG. 1) on wafer W. Consequently, based on the average value of the measurement values of the three Z heads 76a to 76c, main controller 20 can acquire positional information in the Z-axis direction (surface position information) of fine movement stage WFS1 (or WFS2) directly under the exposure position at all times. Further, main controller 20 measures (computes) the rotational amount in the x direction and the y direction, in addition to the position in the Z-axis direction, of fine movement stage WFS1 (or WFS2) based on the measurement values of the three Z heads 76a to 76c.

Second measurement head group 73 has an X head 77x that configures an X liner encoder 55 (refer to FIG. 7), a pair of Y heads 77ya and 77yb that configure a pair of Y linear encoders 56 and 57 (refer to FIG. 7), and three Z heads 78a, 78b and 78c that configure a surface position measuring system 58 (refer to FIG. 7). The respective positional relations of the pair of Y heads 77ya and 77yb and the three Z heads 78a to 78c with X head 77x serving as a reference are similar to the respective positional relations described above of the pair of Y heads 75ya and 75yb and the three Z heads 76a to 76c with X head 75x serving as a reference. An irradiation point (detection point), on grating RG, of the measurement beam irradiated from X head 77x coincides with the detection center of primary alignment system. AL1. More specifically, the measurement center of X head 77x and the substantial measurement center of the two Y heads 77ya and 77yb coincide with the detection center of primary alignment system AL1. Consequently, main controller 20 can perform measurement of positional information within the XY plane and surface position information of fine movement stage WFS2 (or WFS1) at the detection center of primary alignment system AL1 at all times.

Incidentally, while each of X heads 75x and 77x and Y heads 75ya, 75yb, 77ya and 77yb of the embodiment has the light source, the photodetection system (including the photodetector) and the various types of optical systems that are unitized and placed inside measurement bar 71, the configuration of the encoder head is not limited thereto. For example, the light source and the photodetection system can be placed outside the measurement bar. In such a case, the optical systems placed inside the measurement bar, and the light source and the photodetection system are connected to each other via, for example, an optical fiber or the like. Further, a configuration can also be employed in which the encoder head is placed outside the measurement bar and only a measurement beam is guided to the grating via an optical fiber placed inside the measurement bar. Further, the rotational information of the wafer in the z direction can be measured using a pair of the X liner encoders (in this case, there should be one Y linear encoder). Further, the surface position information of the fine movement stage can be measured using, for example, an optical interferometer. Further, instead of the respective heads of first measurement head group 72 and second measurement head group 73, three encoder heads in total, which include at least one XZ encoder head whose measurement directions are the X-axis direction and the Z-axis direction and at least one YZ encoder head whose measurement directions are the Y-axis direction and the Z-axis direction, can be arranged in the placement similar to that of the X head and the pair of Y heads described earlier.

When wafer stage WST1 moves between exposure station 200 and measurement station 300 on surface plate 14A, coarse movement stage position measuring system 68A (refer to FIG. 7) measures positional information of coarse movement stage WCS1 (wafer stage WST1). The configuration of coarse movement stage position measuring system 68A is not limited in particular, and includes an encoder system or an optical interferometer system (it is also possible to combine the optical interferometer system and the encoder system). In the case where coarse movement stage position measuring system 68A includes the encoder system, for example, a configuration can be employed in which the positional information of coarse movement stage WCS1 is measured by irradiating a scale (e.g. two-dimensional grating) fixed (or formed) on the upper surface of coarse movement stage WCS1 with measurement beams from a plurality of encoder heads fixed to main frame BD in a suspended state along the movement course of wafer stage WST1 and receiving the diffraction light of the measurement beams. In the case where coarse movement stage measuring system 68A includes the optical interferometer system, a configuration can be employed in which the positional information of wafer stage WST1 is measured by irradiating the side surface of coarse movement stage WCS1 with measurement beams from an X optical interferometer and a Y optical interferometer that have a measurement axis parallel to the X-axis and a measurement axis parallel to the Y-axis respectively and receiving the reflected light of the measurement beams.

Coarse movement stage position measuring system 68B (refer to FIG. 7) has the configuration similar to coarse movement stage position measuring system 68A, and measures positional information of coarse movement stage WCS2 (wafer stage WST2). Main controller 20 respectively controls the positions of coarse movement stages WCS1 and WCS2 (wafer stages WST1 and WST2) by individually controlling coarse movement stage driving systems 62A and 62B, based on the measurement values of coarse movement stage position measuring systems 68A and 68B.

Further, exposure apparatus 100 is also equipped with a relative position measuring system 66A and a relative position measuring system 66B (refer to FIG. 7) that measure the relative position between coarse movement stage WCS1 and fine movement stage WFS1 and the relative position between coarse movement stage WCS2 and fine movement stage WFS2, respectively. While the configuration of relative position measuring systems 66A and 66B is not limited in particular, relative position measuring systems 66A and 66B can each be configured of, for example, a gap sensor including a capacitance sensor. In this case, the gap sensor can be configured of, for example, a probe section fixed to coarse movement stage WCS1 (or WCS2) and a target section fixed to fine movement stage WFS1 (or WFS2). Incidentally, the configuration is not limited thereto, and for example, the relative position measuring system can be configured using, for example, a liner encoder system, an optical interferometer system or the like.

Furthermore, in exposure apparatus 100 of the embodiment, as shown in FIG. 2, a first unloading position UPA is placed at a position located slightly on the −Y side from projection optical system PL around the center in the X-axis direction of surface plate 14A, and slightly on the −Y side of alignment system AL1, which is placed apart by a predetermined distance from the first unloading position UPA in the −Y direction, a first loading position LPA is placed. The second unloading position UPS and the second loading position LPB are placed at positions symmetric to the first unloading position UPA and the first loading position LPA, respectively, with respect to reference axis LV. Chuck units 102₁ to 102₄ are provided in the first and second unloading positions UPA and UPB and the first and second loading positions LPA and LPB, respectively. FIGS. 6A and 6B representatively show chuck unit 102₁ provided at the first loading position LPA that represents chuck units 102₁ to 102₄, along with wafer stage WST1. Incidentally, in FIG. 2 (and other drawings), in order to prevent the drawing from becoming complicated and difficult to understand, illustration of chuck units 102₁ to 102₄ is omitted.

As shown in FIGS. 6A and 6B, chuck unit 102₁ is equipped with a driving section 104 fixed to the lower surface of main frame BD, a shaft 106 driven in a vertical direction (the Z-axis direction) by driving section 104, and a disc-shaped Bernoulli chuck (also referred to as a float chuck) 108 fixed to the lower and of shaft 106.

As shown in FIG. 6A, narrow plate-shaped extended portions 110a, 110b, and 110c are arranged extending at three places on the outer periphery of Bernoulli chuck 108. To the tip of extended portions 110a, 110b, and 110c, imaging devices 114a, 114b, and 114c such as CCDs and the like are attached. Gap sensor 112 is further attached to the nose (+X side of imaging device 114c) of extended portion 110c.

Bernoulli chuck 108 is a chuck which generates a suction force by blowing out air and holds an object in a non-contact manner, based on the Bernoulli Effect in which the pressure of a fluid decreases when the speed of the fluid increases. In the Bernoulli chuck, the dimension of the gap between the chuck and the object is determined by the weight of the object and the speed of the fluid blown out from the chuck.

Gap sensor 112 measures the gap between Bernoulli chuck 108 and the upper surface of fine movement stages WFS1 and WFS2. As gap sensor 112, for example, a capacitive sensor is used. The output of gap sensor 112 is supplied to main controller 20 (refer to FIG. 7).

Imaging device 114a picks up an image of a notch (a V-shaped notch, not shown) of wafer W in a state where the center of wafer W substantially coincides with the center of Bernoulli chuck 108. The remaining imaging devices 114b and 114c capture an image of the periphery of wafer W. Imaging signals of imaging devices 114a to 114c are sent to signal processing system 116 (refer to FIG. 7). Signal processing system 116 detects a cut-out (such as a notch) of the wafer and the periphery section besides the cut-out and obtains a positional shift and a rotational (a θz rotation) error of the wafer in the X-axis direction and the Y-axis direction of wafer W, by a method disclosed in, for example, U.S. Pat. No. 6,624,433 and the like. Information on such positional shift and rotational error is supplied to main controller 20 (refer to FIG. 7).

Driving section 104 of chuck unit 102₁ and Bernoulli chuck 108 are controlled by main controller 20 (refer to FIG. 7).

The other chuck units 102₂ to 102₄ are configured similar to chuck unit 102₁. Furthermore, along with each of the four chuck units 102₁ to 102₄, wafer carrier arms 118₁ to 118₄ which carry a wafer between chuck units 102₁ to 102₄ and a wafer delivery position (for example, a delivery position (an unloading side or a loading side) of a wafer between a coater developer which is connected in-line to exposure apparatus 100) are provided.

FIG. 7 shows a block diagram that shows input/output relations of main controller 20 that is configured of a control system of exposure apparatus 100 as the central component and performs overall control of the respective components. Main controller 20 includes a workstation (or a microcomputer) and the like, and performs overall control of the respective components of exposure apparatus 100 such as local liquid immersion device 8, surface plate driving systems 60A and 60B, coarse movement stage driving systems 62A and 62B, and fine movement stage driving systems 64A and 64B.

Next, a parallel processing operation that uses two wafer stages WST1 and WST2 will be described. Note that during the operation below, main controller 20 controls liquid supply device 5 and liquid recovery device 6 as described earlier and a constant quantity of liquid Lq is held directly under tip lens 191 of projection optical system PL, and thereby a liquid immersion area is formed at all times.

FIG. 8 shows a state where exposure by a step and scan method is performed to wafer W mounted on fine movement stage WFS1 of wafer stage WST1 in exposure station 200, and detection of a second fiducial mark on measurement plate FM2 of wafer stage WST2 (fine movement stage WFS2) is performed using primary alignment system AL1 in measurement station 300.

Main controller 20 performs the exposure operation by a step-and-scan method by repeating an inter-shot movement (stepping between shots) operation of moving wafer stage WST1 to a scanning starting position (acceleration starting position) for exposure of each shot area on wafer W, based on the results of wafer alignment (e.g. information obtained by converting an arrangement coordinate of each shot area on wafer W obtained by an Enhanced Global Alignment (EGA) into a coordinate with the second fiducial mark on measurement plate FM1 serving as a reference) and reticle alignment and the like that have been performed beforehand, and a scanning exposure operation of transferring a pattern formed on reticle R onto each shot area on wafer W by a scanning exposure method. During this step-and-scan operation, surface plates 14A and 14B exert the function as the countermasses, as described previously, according to movement of wafer stage WST1, for example, in the Y-axis direction during scanning exposure. Further, main controller 20 gives the initial velocity to coarse movement stage WCS1 when driving fine movement stage WFS1 in the X-axis direction for the stepping operation between shots, and thereby coarse movement stage WCS1 functions as a local countermass with respect to fine movement stage WFS1. On this operation, an initial velocity can be given to coarse movement stage WCS1 which makes the stage move in the stepping direction at a constant speed. Such a driving method is described in, for example, U.S. Patent Application Publication No. 2008/0143994. Consequently, the movement of wafer stage WST1 (coarse movement stage WCS1 and fine movement stage WFS1) does not cause vibration of surface plates 14A and 14B and does not adversely affect wafer stage WST2.

The exposure operations described above are performed in a state where liquid Lq is held in the space between tip lens 191 and wafer W (wafer W and plate 82 depending on the position of a shot area), or more specifically, by liquid immersion exposure.

In exposure apparatus 100 of the embodiment, during a series of the exposure operations described above, main controller 20 measures the position of fine movement stage WFS1 using first measurement head group 72 of fine movement stage position measuring system 70 and controls the position of fine movement stage WFS1 (wafer V) based on this measurement result.

In parallel with the exposure operation to wafer W mounted on fine movement stage WFS1 in exposure station 200, in measurement station 200, wafer alignment (and other preprocessing measurements) to a new wafer W mounted on fine movement stage WFS2 is performed, as shown in FIG. 9.

Prior to the wafer alignment, while fiducial mark FM2 on fine movement stage WFS2 within a detection field of primary alignment system AL1 is being positioned as shown in FIG. 8, main controller 20 resets (origin reset) the second measurement head group 73 (encoders 55, 56, and 57 (and Z surface position measuring system 58)).

After encoders 55, 56, and 57 (and Z surface position measuring system 58) are reset, main controller 20 detects the second fiducial mark on measurement plate FM2 using primary alignment system AL1, as shown in FIG. 10A. Then, main controller 20 detects the position of the second fiducial mark with the index center of primary alignment system AL1 serving as a reference, and based on the detection result and the result of position measurement of fine movement stage WFS2 by encoders 55, 56 and 57 at the time of the detection, computes the position coordinate of the second fiducial mark in the orthogonal coordinate system (alignment coordinate system) with reference axis La and reference axis LV serving as coordinate axes.

In the following description, a wafer alignment procedure will be described, in the case of picking wafer W having 43 shot areas as shown in FIG. 10A as an example and choosing all the shot areas on wafer W as a sample shot area, and detecting the one or two specific alignment marks (hereinafter referred to as sample marks) provided in each of the sample shot areas. Incidentally, in the following description, the primary alignment system and the secondary alignment system will both be shortly described as an alignment system. Further, while the positional information of wafer stage WST2 (fine movement stage WFS2) during the wafer alignment is measured by fine movement stage position measuring system 70 (the second measurement head group 73), in the following description of the wafer alignment procedure, explanation related to fine movement stage position measuring system 70 (the second measurement head group 73) will be omitted.

After having detected the second fiducial mark, main controller 20 steps wafer stage WST2 to a position a predetermined distance in the direction and a predetermined distance in the −X direction from the position shown in FIG. 10A, and positions one sample mark each arranged in the first and third shot areas in the first row on wafer W so that the sample marks are within a detection field of alignment systems AL2₂ and AL1, respectively, as shown in FIG. 10B.

Next, main controller 20 steps wafer stage WST2 located at the position shown in FIG. 10B in the +X direction, and positions one sample mark each arranged in the second and third shot areas in the first row on wafer W so that the sample marks are within a detection field of alignment systems AL1 and AL2₃, respectively, as shown in FIG. 10C. And, main controller 20 detects the two sample marks simultaneously and individually, using alignment systems AL1 and AL2₃. This completes the detection of the sample marks in the shot areas of the first row.

Next, main controller 20 steps wafer stage WST2 to a position a predetermined distance in the +Y direction and a predetermined distance in the −X direction from the position shown in FIG. 10C, and positions one sample mark each arranged in the first, third, fifth, and seventh shot areas in the second row on wafer W so that the sample marks are within a detection field of alignment systems AL2₁, AL2₂, AL1, and AL2₃, respectively, as shown in FIG. 11A. And, main controller 20 detects the four sample marks simultaneously and individually, using alignment systems AL2₁, AL2₂, AL1, and AL2₃. Next, main controller 20 steps wafer stage WST2 from the position shown in FIG. 11A in the +X direction, and positions one sample mark each arranged in the second, fourth, sixth, and seventh shot areas in the second row on wafer W so that the sample marks are within a detection field of alignment systems AL2₂, AL1, AL2₃, and AL2₄, respectively, as shown in FIG. 11B. And, main controller 20 detects the four sample marks simultaneously and individually, using alignment systems AL2₂, AL1, AL2₃, and AL2₄. This completes the detection of the sample marks in the shot areas of the second row.

Next, main controller 20 performs detection of the sample marks in the shot areas of the third row, in a procedure similar to the detection of the sample marks in the shot areas of the second row.

And, when the detection of the sample marks in the shot areas of the third row is completed, main controller 20 steps wafer stage WST2 from the position set at that point in time to a position a predetermined distance in the +Y direction and a predetermined distance in the −X direction, and positions one sample mark each arranged in the first, third, fifth, seventh, and ninth shot areas in the fourth row on wafer W so that the sample marks are within a detection field of alignment systems AL2₁, AL2₂, AL1, AL2₃, and AL2₄, respectively, as shown in FIG. 11C. And, main controller 20 detects the five sample marks simultaneously and individually, using alignment systems AL2₁, AL2₂, AL1, AL2₃, and AL2₄. Next, main controller 20 steps wafer stage WST2 from the position shown in FIG. 11C in the +X direction, and positions one sample mark each arranged in the second, fourth, sixth, eighth, and ninth shot areas in the fourth row on wafer W so that the sample marks are within a detection field of alignment systems AL2₁, AL2₂, AL1, AL2₃, and AL2₄, respectively, as shown in FIG. 11D. And, main controller 20 detects the five sample marks simultaneously and individually, using alignment systems AL2₁, AL2₂, AL1, AL2₃, and AL2₄.

Furthermore, main controller 20 performs detection of the sample marks in the shot areas of the fifth and sixth rows, in a manner similar to the detection of the sample marks in the shot areas of the second row. Finally, main controller 20 performs detection of the sample marks in the shot areas of the seventh row, in a manner similar to the detection of the sample marks in the shot areas of the first row.

When detection of the sample marks in all of the shot areas is completed in the manner described above, main controller 20 computes the array (position coordinates) of all of the shot areas on wafer W by performing a statistical computation which is disclosed in, for example, U.S. Pat. No. 4,780,617 and the like, using detection results of the sample marks and measurement values of fine movement stage position measuring system 70 (the second measurement head group 73) at the time of the sample mark detection. More specifically, EGA (Enhanced Global Alignment) is performed. Because measurement station 300 and exposure station 200 are arranged apart here, the position of fine movement stage WFS2 is controlled on different coordinate systems at the time of wafer alignment and at the time of exposure. Therefore, main controller 20 converts an array coordinate (position coordinate) which has been computed to an array coordinate (position coordinate) which uses a position of the second fiducial mark as a reference, using detection results of the second fiducial mark and measurement values of fine movement stage position measuring system 70B at the time of the detection.

As described above, as for the Y-axis direction, main controller 20 gradually steps wafer stage WST2 in the +Y direction, while driving wafer stage WST2 reciprocally in the +X direction and the −X direction for the X-axis direction, so as to detect the alignment marks (sample marks) provided in all of the shot areas on wafer W. In this case, in exposure apparatus 100 of the embodiment, because five alignment systems AL1, and AL2₁ to AL2₄ can be used, the distance of the reciprocal drive in the X-axis direction is short, and the number of times of position setting in one reciprocal movement is few, which is two times. Therefore, alignment marks can be detected in a short amount of time when compared with the case when using a single alignment system. Incidentally, in case no problems occur from the viewpoint of throughput, the wafer alignment previously described where all of the shot areas are sample shots can be performed, using only primary alignment system AL1. In this case, a base line of secondary alignment systems AL2₁ to AL2₄, namely, a relative position of secondary alignment systems AL2₁ to AL2₄ with respect to primary alignment system AL1 will not be required. Further, instead of all the shot areas being a sample shot, a part of the shot areas can be a sample shot. Further, not only the second measurement head group 73 but also a measurement head group that has a measurement center which coincides with each of the detection centers of the secondary alignment systems AL2₁ to AL2₄ can be further provided, and wafer alignment can be performed using the measurement head group along with the second measurement head group 73, while measuring a position coordinate of fine movement stage WFS2 (wafer stage WST2).

Normally, the wafer alignment sequence described above is completed earlier than the exposure sequence. Therefore, when the wafer alignment has been completed, main controller 20 drives wafer stage WST2 in the +X direction to move wafer stage WST2 to a predetermined standby position on surface plate 14B. In this case, when wafer stage WST2 is driven in the +X direction, fine movement stage WFS2 moves out of a measurable range of fine movement stage position measuring system 70 (i.e. the respective measurement beams irradiated from second measurement head group 73 move off from grating RG). Therefore, based on the measurement values of fine movement stage position measuring system 70 (encoders 55, 56 and 57) and the measurement values of relative position measuring system 66B, main controller 20 obtains the position of coarse movement stage WCS2 before fine movement stage WFS2 moves off of a measurable range of fine movement stage position measuring system 70, and thereinafter, controls the position of wafer stage WST2 based on the measurement values of coarse movement stage position measuring system 68B. More specifically, position measurement of wafer stage WST2 within the XY plane is switched from the measurement using encoders 55, 56 and 57 to the measurement using coarse movement stage position measuring system 68B. Then, main controller 20 makes wafer stage WST2 wait at the predetermined standby position described above until exposure on wafer W on fine movement stage WFS1 is completed.

When the exposure on wafer W on fine movement stage WFS1 has been completed, main controller 20 starts to drive wafer stages WST1 and WST2 severally toward a right-side scrum position shown in FIG. 13. When wafer stage WST1 is driven in the −X direction toward the right-side scrum position, fine movement stage WFS1 moves out of the measurable range of fine movement stage position measuring system 70 (encoders 51, 52 and 53 and surface position measuring system 54) (i.e. the measurement beams irradiated from first measurement head group 72 move off from grating RG). Therefore, before fine movement stage WFS1 moves off of a measurable range of fine movement stage position measuring system 70, main controller 20 obtains the position of coarse movement stage WCS1 based on the measurement values of fine movement stage position measuring system 70 (encoders 55, 56 and 57) and the measurement values of relative position measuring system 66A, and thereinafter, controls the position of wafer stage WST1 based on the measurement values of coarse movement stage position measuring system 68A. More specifically, main controller 20 switches position measurement of wafer stage WST1 within the XY plane from the measurement using encoders 51, 52 and 53 to the measurement using coarse movement stage position measuring system 68A. Further, during this operation, main controller 20 measures the position of wafer stage WST2 using coarse movement stage position measuring system 68B, and based on the measurement result, drives wafer stage WST2 in the +Y direction (refer to an outlined arrow in FIG. 12) on surface plate 14B, as shown in FIG. 12. By the action of a reaction force of this drive force of wafer stage WST2, surface plate 14B functions as the countermass.

Further, in parallel with the movement of wafer stages WST1 and WST2 toward the right-side scrum position described above, main controller 20 drives fine movement stage WFS1 in the +X direction based on the measurement values of relative position measuring system 66A and causes fine movement stage WFS1 to be in proximity to or in contact with coarse movement stage WCS1, and also drives fine movement stage WFS2 in the −X direction based on the measurement values of relative position measuring system 66B and causes fine movement stage WFS2 to be in proximity to or in contact with coarse movement stage WCS2.

Then, in a state where both wafer stages WST1 and WST2 have moved to the right-side scrum position, wafer stage WST1 and wafer stage WST2 go into a scrum state of being in proximity or in contact in the X-axis direction, as shown in FIG. 13. Simultaneously with this state, fine movement stage WFS1 and coarse movement stage WCS1 go into a scrum state, and coarse movement stage WCS2 and fine movement stage WFS2 go into a scrum state. Then, the upper surfaces of fine movement stage WFS1, coupling member 92b of coarse movement stage WCS1, coupling member 92b of coarse movement stage WCS2 and fine movement stage WFS2 form a fully flat surface that appears to be integrated.

As wafer stages WST1 and WST2 move in a direction shown by an outlined arrow (the −X direction) while the three scrum states described above are kept, the liquid immersion area (liquid Lq) formed between tip lens 191 and fine movement stage WFS1 sequentially moves onto (is delivered to) fine movement stage WFS1, coupling member 92b of coarse movement stage WCS1, coupling member 92b of coarse movement stage WCS2, and fine movement stage WFS2. FIG. 13 shows a state just before starting the movement (delivery) of the liquid immersion area (liquid Lq). Note that in the case where wafer stage WST1 and wafer stage WST2 are driven while the above-described three scrum states are kept, it is preferable that a gap (clearance) between wafer stage WST1 and wafer stage WST2, a gap (clearance) between fine movement stage WFS1 and coarse movement stage WCS1 and a gap (clearance) between coarse movement stage WCS2 and fine movement stage WFS2 are set such that leakage of liquid Lq is prevented or restrained. In this case, the proximity includes the case where the gap (clearance) between the two members in the scrum state is zero, or more specifically, the case where both the members are in contact.

When the movement of the liquid immersion area (liquid Lq) onto fine movement stage WFS2 has been completed, wafer stage WST1 has moved onto surface plate 14A. As shown in FIG. 14, main controller 20 drives wafer stage WST1 to the first unloading position UPA.

When wafer stage WST1 reaches the first unloading position UPA, main controller 20 uses chuck unit 102₂ at the first unloading position UPA, and unloads wafer W which has been exposed on wafer stage WST1 (fine movement stage WFS1) in the manner described below. Incidentally, in FIG. 14, in order to prevent the drawing from becoming difficult to understand, illustration of chuck unit 102₂ is omitted, and unloading of wafer W is typically shown.

First of all, main controller 20 controls driving section 104 of chuck unit 102₂ as shown in FIGS. 15A and 15B, and drives Bernoulli chuck 108 in a direction (the lower part) indicated by the outlined arrow. During the drive, main controller 20 monitors the measurement values of gap sensor 112. When main controller 20 confirms that the measurement values reach a predetermined value (e.g. a gap of around several μm), main controller 20 stops driving Bernoulli chuck 108 downward, and releases the hold of wafer W by the wafer holder (not shown) of fine movement stage WFS1. After the release, main controller 20 adjusts the flow rate of the air blowing out from Bernoulli chuck 108 so as to maintain the gap of around several μm. This allows wafer W to be held in a non-contact manner from above by Bernoulli chuck 108, via a clearance of around several μm.

Then, as shown in FIGS. 15C and 15D, main controller 20 controls driving section 104 and drives Bernoulli chuck 108 which held wafer W by non-contact is driven in a direction (the upper part) indicated by the outlined arrow. And, main controller 20 inserts (performs a drive in a direction shown by the black arrow) wafer carrier arm 118₂ in the space under wafer W held by Bernoulli chuck 108. After the insertion, main controller 20 drives Bernoulli chuck 108 which holds wafer W in a direction (the lower part) indicated by the outlined arrow as shown in FIGS. 16A and 16B, and holds the back surface of wafer W come in contact against the upper surface of wafer carrier arm 118₂. After the contact, main controller 20 releases the hold by Bernoulli chuck 108. After the release, main controller 20 makes Bernoulli chuck 108 withdraw upward, as shown in FIGS. 16C and 16D. This allows wafer W to be held by wafer carrier arm 118₂ from below. By driving wafer carrier arm 118₂ along a predetermined route after driving wafer carrier arm 118₂ in a direction (−X direction) indicated by the black arrow, main controller 20 carries wafer W from the first unloading position UPA to the wafer unloading position (e.g. a delivery position (unloading side) of the wafer between the coater developer). This completes the unloading of wafer W.

After the unloading of wafer W which has been exposed, main controller 20 moves wafer stage WST1 to the first loading position LPA as shown in FIG. 17. Main controller 20 moves wafer stage WST1 on surface plate 14A in the −Y-direction while measuring its position using coarse movement stage position measuring system 68A. In this case, on the movement of wafer stage WST1 in the −Y direction, surface plate 14A functions as the countermass due to the action of a reaction force of the drive force. Incidentally, when wafer stage WST1 moves in the X-axis direction, surface plate 14A can be made to function as the countermass owing to the action of a reaction force of the drive force.

When wafer stage WST1 reaches the first loading position LPA, main controller 20 loads a new wafer W (which has not yet been exposed) is loaded on wafer stage WST1 (fine movement stage WFS1) using chuck unit 102₁ at the first loading position LPA, as shown in FIG. 18. Incidentally, in FIG. 18, in order to prevent the drawing from becoming difficult to understand, illustration of chuck unit 102 is omitted, and loading of wafer W is typically shown.

The new wafer W is loaded in a procedure which is reverse to the unloading described above.

In other words, main controller 20, first of all, carries wafer W from the wafer loading position (delivery position (loading side) of the wafer, for example, between the coater developer) to the first loading position LPA using wafer carrier arm 118₁.

Then, main controller 20 drives Bernoulli chuck 108 downward, and holds wafer W using Bernoulli chuck 108. And then, main controller 20 drives Bernoulli chuck 108 which holds wafer W upward, and makes wafer carrier arm 118 withdraw from the first loading position LPA.

Then, main controller 20 adjusts the position (including the θz rotation) in the XY plane of fine movement stage WFS1 via fine movement stage driving system 64A (and coarse movement stage driving system 62A), while monitoring the measurement values of coarse movement stage measuring system 68A, so that positional shift and rotational error of wafer W are corrected, based on information on positional shift in the X-axis direction and the Y-axis direction and rotational error of wafer W which is sent from signal processing system 116 previously described.

Then, main controller 20 drives Bernoulli chuck 108 downward to a position until the back surface of wafer W comes in contact with the wafer holder (not shown) of fine movement stage WFS1, and simultaneously with releasing the of hold wafer W by Bernoulli chuck 108, begins to hold wafer W with the wafer holder (not shown) of fine movement stage WFS1. After the wafer holder begins the hold, Bernoulli chuck 108 is made to withdraw upward by main controller 20. This allows a new wafer W to be loaded on fine movement stage WFS1.

After the loading of wafer W, main controller 20 moves wafer stage WST1 into measurement station 300. Main controller 20 then switches position measurement of wafer stage WST1 within the XY plane from the measurement using coarse movement stage position measuring system 68A to the measurement using encoders 55, 56 and 57.

Then, main controller 20 detects the second fiducial mark on measurement plate FM1 using primary alignment system AL1, as shown in FIG. 19. Note that, prior to the detection of the second fiducial mark, main controller 20 executes reset (resetting of the origin) of the second measurement head group 73 of fine movement stage position measuring system 70, or more specifically, encoders 55, 56 and 57 (and surface position measuring system 58). After that, main controller 20 performs wafer alignment (EGA) using alignment systems AL1 and AL2₁ to AL2₄, which is similar to the above-described one, with respect to wafer W on fine movement stage WFS1, while controlling the position of wafer stage WST1.

In parallel with the operation of wafer stage WST1 described above, main controller 20 drives wafer stage WST2 and sets the position of measurement plate FM2 at a position directly under projection optical system PL as shown in FIG. 14. Prior to this operation, main controller 20 has switched position measurement of wafer stage WST2 within the XY plane from the measurement using coarse movement stage position measuring system 68B to the measurement using encoders 51, 52 and 53. Then, the pair of first fiducial marks on measurement plate FM2 are detected using reticle alignment systems RA₁ and RA₂ and the relative position of projected images, on the wafer, of the reticle alignment marks on reticle R that correspond to the first fiducial marks are detected. Incidentally, this detection is performed, via projection optical system PL and liquid Lq that forms the liquid immersion area.

Based on the relative positional information detected as above and the positional information of each of the shot areas on wafer W with the second fiducial mark on fine movement stage WFS2 serving as a reference that has been previously obtained, main controller 20 computes the relative positional relation between the projection position of the pattern of reticle R (the projection center of projection optical system PL) and each of the shot areas on wafer W mounted on fine movement stage WFS2. While controlling the position of fine movement stage WFS2 (wafer stage WST2) based on the computation results, main controller 20 transfers the pattern of reticle R onto each shot area on wafer W mounted on fine movement stage WFS2 by a step-and-scan method, which is similar to the case of wafer W mounted on fine movement stage WFS1 described earlier. FIGS. 17 to 19 show a state where the pattern of reticle R is transferred onto each shot area on wafer W in this manner.

When the wafer alignment (EGA) with respect to wafer W on fine movement stage WFS1 has been completed and also the exposure on wafer W on fine movement stage WFS2 has been completed, main controller 20 drives wafer stages WST1 and WST2 toward a left-side scrum position. This left side scrum position refers to a positional relation in which wafer stages WST1 and WST2 are located at positions symmetrical to the right side scrum position shown in FIG. 13, with respect to reference axis LV previously described. Measurement of the position of wafer stage WST1 during the drive toward the left-side scrum position is performed in a similar procedure to that of the position measurement of wafer stage WST2 described earlier.

At this left-side scrum position as well, wafer stage WST1 and wafer stage WST2 go into the scrum state described earlier, and concurrently with this state, fine movement stage WFS1 and coarse movement stage WCS1 go into the scrum state and coarse movement stage WCS2 and fine movement stage WFS2 go into the scrum state. Then, the upper surfaces of fine movement stage WFS1, coupling member 92b of coarse movement stage WCS1, coupling member 92b of coarse movement stage WCS2 and fine movement stage WFS2 form a fully flat surface that is appears to be integrated.

Main controller 20 drives wafer stages WST1 and WST2 in the +X direction that is reverse to the previous direction, while keeping the three scrum states described above. According this drive, the liquid immersion area (liquid Lq) formed between tip lens 191 and fine movement stage WFS2 sequentially moves onto fine movement stage WFS2, coupling member 92b of coarse movement stage WCS2, coupling member 92b of coarse movement stage WCS1 and fine movement stage WFS1, which is reverse to the previously described order. As a matter of course, also when the wafer stages are moved while the scram states are kept, the position measurement of wafer stages WST1 and WST2 is performed, similarly to the previously described case. When the movement of the liquid immersion area (liquid Lq) has been completed, main controller 20 starts exposure on wafer W on wafer stage WST1 in the procedure similar to the previously described procedure. In parallel with this exposure operation, main controller 20 exchanges wafer W which has been exposed on wafer stage WST2 to a new wafer W as is previously described. In other words, main controller 20 moves wafer stage WST2 to the second unloading position UPB, unloads wafer W which has undergone exposure on wafer stage WST2 using chuck unit 102₄ arranged at the second unloading position UPB, and then moves wafer stage WST2 to the second loading position LPB, and loads a new wafer W on wafer stage WST2 using chuck unit 102₃ arranged at the second loading position LPB. After the wafer exchange, main controller 20 moves wafer stage WST2 into measurement station 300, and then executes wafer alignment to a new wafer W.

After that, main controller 20 repeatedly executes the parallel processing operations using wafer stages WST1 and WST2 described above.

As described in detail above, according to exposure apparatus 100 of the embodiment, by holding wafer W from above in a non-contact manner using chuck unit 102 (Bernoulli chuck 108), wafer W is loaded onto fine movement stages WFS1 and WFS2 as well as unloaded from fine movement stages WFS1 and WFS2. Accordingly, members and the like to load/unload the wafer on/from fine movement stages WFS1 and WFS2 do not have to be provided, which can keep fine movement stages WFS1 and WFS2 from increasing in size and weight. Further, by using Bernoulli chuck 108 which holds the wafer from above in a non-contact manner, a thin, flexible object, e.g. a 450 mm wafer and the like, can be loaded onto wafer stages WFS1 and WFS2 as well as unloaded from wafer stages WFS1 and WFS2 without any problems.

Further, according to exposure apparatus 100 of the embodiment, the first loading position LPA where wafer W is loaded onto fine movement stage WFS1 and the first unloading position UPA where wafer W is unloaded from fine movement stage WFS1 are placed at different positions on surface plate 14A, and at the different positions, chuck units 102₁ and 102₂ (Bernoulli chuck 108) are provided, respectively. Similarly, the second loading position LPA where wafer W is loaded onto fine movement stage WFS2 and the second unloading position UPA where wafer W is unloaded from fine movement stage WFS2 are placed at different positions on surface plate 14B, and at the different positions, chuck units 102 and 102₃ (Bernoulli chuck 108) are provided, respectively. This reduces the time required for wafer exchange.

Further, in exposure apparatus 100 of the embodiment, during the exposure operation and during the wafer alignment (mainly, during the measurement of the alignment marks), first measurement head group 72 and second measurement head group 73 fixed to measurement bar 71 are respectively used in the measurement of the positional information (the positional information within the XY plane and the surface position information) of fine movement stage WFS1 (or WFS2) that holds wafer W. And, since encoder heads 75x, 75ya and 75yb and Z heads 76a to 76c that configure first measurement head group 72, and encoder heads 77x, 77ya and 77yb and Z heads 78a to 78c that configure second measurement head group 73 can respectively irradiate grating RG placed on the bottom surface of fine movement stage WFS1 (or WFS2) with measurement beams from directly below at the shortest distance, measurement error caused by temperature fluctuation of the surrounding atmosphere of wafer stage WST1 or WST2, e.g., air fluctuation is reduced, and high-precision measurement of the positional information of fine movement stage WFS can be performed.

Further, first measurement head group 72 measures the positional information within the XY plane and the surface position information of fine movement stage WFS1 (or WFS2) at the point that substantially coincides with the exposure position that is the center of exposure area IA on wafer W, and second measurement head group 73 measures the positional information within the XY plane and the surface position information of fine movement stage WFS2 (or WFS1) at the point that substantially coincides with the center of the detection area of primary alignment system AL1. Consequently, occurrence of the so-called Abbe error caused by the positional error within the XY plane between the measurement point and the exposure position is restrained, and also in this regard, high-precision measurement of the positional information of fine movement stage WFS1 or WFS2 can be performed.

Further, since measurement bar 71 that has first measurement head group 72 and second measurement head group 73 is fixed in a suspended state to main frame BD to which barrel 40 is fixed, it becomes possible to perform high-precision position control of wafer stage WST1 (or WST2) with the optical axis of projection optical system PL held, by barrel 40 serving as a reference. Further, since measurement bar 71 is in a noncontact state with the members (e.g. surface plates 14A and 14B, base board 14, and the like) other than main frame BD, vibration or the like generated when surface plates 14A and 14B, wafer stages WST1 and WST2, and the like are driven does not travel. Consequently, it becomes possible to perform high-precision measurement of the positional information of wafer stage WST1 (or WST2), by using first measurement head group 72 and second measurement head group 73.

Further, according to exposure apparatus 100 of the embodiment, main controller 20 detects one or more alignment marks arranged in each of all the shot areas on wafer W held by fine movement stage WFS2 using primary alignment system AL1, which has a detection center at a position (an XY position) the same as the reference point used on position measurement by fine movement stage position measuring system 70, and the secondary alignment systems AL2₁ to AL2₄, having detection centers that have a known positional relation with the detection center of primary alignment system AL1. By driving fine movement stage WFS2 in the case of exposure based on the results of the wafer alignment, it becomes possible to achieve a sufficient overlay accuracy at a sufficient throughput. Especially in the case of detecting one or more alignment marks arranged in each of all the shot areas on wafer W held by fine movement stage WFS2 using only primary alignment system AL1, which has a detection center at a position (an XY position) the same as a reference point used on position measurement by fine movement stage position measuring system 70, by driving fine movement stage WFS2 based on the results of the wafer alignment in the case of exposure, alignment of all the shot areas on wafer W to the exposure position with high precision becomes possible, which in turn allows a highly precise (the best precision in) overlay in each of all the shot areas with the reticle pattern.

Further, in wafer stages WST1 and WST2 in the present embodiment, since coarse movement stage WCS1 (or WCS2) is placed on the periphery of fine movement stage WFS1 (or WFS2) wafer stages WST1 and WST2 can be reduced in size in the height direction (Z-axis direction), compared with a wafer stage that has a coarse/fine movement configuration in which a fine movement stage is mounted on a coarse movement stage. Therefore, the distance in the Z-axis direction between the point of action of the thrust of the planar motors that configure coarse movement stage driving systems 62A and 62B (i.e. the point between the bottom surface of coarse movement stage WCS1 (WCS2) and the upper surfaces of surface plates 14A and 14B) and the center of gravity of wafer stages WST1 and WST2 can be decreased, and accordingly, the pitching moment (or the rolling moment) generated when wafer stages WST1 and WTS2 are driven can be reduced. Consequently, the operations of wafer stages WST1 and WST2 become stable.

Further, in exposure apparatus 100 of the embodiment, the surface plate that forms the guide surface used when wafer stages WST1 and WST2 move along the XY plane is configured of the two surface plates 14A and 14B so as to correspond to the two wafer stages WST1 and WST2. These two surface plates 14A and 14B independently function as the countermasses when wafer stages WST1 and WST2 are driven by the planar motors (coarse movement stage driving systems 62A and 62B), and therefore, for example, even when wafer stage WST1 and wafer stage WST2 are respectively driven in directions opposite to each other in the Y-axis direction on surface plates 14A and 14B, surface plates 14A and 14B can individually cancel the reaction forces respectively acting on the surface plates.

Incidentally, in the embodiment above, while the case has been described where the wafer is loaded onto fine movement stages WFS1 and WFS2 as well as unloaded from fine movement stages WFS1 and WFS2 using chuck unit 102, which, is equipped with Bernoulli chuck 108 driven vertically by drive section 104, and wafer carrier arm 118, the embodiment above is not limited to this, and for example, the wafer can be loaded and unloaded, using a vertically movable horizontal multijoint robot arm that has Bernoulli chuck 108 fixed to the tip, or a chuck unit which is configured so that Bernoulli chuck 108 can be carried in the horizontal direction.

Further, in the embodiment described above, instead of the Bernoulli chuck, for example, a chuck member and the like using a differential evacuation as in a vacuum preload type static gas bearing can be used, which can hold wafer W from above in a non-contact manner.

Further, in the embodiment above, while loading positions LPA and LPB and unloading positions UPA and UPB were placed at different positions, these positions could also be placed at the same position. In this case, further at the same position, two chuck units which are chuck unit 102 used only for loading of the wafer and chuck unit 102 used only for unloading of the wafer can be provided.

Further, in the embodiment above, while loading position LPA and unloading position UPA for wafer stage WST1 and loading position LPB and unloading position UPB for wafer stage WST2 were placed individually, a loading position and an unloading position shared by wafer stages WST1 and WST2 can also be placed.

Further, in the embodiment above, while the case has been described where measurement bar 71 and main frame BD are integrated, the arrangement is not limited to this, and measurement bar 71 and main frame BD can physically be separated. In such a case, a measurement device (e.g. an encoder and/or an interferometer, or the like) that measures the position. (or displacement) of measurement bar 71 with respect to main frame BD (or a reference position), and an actuator or the like that adjusts the position of measurement bar 71 should be arranged, and based on the measurement result of the measurement device, main controller 20 and/or another controller should maintain the positional relation between main frame BD (and projection optical system PL) and measurement bar 71 in a predetermined relation (e.g. constant).

Further, in the embodiment and the modified example described above, while measuring systems 30 and 30′ were described that measure variation of measurement bar 71 by an optical method, the embodiment described above is not limited to this. To measure the variation of measurement bar 71, a temperature sensor, a pressure sensor, an acceleration sensor for vibration measurement and the like can be attached to measurement bar 71. Or, a distortion sensor (distortion gauge), or a displacement sensor and the like to measure variation of measurement bar 71 can be arranged. Then, variation (deformation, displacement and the like) of measurement bar 71 (housing 72₀) is obtained with these sensors, and based on results that have been obtained, main controller 20 obtains the tilt angle with respect to the Z-axis of the optical axis of the heads 75x, 75ya, and 75yb provided in measurement bar 71 (housing 72₀) and the distance from grating RG, and based on the tilt angle, the distance, and the correction information previously described, correction information of measurement errors (the third position error) of each of the heads 75x, 75ya, and 75yb of the first measurement head group 72 is obtained. Incidentally, main controller 20 can correct the positional information obtained by coarse movement stage position measuring systems 68A and 68B, based on the variation of measurement bar 71 obtained by the sensors.

Further, while the exposure apparatus of the embodiment above has the two surface plates corresponding to the two wafer stages, the number of the surface plates is not limited thereto, and one surface plate or three or more surface plates can be employed. Further, the number of the wafer stages is not limited to two, but one wafer stage or three or more wafer stages can be employed, and a measurement stage, for example, which has an aerial image measuring instrument, an uneven illuminance measuring instrument, an illuminance monitor, a wavefront aberration measuring instrument and the like, can be placed on the surface plate, which is disclosed in, for example, U.S. Patent Application Publication No. 2007/201010.

Further, the position of the border that separates the surface plate or the base member into a plurality of sections is not limited to the position as in the embodiment above. While the border line is set as the line that includes reference axis LV and intersects optical axis AX in the embodiments above, the border line can be set at another position, for example, in the case where, if the boundary is located in the exposure station, the thrust of the planar motor at the portion where the boundary is located weakens.

Further, the mid portion (which can be arranged at a plurality of positions) in the longitudinal direction of measurement bar 71 can be supported on the base board by an empty-weight canceller as disclosed in, for example, U.S. Patent Application Publication No. 2007/0201010.

Further, the motor to drive surface plates 14A and 14B on base board 12 is not limited to the planar motor by the electromagnetic force (Lorentz force) drive method, but for example, can be a planar motor (or a linear motor) by a variable magnetoresistance drive method. Further, the motor is not limited to the planar motor, but can be a voice coil motor that includes a mover fixed to the side surface of the surface plate and a stator fixed to the base board. Further, the surface plates can be supported on the base board via the empty-weight canceller as disclosed in, for example, U.S. Patent Application Publication No. 2007/0201010 and the like. Further, the drive directions of the surface plates are not limited to the directions of three degrees of freedom, but for example, can be the directions of six degrees of freedom, only the Y-axis direction, or only the XY two-axial directions. In this case, the surface plates can be levitated above the base board by static gas bearings (e.g. air bearings) or the like. Further, in the case where the movement direction of the surface plates can be only the Y-axis direction, the surface plates can be mounted on, for example, a Y guide member arranged extending in the Y-axis direction so as to be movable in the Y-axis direction.

Further, in the embodiment above, while the grating is placed on the lower surface of the fine movement stage, i.e. the Surface that is opposed to the upper surface of the surface plate, the arrangement is not limited to this, and the main section of the fine movement stage is made up of a solid member that can transmit light, and the grating can be placed on the upper surface of the main section. In this case, since the distance between the wafer and the grating is closer compared with the embodiment above, the Abbe error, which is caused by the difference in the Z-axis direction between the surface subject to exposure of the wafer that includes the exposure point and the reference surface (the placement surface of the grating) of position measurement of the fine movement stage by encoders 51, 52 and 53, can be reduced. Further, the grating can be formed on the back surface of the wafer holder. In this case, even if the wafer holder expands or the attachment position with respect to the fine movement stage shifts during exposure, the position of the wafer holder (wafer) can be measured according to the expansion or the shift.

Further, in the embodiment above, while the case has been described as an example where the encoder system is equipped with the X head and the pair of Y heads, the arrangement is not limited to this, and for example, one or two two-dimensional head(s) (2D head(s)) whose measurement directions are the two directions that are the X-axis direction and the Y-axis direction can be placed inside the measurement bar. In the case of arranging the two 2D heads, their detection points can be set at the two points that are spaced apart in the X-axis direction at the same distance from the exposure position as the center, on the grating. In the embodiment above, while the number of the heads is one X head and two Y heads, the number of the heads can further be increased. Further, in the embodiment above, while the number of the heads per head group is one X head and two Y heads, the number of the heads can further be increased. Moreover, first measurement head group 72 on the exposure station 300 side can further have a plurality of head groups. For example, on each of the sides (the four directions that are the +X, +Y, −X and −Y directions) on the periphery of the head group placed at the position corresponding to the exposure position (a shot area being exposed on wafer W), another head group can be arranged. And, the position of the fine movement stage (wafer W) just before exposure of the shot area can be measured in a so-called read-ahead manner. Further, the configuration of the encoder system that configures fine movement stage position measuring system 70 is not limited to the one in the embodiment above and an arbitrary configuration can be employed. For example, a 3D head can also be used that is capable of measuring the positional information in each direction of the X-axis, the I-axis and the Z-axis.

Further, in the embodiment above, the measurement beams emitted from the encoder heads and the measurement beams emitted from the Z heads are irradiated on the gratings of the fine movement stages via a gap between the two surface plates or the light-transmitting section formed at each of the surface plates. In this case, as the light-transmitting section, holes each of which is slightly larger than a beam diameter of each of the measurement beams are formed at each of surface plates 14A and 14B taking the movement range of surface plate 14A or 14B as the countermass into consideration, and the measurement beams can be made to pass through these multiple opening sections. Further, for example, it is also possible that pencil-type heads are used as the respective encoder heads and the respective Z heads, and opening sections in which these heads are inserted are formed at each of the surface plates.

Incidentally, in the embodiment above, the case has been described as an example where according to employment of the planar motors as coarse movement stage driving systems 62A and 62B that drive wafer stages WST1 and WST2, the guide surface (the surface that generates the force in the Z-axis direction) used on the movement of wafer stages WST1 and WST2 along the XY plane is formed by surface plates 14A and 14B that have the stator sections of the planar motors. However, the embodiment above is not limited thereto. Further, in the embodiment above, while the measurement surface (grating RG) is arranged on fine movement stages WFS1 and WFS2 and first measurement head group 72 (and second measurement head group 73) composed of the encoder heads (and the Z heads) is arranged at measurement bar 71, the embodiment above is not limited thereto. More specifically, reversely to the above-described case, the encoder heads (and the Z heads) can be arranged at fine movement stage WFS1 and the measurement surface (grating RG) can be formed on the measurement bar 71 side. Such a reverse placement can be applied to a stage device that has a configuration in which a magnetic levitated stage is combined with a so-called H-type stage, which is employed in, for example, an electron beam exposure apparatus, an EUV exposure apparatus or the like. In this stage device, since a stage is supported by a guide bar, a scale bar (which corresponds to the measurement bar on the surface of which a diffraction grating is formed) is placed below the stage so as to be opposed to the stage, and at least a part (such as an optical system) of an encoder head is placed on the lower surface of the stage that is opposed to the scale bar. In this case, the guide bar configures the guide surface forming member. As a matter of course, another configuration can also be employed. The place where grating RG is arranged on the measurement bar 71 side can be, for example, measurement bar 71, or a plate of a nonmagnetic material or the like that is arranged on the entire surface or at least one surface on surface plate 14A (14B).

Incidentally, in the embodiment above, since measurement bar 71 is integrally fixed to main frame BD, there is a possibility that twist or the like occurs in measurement bar 71 owing to inner stress (including thermal stress) and the relative position between measurement bar 71 and main frame BD varies. Therefore, as the countermeasure taken in such as case, it is also possible that the position of measurement bar 71 (the relative position with respect to main frame BD, or the variation of the position with respect to a reference position) is measured, and the position of measurement bar 71 is finely adjusted by an actuator or the like, or the measurement result is corrected.

Further, in the embodiment above, the case has been described where the liquid immersion area (liquid Lq) is constantly maintained below projection optical system PL by delivering the liquid immersion area (liquid Lq) between fine movement stage WFS1 and fine movement stage WFS2 via coupling members 92b that coarse movement stages WCS1 and WCS2 are respectively equipped with. However, the present invention is not limited to this, and it is also possible that the liquid immersion area (liquid Lq) is constantly maintained below projection optical system PL by moving a shutter member (not illustrated) having a configuration similar to the one disclosed in, for example, the third embodiment of U.S. Patent Application Publication No. 2004/0211920, to below projection optical system PL in exchange of wafer stages WST1 and WST2.

Further, while the case has been described where the embodiment above is applied to stage device (wafer stages) 50 of the exposure apparatus, the present invention is not limited to this, and the embodiment above can also be applied to reticle stage RST. Incidentally, in the embodiment above, grating RG can be covered with a protective member, e.g. a cover glass, so as to be protected. The cover glass can be arranged to cover the substantially entire surface of the lower surface of main section 80, or can be arranged to cover only a part of the lower surface of main section 80 that includes grating RG. Further, while a plate-shaped protective member is desirable because the thickness enough to protect grating RG is required, a thin film-shaped protective member can also be used depending on the material. Besides, it is also possible that a transparent plate, on one surface of which grating RG is fixed or formed, has the other surface that is placed in contact with or in proximity to the back surface of the wafer holder and a protective member (cover glass) is arranged on the one surface side of the transparent plate, or the one surface of the transparent plate on which grating RG is fixed or formed is placed in contact with or in proximity to the back surface of the wafer holder without arranging the protective member (cover glass). Especially in the former case, grating RG can be fixed or formed on an opaque member such as ceramics instead of the transparent plate, or grating RG can be fixed or formed on the back surface of the wafer holder. In the latter case, even if the wafer holder expands or the attachment position with respect to the fine movement stage shifts during exposure, the position of the wafer holder (wafer) can be measured according to the expansion or the shift. Or, it is also possible that the wafer holder and grating RG are merely held by the conventional fine movement stage. Further, it is also possible that the wafer holder is formed by a solid glass member, and grating RG is placed on the upper surface (wafer mounting surface) of the glass member. Incidentally, in the embodiment above, while the case has been described as an example where the wafer stage is a coarse/fine movement stage that is a combination of the coarse movement stage and the fine movement stage, the present invention is not limited to this. Further, in the embodiment above, while fine movement stages WFS1 and WFS2 can be driven in all the directions of six degrees of freedom, the present invention is not limited to this, and the fine movement stages should be moved at least within the two-dimensional plane parallel to the XY plane. Moreover, fine movement stages WFS1 and WFS2 can be supported in a contact manner by coarse movement stages WCS1 and WCS2. Consequently, the fine movement stage driving system to drive fine movement stage WFS1 or WFS2 with respect to coarse movement stage WCS1 or WCS2 can be a combination of a rotary motor and a ball screw (or a feed screw). Incidentally, the fine movement stage position measuring system can be configured such that the position measurement can be performed in the entire area of the movement range of the wafer stages. In such a case, the coarse movement stage position measuring systems become unnecessary. Incidentally, the wafer used in the exposure apparatus of the embodiment above can be any one of wafers with various sizes, such as a 450-mm wafer or a 300-mm wafer.

Incidentally, in the embodiment above, while the case has been described where the exposure apparatus is the liquid immersion type exposure apparatus, the present invention is not limited to this, and the embodiment above can suitably be applied to a dry type exposure apparatus that performs exposure of wafer W without liquid (water).

Incidentally, in the embodiment above, while the case has been described where the exposure apparatus is a scanning stepper, the present invention is not limited to this, and the embodiment above can also be applied to a static exposure apparatus such as a stepper. Even in the stepper or the like, occurrence of position measurement error caused by air fluctuation can be reduced to almost zero by measuring the position of a stage on which an object that is subject to exposure is mounted using an encoder. Therefore, it becomes possible to set the position of the stage with high precision based on the measurement values of the encoder, and as a consequence, high-precision transfer of a reticle pattern onto the object can be performed. Further, the embodiment above can also be applied to a reduced projection exposure apparatus by a step-and-stitch method that synthesizes a shot area and a shot area.

Further, the magnification of the projection optical system in the exposure apparatus in the embodiment above is not only a reduction system, but also can be either an equal magnifying system or a magnifying system, and the projection optical system is not only a dioptric system, but also can be either a catoptric system or a catadioptric system, and in addition, the projected image can be either an inverted image or an erected image.

Further, illumination light IL is not limited to ArF excimer laser light (with a wavelength of 193 nm), but can be ultraviolet light such as KrF excimer laser light (with a wavelength of 248 nm), or vacuum ultraviolet light such as F₂ laser light (with a wavelength of 157 nm). As disclosed in, for example, U.S. Pat. No. 7,023,610, a harmonic wave, which is obtained by amplifying a single-wavelength laser beam in the infrared or visible range emitted by a DFB semiconductor laser or fiber laser with a fiber amplifier doped with, for example, erbium (or both erbium and ytterbium), and by converting the wavelength into ultraviolet light using a nonlinear optical crystal, can also be used as vacuum ultraviolet light.

Further, in the embodiment above, illumination light IL of the exposure apparatus is not limited to the light having a wavelength more than or equal to 100 nm, and it is needless to say that the light having a wavelength less than 100 nm can be used. For example, the embodiment above can be applied to an EUV (Extreme Ultraviolet) exposure apparatus that uses an EUV light in a soft X-ray range (e.g. a wavelength range from 5 to 15 nm). In addition, the embodiment above can also be applied to an exposure apparatus that uses charged particle beams such as an electron beam or an ion beam.

Further, in the embodiment above, a light transmissive type mask (reticle) is used, which is obtained by forming a predetermined light-shielding pattern (or a phase pattern or a light-attenuation pattern) on a light-transmitting substrate, but instead of this reticle, as disclosed in, for example, U.S. Pat. No. 6,778,257, an electron mask (which is also called a variable shaped mask, an active mask or an image generator, and includes, for example, a DMD (Digital Micromirror Device) that is a type of a non-emission type image display element (spatial light modulator) or the like) on which a light-transmitting pattern, a reflection pattern, or an emission pattern is formed according to electronic data of the pattern that is to be exposed can also be used. In the case of using such a variable shaped mask, a stage on which a wafer, a glass plate or the like is mounted is scanned relative to the variable shaped mask, and therefore the equivalent effect to the embodiment above can be obtained by measuring the position of this stage using an encoder system.

Further, as disclosed in, for example, PCT International Publication No. 2001/035168, the embodiment above can also be applied to an exposure apparatus (a lithography system) in which line-and-space patterns are formed on wafer W by forming interference fringes on wafer W.

Moreover, the embodiment above can also be applied to an exposure apparatus that synthesizes two reticle patterns on a wafer via a projection optical system and substantially simultaneously performs double exposure of one shot area on the wafer by one scanning exposure, as disclosed in, for example, U.S. Pat. No. 6,611,316.

Incidentally, an object on which a pattern is to be formed (an object subject to exposure on which an energy beam is irradiated) in the embodiment above not limited to a wafer, but may be another object such as a glass plate, a ceramic substrate, a film member, or a mask blank.

The usage of the exposure apparatus is not limited to the exposure apparatus used for manufacturing semiconductor devices, but the embodiment above can be widely applied also to, for example, an exposure apparatus for manufacturing liquid crystal display elements in which a liquid crystal display element pattern is transferred onto a rectangular glass plate, and to an exposure apparatus for manufacturing organic EL, thin-film magnetic heads, imaging devices (such as CCDs), micromachines, DNA chips or the like. Further, the embodiment above can also be applied to an exposure apparatus that transfers a circuit pattern onto a glass substrate, a silicon wafer or the like not only when producing microdevices such as semiconductor devices, but also when producing a reticle or a mask used in an exposure apparatus such as an optical exposure apparatus, an EUV exposure apparatus, an X-ray exposure apparatus, and an electron beam exposure apparatus.

Incidentally, the disclosures of all publications, the PCT International Publications, the U.S. patent application Publications and the U.S. patents that are cited in the description so far related to exposure apparatuses and the like are each incorporated herein by reference.

Electron devices such as semiconductor devices are manufactured through the following steps: a step where the function/performance design of a device is performed; a step where a reticle based on the design step is manufactured; a step where a wafer is manufactured using a silicon material; a lithography step where a pattern of a mask (the reticle) is transferred onto the wafer With the exposure apparatus (pattern formation apparatus) of the embodiment described earlier and the exposure method thereof; a development step where the exposed wafer is developed; an etching step where an exposed member of an area other than an area where resist remains is removed by etching; a resist removing step where the resist that is no longer necessary when the etching is completed is removed; a device assembly step (including a dicing process, a bonding process, and a packaging process); an inspection step; and the like. In this case, in the lithography step, the exposure method described earlier is executed using the exposure apparatus of the embodiment above and device patterns are formed on the wafer, and therefore, the devices with high integration degree can be manufactured with high productivity.

While the above-described embodiment of the present invention is the presently preferred embodiment thereof, those skilled in the art of lithography systems will readily recognize that numerous additions, modifications, and substitutions may be made to the above-described embodiment without departing from the spirit and scope thereof. It is intended that all such modifications, additions, and substitutions fall within the scope of the present invention, which is best defined by the claims appended below.

Claims

1. An exposure apparatus that exposes an object with an energy beam via an optical system supported by a first support member, the apparatus comprising: a movable body that holds the object and is movable along a predetermined plane;a guide surface forming member that forms a guide surface used when the movable body moves along the predetermined plane;a second support member which is placed apart from the guide surface forming member on a side opposite to the optical system, via the guide surface forming member, and whose positional relation with the first support member is maintained at a predetermined relation;a position measuring system which includes a first measurement member that irradiates a measurement surface parallel to the predetermined plane with a measurement beam and receives light from the measurement surface, and which obtains positional information of the movable body within the predetermined plane based on an output of the first measurement member, the measurement surface being arranged at one of the movable body and the second support member and at least a part of the first measurement member being arranged at the other of the movable body and the second support member;a drive system which drives the movable body based on positional information of the movable body within the predetermined plane; anda carrier system which has at least one chuck member holding the object from above in a non-contact manner, and loads the object on the movable body as well as unload the object from the movable body, using the chuck member.

2. The exposure apparatus according to claim 1 wherein the carrier system unloads the object from the movable body at an unloading position which is set apart from a load position where the object is loaded on the movable body.

3. The exposure apparatus according to claim 2 wherein the carrier system has a chuck member used to load the object, and a chuck member used to unload the object.

4. The exposure apparatus according to claim 1 wherein the carrier system has a driving section which drives the chuck member at least on a direction perpendicular to the predetermined plane so that the chuck member approaches and moves away from the movable body, and a detection section which detects the distance between movable body and the chuck member.

5. The exposure apparatus according to claim 4 wherein the carrier system releases holding the object in a non-contact manner after making the chuck member holding the object in a non-contact manner approach the movable body via the drive section.

6. The exposure apparatus according to claim 4 wherein the carrier system holds the object in a non-contact manner after the chuck member is made to approach the object on the movable body via the driving section.

7. The exposure apparatus according to claim 1 wherein the carrier system has a measuring section which obtains a positional information of the object held by the chuck member, and the drive system adjusts a position of the movable body based on measurement results of the measuring section.

8. The exposure apparatus according to claim 1 wherein the chuck member holds the object in a non-contact manner using the Bernoulli effect.

9. The exposure apparatus according to claim 1 wherein the second support member is a beam-like member which is placed parallel to the predetermined plane.

10. The exposure apparatus according to claim 9 wherein the beam-like member has both ends in its longitudinal direction that are fixed to the first support member in a suspended state.

11. The exposure apparatus according to claim 1 wherein a grating whose periodic direction is in a direction parallel to the predetermined plane is placed on the measurement surface, andthe first measurement member includes an encoder head that irradiates the grating with the measurement beam and receives diffraction light from the grating.

12. The exposure apparatus according to claim 1 wherein the guide surface forming member is a surface plate that is placed on the optical system side of the second support member so as to be opposed to the movable body and that has the guide surface parallel to the predetermined plane formed on one surface thereof on a side opposed to the movable body.

13. The exposure apparatus according to claim 12 wherein the surface plate has a light-transmitting section through which the measurement beam can pass.

14. The exposure apparatus according to claim 12 wherein the drive system includes a planar motor that has a mover arranged at the movable body and a stator arranged at the surface plate and drives the movable body by a drive force generated between the mover and the stator.

15. The exposure apparatus according to claim 1 wherein the measurement surface is arranged at the movable body, and the at least a part of the first measurement member is placed at the second support member.

16. The exposure apparatus according to claim 15 wherein the object is mounted on a first surface opposed to the optical system of the movable body, and the measurement surface is placed on a second surface on an opposite side of the first surface.

17. The exposure apparatus according to claim 15 wherein the movable body includes a first movable member which is movable along the predetermined plane and a second movable member which holds the object and is supported relatively movable with the first movable member, and the measurement surface is placed at the second movable member.

18. The exposure apparatus according to claim 17 wherein the drive system includes a first drive system which drives the first movable member and a second drive system which relatively drives the second movable member with respect to the first movable member.

19. The exposure apparatus according to claim 15 wherein the measuring system has one, or two or more of the first measurement members whose measurement center, which a substantial measurement axis passes through on the measurement surface, coincides with an exposure position that is a center of an irradiation area of an energy beam irradiated on the object.

20. The exposure apparatus according to claim 15, the apparatus further comprising: a mark detecting system that detects a mark placed on the object,wherein the measuring system has one, or two or more second measurement members whose measurement center, which a substantial measurement axis passes through on the measurement surface, coincides with a detection center of the mark detecting system.

21. A device manufacturing method, including exposing an object with the exposure apparatus according to claim 1; andand developing the exposed object.

22. An exposure apparatus that exposes an object with an energy beam via an optical system supported by a first support member, the apparatus comprising: a movable body that holds the object and is movable along a predetermined plane;a second support member whose positional relation with the first support member is maintained in a predetermined relation;a movable body supporting member placed between the optical system and the second support member so as to be apart from the second support member, which supports the movable body at least at two points of the movable body in a direction orthogonal to a longitudinal direction of the second support member when the movable body moves along the predetermined plane;a position measuring system which includes a first measurement member that irradiates a measurement surface parallel to the predetermined plane with a measurement beam and receives light from the measurement surface, and which obtains positional information of the movable body within the predetermined plane based on an output of the first measurement member, the measurement surface being arranged at one of the movable body and the second support member and at least a part of the first measurement member being arranged at the other of the movable body and the second support member;a drive system which drives the movable body based on positional information of the movable body within the predetermined plane; anda carrier system which has at least one chuck member holding the object from above in a non-contact manner, and loads the object on the movable body as well as unload the object from the movable body, using the chuck member.

23. The exposure apparatus according to claim 22 wherein the carrier system unloads the object from the movable body at an unloading position which is set apart from a load position where the object is loaded on the movable body.

24. The exposure apparatus according to claim 22 wherein the chuck member holds the object in a non-contact manner using the Bernoulli effect.

25. The exposure apparatus according to claim 22 wherein the movable body support member is a surface plate that is placed on the optical system side of the second support member so as to be opposed to the movable body and that has a guide surface parallel to the predetermined plane formed on one surface on a side opposing to the movable body.

26. A device manufacturing method, including exposing an object by the exposure apparatus according to claim 22; anddeveloping the object which has been exposed.