The present invention relates to a fabrication method for a semiconductor structure and a corresponding semiconductor structure.
Although applicable in principle to any desired integrated circuits, the present invention and the problem area on which it is based are explained with regard to integrated memory circuits using silicon technology.
a-c show schematic illustrations of successive method stages of a method for fabricating a semiconductor structure in order to illustrate the problem area according to the invention.
In
Partly finished elongate, essentially parallel gate stacks GS1, GS2 have been etched into the layer sequence by means of a customary etching method. In this case, the bottommost layer 10 has been thinned merely to a reduced thickness h″ in comparison with its original thickness h′. In other words, the gate stacks GS1, GS2 have not yet been completely separated from one another in the process state shown in
In a subsequent process step, illustrated in
After the process state shown in
In a further method step, the uncovered lateral surface of the bottommost layer 10 made of polysilicon is then selectively oxidized in order to create sidewall oxide regions 50 as insulation there.
What is problematic about the semiconductor structure described with reference to
The high contact resistance stems from an inadequate protection from oxygen diffusion through the thin spacers, and the word line/bit line short circuits stem from the fact that the polysilicon 10 of the bottommost layer 10 projects laterally outward below the spacers 30 and, therefore, only a very thin insulation made of the sidewall oxide region 50 is present there.
Therefore, it is an object of the present invention to provide a fabrication method for a semiconductor structure and a corresponding semiconductor structure in which the above encapsulation problems are eliminated.
According to the invention, this problem is solved by means of the fabrication method specified in claim 1 and by means of the semiconductor structure specified in claim 8.
The advantages of the method according to the invention and of the semiconductor structure according to the invention reside in particular in the fact that an effective encapsulation is achieved.
Advantageous developments and improvements of the respective subject-matter of the invention are found in the subclaims.
In accordance with one preferred development, after the selective oxidation, a third liner layer made of the first or second material is provided over the gate stacks and the gate dielectric uncovered beside the latter.
In accordance with a further preferred development, the second material is silicon oxide or doped polysilicon.
In accordance with a further preferred development, the gate stacks have a second from bottom layer made of WN, a third from bottom layer made of W and a topmost layer made of silicon nitride.
In accordance with a further preferred development, the first material is silicon nitride.
In accordance with a further preferred development, the selective removal is effected by means of a wet etching.
In accordance with a further preferred development, the sidewall oxide regions on the gate stacks are not in contact with the second from bottom layer made of WN.
An exemplary embodiment of the invention is illustrated in the drawings and is explained in more detail in the description below.
a-e show schematic illustrations of successive method stages of a method for fabricating a semiconductor structure as an embodiment of the present invention; and
a-c show schematic illustrations of successive method stages of a method for fabricating a semiconductor structure in order to illustrate the problem area according to the invention.
In the figures, identical reference symbols designate identical or functionally identical constituent parts.
a-e show schematic illustrations of successive method stages of a method for fabricating a semiconductor structure as an embodiment of the present invention.
The process state in accordance with
Furthermore referring to
Afterward, a further liner layer made of silicon oxide, e.g. TEOS, is deposited over the resulting structure, said further liner layer having a thickness of typically 8 nm. The liner layer is etched by means of a known anisotropic spacer etching in order to provide sidewall spacers 70 made of silicon oxide over the first liner layer 60 on the vertical sidewalls of the gate stacks GS1, GS2, a region of the first liner layer 60 over the gate dielectric 5 between the gate stacks GS1, GS2 remaining free.
In a subsequent process step, illustrated in
In a subsequent process step, the uncovered bottommost layer 10 is selectively oxidized for the purpose of forming sidewall oxide regions 50′ on the underside of the gate stacks GS1, GS2. In contrast to the example illustrated in
Finally, a further liner layer 75 made of silicon oxide having a thickness of typically 8 nm is deposited over the resulting structure in order to close the structure under the sidewall spacers 60′, 70.
During the selective etching process, sidewall spacers 60′ are formed from the liner layer 60, said sidewall spacers being arranged essentially conformally with respect to the sidewall spacers 70.
The deposition of the liner layer 75 made of silicon oxide closes the coves under the spacers 60′, 70 and results in a solid encapsulation of the gate stacks GS1, GS2 which is essentially insusceptible toward oxygen diffusion.
Although the present invention has been described above on the basis of a preferred exemplary embodiment, it is not restricted thereto, but rather can be modified in diverse ways.
In particular, the selection of the layer materials or filling materials is only by way of example and can be varied in many different ways.
Number | Date | Country | Kind |
---|---|---|---|
102004005992.6 | Feb 2004 | DE | national |