Chan, E.Y.; Le, Q.N.; Beranek, M.W. □□Electronic Components & Technology Conference, 1998. 48th IEEE , 1998 □□Page(s): 410-417□□.* |
Said F. Al-sarawi, □□Centre for High Performance Integrated Technologies and Systems (CHIPTEC), □□Adelaide, SA 5005, □□Mar. 1997.* |
Hagge, J.K.; Camilletti, R.C. □□Advanced Packaging, IEEE Transactions on [see also Components, Packaging and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on], vol.: 22 Issue: 2 , May 1999 □□Page(s): 145-152□□.* |
Hagge, J. K.: Camilletti, R.C. □□Electronic Components & Technology Conference, 1998. 48th IEEE , 1998 □□Page(s): 889-894□□.* |
Technical Data Sheet, Boeing FDDI Transmitter And Receiver, Jul. 1994. |
Philippe Clot, Pierre Sarbach and Donald Styblo, Chip On Board Technology For Low Cost Multi-Chip Modules, MCM 94 Proceedings, pp. 455-460, 1994. |
Patrick Thompson, MCM-L Product Development Process For Low-Cost MCMs, MCM 94 Proceedings, pp. 449-454. |
Eric Y. Chan, Quynhgiao N. Le and Mark W. Beranek, High Performance, Low-Cost Chip-On-Board (COB) FDDI Transmitter And Receiver For Avionics Applications, 48th Electronic Components & Technology Conference 1998 Proceedings, pp. 410-417, May 25-28, 1998. |