Electromagnetic shielding

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H01L2924/3025

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/3025Electromagnetic shielding

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,327,812
- Issue date Jun 10, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 12,300,679
- Issue date May 13, 2025
- Mediatek Inc.
- Yi-Jyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,300,624
- Issue date May 13, 2025
- INNOLUX CORPORATION
- Jen-Hai Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package structure comprising package unit incl...
- Patent number 12,300,630
- Issue date May 13, 2025
- Advanced Semiconductor Engineering, Inc.
- Ming-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including shielding cover that covers molded...
- Patent number 12,293,977
- Issue date May 6, 2025
- Samsung Electronics Co., Ltd.
- Young-Woo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising discrete antenna device
- Patent number 12,293,980
- Issue date May 6, 2025
- QUALCOMM Incorporated
- Jaehyun Yeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package device and method of operating the same
- Patent number 12,293,987
- Issue date May 6, 2025
- Realtek Semiconductor Corporation
- Chih-Chiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor EMI shielding component, semiconductor package struct...
- Patent number 12,293,976
- Issue date May 6, 2025
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- E-Tung Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of stacking devices using support f...
- Patent number 12,288,754
- Issue date Apr 29, 2025
- STATS ChipPAC Pte. Ltd.
- GunHyuck Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible electronic structure
- Patent number 12,283,561
- Issue date Apr 22, 2025
- PRAGMATIC SEMICONDUCTOR LIMITED
- Brian Cobb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,283,551
- Issue date Apr 22, 2025
- KIOXIA CORPORATION
- Akihito Sawanobori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 12,278,196
- Issue date Apr 15, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Tae Ki Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated voltage regulator and passive components
- Patent number 12,278,215
- Issue date Apr 15, 2025
- Adeia Semiconductor Inc.
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor memory device and structure with memory and metal...
- Patent number 12,272,586
- Issue date Apr 8, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated devices in semiconductor packages and methods of forming...
- Patent number 12,266,619
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 12,255,153
- Issue date Mar 18, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with EMI shield and fabricating method thereof
- Patent number 12,243,834
- Issue date Mar 4, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Doo Soub Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,243,852
- Issue date Mar 4, 2025
- Kioxia Corporation
- Akihito Sawanobori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers and memory...
- Patent number 12,243,765
- Issue date Mar 4, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Flexible electronic structure including a support element
- Patent number 12,237,289
- Issue date Feb 25, 2025
- PRAGMATIC SEMICONDUCTOR LIMITED
- Brian Cobb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures comprising a via structure with a first pr...
- Patent number 12,237,274
- Issue date Feb 25, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Zongzheng Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic core inductors in interposer
- Patent number 12,224,252
- Issue date Feb 11, 2025
- Intel Corporation
- Krishna Bharath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package including lead frame having multiple conductive...
- Patent number 12,224,255
- Issue date Feb 11, 2025
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic wave attenuator, electronic device, film formation...
- Patent number 12,224,250
- Issue date Feb 11, 2025
- Shibaura Mechatronics Corporation
- Hisashi Nishigaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DC and AC magnetic field protection for MRAM device using magnetic-...
- Patent number 12,218,074
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device, resin package, resin-molded body, and method...
- Patent number 12,211,959
- Issue date Jan 28, 2025
- Nichia Corporation
- Hirofumi Ichikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level design and wiring pattern for a semiconductor package
- Patent number 12,205,904
- Issue date Jan 21, 2025
- Nepes Co., Ltd.
- Yong Tae Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor devices and structures with metal layers
- Patent number 12,199,093
- Issue date Jan 14, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming microelectronic device assemblies and packages
- Patent number 12,199,068
- Issue date Jan 14, 2025
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including electromagnetic interference (EMI) s...
- Patent number 12,191,261
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Yao Chuang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Integrated Devices in Semiconductor Packages and Methods of Forming...
- Publication number 20250192080
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH BENT POLYIMIDE TAPE AND ASSOCIATED MANUF...
- Publication number 20250191959
- Publication date Jun 12, 2025
- INFINEON TECHNOLOGIES AG
- Rainer Markus SCHALLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250174535
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Heewoo AN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250174603
- Publication date May 29, 2025
- KIOXIA Corporation
- Akihito SAWANOBORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...
- Publication number 20250132187
- Publication date Apr 24, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
ELECTRONIC PACKAGE INCLUDING LEAD FRAME HAVING MULTIPLE CONDUCTIVE...
- Publication number 20250132273
- Publication date Apr 24, 2025
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE, RESIN PACKAGE, RESIN-MOLDED BODY, AND METHOD...
- Publication number 20250133878
- Publication date Apr 24, 2025
- Nichia Corporation.
- Hirofumi Ichikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BOND ELECTROMAGNETIC INTERFERENCE (EMI) CAGE TO BLOCK TRANSMIS...
- Publication number 20250125279
- Publication date Apr 17, 2025
- STMicroelectronics International N.V.
- Kai Quan CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mitigating process problems in hybrid bonding of vertical die stacking
- Publication number 20250118692
- Publication date Apr 10, 2025
- Marvell Asia Pte Ltd.
- Runzi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF FORMATION
- Publication number 20250118710
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Ming WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS
- Publication number 20250098325
- Publication date Mar 20, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING INTERPOSER AND METHOD OF MAKING THE SAME
- Publication number 20250096081
- Publication date Mar 20, 2025
- Alpha and Omega Semiconductor International LP
- Madhur Bobde
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL, MECHANICAL, COMPUTING, AND/OR OTHER DEVICES FORMED OF E...
- Publication number 20250098551
- Publication date Mar 20, 2025
- Ambature Inc.
- Douglas J. GILBERT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING METHOD AND APPARATUS FOR ELECTROMAGNETIC INTERFERENCE...
- Publication number 20250096151
- Publication date Mar 20, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Shaowu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING ELECTROMAGNETIC INTERFERENCE (EMI) S...
- Publication number 20250087598
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Yao Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR SHIELDING ELECTROMAGNETIC WAVE OF SEMICONDUCTOR PACKAGE
- Publication number 20250087597
- Publication date Mar 13, 2025
- JOINSET CO., LTD.
- Sun-Ki Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND SEMICONDUCTOR STRUCTURE
- Publication number 20250079375
- Publication date Mar 6, 2025
- CXMT Corporation
- Hengrong SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming AIP Structure to Reduce...
- Publication number 20250079350
- Publication date Mar 6, 2025
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250069979
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Eunseok CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENABLING MICRO-BUMP ARCHITECTURES WITHOUT THE USE OF SACRIFICIAL PA...
- Publication number 20250070067
- Publication date Feb 27, 2025
- Microsoft Technology Licensing, LLC
- Rahul AGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250069995
- Publication date Feb 27, 2025
- Realtek Semiconductor Corp.
- Nai-Jen Hsuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL ISOLATION FOR MODULE WITH BALL GRID ARRAY
- Publication number 20250054876
- Publication date Feb 13, 2025
- Skyworks Solutions, Inc.
- Howard E. CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR INTERCONNECTION UNIT, SEMICONDUCTOR PACKAGE AND METHOD FOR...
- Publication number 20250038059
- Publication date Jan 30, 2025
- JCET STATS ChipPAC Korea Limited
- HyeonChul LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER SYSTEMS INCLUDING CONTROL INTERFACE AND WIRE BOND PAD
- Publication number 20250030386
- Publication date Jan 23, 2025
- Skyworks Solutions, Inc.
- Weimin Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250022809
- Publication date Jan 16, 2025
- Siliconware Precision Industries Co., Ltd.
- Wen-Jung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Active Shield Structure
- Publication number 20250016968
- Publication date Jan 9, 2025
- ARM Limited
- Narayan Prasad Ramachandran
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...
- Publication number 20250006544
- Publication date Jan 2, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240429183
- Publication date Dec 26, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Tae Yong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH SINGLE-CRYSTAL LAYERS
- Publication number 20240429086
- Publication date Dec 26, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING WITH EMBEDDED EMF SHIELDING PROTECTION USIN...
- Publication number 20240421055
- Publication date Dec 19, 2024
- STMicroelectronics International N.V.
- Loic Pierre Louis RENARD
- H01 - BASIC ELECTRIC ELEMENTS

Electromagnetic shielding

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and manufacturing method thereof

Semiconductor package structure

Electronic device

Semiconductor device package structure comprising package unit incl...

Semiconductor package including shielding cover that covers molded...

Package comprising discrete antenna device

Electronic package device and method of operating the same

Semiconductor EMI shielding component, semiconductor package struct...

Semiconductor device and method of stacking devices using support f...

Flexible electronic structure

Semiconductor device and manufacturing method thereof

Semiconductor devices and methods of manufacturing semiconductor de...

Integrated voltage regulator and passive components

3D semiconductor memory device and structure with memory and metal...

Integrated devices in semiconductor packages and methods of forming...

Wire bond wires for interference shielding

Semiconductor package with EMI shield and fabricating method thereof

Semiconductor package and manufacturing method thereof

3D semiconductor device and structure with metal layers and memory...

Flexible electronic structure including a support element

Semiconductor structures comprising a via structure with a first pr...

Magnetic core inductors in interposer

Electronic package including lead frame having multiple conductive...

Electromagnetic wave attenuator, electronic device, film formation...

DC and AC magnetic field protection for MRAM device using magnetic-...

Light emitting device, resin package, resin-molded body, and method...

Wafer-level design and wiring pattern for a semiconductor package

3D semiconductor devices and structures with metal layers

Methods of forming microelectronic device assemblies and packages

Semiconductor device including electromagnetic interference (EMI) s...

Patents Applicationslast 30 patents

Integrated Devices in Semiconductor Packages and Methods of Forming...

SEMICONDUCTOR DEVICES WITH BENT POLYIMIDE TAPE AND ASSOCIATED MANUF...

WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...

ELECTRONIC PACKAGE INCLUDING LEAD FRAME HAVING MULTIPLE CONDUCTIVE...

LIGHT EMITTING DEVICE, RESIN PACKAGE, RESIN-MOLDED BODY, AND METHOD...

WIRE BOND ELECTROMAGNETIC INTERFERENCE (EMI) CAGE TO BLOCK TRANSMIS...

Mitigating process problems in hybrid bonding of vertical die stacking

SEMICONDUCTOR DEVICE AND METHODS OF FORMATION

3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS

SEMICONDUCTOR PACKAGE HAVING INTERPOSER AND METHOD OF MAKING THE SAME

ELECTRICAL, MECHANICAL, COMPUTING, AND/OR OTHER DEVICES FORMED OF E...

WIRE BONDING METHOD AND APPARATUS FOR ELECTROMAGNETIC INTERFERENCE...

SEMICONDUCTOR DEVICE INCLUDING ELECTROMAGNETIC INTERFERENCE (EMI) S...

APPARATUS FOR SHIELDING ELECTROMAGNETIC WAVE OF SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE AND SEMICONDUCTOR STRUCTURE

Semiconductor Device and Method of Forming AIP Structure to Reduce...

SEMICONDUCTOR PACKAGE

ENABLING MICRO-BUMP ARCHITECTURES WITHOUT THE USE OF SACRIFICIAL PA...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SIGNAL ISOLATION FOR MODULE WITH BALL GRID ARRAY

MODULAR INTERCONNECTION UNIT, SEMICONDUCTOR PACKAGE AND METHOD FOR...

POWER AMPLIFIER SYSTEMS INCLUDING CONTROL INTERFACE AND WIRE BOND PAD

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

Active Shield Structure

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH SINGLE-CRYSTAL LAYERS

SEMICONDUCTOR PACKAGING WITH EMBEDDED EMF SHIELDING PROTECTION USIN...