Inductance

Industry

CPC
H01L2924/30107

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/30107Inductance

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Multi-tier IC package including processor and high bandwidth memory
- Patent number 12,154,890
- Issue date Nov 26, 2024
- Huawei Technologies Co., Ltd.
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,148,737
- Issue date Nov 19, 2024
- Mitsubishi Electric Corporation
- Kazuto Mikami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-pin-wafer-level-chip-scale-packaging solution for high power...
- Patent number 12,100,679
- Issue date Sep 24, 2024
- Dialog Semiconductor (UK) Limited
- Habeeb Mohiuddin Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Doherty amplifier
- Patent number 12,081,174
- Issue date Sep 3, 2024
- Mitsubishi Electric Corporation
- Katsuya Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integrations and methods of making thereof
- Patent number 12,068,231
- Issue date Aug 20, 2024
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,068,235
- Issue date Aug 20, 2024
- Rohm Co., Ltd.
- Masaaki Matsuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical, mechanical, computing, and/or other devices formed of e...
- Patent number 12,063,874
- Issue date Aug 13, 2024
- Ambature, Inc.
- Douglas J. Gilbert
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Chip package
- Patent number 12,062,618
- Issue date Aug 13, 2024
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 12,057,426
- Issue date Aug 6, 2024
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Impedance controlled electrical interconnection employing meta-mate...
- Patent number 12,027,465
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die FPGA implementing built-in analog circuit using active si...
- Patent number 12,009,307
- Issue date Jun 11, 2024
- WUXI ESIONTECH CO., LTD.
- Yueer Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,996,354
- Issue date May 28, 2024
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
- Patent number 11,973,007
- Issue date Apr 30, 2024
- Rohm Co., Ltd.
- Toshio Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
- Patent number 11,967,543
- Issue date Apr 23, 2024
- Rohm Co., Ltd.
- Toshio Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,967,545
- Issue date Apr 23, 2024
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,955,451
- Issue date Apr 9, 2024
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,955,452
- Issue date Apr 9, 2024
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having electrode pads arranged between groups...
- Patent number 11,901,251
- Issue date Feb 13, 2024
- Rohm Co., Ltd.
- Kunihiro Komiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package
- Patent number 11,894,306
- Issue date Feb 6, 2024
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacking integrated circuits containing serializer and deserializer...
- Patent number 11,894,342
- Issue date Feb 6, 2024
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 11,876,067
- Issue date Jan 16, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 11,848,288
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,830,839
- Issue date Nov 28, 2023
- Murata Manufacturing Co., Ltd.
- Shingo Yanagihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module, power semiconductor module, and power electro...
- Patent number 11,749,578
- Issue date Sep 5, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Koji Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module
- Patent number 11,721,613
- Issue date Aug 8, 2023
- Hyundai Motor Company
- Tae Hwa Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,710,671
- Issue date Jul 25, 2023
- Mitsubishi Electric Corporation
- Ryo Goto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,705,438
- Issue date Jul 18, 2023
- Kabushiki Kaisha Toshiba
- Tatsuya Hirakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switching power supply module and packaging method thereof
- Patent number 11,657,947
- Issue date May 23, 2023
- Shenzhen Sunlord Electronics Co., Ltd.
- Wenjie Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,652,033
- Issue date May 16, 2023
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-performance integrated circuit packaging platform compatible w...
- Patent number 11,605,583
- Issue date Mar 14, 2023
- Keysight Technologies, Inc.
- Philipp Pahl
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE
- Publication number 20240379566
- Publication date Nov 14, 2024
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240379512
- Publication date Nov 14, 2024
- Mitsubishi Electric Corporation
- Tomokazu KANNA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR MAKING A SECURED SUBSTRATE
- Publication number 20240355722
- Publication date Oct 24, 2024
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240355728
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Chun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240347466
- Publication date Oct 17, 2024
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Yuji MORINAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240332271
- Publication date Oct 3, 2024
- ROHM CO., LTD.
- Hiroto SAKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20240321692
- Publication date Sep 26, 2024
- AMOSENSE CO., LTD.
- Jinhyuck BIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240321811
- Publication date Sep 26, 2024
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP AND METHOD FOR FORMING THE SAME, AND PACKAGE STRUCTURE
- Publication number 20240321801
- Publication date Sep 26, 2024
- Beijing Youzhuju Network Technology Co., Ltd.
- Haiying CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER MODULE, ELECTRIC MOTOR CONTROLLER AND VEHICLE
- Publication number 20240297113
- Publication date Sep 5, 2024
- BYD SEMICONDUCTOR COMPANY LIMITED
- Yuqi ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240297153
- Publication date Sep 5, 2024
- Kabushiki Kaisha Toshiba
- Satoshi YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE SEMICONDUCTOR DEVICE AND INVERTER EQUIPMENT, AND FABRI...
- Publication number 20240282675
- Publication date Aug 22, 2024
- ROHM CO., LTD.
- Toshio HANADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240274513
- Publication date Aug 15, 2024
- ROHM CO., LTD.
- Koshun SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240266315
- Publication date Aug 8, 2024
- Mitsubishi Electric Corporation
- Kazuya OKADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...
- Publication number 20240234228
- Publication date Jul 11, 2024
- Rohm Co., Ltd.
- Kunihiro KOMIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER MODULE WITH TRANSISTOR DIES FOR MULTIPLE AMPLIFIER...
- Publication number 20240186212
- Publication date Jun 6, 2024
- NXP USA, Inc.
- Stephen Reza Hiemstra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240170441
- Publication date May 23, 2024
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NAND DIE WITH WIRE-BOND INDUCTIVE COMPENSATION FOR ALTERED BOND WIR...
- Publication number 20240145424
- Publication date May 2, 2024
- Western Digital Technologies, Inc.
- John Contreras
- G11 - INFORMATION STORAGE
Information Patent Application
RF AMPLIFIERS WITH IMPROVED STABILITY BY SOURCE INDUCTANCE ADJUSTMENT
- Publication number 20240145414
- Publication date May 2, 2024
- Wolfspeed, Inc.
- Gerard Bouisse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240145413
- Publication date May 2, 2024
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Makoto NISHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...
- Publication number 20240136241
- Publication date Apr 25, 2024
- Rohm Co., Ltd.
- Kunihiro KOMIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MAKING SAME
- Publication number 20240128246
- Publication date Apr 18, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Kwang-Soo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED CLIP DESIGN FOR GaN HALF BRIDGE IPM
- Publication number 20240120308
- Publication date Apr 11, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Kwang-Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240088796
- Publication date Mar 14, 2024
- Fuji Electric Co., Ltd.
- Yuhei NISHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING CAPACITOR INTERPOSER SUB...
- Publication number 20240079352
- Publication date Mar 7, 2024
- QUALCOMM Incorporated
- Jihong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH INTEGRATED EMBEDDED OFF-DIE INDUCTORS
- Publication number 20240071958
- Publication date Feb 29, 2024
- Xilinx, Inc.
- Hong SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH INTEGRATED VOLTAGE REGULATOR AND METHOD FORMING THE SAME
- Publication number 20240055468
- Publication date Feb 15, 2024
- TAIWAN SEMICONDUCTOR MANUFACTRING CO., LTD.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package or a Printed Circuit Board, Both Modified to...
- Publication number 20240014104
- Publication date Jan 11, 2024
- Infineon Technologies Austria AG
- Edward Fürgut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH STAR-CONNECTED LEAD
- Publication number 20240006273
- Publication date Jan 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Kumar Anurag SHRIVASTAVA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20230411339
- Publication date Dec 21, 2023
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multi-tier IC package including processor and high bandwidth memory

Semiconductor device

Multi-pin-wafer-level-chip-scale-packaging solution for high power...

Doherty amplifier

3D integrations and methods of making thereof

Semiconductor device

Electrical, mechanical, computing, and/or other devices formed of e...

Chip package

Semiconductor module

Impedance controlled electrical interconnection employing meta-mate...

Multi-die FPGA implementing built-in analog circuit using active si...

Semiconductor device

Power module semiconductor device and inverter equipment, and fabri...

Power module semiconductor device and inverter equipment, and fabri...

Semiconductor device

Semiconductor module

Semiconductor module

Semiconductor device having electrode pads arranged between groups...

Chip package

Stacking integrated circuits containing serializer and deserializer...

Semiconductor package and method of manufacturing the same

Semiconductor device and method

Semiconductor device

Semiconductor module, power semiconductor module, and power electro...

Power module

Semiconductor module

Semiconductor device

Switching power supply module and packaging method thereof

Semiconductor device

High-performance integrated circuit packaging platform compatible w...

Patents Applicationslast 30 patents

CHIP PACKAGE

SEMICONDUCTOR DEVICE

APPARATUS AND METHOD FOR MAKING A SECURED SUBSTRATE

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE

POWER MODULE

SEMICONDUCTOR MODULE

CHIP AND METHOD FOR FORMING THE SAME, AND PACKAGE STRUCTURE

SEMICONDUCTOR POWER MODULE, ELECTRIC MOTOR CONTROLLER AND VEHICLE

SEMICONDUCTOR DEVICE

POWER MODULE SEMICONDUCTOR DEVICE AND INVERTER EQUIPMENT, AND FABRI...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...

POWER AMPLIFIER MODULE WITH TRANSISTOR DIES FOR MULTIPLE AMPLIFIER...

SEMICONDUCTOR MODULE

NAND DIE WITH WIRE-BOND INDUCTIVE COMPENSATION FOR ALTERED BOND WIR...

RF AMPLIFIERS WITH IMPROVED STABILITY BY SOURCE INDUCTANCE ADJUSTMENT

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...

SEMICONDUCTOR DEVICES AND METHODS OF MAKING SAME

STACKED CLIP DESIGN FOR GaN HALF BRIDGE IPM

SEMICONDUCTOR MODULE

INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING CAPACITOR INTERPOSER SUB...

CHIP PACKAGE WITH INTEGRATED EMBEDDED OFF-DIE INDUCTORS

PACKAGE WITH INTEGRATED VOLTAGE REGULATOR AND METHOD FORMING THE SAME

Semiconductor Package or a Printed Circuit Board, Both Modified to...

INTEGRATED CIRCUIT PACKAGE WITH STAR-CONNECTED LEAD

SEMICONDUCTOR MODULE