Claims
- 1. A conductive fine sphere comprising a fine sphere and a conductive layer made of In formed on a surface of said fine sphere, wherein the fine sphere has a K-value defined as ##EQU4## (wherein F and S represent a load value (kgf) and a compression displacement (mm) at 10% compression deformation of said fine sphere, respectively, and R represents a radius (mm) of said fine sphere spacer) which is in the range of 250 kgf/mm.sup.2 to 700 kgf/mm.sup.2 at 20.degree. C.; and a recovery factor after the compression deformation which is in the range of 30% to 80% at 20.degree. C.
- 2. A conductive fine sphere according to claim 1, wherein said K-value is in the range of 350 kgf/mm.sup.2 to 550 kgf/mm.sup.2 at 20.degree. C.
- 3. A conductive fine sphere according to claim 1, wherein said recovery factor after the compression deformation is in the range of 40% to 70% at 20.degree. C.
- 4. A conductive fine sphere according to claim 1, wherein said fine sphere is at least one selected from the group consisting of polydivinylbenzene, divinylbenzene-styrene copolymer, divinylbenzene-acrylate copolymer, and polydiallyphthalate.
- 5. A conductive fine sphere according to claim 1, wherein said fine sphere has a diameter in the range of 0.1 to 100 .mu.m.
- 6. A conductive fine sphere according to claim 5, wherein the diameter of said fine sphere is in the range of 0.5 to 50 .mu.m.
- 7. A conductive fine sphere according to claim 5, wherein the diameter of said fine sphere is in the range of 1.0 to 20 .mu.m.
- 8. A method of making a conductive fine sphere for a liquid crystal element comprising the steps of:
- making a fine sphere from a synthetic resin;
- providing said fine sphere having a K-value defined as ##EQU5## (wherein F and S represent a load value (kgf) and a compression displacement (mm) at 10% compression deformation of said fine sphere, respectively, and R represents a radius (mm) of said fine sphere spacer) which is in the range of 250 kgf/mm.sup.2 to 700 kgf/mm.sup.2 at 20.degree. C.; and a recovery factor after the compression deformation which is in the range of 30% to 80% at 20.degree. C.; and
- forming a conductive layer made of In on said fine sphere.
- 9. A method according to claim 8, wherein said K-value is in the range of 350 kgf/mm.sup.2 to 550 kgf/mm.sup.2 at 20.degree. C.
- 10. A method according to claim 8, wherein said recovery factor after the compression deformation is in the range of 40% to 70% at 20.degree. C.
- 11. A method according to claim 8, wherein said fine sphere is at least one selected from the group consisting of polydivinylbenzene, divinylbenzenestyrene copolymer, divinylbenzene-acrylate copolymer, and polydiallyphthalate.
- 12. A method according to claim 8, wherein said fine sphere has a diameter in the range of 0.1 to 100 .mu.m.
- 13. A method according to claim 12, wherein the diameter of said fine sphere is in the range of 0.5 to 50 .mu.m.
- 14. A method according to claim 12, wherein the diameter of said fine sphere is in the range of 1.0 to 20 .mu.m.
Priority Claims (5)
Number |
Date |
Country |
Kind |
2-261728 |
Sep 1990 |
JPX |
|
3-104298 |
May 1991 |
JPX |
|
3-104299 |
May 1991 |
JPX |
|
3-104300 |
May 1991 |
JPX |
|
PCT/JP91/01285 |
Sep 1991 |
WOX |
|
Parent Case Info
This application is a division of application Ser. No. 07/859,408, filed as PCT/JP91/01285, Sep. 27, 1991, published as WO92/06402, Apr. 16, 1992 now U.S. Pat. No. 5,486,941.
US Referenced Citations (5)
Foreign Referenced Citations (2)
Number |
Date |
Country |
61-19602 |
Jan 1986 |
JPX |
61-95016 |
May 1986 |
JPX |
Divisions (1)
|
Number |
Date |
Country |
Parent |
859408 |
May 1992 |
|