1. Field of the Invention
Embodiments described herein relate to semiconductor processing, and more particularly to an apparatus for fluid delivery within substrate processing systems.
2. Description of the Related Art
A chip manufacturing facility is composed of a broad spectrum of technologies. Cassettes containing semiconductor substrates are routed to various stations in the facility where they are either processed or inspected. Semiconductor processing involves the deposition of material onto and removal of material from substrates. Typical processes include chemical vapor deposition (CVD), physical vapor deposition (PVD), electrochemical plating (ECP), chemical mechanical planarization (CMP), etching, cleaning, and others. Of the above processes, approximately 25% involve liquid chemical processes.
One issue regarding semiconductor processing involves the accurate delivery of fluids to tightly control the chemical concentrations within a process solution. Conventional fluid delivery systems take fluids, such as processing chemicals, from bulk supplies, local reservoirs, or bottles and deliver them using a metering pump and/or flow meter. A typical system uses a fixed orifice with constant pressure. More specifically, such a system may control flow with an orifice, for example a control valve, and a pressure regulator, for example a flow meter, which maintains a constant fluid pressure upstream of the control valve and therefore maintains a constant flow rate.
There are various flow meter technologies available to measure the amount of fluid dispensed, and one of the frequently used technologies is differential pressure technology. Differential pressure technology incorporates measurement of pressure by placing a flow meter on the outlet side of an orifice to measure the flow rate of the fluid. However, flow meters are prone to particle generation and require periodic service and calibration. In addition, conventional flow meter technologies are unable to provide accurate measurement for small volumes or very low flow rates. The technologies capable of more accurate mass flow measurement tend to be more expensive.
Also, it is also sometimes desirable that two different chemicals be selectively mixed and/or delivered to respective sides of a wafer. However, conventional flow meter technologies are only capable of measuring the flow rate of a single fluid. Conventional flow meter technologies are unable to control or monitor the division of a fluid into two or more fluid streams.
Therefore, there is a need for a fluid delivery system configured to provide controllable fluid delivery, improved fluid delivery precision, and increased fluid utilization into multiple streams.
Embodiments described herein provide an application for delivery of fluids within substrate processing systems. More particularly, embodiments described herein provide applications for delivery of processing chemicals within substrate processing systems. In one embodiment, a fluid delivery system is provided. The fluid delivery system comprises a bulk fluid source for supplying fluids, a fluid delivery module for controlling and monitoring a ratio of fluids flowing from the bulk fluid source, a first stream line positioned downstream from the fluid delivery module, a first switch positioned along the first stream line, a second stream line positioned downstream from the fluid delivery module, and a second switch positioned along the second stream line, wherein the fluid delivery module splits the fluids from the bulk fluid source into two streams flowing through the first stream line and the second stream line according to a pre-defined ratio.
In another embodiment, a fluid delivery system is provided. The fluid delivery system comprises a control valve for controlling the flow of the fluids from the bulk fluid source, a flow meter positioned upstream from the control valve, a first pressure transducer positioned upstream from the flow meter, a second pressure transducer positioned in between the flow meter and the control valve, and a switch positioned downstream from the control valve, a first stream line coupled with the switch, and a second stream line coupled with the switch, wherein the first stream line and the second stream line are positioned downstream from the switch.
In yet another embodiment, a system for chemical mechanical polishing of substrate is provided. The system comprises a platen assembly, a polishing surface supported on the platen assembly, one or more polishing heads on which substrates are retained while polishing, and a fluid delivery system for delivering fluids to the polishing surface. The fluid delivery system comprises a bulk fluid source for supplying fluids, a fluid delivery module for controlling and monitoring a ratio of fluids flowing from the bulk fluid source, a first stream line positioned downstream from the fluid delivery module, a first switch positioned along the first stream line, a second stream line positioned downstream from the fluid delivery module, and a second switch positioned along the second stream line, wherein the fluid delivery module splits the fluids from the bulk fluid source into two streams flowing through the first stream line and the second stream line according to a pre-defined ratio.
In yet another embodiment, a method for controlling the flow of a fluid through a fluid delivery system is provided. The method comprises flowing a fluid through a fluid delivery system comprising a bulk fluid source for supplying fluids, a fluid delivery module for controlling and monitoring a ratio of fluids flowing from the bulk fluid source, a first stream line positioned downstream from the fluid delivery module, a first switch positioned along the first stream line, a second stream line positioned downstream from the fluid delivery module, and a second switch positioned along the second stream line, wherein the fluid delivery module splits the fluids from the bulk fluid source into two streams flowing through the first stream line and the second stream line according to a pre-defined ratio, measuring a differential pressure for each of the first stream line and the second stream line by shutting off each of the first switch and the second switch intermittently, and determining the ratio of the flows when both stream lines are open by comparing the differential pressure measurements from the first stream line and the second stream line.
So that the manner in which the above recited features of the invention can be understood in detail, a more particular description of the invention, briefly summarized above, may be had by reference to embodiments, some of which are illustrated in the appended drawings. It is to be noted, however, that the appended drawings illustrate only typical embodiments of the invention and are therefore not to be considered limiting of its scope, for the invention may admit to other equally effective embodiments.
Embodiments described herein relate to semiconductor processing, and more particularly to an apparatus for fluid delivery within substrate processing systems. Flow controllers are usually the most expensive component in fluid delivery systems and represent the largest percentage of material cost of any type of component. Embodiments described herein advantageously provide a means for controlling and/or monitoring the division of a fluid stream into two or more streams of equal amounts or predefined ratios without the need for additional costly flow controllers. In one embodiment, a control valve is positioned upstream of a flow measurement device and/or additional pressure transducer(s) are positioned on the downstream side of the control valve so that the back pressure associated with dispense tubing between the flow controller and the point of dispense may be measured.
While the particular apparatus in which the embodiments described herein can be practiced is not limited, it is particularly beneficial to practice the embodiments in a REFLEXION® LK CMP system and MIRRA MESA® system sold by Applied Materials, Inc., Santa Clara, Calif. Additionally, CMP systems available from other manufacturers may also benefit from embodiments described herein. Embodiments described herein may also be practiced on overhead circular track polishing systems.
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In one embodiment depicted in
Each polishing station 124 includes a polishing surface 130 capable of polishing at least two substrates at the same time and a matching number of polishing units for each of the substrates. Each of the polishing units includes a polishing head 126, a pad conditioning assembly 132 which dresses the pad by removing polishing debris and opening the pores of the pad, and a polishing fluid delivery arm 134. In one embodiment, each polishing station 124 comprises multiple pad conditioning assemblies 132, 133. In one embodiment, each polishing station 124 comprises multiple fluid delivery arms 134, 135 for the delivery of a fluid stream to each polishing stations 124. The polishing surface 130 is supported on a platen assembly 250 (see
To facilitate control of the CMP system 100 and processes performed thereon, a controller 190 comprising a central processing unit (CPU) 192, memory 194, and support circuits 196, is connected to the CMP system 100. The CPU 192 may be one of any form of computer processor that can be used in an industrial setting for controlling various drives and pressures. The memory 194 is connected to the CPU 192. The memory 194, or computer-readable medium, may be one or more of readily available memory such as random access memory (RAM), read only memory (ROM), floppy disk, hard disk, or any other form of digital storage, local or remote. The support circuits 196 are connected to the CPU 192 for supporting the processor in a conventional manner. These circuits include cache, power supplies, clock circuits, input/output circuitry, subsystems, and the like.
The fluid delivery module 204 is further adapted to measure the amount of fluid delivered from the bulk fluid source 202, split the fluid into two streams flowing through a first stream line 220 and a second stream line 222, according to a pre-defined ratio, and deliver the fluid in a metered amount through the first switch 206 positioned along the first stream line 220 and the second switch 208 positioned along the second stream line 222 to the platen assembly 250. The fluid delivery module 204 may include a control valve 210 for controlling the flow of fluids from the bulk fluid source 202 via tubing 229. The tubing 229 may be formed of flexible materials such as PTFE, vinyl, and other plastic materials that are chemically compatible with the fluids. The tubing 229 may be configured in any diameter, flexibility, and wall thickness. The fluid delivery module 204 may further include a flow meter 212 for monitoring the flow rate of the fluid flowing through the stream line 203. The flow meter 212 communicates with the control valve 210 via a feedback loop (not shown).
The fluid delivery module 204 may further include pressure detection devices, for example, a first pressure transducer 214 and a second pressure transducer 216. The pressure transducers 214 and 216 may be used to determine a degree of resistance or impedance of the fluid within the stream line 203 at a certain point. The impedance may be determined by measuring and calculating the differential pressure at various locations within the stream line 203. By measuring the differential pressure of the fluid in the stream line 203, a ratio of the fluid flowing in the first stream line 220 and the second stream line 222 is determined, and the consistency of the ratio can be monitored in real-time.
In one embodiment, the control valve 210 is positioned upstream from the flow meter 212, the first pressure transducer 214 is positioned in between the control valve 210 and the flow meter 212 to monitor the pressure of the fluid flowing through stream line 203, and the second pressure transducer 216 is positioned downstream from the flow meter 212. A first measurement of the impedance may be taken by the first pressure transducer 214 before the fluid flows through the flow meter 212.
In one embodiment, the second pressure transducer 216 is positioned downstream of the flow meter 212. The second pressure transducer 216 may also measure impedance which can be used to determine the ratio between the two fluid streams. In one embodiment, the ratio of the two fluid streams may be equal or the ratio may be any combination of pre-defined ratios based on processing requirements. By using a pre-defined ratio for the fluid streams, the controller 190 is able to control and monitor the two fluid streams according to the pre-defined ratio. The impedance measured by the pressure transducers 214 and 216 may also be used to determine the differential pressure across the stream line 203 and the flow rate of the fluid. Also, by placing the second pressure transducer 216 downstream from the flow meter 212, the second pressure transducer 216 may provide additional pressure data that acts as a second measure in the differential pressure determination and the measure of impedance.
In operation, a differential pressure measurement may be made for each of the first stream line 220 and the second stream line 222 by shutting off each of the first switch 206 and the second switch 208 individually. For example, the first switch 206 may be closed while the second switch 208 remains open and the differential pressure for the second stream line 222 is measured. The ratio of the individual differential pressure measurements from the first stream line 220 and the second stream line 222 is the ratio of the flows when both/all stream lines are open. This ratio measurement may be used periodically to monitor the consistency of the ratio of the flows through the stream lines and detect any divergence from requirements in real-time, due to, for example, clogging of the stream lines by polishing slurry.
The fluid delivery module 404 may split the fluids flowing through the stream line 203 into two streams flowing through a first stream line 220 and a second stream line 222, in which the flow meter 212 may monitor the stream lines intermittently to ensure constant flow throughout the system. It is important for the first pressure transducer 214, the second pressure transducer 216, and the third pressure transducer 406 to accurately measure the impedance and the differential pressure within the stream line while fluids are flowing through. Accurate measurement enables the control valve 210 to control and maintain the same ratio between multiple streams while keeping the total flow of the fluid constant throughout the stream line so that the fluid may be evenly distributed to the platen 250 during substrate processing.
While the foregoing is directed to embodiments of the invention, other and further embodiments of the invention may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.