Flow Diversion Heat Sinks For Temperature Uniformity in Back to Back Multi-processor Configurations

Abstract

A system for maintaining heat sink temperature uniformity in a system with pairs of substantially similar components mounted on a surface in close proximity and substantially aligned with an air flow, where the air flow is divided into a plurality of air flows by dividers radiating upward from the heat sink bases' top surfaces and containing cooling fins on the heat sink on only one side of the divider, where each airflow is diverted past the cooling fins of at least one of the heat sinks without significant pre-heating and through the cooling fins of at least one of the other heat sinks.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1 and 2 are isotropic views of a Flow Diversion Heat Sink in accordance with an exemplary embodiment of the invention.

FIG. 3 is a Top View of two Flow Diversion Heat Sinks in a back-to-back configuration in accordance with an exemplary embodiment of the invention.

FIG. 4 is a Top View of a Flow Diversion Heat Sink in accordance with an exemplary embodiment of the invention.

FIG. 5 is a Front View of a Flow Diversion Heat Sink in accordance with an exemplary embodiment of the invention.

FIG. 6 is a Side View of a Flow Diversion Heat Sink in accordance with an exemplary embodiment of the invention.

FIG. 7 is a Bottom View of a Flow Diversion Heat Sink in accordance with an exemplary embodiment of the invention.

Claims

1. A system for maintaining heat sink temperature uniformity comprising; a pair of substantially similar components mounted on a surface in close proximity, and substantially aligned with an air flow;a pair of heat sinks each comprising: a base;a divider extending from one approximate edge of the base to the opposite approximate edge of the base, and radiating upward from the base;a plurality of cooling fins on one side of the divider; andand a clear air channel on the other side of the divider;the heat sinks attached to the components in a rotated fashion such that clear air channel of one heat sink aligns with the cooling fins of the other heat sink.

2. A system as in claim 1 wherein the heat sinks are adjoined.

3. A system as in claim 1 wherein each heat sink further comprises a gasket around the bottom perimeter of the heat sink base preventing airflow between the heat sink base and the surface of the circuit board.

4. A system as in claim 1 wherein the heat sinks further comprise one or more fasteners for fastening to the circuit board.

5. A system as in claim 1 wherein the heat sinks further comprise one or more fasteners for fastening to the component.

6. A system as in claim 1 wherein the heat sinks are substantially similar shape.

7. A system as in claim 1 further comprising a plurality of pairs of heat sinks.

8. An apparatus for dissipating heat from a component comprising: a base,a divider extending across the top of the base from one side to the opposite side,a plurality of cooling fins on one side of the divider radiating upward from the top side of the base and running parallel to the divider, anda clear air channel on the other side of the divider.

9. An apparatus as in claim 8 wherein the clear air channel comprises less than half the area of the base's top surface.

10. An apparatus as in claim 8 wherein the divider extends at least to one edge of the heat sink base.

11. An apparatus as in claim 8 wherein the divider comprises an inclined plane extending from one end of the divider to substantially the middle of one edge of the heat sink base.

12. An apparatus as in claim 8 wherein the divider extends below the top edge of the heat sink base.

13. An apparatus as in claim 12 wherein the heat sink base comprises a notched portion to accommodate the portion of the divider extending below the top edge of the heat sink base.

14. An apparatus as in claim 8 wherein the divider of a heat sink comprises a cooling fin.

15. An apparatus as in claim 8 wherein the divider of a heat sink comprises an insulator for insulating the cooling fins from the clear air channel.

16. An apparatus as in claim 15 wherein the heat sink further comprises an insulator for insulating the heat sink base from the clear air channel.

17. An apparatus as in claim 8 wherein the heat sink base comprises a means for substantially uniformly distributing heat between the clear air channel side of the base and the cooling fin side of the base.

18. An apparatus as in claim 8 wherein the heat sink base comprises heat pipes.

19. An apparatus as in claim 8 wherein the heat sink further comprises fasteners for fastening to a circuit board.

20. An apparatus as in claim 8 wherein the heat sink further comprises fasteners for fastening to a component.

21. An apparatus as in claim 8 wherein the heat sink further comprises a gasket adjoining the bottom side of the heat sink base to a surface on which the heat sink is fastened.

22. An apparatus as in claim 8 wherein the spacing of the plurality of cooling fins is non-linear.

23. An apparatus as in claim 8 wherein the length of the plurality of cooling fins is not uniform.

24. A method of maintaining heat sink temperature uniformity comprising; dividing an air flow across a plurality of heat sinks into a plurality of air flows;directing one of the air flows past at least one of the heat sinks without substantially pre-heating, and further directing that air flow through the plurality of cooling fins of another of the plurality of heat sinks.