Patent Application
20130026155
N/A
Solar or photovoltaic cells are manufactured by depositing conductive inks in desired patterns on the tops and bottoms of a solar cell wafer. The wafers are thermally processed in a furnace system to dry the conductive ink and burn off binders and other materials after which the materials are fired to form metallization patterns on the wafer surfaces. Furnace systems for such metallization processes typically employ infrared heating lamps to provide the rapid thermal processing environment needed for processing the wafers.
Known wafer firing furnaces can be generally characterized as comprising three sections: a drying zone at an entrance where the wafers are loaded into the furnace; a burnout/firing zone, generally thought of as the middle zone; and a cooling section located at the end and having an exit from which the wafers are removed. In some wafer firing furnaces, a single-belt conveyor is used to move the wafers through the sections and, therefore, the wafers move through each section at the same speed. Alternatively, multi-belt structures are known where a separate belt runs through each section, allowing for variations in belt speed depending upon the section.
It is known that the wafer should be quickly cooled after it has reached its maximum temperature in order to assure highest quality wafers. Known ovens, however, cause a heated wafer to dwell at this high temperature because of the time necessary to transfer the wafer from the burnout/firing zone to the cooling zone.
What is needed is a wafer processing furnace that provides for minimal dwell time at temperature along with a very fast cooling profile.
An infrared firing furnace includes a case-integrated cooling system to provide high performance cooling as the first step in the cooling process. The cooling system includes a cooling manifold integrated into, and made from, the same case material as the adjacent firing zone. As the cooling system is made from the same material as the rest of the case, it can handle being exposed to higher temperatures. The cooling system is positioned such that the plane of its outlet is at a specific clearance level relative to the product passing underneath. High pressure cooling jets of air are directed downward toward the products as they pass under the cooling manifold in order to quickly bring the temperature of the products down from the much higher firing temperature, and minimize the dwell time of the product at the higher temperature.
Embodiments of the present invention may be better understood by referring to the following description in conjunction with the accompanying drawings in which:
It will be appreciated that for simplicity and clarity of illustration, elements shown in the drawings have not necessarily been drawn accurately or to scale. For example, the dimensions of some of the elements may be exaggerated relative to other elements for clarity or several physical components may be included in one functional block or element. Further, where considered appropriate, reference numerals may be repeated among the drawings to indicate corresponding or analogous elements. Moreover, some of the blocks depicted in the drawings may be combined into a single function.
In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the various embodiments of the present invention. It will be understood by those of ordinary skill in the art that embodiments of the present invention may be practiced without some of these specific details. In other instances, well-known methods, procedures, components and structures may not have been described in detail so as not to obscure details of the embodiments of the present invention.
In accordance with various embodiments of the present invention, a furnace is provided with a case-integrated cooling system to provide high performance cooling as the first step in the cooling process. The cooling system includes a cooling manifold integrated into, and made from, the same case material as the firing zone, and located adjacent to the firing zone. As the cooling manifold is made from the same material as the rest of the case, it can handle being exposed to higher temperatures. The cooling manifold is positioned such that the plane of its outlet is at a specified clearance level relative to the product passing underneath. High pressure cooling jets of air are directed downward toward the products as they pass under the cooling manifold in order to quickly bring the temperature of the products down from the firing temperature, and thereby minimize the dwell time of the product at the higher temperature. The case may be made of insulator brick or other known insulating material.
Referring now to
In operation, a workpiece such as, e.g., a wafer or other object or product to be processed, is placed into an opening 110 at the start of the drying section 102 and moved along, for example, by a conveyor belt or the like, from one section to the next. A wafer, for example, is exposed to varying gases and temperatures depending on the process, technology and type of wafer as is generally known. The specifics of the processing of a wafer, however, are not necessary to the operation, or description, of the embodiments of the present invention as will be described in more detail below. The wafer passes from the section 106 into the HPC cooler section 108 and then the processed wafer exits from the HPC cooler section 108 at an opening 112.
Referring now to
At the end of the dryer section 102, the workpiece 202 is transferred to the burnout/firing section 104, sometimes referred to as the “firing process” section. The burnout/firing section 104 includes an array of infrared heating lamps 206 provided in each of an upper and lower section for heating the workpieces 202 being conveyed through the burnout/firing section 104. Although shown with only one zone, the burnout/firing section 104 may have multiple zones thereby providing different zones having different temperatures that can provide the workpiece 202 with a temperature profile in accordance with the desired process.
When the workpiece 202 has reached the end of the burnout/firing section 104 it is conveyed to the cooling system 106. The temperature of the workpiece 202 is quickly lowered to about 600° C. in the cooling section 106. The cooling section 106 includes an air plenum 209 as will be discussed below. Advantageously, the workpiece 202 is quickly cooled down as it passes underneath the air plenum 209.
The HPC cooler 108 includes a ladder plenum 216 that directs high velocity cooling air downward toward the workpiece 202 as it passes through this section on a conveyor belt 230. The downward-directed air is for both impingement to cool and to provide a hold-down force while lower velocity air flows up through the conveyor belt 230. An upper air plenum 218 collects the air and directs it to an upper heat exchanger 220 to further remove the heat from the air. The heat exchanger 220 operates to remove heat from the furnace directly out to either ambient air in the room or through an HVAC system. A lower air plenum 222 provides air to a lower heat exchanger 224 in order to provide uniform cooling air, at a high volume but low velocity, to cool the belt running through the HPC cooler 108. The ladder plenum 216 provides evenly distributed air downward onto the workpiece 202.
A plurality of exhaust piers 208 are provided between the burnout/firing section 104 and the cooling section 106 in order to prevent the cooling gas or air that is directed downward onto the workpiece 202 by the air plenum 209 from interfering with the process gas in the burnout/firing section 104.
Referring now to
As shown in
Referring now to
It should be noted that embodiments of the present invention are not limited to a firing furnace for processing wafers but may be implemented in other types of furnaces for processing other types of products.
Certain features of the invention, which, for clarity, have been described in the context of separate embodiments, may also be provided in combination in a single embodiment. Conversely, various features of the invention, which are, for brevity, described in the context of a single embodiment, may also be provided separately or in any suitable sub-combination.
It is to be appreciated that various embodiments of the methods and apparatuses discussed herein are not limited in application to the details of construction and arrangement of components or steps set forth in the following description or illustrated in the accompanying drawings. The method and apparatus are capable of implementation by other embodiments that are being practiced or being carried out in various ways. Examples of specific implementations or embodiments are provided herein for illustrative purposes only and are not intended to be limiting. Particular acts, elements and features discussed in connection with any one of the embodiments are not intended to be excluded from a similar role in any other embodiments. Also, the phraseology and terminology used herein are for the purposes of description and should not be regarded as limiting. The use herein of “including,” “comprising,” “having,” “containing,” “involving,” and variations thereof, is meant to encompass the items listed thereafter and equivalents thereof, as well as additional items.
Having thus described several features of at least one embodiment of the present invention, it is to be appreciated that various alterations, modifications, and improvements will readily occur to those skilled in the art. Such alterations, modifications, and improvements are intended to be part of this disclosure and are intended to be within the scope of the invention. Accordingly, the foregoing description and drawings are by way of example only, and the scope of the invention should be determined from proper construction of the appended claims, and their equivalents.
